H5TC4G63CFR-H9A - 4Gb DDR3L SDRAM 96-FBGA | SK hynix
MPN: H5TC4G63CFR-H9A ✓ פעילH5TC4G63CFR-H9A סקירה
DDR3L SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining backward compatibility with DDR3 environments. It is part of the DDR3 memory family, which uses double data rate architecture to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is widely used in laptops, embedded systems, and networking equipment where energy efficiency is critical.
Key features include fully differential clock inputs (CK, CK), differential data strobe (DQS, DQS), and an on-chip DLL that aligns DQ, DQS, and DQS transitions with CK transitions. The DM (data mask) function masks write data at both rising and falling edges, ensuring data integrity. The device supports burst lengths of 8 and 4 (with burst chop), and features programmable CAS latency and additive latency for flexible timing.
The H5TC4G63CFR-H9A is designed for high-bandwidth, low-power main memory applications. Its 4Gb density and x16 organization make it ideal for applications requiring large memory capacity with a moderate bus width. The 96-ball TFBGA package offers excellent thermal and electrical performance, with a ball pitch of 0.8mm, facilitating high-density PCB layouts.
Typical applications include laptops and ultrabooks, embedded computing, networking switches and routers, and industrial automation systems. The low operating voltage and high bandwidth make it suitable for battery-powered devices and energy-conscious designs.
When designing with this component, ensure proper decoupling capacitors are placed near the VDD and VDDQ pins to minimize noise. The device requires a stable 1.35V supply and careful signal integrity management for the high-speed data bus. Refer to the datasheet for detailed timing parameters and PCB layout guidelines.
חלופות תחליף ישיר עבור H5TC4G63CFR-H9A — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם H5TC4G63CFR-H9A (אותו גורם צורה וטביעת רגל) — שונים ב Package, Burst Length, Supply Voltage, CAS Latency, Data Rate.
H5TC4G63AFR-H9A
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←H5TC4G63CFR-H9I
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←H5TC4G63CFR-H9J
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←K4B4G1646E-BYK0
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←MT41K256M16HA-125
✅ Drop-In ⚠️ מפרטים לא מאומתים✗ אזל מהמלאי
$6.3636 / יחידה
הצג גיליון נתונים ←IS43TR16256AL-125KBL
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←H5TC4G63CFR-H9A דירוגים מרביים ומאפיינים חשמליים
| סוג זיכרון | DDR3L SDRAM |
| Memory Density | 4Gb (4294967296 bit) |
| ארגון | 256M x 16 |
| Supply Voltage (VDD) | 1.35V + 0.100 / - 0.067V |
| Supply Voltage (VDDQ) | 1.35V + 0.100 / - 0.067V |
| מארז | 96-ball TFBGA |
| Number of Terminals | 96 |
| Package Shape | RECTANGULAR |
| סטטוס RoHS | Compliant |
| Lead-Free | Yes |
| נטול הלוגנים | Yes |
| Burst Length | 8, 4 (with burst chop) |
| Differential Clock Inputs | Yes (CK, CK) |
| Differential Data Strobe | Yes (DQS, DQS) |
| On-Chip DLL | Yes |
| DM (Data Mask) | Yes |
תצורת פינים של H5TC4G63CFR-H9A
| פין A1 | VDD — Power supply |
| פין A2 | DQ0 — Data input/output 0 |
| פין A3 | DQ1 — Data input/output 1 |
| פין A4 | VSS — Ground |
| פין A5 | DQ2 — Data input/output 2 |
| פין A6 | DQ3 — Data input/output 3 |
| פין A7 | VDDQ — Power supply for output |
| פין A8 | DQ4 — Data input/output 4 |
| פין A9 | DQ5 — Data input/output 5 |
| פין A10 | VSS — Ground |
| פין A11 | DQ6 — Data input/output 6 |
| פין A12 | DQ7 — Data input/output 7 |
| פין B1 | VSS — Ground |
| פין B2 | DQ8 — Data input/output 8 |
| פין B3 | DQ9 — Data input/output 9 |
| פין B4 | VDD — Power supply |
| פין B5 | DQ10 — Data input/output 10 |
| פין B6 | DQ11 — Data input/output 11 |
| פין B7 | VSS — Ground |
| פין B8 | DQ12 — Data input/output 12 |
| פין B9 | DQ13 — Data input/output 13 |
| פין B10 | VDDQ — Power supply for output |
| פין B11 | DQ14 — Data input/output 14 |
| פין B12 | DQ15 — Data input/output 15 |
| פין C1 | VDDQ — Power supply for output |
| פין C2 | VSS — Ground |
