K4B4G1646Q - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
N.º de pieza: K4B4G1646Q ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.5 | $6.500,00 |
K4B4G1646Q Descripción general
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a reduced I/O voltage of 1.35V, compared to standard DDR3's 1.5V. This lower voltage reduces power consumption by approximately 15-20%, making it ideal for power-sensitive devices such as laptops, servers, and industrial systems. DDR3L is part of the DDR3 memory family, which uses an 8n-prefetch architecture to achieve high data rates, and is a predecessor to DDR4.
Key features of the K4B4G1646Q include a 16-bit data bus, a data rate of up to 1866 Mbps (PC3-14900), and a 96-ball FBGA package. It is lead-free and halogen-free, and RoHS compliant. The device supports a burst length of 8 (BL8) and on-die termination (ODT) for improved signal integrity. It also features programmable CAS latency and additive latency, allowing system designers to optimize performance.
Technically, the K4B4G1646Q uses Samsung's Q-die process technology, which is a 20nm-class DRAM process. This advanced process node enables higher density and lower power consumption compared to older D-die or E-die variants. The device includes an internal temperature sensor for self-refresh rate control, which helps manage power in thermally constrained environments.
Typical applications include main memory for laptops and ultrabooks, embedded systems, networking equipment, and industrial PCs. Its low voltage and high density make it suitable for designs where power efficiency and board space are critical.
When designing with this device, ensure proper decoupling capacitors are placed near the power pins, and follow the layout guidelines in the datasheet for the 96-ball FBGA package to maintain signal integrity at high data rates.
Alternativas directas para K4B4G1646Q — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con K4B4G1646Q (mismo factor de forma y huella) — difiere en Package, Supply Voltage, Data Rate, Operating Temperature, CAS Latency.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
K4B4G1646E-BYK0
✅ Sustitución directa✓ En stock
$1.8 / unidad
Ver hoja de datos →K4B4G1646D-BCK00
✅ Sustitución directa✓ En stock
$5.9 / unidad
Ver hoja de datos →K4B4G1646D-BMK0
✅ Sustitución directa✓ En stock
$5.9 / unidad
Ver hoja de datos →MT41K256M16HA-125
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6.3636 / unidad
Ver hoja de datos →MT41K256M16TW-093
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$15.5 / unidad
Ver hoja de datos →IS43TR16256AL-125KBL
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.6 / unidad
Ver hoja de datos →K4B4G1646Q Valores máximos y características eléctricas
| Tipo de memoria | DDR3L SDRAM |
| Density | 4Gb |
| Organización de memoria | 256M x 16 |
| Ancho del bus de datos | 16 bits |
| Tensión de alimentación | 1.35V |
| Velocidad de datos | 1866 Mbps (PC3-14900) |
| Encapsulado | 96-ball FBGA |
| Die | Q-die |
| Lead-Free | Yes |
| Sin halógenos | Yes |
| RoHS Compliant | Yes |
| Burst Length | 8 (BL8) |
| On-Die Termination | Yes (ODT) |
| Latencia CAS | Programmable |
Configuración de pines de K4B4G1646Q
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — I/O power supply |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin D1 | VSSQ — I/O ground |
| Pin D2 | DQ6 — Data input/output 6 |
| Pin D3 | DQ7 — Data input/output 7 |
Aplicaciones típicas
K4B4G1646Q es adecuado para 6 aplicacións: Laptop and Ultrabook Main Memory, Embedded Systems, Networking Equipment, Industrial PCs, Servers and Data Centers, Consumer Electronics.
Laptop and Ultrabook Main Memory
The K4B4G1646Q's low 1.35V operation and 4Gb density make it ideal for laptop and ultrabook main memory. Its 16-bit bus width allows for flexible memory configurations, and the 96-ball FBGA package saves board space. The low power consumption extends battery life, while the 1866 Mbps data rate ensures responsive performance for everyday computing tasks.
Recomendado
Embedded Systems
In embedded systems, the K4B4G1646Q provides a balance of capacity and power efficiency. Its 4Gb density is sufficient for running operating systems and applications, while the 1.35V supply reduces thermal output. The 96-ball FBGA package is suitable for compact PCB designs, and the device's RoHS compliance meets environmental standards for industrial and consumer products.
Recomendado
Networking Equipment
The K4B4G1646Q is well-suited for networking equipment such as routers and switches, where high data throughput and reliability are critical. Its 1866 Mbps data rate supports fast packet processing, and the low voltage helps manage power in densely packed chassis. The device's on-die termination improves signal integrity, reducing errors in high-speed data transmission.
Recomendado
Industrial PCs
For industrial PCs, the K4B4G1646Q offers reliable performance in harsh environments. Its 4Gb capacity supports demanding applications like machine vision and process control, while the 1.35V operation reduces heat generation. The 96-ball FBGA package is robust and suitable for industrial-grade PCBs, and the device's long lifecycle ensures availability for long-term projects.
Recomendado
Servers and Data Centers
In servers and data centers, the K4B4G1646Q provides a cost-effective memory solution for entry-level servers. Its 4Gb density and 16-bit bus allow for flexible memory configurations, and the low voltage helps reduce overall power consumption. The device's high data rate supports virtualization and cloud computing workloads, making it a practical choice for budget-conscious deployments.
Recomendado
Consumer Electronics
The K4B4G1646Q is used in consumer electronics like smart TVs and set-top boxes, where low power and compact size are important. Its 4Gb capacity supports multimedia applications, and the 1.35V supply minimizes energy consumption. The 96-ball FBGA package enables slim device designs, and the device's RoHS compliance aligns with consumer product regulations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para K4B4G1646Q — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | K4B4G1646E-BYK0 | K4B4G1646D-BCK00 | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps |
| RoHS Compliant | Yes | Yes | Yes | Yes |
Diferenciadores clave
- Q-die process technology (frente a K4B4G1646D-BCK00)
- Low voltage operation (frente a MT41K256M16HA-125)
- Same-brand availability (frente a MT41K256M16HA-125)
Notas de diseño
The K4B4G1646Q operates at 1.35V, which is lower than standard DDR3's 1.5V. Ensure the power supply can provide a stable 1.35V rail with adequate decoupling. Use multiple 0.1uF ceramic capacitors near the VDD and VDDQ pins to filter high-frequency noise, and a bulk capacitor (e.g., 10uF) for transient currents.
For the 96-ball FBGA package, follow the layout guidelines in the datasheet. Maintain controlled impedance for the data and address lines, typically 50 ohms single-ended and 100 ohms differential. Keep the trace lengths matched to minimize skew, and place the device close to the controller to reduce signal degradation.
Ensure the memory controller is configured for DDR3L (1.35V) operation, not standard DDR3 (1.5V), to avoid damage. Also, verify the speed grade matches the system requirements. Incorrect termination settings can cause signal integrity issues, so use the on-die termination (ODT) features as specified in the datasheet.
Información de cumplimiento
RoHS compliant, lead-free, and halogen-free per datasheet. REACH and conflict minerals status not specified in the provided data.
