XCZU19EG-1FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
MPN： XCZU19EG-1FFVC1760E ✓ 啟用中XCZU19EG-1FFVC1760E 概覽
A System-on-Chip (SoC) FPGA combines a hard processor system (PS) with programmable logic (PL) on a single die, enabling software-defined functionality with hardware acceleration. The Zynq UltraScale+ MPSoC family extends this concept with heterogeneous processing, supporting asymmetric multiprocessing and real-time control alongside FPGA fabric.
Key features include 1143K+ logic cells, 500MHz/600MHz/1.2GHz processor clock speeds, and a 1760-ball FCBGA package. The EG variant provides extensive DSP and block RAM resources for compute-intensive applications. The device supports high-speed transceivers, PCIe, and DDR4 memory interfaces.
Architecturally, the device uses TSMC 16nm FinFET process technology, balancing performance with power efficiency. The programmable logic is based on the UltraScale+ architecture, featuring configurable logic blocks, DSP48E2 slices, and UltraRAM. The PS subsystem includes memory controllers, peripheral interfaces, and security features.
Typical applications include aerospace and defense signal processing, automotive driver assistance systems, industrial automation, and data center acceleration. The combination of ARM processing and FPGA fabric makes it suitable for edge computing and real-time control.
When designing with this device, consider power sequencing requirements and thermal management. The 1760-FCBGA package requires careful PCB layout for signal integrity and power delivery. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for detailed design guidelines.
直接替換替代品，適用於 XCZU19EG-1FFVC1760E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XCZU19EG-1FFVC1760E （相同外形與佔位） — 差異在於 Operating Temperature, Processor Core, Speed Grade.
XCZU19EG-2FFVC1760E
✅ 直接替換聯絡詢價
查看資料表 →XCZU19EG-1FFVC1760I
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU19EG-2FFVC1760I
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU19EG-L2FFVD1760E
✅ 直接替換📋 參考替代品（不在目錄中）
XCZU19EG-1FFVD1760E
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XCZU19EG-1FFVC1760E 最大額定值與電氣特性
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| Logic Cells | 1143K+ |
| Processor Clock Speed | 500MHz, 600MHz, 1.2GHz |
| 封裝 | 1760-FCBGA (42.5x42.5 mm) |
| 工作溫度 | 0°C to 100°C (TJ) |
| 安裝類型 | Surface Mount |
| Terminal Form | BALL |
| Number of Terminals | 1760 |
| Package Code | BGA |
| Package Shape | RECTANGULAR |
| Speed Grade | -1 |
XCZU19EG-1FFVC1760E 腳位配置
| 腳位 A1 | VCCINT — Core logic power supply |
| 腳位 A2 | GND — Ground |
| 腳位 B1 | VCCO_0 — I/O bank 0 power supply |
| 腳位 B2 | IO_L1P_T0 — Differential I/O pair |
| 腳位 C1 | IO_L1N_T0 — Differential I/O pair |
| 腳位 C2 | VCCAUX — Auxiliary power supply |
| 腳位 D1 | DDR4_DQ[0] — DDR4 data line |
| 腳位 D2 | DDR4_DQ[1] — DDR4 data line |
| 腳位 E1 | DDR4_DQS[0] — DDR4 data strobe |
| 腳位 E2 | DDR4_DM[0] — DDR4 data mask |
| 腳位 F1 | GTY_REFCLK0 — GTY transceiver reference clock |
| 腳位 F2 | GTY_TX0_P — GTY transceiver transmit positive |
典型應用
XCZU19EG-1FFVC1760E 適用於 6 應用s: Aerospace and Defense Signal Processing, Automotive Driver Assistance Systems, Industrial Automation and Control, Data Center Acceleration, Medical Imaging and Diagnostics, Wireless Communication Infrastructure.