| פין C3 | VDD — Power supply |
| פין C4 | VSS — Ground |
| פין C5 | VDDQ — Power supply for output |
| פין C6 | VSS — Ground |
| פין C7 | VDD — Power supply |
| פין C8 | VSS — Ground |
| פין C9 | VDDQ — Power supply for output |
| פין C10 | VSS — Ground |
| פין C11 | VDD — Power supply |
| פין C12 | VSS — Ground |
| פין D1 | CK — Clock input |
| פין D2 | CK — Complementary clock input |
| פין D3 | VSS — Ground |
| פין D4 | CKE — Clock enable |
| פין D5 | VDD — Power supply |
| פין D6 | VSS — Ground |
| פין D7 | VDDQ — Power supply for output |
| פין D8 | VSS — Ground |
| פין D9 | VDD — Power supply |
| פין D10 | VSS — Ground |
| פין D11 | VDDQ — Power supply for output |
| פין D12 | VSS — Ground |
| פין E1 | RAS — Row address strobe |
| פין E2 | CAS — Column address strobe |
| פין E3 | WE — Write enable |
| פין E4 | CS — Chip select |
| פין E5 | VDD — Power supply |
| פין E6 | VSS — Ground |
| פין E7 | VDDQ — Power supply for output |
| פין E8 | VSS — Ground |
| פין E9 | VDD — Power supply |
| פין E10 | VSS — Ground |
| פין E11 | VDDQ — Power supply for output |
| פין E12 | VSS — Ground |
| פין F1 | A0 — Address input 0 |
| פין F2 | A1 — Address input 1 |
| פין F3 | A2 — Address input 2 |
| פין F4 | A3 — Address input 3 |
| פין F5 | VDD — Power supply |
| פין F6 | VSS — Ground |
| פין F7 | VDDQ — Power supply for output |
| פין F8 | VSS — Ground |
| פין F9 | VDD — Power supply |
| פין F10 | VSS — Ground |
| פין F11 | VDDQ — Power supply for output |
| פין F12 | VSS — Ground |
| פין G1 | A4 — Address input 4 |
| פין G2 | A5 — Address input 5 |
| פין G3 | A6 — Address input 6 |
| פין G4 | A7 — Address input 7 |
| פין G5 | VDD — Power supply |
| פין G6 | VSS — Ground |
| פין G7 | VDDQ — Power supply for output |
| פין G8 | VSS — Ground |
| פין G9 | VDD — Power supply |
| פין G10 | VSS — Ground |
| פין G11 | VDDQ — Power supply for output |
| פין G12 | VSS — Ground |
| פין H1 | A8 — Address input 8 |
| פין H2 | A9 — Address input 9 |
| פין H3 | A10/AP — Address input 10 / Auto-precharge |
| פין H4 | A11 — Address input 11 |
| פין H5 | VDD — Power supply |
| פין H6 | VSS — Ground |
| פין H7 | VDDQ — Power supply for output |
| פין H8 | VSS — Ground |
| פין H9 | VDD — Power supply |
| פין H10 | VSS — Ground |
| פין H11 | VDDQ — Power supply for output |
| פין H12 | VSS — Ground |
| פין J1 | A12 — Address input 12 |
| פין J2 | A13 — Address input 13 |
| פין J3 | BA0 — Bank address 0 |
| פין J4 | BA1 — Bank address 1 |
| פין J5 | VDD — Power supply |
| פין J6 | VSS — Ground |
| פין J7 | VDDQ — Power supply for output |
| פין J8 | VSS — Ground |
| פין J9 | VDD — Power supply |
| פין J10 | VSS — Ground |
| פין J11 | VDDQ — Power supply for output |
| פין J12 | VSS — Ground |
| פין K1 | BA2 — Bank address 2 |
| פין K2 | ODT — On-die termination |
| פין K3 | VSS — Ground |
| פין K4 | VDD — Power supply |
| פין K5 | VSS — Ground |
| פין K6 | VDDQ — Power supply for output |
| פין K7 | VSS — Ground |
| פין K8 | VDD — Power supply |
| פין K9 | VSS — Ground |
| פין K10 | VDDQ — Power supply for output |
| פין K11 | VSS — Ground |
| פין K12 | VDD — Power supply |
| פין L1 | DM — Data mask |
| פין L2 | DQS — Data strobe |
| פין L3 | DQS — Complementary data strobe |
| פין L4 | VSS — Ground |
| פין L5 | VDDQ — Power supply for output |
| פין L6 | VSS — Ground |
| פין L7 | VDD — Power supply |
| פין L8 | VSS — Ground |
| פין L9 | VDDQ — Power supply for output |
| פין L10 | VSS — Ground |
| פין L11 | VDD — Power supply |
| פין L12 | VSS — Ground |
| פין M1 | VSS — Ground |
| פין M2 | VDD — Power supply |
| פין M3 | VSS — Ground |
| פין M4 | VDDQ — Power supply for output |
| פין M5 | VSS — Ground |
| פין M6 | VDD — Power supply |
| פין M7 | VSS — Ground |
| פין M8 | VDDQ — Power supply for output |
| פין M9 | VSS — Ground |
| פין M10 | VDD — Power supply |
| פין M11 | VSS — Ground |
| פין M12 | VDDQ — Power supply for output |
יישומים טיפוסיים
H5TC4G63CFR-H9A מתאים עבור 6 יישוםs: Laptops and Ultrabooks, Embedded Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Networking and Communications.
