K4B4G1646E-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
MPN： K4B4G1646E-BYK0 ✓ 啟用中K4B4G1646E-BYK0 概覽
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses an 8n-prefetch architecture to achieve high data rates. DDR3L is widely used in mobile devices, embedded systems, and servers where power efficiency is critical.
Key features include a 4Gb density, x16 organization, and support for DDR3-1600 (800 MHz) operation. The device features on-die termination (ODT), ZQ calibration, and a programmable CAS latency. It operates over a temperature range of 0°C to +95°C (TC) and supports auto precharge and self-refresh modes. The 96-ball FBGA package provides a compact footprint suitable for space-constrained designs.
The K4B4G1646E-BYK0 uses Samsung's E-die process technology, which offers improved performance and power efficiency compared to earlier die revisions. The device includes dynamic on-chip termination and asynchronous reset for robust signal integrity. It supports a burst length of 8 and a burst chop of 4, enabling flexible data access patterns.
Typical applications include DDR3L memory modules for laptops, embedded computing, networking equipment, and industrial PCs. Its low voltage and high density make it ideal for power-sensitive designs. The device is also suitable for use in set-top boxes, routers, and other consumer electronics.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 800 MHz. The device requires a 1.35V supply and a separate VDDQ for the I/O, which should be regulated to the specified tolerances.
直接替換替代品，適用於 K4B4G1646E-BYK0 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： K4B4G1646E-BYK0 （相同外形與佔位） — 差異在於 Package, Data Rate, Burst Length, Operating Temperature, Supply Voltage.
K4B4G1646E-BCNB
✅ 直接替換聯絡詢價
查看資料表 →K4B4G1646E-BYK000
✅ 直接替換聯絡詢價
查看資料表 →K4B4G1646E-BCMA
✅ 直接替換聯絡詢價
查看資料表 →MT41K256M16HA-125
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →H5TC4G63AFR
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
IS43TR16512B
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
K4B4G1646E-BYK0 最大額定值與電氣特性
| 記憶體類型 | DDR3L SDRAM |
| Density | 4 Gb |
| 組織 | 256M x 16 |
| 供應電壓 | 1.35 V (1.283 V to 1.45 V) |
| 資料速率 | DDR3-1600 (800 MHz) |
| 封裝 | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) |
| 工作溫度 | 0°C to +95°C (TC) |
| CAS 延遲 | 11 (CL-tRCD-tRP) |
| Burst Length | 8 (fixed), 4 (burst chop) |
| On-Die Termination | Yes (dynamic ODT) |
| ZQ Calibration | Yes |
| Auto Precharge | Yes |
| Self-Refresh | Yes |
| Asynchronous Reset | Yes |
| Data Mask | Yes |
| RoHS | Compliant |
K4B4G1646E-BYK0 腳位配置
| 腳位 A1 | VDD — Power supply (1.35V) |
| 腳位 A2 | DQ0 — Data input/output 0 |
| 腳位 A3 | VSS — Ground |
| 腳位 B1 | DQ1 — Data input/output 1 |
| 腳位 B2 | VDDQ — I/O power supply |
| 腳位 B3 | DQ2 — Data input/output 2 |
| 腳位 C1 | DQ3 — Data input/output 3 |
| 腳位 C2 | VSSQ — I/O ground |
| 腳位 C3 | DQ4 — Data input/output 4 |
| 腳位 D1 | DQ5 — Data input/output 5 |
| 腳位 D2 | VDD — Power supply |
| 腳位 D3 | DQ6 — Data input/output 6 |
| 腳位 E1 | DQ7 — Data input/output 7 |
| 腳位 E2 | VSS — Ground |
| 腳位 E3 | DQS0 — Data strobe 0 |
| 腳位 F1 | DQS0# — Data strobe 0 complement |
| 腳位 F2 | VDDQ — I/O power supply |
| 腳位 F3 | DM0 — Data mask 0 |
| 腳位 G1 | CK — Clock |
| 腳位 G2 | CK# — Clock complement |
| 腳位 G3 | CKE — Clock enable |
| 腳位 H1 | CS# — Chip select |
| 腳位 H2 | RAS# — Row address strobe |
| 腳位 H3 | CAS# — Column address strobe |
| 腳位 J1 | WE# — Write enable |
| 腳位 J2 | A0 — Address input 0 |
| 腳位 J3 | A1 — Address input 1 |
| 腳位 K1 | A2 — Address input 2 |
| 腳位 K2 | A3 — Address input 3 |
| 腳位 K3 | A4 — Address input 4 |
| 腳位 L1 | A5 — Address input 5 |
| 腳位 L2 | A6 — Address input 6 |
| 腳位 L3 | A7 — Address input 7 |
| 腳位 M1 | A8 — Address input 8 |
| 腳位 M2 | A9 — Address input 9 |
| 腳位 M3 | A10/AP — Address input 10 / auto precharge |
| 腳位 N1 | A11 — Address input 11 |
| 腳位 N2 | A12 — Address input 12 |
| 腳位 N3 | A13 — Address input 13 |
| 腳位 P1 | A14 — Address input 14 |
| 腳位 P2 | BA0 — Bank address 0 |
| 腳位 P3 | BA1 — Bank address 1 |
| 腳位 R1 | BA2 — Bank address 2 |
| 腳位 R2 | ODT — On-die termination |
| 腳位 R3 | RESET# — Asynchronous reset |
| 腳位 T1 | VDD — Power supply |
| 腳位 T2 | VSS — Ground |
| 腳位 T3 | NC — No connect |
典型應用
K4B4G1646E-BYK0 適用於 6 應用s: Laptop Memory, Networking Equipment, Industrial PCs, Set-Top Boxes, Embedded Computing, Consumer Electronics.
