K4B4G1646Q - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
MPN： K4B4G1646Q ✓ 啟用中K4B4G1646Q 概覽
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a reduced I/O voltage of 1.35V, compared to standard DDR3's 1.5V. This lower voltage reduces power consumption by approximately 15-20%, making it ideal for power-sensitive devices such as laptops, servers, and industrial systems. DDR3L is part of the DDR3 memory family, which uses an 8n-prefetch architecture to achieve high data rates, and is a predecessor to DDR4.
Key features of the K4B4G1646Q include a 16-bit data bus, a data rate of up to 1866 Mbps (PC3-14900), and a 96-ball FBGA package. It is lead-free and halogen-free, and RoHS compliant. The device supports a burst length of 8 (BL8) and on-die termination (ODT) for improved signal integrity. It also features programmable CAS latency and additive latency, allowing system designers to optimize performance.
Technically, the K4B4G1646Q uses Samsung's Q-die process technology, which is a 20nm-class DRAM process. This advanced process node enables higher density and lower power consumption compared to older D-die or E-die variants. The device includes an internal temperature sensor for self-refresh rate control, which helps manage power in thermally constrained environments.
Typical applications include main memory for laptops and ultrabooks, embedded systems, networking equipment, and industrial PCs. Its low voltage and high density make it suitable for designs where power efficiency and board space are critical.
When designing with this device, ensure proper decoupling capacitors are placed near the power pins, and follow the layout guidelines in the datasheet for the 96-ball FBGA package to maintain signal integrity at high data rates.
直接替換替代品，適用於 K4B4G1646Q — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： K4B4G1646Q （相同外形與佔位） — 差異在於 Package, Supply Voltage, Data Rate, Operating Temperature, CAS Latency.
K4B4G1646E-BYK0
✅ 直接替換聯絡詢價
查看資料表 →K4B4G1646D-BCK00
✅ 直接替換聯絡詢價
查看資料表 →K4B4G1646D-BMK0
✅ 直接替換聯絡詢價
查看資料表 →MT41K256M16HA-125
✅ 直接替換 ⚠️ 規格未經驗證✗ 缺貨
$6.3636 / 單位
查看資料表 →MT41K256M16TW-093
✅ 直接替換 ⚠️ 規格未經驗證✓ 有庫存
$15.5 / 單位
查看資料表 →IS43TR16256AL-125KBL
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →K4B4G1646Q 最大額定值與電氣特性
| 記憶體類型 | DDR3L SDRAM |
| Density | 4Gb |
| 組織 | 256M x 16 |
| 資料匯流排寬度 | 16 bits |
| 供應電壓 | 1.35V |
| 資料速率 | 1866 Mbps (PC3-14900) |
| 封裝 | 96-ball FBGA |
| Die | Q-die |
| Lead-Free | Yes |
| 無鹵素 | Yes |
| RoHS Compliant | Yes |
| Burst Length | 8 (BL8) |
| On-Die Termination | Yes (ODT) |
| CAS 延遲 | Programmable |
K4B4G1646Q 腳位配置
| 腳位 A1 | VDD — Power supply |
| 腳位 A2 | DQ0 — Data input/output 0 |
| 腳位 A3 | DQ1 — Data input/output 1 |
| 腳位 B1 | VSS — Ground |
| 腳位 B2 | DQ2 — Data input/output 2 |
| 腳位 B3 | DQ3 — Data input/output 3 |
| 腳位 C1 | VDDQ — I/O power supply |
| 腳位 C2 | DQ4 — Data input/output 4 |
| 腳位 C3 | DQ5 — Data input/output 5 |
| 腳位 D1 | VSSQ — I/O ground |
| 腳位 D2 | DQ6 — Data input/output 6 |
| 腳位 D3 | DQ7 — Data input/output 7 |
典型應用
K4B4G1646Q 適用於 6 應用s: Laptop and Ultrabook Main Memory, Embedded Systems, Networking Equipment, Industrial PCs, Servers and Data Centers, Consumer Electronics.
Laptop and Ultrabook Main Memory
The K4B4G1646Q's low 1.35V operation and 4Gb density make it ideal for laptop and ultrabook main memory. Its 16-bit bus width allows for flexible memory configurations, and the 96-ball FBGA package saves board space. The low power consumption extends battery life, while the 1866 Mbps data rate ensures responsive performance for everyday computing tasks.
推薦
Embedded Systems
In embedded systems, the K4B4G1646Q provides a balance of capacity and power efficiency. Its 4Gb density is sufficient for running operating systems and applications, while the 1.35V supply reduces thermal output. The 96-ball FBGA package is suitable for compact PCB designs, and the device's RoHS compliance meets environmental standards for industrial and consumer products.
推薦
Networking Equipment
The K4B4G1646Q is well-suited for networking equipment such as routers and switches, where high data throughput and reliability are critical. Its 1866 Mbps data rate supports fast packet processing, and the low voltage helps manage power in densely packed chassis. The device's on-die termination improves signal integrity, reducing errors in high-speed data transmission.
推薦
Industrial PCs
For industrial PCs, the K4B4G1646Q offers reliable performance in harsh environments. Its 4Gb capacity supports demanding applications like machine vision and process control, while the 1.35V operation reduces heat generation. The 96-ball FBGA package is robust and suitable for industrial-grade PCBs, and the device's long lifecycle ensures availability for long-term projects.
推薦
Servers and Data Centers
In servers and data centers, the K4B4G1646Q provides a cost-effective memory solution for entry-level servers. Its 4Gb density and 16-bit bus allow for flexible memory configurations, and the low voltage helps reduce overall power consumption. The device's high data rate supports virtualization and cloud computing workloads, making it a practical choice for budget-conscious deployments.
推薦
Consumer Electronics
The K4B4G1646Q is used in consumer electronics like smart TVs and set-top boxes, where low power and compact size are important. Its 4Gb capacity supports multimedia applications, and the 1.35V supply minimizes energy consumption. The 96-ball FBGA package enables slim device designs, and the device's RoHS compliance aligns with consumer product regulations.
推薦
推薦產品摘要
工程參考資料，適用於 K4B4G1646Q — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | K4B4G1646E-BYK0 | K4B4G1646D-BCK00 | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps |
| RoHS Compliant | Yes | Yes | Yes | Yes |
主要差異化特點
- Q-die process technology (對比K4B4G1646D-BCK00)
- Low voltage operation (對比MT41K256M16HA-125)
- Same-brand availability (對比MT41K256M16HA-125)
設計說明
The K4B4G1646Q operates at 1.35V, which is lower than standard DDR3's 1.5V. Ensure the power supply can provide a stable 1.35V rail with adequate decoupling. Use multiple 0.1uF ceramic capacitors near the VDD and VDDQ pins to filter high-frequency noise, and a bulk capacitor (e.g., 10uF) for transient currents.
For the 96-ball FBGA package, follow the layout guidelines in the datasheet. Maintain controlled impedance for the data and address lines, typically 50 ohms single-ended and 100 ohms differential. Keep the trace lengths matched to minimize skew, and place the device close to the controller to reduce signal degradation.
Ensure the memory controller is configured for DDR3L (1.35V) operation, not standard DDR3 (1.5V), to avoid damage. Also, verify the speed grade matches the system requirements. Incorrect termination settings can cause signal integrity issues, so use the on-die termination (ODT) features as specified in the datasheet.
合規資訊
RoHS compliant, lead-free, and halogen-free per datasheet. REACH and conflict minerals status not specified in the provided data.