Laptops and Ultrabooks
The H5TC4G63CFR-H9A is ideal for laptops and ultrabooks due to its low 1.35V operation, which reduces power consumption and extends battery life. Its 4Gb density and x16 organization provide sufficient memory capacity for mainstream computing tasks. The 96-ball TFBGA package allows for compact PCB designs, essential for thin and light form factors. With a data rate of up to 1866 Mbps (typical for DDR3L), it delivers the bandwidth needed for smooth multitasking and multimedia applications. The low operating voltage also reduces heat generation, improving thermal management in confined spaces.
מומלץ
Embedded Computing
In embedded systems, the H5TC4G63CFR-H9A provides high-density, low-power memory for applications such as industrial PCs, point-of-sale terminals, and medical devices. Its 1.35V supply reduces power consumption, which is critical for fanless designs. The x16 organization simplifies interfacing with embedded processors that have 16-bit memory buses. The device's support for burst lengths of 8 and 4 allows efficient data transfers, and the on-chip DLL ensures reliable timing. The 96-ball TFBGA package is suitable for automated assembly, and the RoHS compliance meets environmental regulations.
מומלץ
Networking Equipment
The H5TC4G63CFR-H9A is well-suited for networking switches and routers, where high bandwidth and low power are essential. Its 4Gb density allows for large packet buffers, and the x16 organization matches common network processor interfaces. The low 1.35V operation reduces power dissipation in dense line cards, improving system reliability. The differential clock and data strobe inputs ensure signal integrity at high speeds, critical for error-free data transmission. The device's RoHS compliance is important for global market access.
מומלץ
Industrial Automation
In industrial automation, the H5TC4G63CFR-H9A provides reliable memory for PLCs, robotics controllers, and HMI systems. Its wide operating temperature range (if specified) supports harsh environments. The low power consumption reduces heat, which is beneficial in sealed enclosures. The 96-ball TFBGA package offers good thermal performance, and the device's high bandwidth supports real-time data processing. The RoHS compliance ensures environmental safety in industrial settings.
מומלץ
Consumer Electronics
The H5TC4G63CFR-H9A is used in consumer electronics such as smart TVs, set-top boxes, and gaming consoles. Its 4Gb density provides ample memory for multimedia applications, and the low 1.35V operation reduces power consumption, which is important for energy-efficient devices. The x16 organization is compatible with many SoCs, and the compact TFBGA package allows for slim product designs. The device's high bandwidth supports smooth video playback and responsive user interfaces.
מומלץ
Networking and Communications
The H5TC4G63CFR-H9A is also used in communication infrastructure such as base stations and network appliances. Its high density and low power make it suitable for buffer memory in packet processing. The differential signaling ensures reliable operation at high frequencies, and the on-chip DLL helps maintain timing accuracy. The device's RoHS compliance is essential for global deployment. The 96-ball TFBGA package is suitable for high-density PCB designs.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור H5TC4G63CFR-H9A — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | H5TC4G63AFR-H9A | H5TC4G63CFR-H9I | H5TC4G63CFR-H9J | K4B4G1646E-BYK0 | MT41K256M16HA-125 | IS43TR16256AL-125KBL |
|---|---|---|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball FBGA | 96-ball FBGA | 96-ball TFBGA |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | Samsung | Micron | ISSI |
| Memory Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Speed Grade | H9A (1866 Mbps) | H9A (1866 Mbps) | H9I (1600 Mbps) | H9J (1333 Mbps) | BYK0 (1866 Mbps) | -125 (1600 Mbps) | -125 (1600 Mbps) |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1333 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
מבדילים עיקריים
- Low power consumption (לעומתK4B4G1646E-BYK0)
- High speed grade (לעומתMT41K256M16HA-125)
- Same-brand availability (לעומתIS43TR16256AL-125KBL)
הערות תכנון
Ensure stable 1.35V supply for VDD and VDDQ. Use low-ESR decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each power pin to minimize noise. The tolerance is +0.100V / -0.067V, so a well-regulated supply is critical. Consider using a dedicated DDR3L power solution to maintain voltage accuracy under load transients.
For high-speed DDR3L signals, maintain controlled impedance (typically 50 ohms single-ended, 100 ohms differential) and keep trace lengths matched within 50 mils. Place the device close to the controller to minimize stub effects. Use ground planes to provide a return path and reduce EMI. Follow the layout guidelines in the SK hynix datasheet for optimal signal integrity.
The H5TC4G63CFR-H9A in a 96-ball TFBGA package has a thermal resistance that depends on PCB design. Ensure adequate thermal vias and copper pour under the package to dissipate heat. The device's low 1.35V operation reduces power dissipation, but in high-density systems, monitor junction temperature to stay within the specified operating range.
מידע על תאימות
RoHS compliant and lead-free/halogen-free per datasheet. REACH and conflict minerals status not specified in provided data.
