K4S561633F-ZL75 vs K4S561633FZN75 比較

詳細並排比較 K4S561633F-ZL75 由 Samsung Electronics 與 K4S561633FZN75 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K4S561633F-ZL75 K4S561633F-ZL75 - 256Mb Mobile SDRAM, 4x16Mx16, 133MHz, 54-BGA

K4S561633F-ZL75 - 256Mb Mobile SDRAM, 4x16Mx16, 133MHz, 54-BGA

K4S561633F-ZL75 Nrnd

規格比較

參數 K4S561633F-ZL75 K4S561633FZN75
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs Memory ICs
生命週期狀態 NRND NRND
記憶體類型 Synchronous DRAM (Mobile SDRAM) Mobile SDRAM (Synchronous DRAM)
Density 256 Mbit (268,435,456 bits) 256 Mbit (268,435,456 bits)
組織 4 banks x 4,196,304 words x 16 bits (4M x 16 x 4 banks) 4 banks x 4,196,304 words x 16 bits
Operating Frequency (max) 133 MHz —
Clock Access Time 5.4 ns —
Speed Grade ZL75 (7.5 ns / CAS Latency 3, 133 MHz) —
Supply Voltage (VDD) 3.3 V —
I/O Standard LVCMOS-compatible —
Number of Banks 4 —
Burst Length 1, 2, 4, 8, Full Page 1, 2, 4, 8, full page (programmable)
Burst Type Sequential or Interleave —
CAS 延遲 Programmable, 2 or 3 Programmable, 2 or 3
封裝 54-ball FBGA (54-BOC) / TFBGA 54-ball FBGA (54BOC)
安裝類型 Surface Mount —
RoHS / Lead-Free Pb-Free (per -L75 suffix) —
工作溫度 [DATA_NEEDED: operating temperature grade] Commercial grade (per -ZN75 suffix)
Clock Frequency — 133 MHz
資料速率 — PC133 (SDRAM)
Supply Voltage (VDD/VDDQ) — 3.0 V (typ); 2.7 V-3.3 V range
介面 — LVCMOS
Process Technology — Samsung high-performance CMOS
Refresh — Auto-Refresh and Self-Refresh
Power Modes — Power-Down mode, Partial Array Self-Refresh (PASR)
Lead-Free / RoHS — Pb-free (lead-free) - per '-ZN' suffix
Bank Architecture — 4 internal banks
Row Address — A0-A12 (13-bit)
Data Width — x16 (DQ0-DQ15)

資料表與資源

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