Infineon

1ED3142MC12HXUMA1 - 6A Isolated Gate Driver | Infineon EiceDRIVER

MPN: 1ED3142MC12HXUMA1 ✓ Active
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3000 Vrms Vdss 6 A Id PG-DSO-8 (PG-LDSO-8-1) Package
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Price updated: 2026-09-14
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Qty Unit Price Extended
1 $2.85 $2.85
10 $2.45 $24.50
100 $1.98 $198.00
500 $1.72 $860.00
1,000 $1.48 $1,480.00
3,000 $1.32 $3,960.00
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Drop-in alternatives for 1ED3142MC12HXUMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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2ED21844S06JXUMA1

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2ED2106S06FXUMA1

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1ED3142MC12HXUMA1 Maximum Ratings & Electrical Characteristics

Manufacturer Infineon Technologies
Part Number 1ED3142MC12HXUMA1
Product Family EiceDRIVER X3 Compact
Driver Type Isolated single-channel gate driver
Isolation Technology Coreless transformer (galvanic)
Isolation Voltage 3000 Vrms
Number of Channels 1
Number of Outputs 2 (separate source/sink)
Configuration Inverting, Non-Inverting
Source Drive Current 6 A
Sink Drive Current 6.5 A
Maximum Rise Time 20 ns
Maximum Fall Time 20 ns
Propagation Delay (typ.) 40 ns
Supported Switches IGBT, MOSFET, SiC MOSFET
Package PG-DSO-8 (PG-LDSO-8-1)
Mounting Type Surface Mount
EU RoHS Compliant
Part Status Active
ECCN EAR99

1ED3142MC12HXUMA1 Pin Configuration

SOIC-8 Package Pinout Diagram SOIC-8 8-pin small outline IC, 3.9x4.9mm, P1.27mm, JEDEC MS-012. 1 8 2 7 3 6 4 5 SOIC-8
Pin 1 VCC1 — Primary-side (low-voltage) supply, 3.1 V to 5.5 V
Pin 2 GND1 — Primary-side ground, reference for control logic
Pin 3 IN+ — Non-inverting PWM input from MCU/FPGA
Pin 4 IN- — Inverting PWM input (optional)
Pin 5 GND2 — Secondary-side ground reference for the driven switch
Pin 6 VCC2 — Secondary-side (gate-drive) supply, UVLO-referenced
Pin 7 OUT_L — Gate-drive sink output (pull-down)
Pin 8 OUT — Gate-drive source output (pull-up)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 1ED3142MC12HXUMA1 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this component. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

1ED3142MC12HXUMA1 is suitable for 6 applications: Industrial Servo Drives, Photovoltaic String Inverters, On-Board EV Chargers (OBC), Telecom Rectifier Modules, Industrial Welding Power Supplies, Solar Microinverters and Power Optimizers.

🏭

Industrial Servo Drives

The 1ED3142MC12HXUMA1 fits servo drives because its 6 A source / 6.5 A sink drive current and 40 ns typical propagation delay satisfy the switching demands of 600 V/1200 V IGBT half-bridges used in three-phase inverters. The 3000 Vrms coreless-transformer isolation meets IEC 61800-5-1 reinforced-insulation requirements, while high CMTI rejects the fast dv/dt events from IGBT turn-off. Placed between the control MCU and the IGBT module, the part sequences gate charge and discharge through 5-10 Ω gate resistors, reducing switching losses versus discrete driver designs.

Photovoltaic String Inverters

In PV string inverters, the 1ED3142MC12HXUMA1 drives SiC MOSFETs and IGBTs in the DC-AC conversion stage with its 6 A source/6.5 A sink drive strength. The 40 ns propagation delay and 20 ns rise/fall times enable switching frequencies above 50 kHz, reducing output-filter magnetics size. The 3000 Vrms isolation supports the high DC-link voltage and provides reinforced insulation for grid-tie safety per IEC 62109. Mount the part with a low-inductance bootstrap diode and 1 µF X7R bypass capacitor for stable VCC2 operation.

🚗

On-Board EV Chargers (OBC)

The 1ED3142MC12HXUMA1 supports OBC PFC and DCDC stages by driving 650 V/1200 V SiC MOSFETs in totem-pole and LLC topologies. Its high CMTI (>100 kV/μs) rejects the high dv/dt from SiC switching, while 6 A drive strength ensures rapid gate charging to minimize transition losses. The PG-DSO-8 footprint with reinforced isolation simplifies PCB layout and meets IEC 60664-1 creepage for 800 V battery systems. Use separate source/sink gate resistors for tunable EMI and switching-loss balance.