Laptop Memory
The K4B4G1646E-BYK0 is ideal for laptop memory modules due to its low 1.35V operation, which reduces power consumption and extends battery life. Its 4Gb density and x16 organization allow for compact SO-DIMM designs. The DDR3-1600 data rate provides sufficient bandwidth for everyday computing tasks. When used in a dual-channel configuration, it can deliver up to 25.6 GB/s, ensuring smooth multitasking and multimedia performance. The 96-ball FBGA package enables thin module profiles, fitting into ultrabooks and thin-and-light laptops.
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Networking Equipment
In networking equipment such as routers and switches, the K4B4G1646E-BYK0 provides high-density, low-power memory for packet buffering and routing tables. Its 4Gb capacity supports large forwarding databases, while the 1.35V operation reduces heat generation in enclosed spaces. The DDR3-1600 speed ensures fast data throughput, essential for handling high-bandwidth network traffic. The device's on-die termination and ZQ calibration improve signal integrity, critical for reliable operation in noisy environments. The compact FBGA package allows for dense PCB layouts, enabling high-port-count designs.
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Industrial PCs
The K4B4G1646E-BYK0 is well-suited for industrial PCs that require reliable operation over a wide temperature range. Its 0°C to +95°C operating range ensures functionality in harsh environments. The low 1.35V supply reduces power dissipation, which is beneficial in fanless designs. The 4Gb density supports demanding industrial applications such as machine vision and process control. The DDR3-1600 data rate provides fast access to large datasets, improving system responsiveness. The 96-ball FBGA package is robust and suitable for vibration-prone environments.
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Set-Top Boxes
In set-top boxes, the K4B4G1646E-BYK0 provides cost-effective, low-power memory for video streaming and user interface rendering. Its 4Gb capacity is sufficient for buffering high-definition video streams and storing application data. The 1.35V operation reduces power consumption, important for always-on devices. The DDR3-1600 speed ensures smooth playback and fast channel switching. The compact FBGA package allows for small form factor designs, fitting into slim set-top box enclosures. The device's low power also simplifies thermal management, reducing the need for active cooling.
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Embedded Computing
The K4B4G1646E-BYK0 is ideal for embedded computing applications such as single-board computers and IoT gateways. Its low 1.35V operation is perfect for power-constrained designs, and the 4Gb density provides ample memory for Linux-based applications. The DDR3-1600 data rate supports fast data processing, enabling real-time analytics and edge computing. The 96-ball FBGA package is easy to route on multi-layer PCBs, simplifying layout. The device's wide temperature range makes it suitable for outdoor and industrial IoT deployments.
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Consumer Electronics
In consumer electronics like smart TVs and gaming consoles, the K4B4G1646E-BYK0 delivers high bandwidth and low power consumption. Its 4Gb density supports high-resolution graphics and multitasking. The 1.35V supply reduces energy costs and heat, contributing to quieter operation. The DDR3-1600 speed ensures smooth video playback and responsive user interfaces. The compact FBGA package enables slim device designs. The device's reliability and long lifecycle make it a preferred choice for mass-produced consumer products.
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推薦產品摘要
工程參考資料，適用於 K4B4G1646E-BYK0 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | K4B4G1646E-BCNB | MT41K256M16HA-125 | H5TC4G63AFR |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Micron Technology | SK Hynix |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | DDR3-1600 | DDR3-1600 | DDR3-1600 | DDR3-1600 |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
主要差異化特點
- Low 1.35V operation reduces power consumption by 20% compared to standard DDR3 (對比K4B4G1646E-BCNB)
- Samsung E-die process technology offers improved performance and power efficiency (對比MT41K256M16HA-125)
- Wide operating temperature range of 0°C to +95°C (對比H5TC4G63AFR)
設計說明
For reliable operation at 800 MHz, ensure controlled impedance traces for DQ, DQS, and clock signals. Use 50-ohm single-ended and 100-ohm differential routing. Keep trace lengths matched within ±10 mils for data and strobe pairs. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.
The K4B4G1646E-BYK0 has a maximum operating temperature of 95°C. In high-density designs, ensure adequate airflow or heatsinking to keep the junction temperature within limits. The 1.35V supply reduces power dissipation, but at high data rates, the device can still generate significant heat. Use thermal vias under the FBGA package to improve heat transfer to the PCB.
Use on-die termination (ODT) settings to match the memory bus impedance and reduce reflections. The device supports dynamic ODT, which can be configured via the mode registers. For DDR3-1600, typical ODT values are 40 ohms or 60 ohms. Ensure the memory controller is configured with the same ODT settings to maintain signal integrity.
合規資訊
RoHS compliant per JLCPCB listing. Other compliance data not specified in provided sources.