Aerospace and Defense Signal Processing
The XCZU19EG-1FFVC1760E excels in aerospace and defense applications requiring high-throughput signal processing. Its 1143K+ logic cells and quad-core Cortex-A53 enable real-time radar, sonar, and electronic warfare processing. The programmable logic accelerates FFT and beamforming algorithms, while the ARM cores handle system control and communication protocols. The 1760-FCBGA package supports high-density PCB designs for mission-critical systems.
推薦
Automotive Driver Assistance Systems
In automotive ADAS applications, the XCZU19EG-1FFVC1760E provides the processing power for sensor fusion, object detection, and decision-making. The dual-core Cortex-R5 handles real-time control tasks, while the Cortex-A53 runs Linux-based applications. The programmable logic accelerates neural network inference and image processing. The device's 0°C to 100°C temperature range suits under-hood environments.
推薦
Industrial Automation and Control
The XCZU19EG-1FFVC1760E is ideal for industrial automation, offering real-time control and flexible I/O. The dual-core Cortex-R5 provides deterministic response for motion control, while the programmable logic implements custom communication protocols like EtherCAT and PROFINET. The Mali-400 GPU supports HMI graphics. The device's robust design handles harsh industrial environments.
推薦
Data Center Acceleration
For data center workloads, the XCZU19EG-1FFVC1760E provides hardware acceleration for networking, storage, and compute-intensive applications. The programmable logic implements custom packet processing and compression algorithms, while the ARM cores handle management and control plane functions. The device supports PCIe and DDR4 interfaces for high-bandwidth data movement.
推薦
Medical Imaging and Diagnostics
In medical imaging, the XCZU19EG-1FFVC1760E enables real-time processing of ultrasound, CT, and MRI data. The programmable logic accelerates image reconstruction and filtering, while the ARM cores run the imaging application software. The Mali-400 GPU supports 3D visualization. The device's high logic density and DSP resources handle complex algorithms.
推薦
Wireless Communication Infrastructure
The XCZU19EG-1FFVC1760E is suited for 5G and wireless infrastructure, providing baseband processing and beamforming. The programmable logic implements PHY layer functions, while the ARM cores handle protocol stack and network management. The device supports high-speed serial transceivers for fronthaul/backhaul interfaces. Its processing power enables massive MIMO and advanced modulation schemes.
推薦
推薦產品摘要
工程參考資料，適用於 XCZU19EG-1FFVC1760E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XCZU19EG-2FFVC1760E | XCZU19EG-1FFVC1760I | XCZU19EG-2FFVC1760I | XCZU19EG-L2FFVD1760E |
|---|---|---|---|---|---|
| Package | 1760-FCBGA (42.5x42.5 mm) | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -2 | -L2 |
| Temperature Range | 0°C to 100°C (TJ) | 0°C to 100°C (TJ) | Extended industrial | Extended industrial | 0°C to 100°C (TJ) |
| Logic Cells | 1143K+ | 1143K+ | 1143K+ | 1143K+ | 1143K+ |
| Processor Clock | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz |
| Package Code | BGA | BGA | BGA | BGA | BGA |
主要差異化特點
- Higher speed grade option (對比XCZU19EG-1FFVC1760E)
- Extended temperature range option (對比XCZU19EG-1FFVC1760E)
- Low-voltage capable option (對比XCZU19EG-1FFVC1760E)
設計說明
The XCZU19EG-1FFVC1760E requires multiple power rails including VCCINT, VCCAUX, and VCCO. Proper power sequencing is critical to prevent damage. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for recommended power-up sequences and decoupling capacitor requirements.
The 1760-FCBGA package dissipates significant heat under full load. A heatsink and forced airflow are recommended for sustained operation. The 0°C to 100°C junction temperature range must be respected. Use thermal vias and copper pours for effective heat spreading.
The 1760-ball FCBGA requires a high-layer-count PCB with controlled impedance for high-speed signals. Follow AMD layout guidelines for DDR4, GTY transceivers, and PCIe interfaces. Use blind and buried vias for routing density.
合規資訊
Compliance information not provided in verified web data. Contact AMD for RoHS/REACH certification details.