🌐

Telecom Rectifier Modules

In 48 V telecom rectifiers and -48 V HVDC modules, the 1ED3142MC12HXUMA1 drives the primary-side MOSFETs of a DCDC stage with reinforced isolation to meet IEC 62368-1. Its 40 ns propagation delay enables higher switching frequencies that shrink the transformer, while 6 A drive handles 600 V or 800 V primary MOSFETs. The coreless-transformer isolation integrates the safety barrier without an optocoupler, increasing MTBF in always-on telecom applications.

🏭

Industrial Welding Power Supplies

Welding inverters rely on robust gate drivers to handle 600 V/1200 V IGBT modules at high switching currents; the 1ED3142MC12HXUMA1 fits this role with 6.5 A sink current that pulls the gate below threshold quickly, preventing Miller-induced shoot-through. The 3000 Vrms reinforced isolation survives the high dv/dt and noisy environment, while the wide-body PG-DSO-8 package maintains creepage under harsh industrial pollution. Pair with a 1 W bootstrap diode and 22 µF X7R VCC2 capacitor for sustained high-duty-cycle operation.

Solar Microinverters and Power Optimizers

In microinverters and module-level power optimizers, the 1ED3142MC12HXUMA1 drives the high-frequency primary MOSFETs of a DCDC stage with reinforced isolation to the grid side. Its compact PG-DSO-8 footprint and 6 A drive strength suit 300 W class designs where PCB area is constrained. The 40 ns propagation delay enables zero-voltage-switching (ZVS) phase-shift topologies, while high CMTI maintains reliability under rapid switching transients.

What is the output drive current of the 1ED3142MC12HXUMA1?
The 1ED3142MC12HXUMA1 from Infineon's EiceDRIVER X3 Compact family delivers 6 A source and 6.5 A sink drive current per the manufacturer datasheet. This drive strength is sufficient to switch most 600 V/650 V/1200 V IGBTs and SiC MOSFETs at frequencies up to several hundred kilohertz when used with appropriately sized gate resistors.
What is the isolation voltage of the 1ED3142MC12HXUMA1?
The 1ED3142MC12HXUMA1 provides 3000 Vrms galvanic isolation through a coreless transformer according to the verified distributor listing. This rating supports reinforced insulation per IEC 60747-17 for typical industrial 600 V and 1200 V bus designs when PCB creepage and clearance guidelines are observed.
What package does the 1ED3142MC12HXUMA1 use?
The 1ED3142MC12HXUMA1 is offered in a PG-DSO-8 package, also referred to as PG-LDSO-8-1 on DigiKey. This 8-pin surface-mount wide-body DSO package provides the creepage needed for reinforced isolation and is pin-compatible with the rest of the EiceDRIVER X3 Compact family.
What is the typical propagation delay of the 1ED3142MC12HXUMA1?
The 1ED3142MC12HXUMA1 has a typical propagation delay of 40 ns according to Infineon's datasheet and Arrow's technical listing. Combined with matched rise and fall times of 20 ns, this enables switching frequencies well above 100 kHz in half-bridge topologies.
Where can I buy the 1ED3142MC12HXUMA1 online?
The 1ED3142MC12HXUMA1 is in stock at LCSC at $1.4798 per unit as of 2026-09-14, and is also available from authorized distributors DigiKey, Mouser, and Arrow. Lead time is generally same-day to two weeks through authorized channels, with multi-source options to mitigate supply risk.
What is the price of the 1ED3142MC12HXUMA1?
The 1ED3142MC12HXUMA1 is priced from approximately $1.31 in 3000-unit quantities as of 2026-09-14 per LCSC's catalog, with single-piece pricing closer to $2.85 at franchised distributors like DigiKey and Mouser. Volume discounts reduce the unit cost meaningfully above 500 pieces.
Is the 1ED3142MC12HXUMA1 in stock?
Yes, the 1ED3142MC12HXUMA1 is showing active inventory at LCSC, JLCPCB, DigiKey, and Mouser as of 2026-09-14. DigiKey lists ships-today availability. Demand for SiC-friendly isolated drivers continues to grow, so procuring in advance of design freeze is recommended.
1ED3142MC12HXUMA1 vs 1ED3125MU12FXUMA1 - which is better for SiC MOSFETs?
Both parts come from the EiceDRIVER family with the same PG-DSO-8 footprint, but the 1ED3142MC12HXUMA1 offers a higher 6.5 A sink current and tighter 40 ns propagation delay versus the 1ED3125MU12FXUMA1's 5 A sink. For SiC MOSFETs that demand high dv/dt immunity and fast fall times, the 1ED3142MC12H variant is generally preferred.
1ED3142MC12HXUMA1 vs UCC21750 - which should I choose for an EV charger?
The 1ED3142MC12HXUMA1 (coreless-transformer isolation, 6 A/6.5 A drive, 40 ns delay) and the UCC21750 (capacitive isolation, 10 A drive, similar delay) are both automotive-friendly isolated drivers. Choose 1ED3142MC12H when CMTI robustness above 100 kV/μs and a compact 8-pin DSO are priorities; choose UCC21750 when you need integrated Miller clamp or higher drive current.
When should I choose the 1ED3142MC12HXUMA1 over a non-isolated gate driver?
Choose the 1ED3142MC12HXUMA1 whenever the low-voltage controller must remain galvanically isolated from a switching node above 50 V, or when functional-safety/regulatory requirements demand reinforced insulation per IEC 60747-17. For low-side only switches below 50 V, a non-isolated driver like the IRS2004STRPBF is more cost-effective.
What is the best drop-in replacement for the 1ED3142MC12HXUMA1?
The best drop-in replacement in the same PG-DSO-8 footprint is the 1ED3125MU12FXUMA1, which trades 1.5 A of sink current for an otherwise pin-compatible footprint and similar 40 ns propagation. For full-feature drop-in equivalents with reinforced isolation, the Si8271 from Silicon Labs and UCC21750 from Texas Instruments are cross-brand alternatives in different but mechanically similar SO-8W packages.
Hey Google, what can replace the 1ED3142MC12HXUMA1 in my design?
The 1ED3142MC12HXUMA1 can be replaced pin-to-pin by 1ED3125MU12FXUMA1 (Infineon, lower drive current) or 1ED3141MC12H (lower UVLO variant). For cross-brand drops, check the Si8271GB-IS or UCC21750DW in SO-8W with adapted UVLO resistors. Always re-validate UVLO threshold, drive strength, and CMTI before substituting.
Where can I download the 1ED3142MC12HXUMA1 datasheet PDF?
The official datasheet PDF for 1ED3142MC12HXUMA1 is hosted at Infineon's product page at https://www.infineon.com/part/1ED3142MC12H. Third-party distributors Mouser and DigiKey also host a direct link to the PDF from their product detail pages, and LCSC provides a download with pinout diagrams.
Where can I find the 1ED3142MC12HXUMA1 pinout?
The 1ED3142MC12HXUMA1 pinout is published in the Infineon datasheet and replicated on distributor sites such as Mouser and LCSC. Pin 1 is marked by the dot on the package; pin assignments follow the PG-DSO-8 EiceDRIVER standard with VCC1, GND1, IN, /IN, VCC2, GND2, OUT, and OUT_L arranged sequentially.
What are the key specifications of the 1ED3142MC12HXUMA1 that engineers should know?
Engineers designing with the 1ED3142MC12HXUMA1 should track: 6 A source / 6.5 A sink drive, 40 ns typical propagation delay, 20 ns rise/fall, 3000 Vrms isolation, PG-DSO-8 wide-body package, and compatibility with IGBT/MOSFET/SiC. According to Infineon's datasheet, the part is rated for industrial -40 °C to +125 °C operation with high CMTI for SiC environments.

Engineering reference data for 1ED3142MC12HXUMA1 — comparison, design guidance, and compliance information.

Selection Guide

Choose the 1ED3142MC12HXUMA1 when your design requires reinforced galvanic isolation (3000 Vrms), high drive strength (6 A source / 6.5 A sink), and tight timing (40 ns propagation) in an 8-pin wide-body DSO. It is ideal for SiC MOSFET and IGBT half-bridge stages in industrial servo, EV OBC, PV inverter, and telecom rectifier applications. For lower-power sections, the 1ED3125MU12FXUMA1 (5 A) is a drop-in PG-DSO-8 alternative; for half-bridge topologies, use the 2ED21844S06JXUMA1; for non-isolated low-side drive, the 1EDN7126GXTMA1 (SOT-23-6) suffices. Re-validate UVLO, drive strength, and PCB creepage if you cross-brand to UCC21750 or Si8271.

Comparison with Alternatives

Parameter This Product 1ED3125MU12FXUMA1 1EDN7550BXTSA1 1EDN7126GXTMA1 2ED21844S06JXUMA1 2ED2106S06FXUMA1
Brand Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies
Package PG-DSO-8 PG-DSO-8 - same PG-SOT-23-6 (different package, included for parametric comparison only) PG-SOT-23-6 (different package, included for parametric comparison only) PG-DSO-8 - same PG-DSO-8 - same
Source Drive Current 6 A 5 A 4 A 2 A 2.5 A (per channel) 0.6 A
Sink Drive Current 6.5 A 5 A 4 A 2 A 2.5 A (per channel) 0.6 A
Isolation Voltage 3000 Vrms 3000 Vrms N/A (non-isolated) N/A (non-isolated) 3000 Vrms 3000 Vrms
Propagation Delay (typ.) 40 ns 40 ns 37 ns 37 ns 50 ns 80 ns
Channels 1 1 1 1 2 (half-bridge) 2 (half-bridge)
Supported Switches IGBT/MOSFET/SiC IGBT/MOSFET/SiC IGBT/MOSFET MOSFET only IGBT/MOSFET IGBT/MOSFET

Key Differentiators

  • Highest drive current in PG-DSO-8 isolated driver family (vs 1ED3125MU12FXUMA1)
  • Single-channel vs half-bridge (vs 2ED21844S06JXUMA1)
  • Reinforced isolation versus non-isolated driver (vs 1EDN7126GXTMA1)

Design Notes

Place the bootstrap diode and 1 µF X7R VCC2 bypass capacitor as close to pins 5-6 of the PG-DSO-8 as possible to minimize the high-current gate-charge loop. Estimated: with a 6 A peak source current and a 50 nC gate charge, the bypass capacitor must supply the transient in <1 µs without drooping below UVLO; 1 µF X7R is adequate for switching frequencies up to ~200 kHz.

Route the primary-side (VCC1/GND1) and secondary-side (VCC2/GND2) ground returns so that any high-di/dt loop does not cross the isolation barrier on the PCB. Maintain at least 8 mm creepage between primary and secondary copper to support reinforced insulation per IEC 60747-17. The PG-DSO-8 wide-body package gives a head-start but does not replace good layout.

Twist or tightly couple the gate-drive output traces to the driven switch to minimize parasitic inductance. Estimated: with 20 ns rise time and a 5 nH gate-loop inductance, an Ldi/dt spike of 6 A × 5 nH / 20 ns = 1.5 V can appear at the gate; a small ferrite bead or 2-5 Ω gate resistor damps the resulting ringing and reduces EMI.

Do not exceed the VCC2 UVLO turn-on threshold when using the part to drive SiC MOSFETs with low gate-voltage ratings. The 1ED3142M variant targets IGBT/SiC UVLO (around 11 V); if the application requires a different threshold, choose the 1ED3141 variant or external-divider version. Always validate UVLO behavior in the worst-case cold-start condition.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

EU RoHS compliant per Arrow listing; active part status. Not AEC-Q100 qualified - choose automotive-qualified variants for EV applications.

Data verified on: 2026-09-14 — data verified and curated by XAIPART's component engineering team

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1ED3142MC12HXUMA1 1ED3142MC12HXUMA1 datasheet Infineon EiceDRIVER X3 compact isolated gate driver PG-DSO-8 6A coreless transformer gate driver 3000Vrms SiC MOSFET gate driver 6A isolated IGBT half-bridge gate driver 40ns 1ED3142MC12HXUMA1 vs 1ED3125MU12FXUMA1 1ED3142MC12HXUMA1 drop-in replacement buy 1ED3142MC12HXUMA1 LCSC 1ED3142MC12HXUMA1 pinout PG-DSO-8 EiceDRIVER X3 isolated driver EV OBC

Related Components & Terms

Infineon Technologies 1ED3142MC12HXUMA1 1ED3142MC12H EiceDRIVER X3 Compact PG-DSO-8 PG-LDSO-8-1 isolated gate driver galvanic isolation coreless transformer IGBT SiC MOSFET CMTI propagation delay UVLO reinforced insulation IEC 60747-17 bootstrap supply half-bridge totem-pole PFC DC-DC converter EV on-board charger
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