5CSXFC4C6U23A7N - Cyclone V SX SoC FPGA 40K LE, ARM Cortex-A9 | Intel
MPN: 5CSXFC4C6U23A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $227.06 | $227.06 |
| 10 | $204.35 | $2,043.50 |
| 100 | $181.65 | $18,165.00 |
| 500 | $159 | $79,500.00 |
| 1,000 | $136.24 | $136,240.00 |
Drop-in alternatives for 5CSXFC4C6U23A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSXFC4C6U23C7N
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View Datasheet →5CSXFC4C6U23A7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SX SoC FPGA |
| Device Family | Cyclone V SX (5CSXFC4C6U23) |
| Logic Elements | 40,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum User I/O | 188 |
| Package | 672-pin UFBGA (UBGA), 23x23 mm |
| Process Technology | 28 nm low-power |
| Core Voltage | 1.1 V (typical) |
| Operating Temperature Grade | Automotive / Extended |
| Memory Interfaces | DDR2, DDR3, LPDDR2 |
| DSP Blocks | Variable-precision, 18x19 multipliers |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead Free | Yes |
5CSXFC4C6U23A7N 672-pin ufbga (ubga), 23x23 mm Pin Configuration Guide
Complete pinout information for 5CSXFC4C6U23A7N (672-pin ufbga (ubga), 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC4C6U23A7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC4C6U23A7N is suitable for 6 applications: Automotive Driver-Assistance (ADAS) Sensor Fusion, Industrial Motor Control & Drive Systems, Machine Vision & Smart Camera Edge Processing, Low-Power Wireless Baseband (Small Cell / IoT Gateway), Portable Medical Imaging & Point-of-Care Devices, Smart Energy / Grid Substation Edge Controller.
Automotive Driver-Assistance (ADAS) Sensor Fusion
The 5CSXFC4C6U23A7N's combination of dual ARM Cortex-A9 cores plus 40K FPGA logic elements suits ADAS sensor-fusion nodes where one CPU core runs the AUTOSAR real-time OS and the second runs Linux for vision pre-processing, while the FPGA fabric performs deterministic sensor data fusion (camera + radar + LiDAR timestamping). The automotive temperature grade (A7 code) supports under-hood and behind-windshield mounting. Hardware acceleration in fabric reduces latency below 10 ms for object detection loops. Quartus Prime reference designs provide CAN-FD, FlexRay, and Automotive Ethernet MAC cores.
Recommended
Industrial Motor Control & Drive Systems
The 5CSXFC4C6U23A7N delivers deterministic FPGA-based PWM generation, encoder decoding, and field-oriented control loops with microsecond latency while the ARM cores run Modbus/TCP, EtherCAT, or PROFINET stack and HMI logic. The 188 user I/Os accept multi-axis encoder inputs and gate driver feedback signals directly. On-chip DSP blocks execute Clarke/Park transforms and SVPWM modulation without CPU loading. Industrial-grade variants share the same 672-UFBGA footprint, enabling a single PCB design to support both commercial and harsh-environment deployments.
Recommended
Machine Vision & Smart Camera Edge Processing
The 5CSXFC4C6U23A7N integrates MIPI CSI-2 receive and image signal processing in the FPGA fabric while the dual ARM cores run OpenCV and TensorFlow Lite inference for defect classification, all on a single chip. The 28 nm low-power process keeps the SoC under typical vision-appliance thermal envelopes, and the 672-UFBGA package allows compact camera head designs. The HPS handles network streaming (Gigabit Ethernet, USB 3.0) and JPEG compression, while fabric-implemented ISP pipelines minimize latency. FPGA PCIe Gen2 hard IP supports frame-grabber backplane connectivity.
Recommended
Low-Power Wireless Baseband (Small Cell / IoT Gateway)
The 5CSXFC4C6U23A7N implements LTE/5G NR PHY-layer baseband processing (FFT/iFFT, channel coding, MIMO detection) in its FPGA fabric while the ARM Cortex-A9 HPS runs the MAC scheduler, RRC protocol stack, and OAM management. The 28 nm process and integrated HPS eliminate the need for a separate processor chip, reducing BOM and PCB area for small-cell and private-5G deployments. 672-UFBGA package supports fanless thermal designs under 15 W. Transceiver-grade GPIO and SerDes lanes interface directly with RFICs and DACs/ADCs.
Recommended
Portable Medical Imaging & Point-of-Care Devices
The 5CSXFC4C6U23A7N's low-power 28 nm SoC architecture supports battery-powered ultrasound and endoscopy imaging carts where the FPGA fabric performs beamforming and Doppler processing while the ARM cores drive the display, user interface, and DICOM image storage. Integrated DDR3 controller with ECC support is suitable for medical-grade data integrity requirements. The 672-UFBGA package enables compact handheld form factors, and the SoC consolidation reduces component count for IEC 60601 compliance verification.
Recommended
Smart Energy / Grid Substation Edge Controller
The 5CSXFC4C6U23A7N's 40K logic elements and ARM Cortex-A9 HPS support IEC 61850 substation controllers where the FPGA implements parallel multi-protocol parsing (GOOSE, SV, MMS) and the HPS runs the SCADA gateway, encryption, and event logging. The 28 nm process and automotive-grade temperature range deliver high reliability for outdoor enclosure mounting. Hardware crypto engines and tamper detection through FPGA fabric provide grid-security compliance. Single-chip integration replaces legacy sub-controller stacks.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC4C6U23A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC4C6U23C7N | 5CSXFC4C6U23C8N | 5CSXFC4C6U23I7N | 5CSXFC5C6U23A7N | 5CSXFC2C6U23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-UFBGA (23x23 mm) | 672-UFBGA (23x23 mm) - same | 672-UFBGA (23x23 mm) - same | 672-UFBGA (23x23 mm) - same | 672-UFBGA (23x23 mm) - same | 672-UFBGA (23x23 mm) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 85,000 | 25,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed Grade | A7 (automotive) | C7 (commercial) | C8 (commercial, slower) | I7 (industrial) | A7 (automotive) | I7 (industrial) |
| Maximum User I/O | 188 | 188 | 188 | 188 | 188 | [DATA_NEEDED] |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Approximate Unit Price (USD, as of 2026-09-06) | ~$227.06 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher logic element density than 5CSXFC2C6U23I7N with same package (vs 5CSXFC2C6U23I7N)
- Automotive temperature grade over commercial/industrial variants (vs 5CSXFC4C6U23C7N)
- Higher speed grade than C8 commercial variant (vs 5CSXFC4C6U23C8N)
Design Notes
The 5CSXFC4C6U23A7N requires multiple independent power rails: VCCINT (core, ~1.1 V), VCCAUX and VCCA_FPLL (auxiliary analog, ~2.5 V), VCCPD (I/O pre-driver, 2.5/3.0/3.3 V), VCCIO (per-bank user I/O, 1.2-3.3 V), and separate HPS rails (VCC_HPS, VCC_HPS_IO). Decouple each rail with 0.1 uF + 10 uF ceramic capacitors placed as close as possible to the BGA balls, and use a 4-layer PCB with continuous ground and power planes. Estimate: a fully-utilized SX SoC at 700 MHz HPS + 40K LE running typical workloads draws 5-8 W; at A7 speed grade this can reach 10 W with high fabric utilization.
The 672-UFBGA package requires a thermal management strategy because SoC FPGAs concentrate ARM cores plus 40K LE plus HPS peripherals on one die. Use the exposed thermal pad (if present on the package) or assign multiple GND balls as thermal vias to inner copper layers. For ambient temperatures above 70 C or sustained high fabric utilization, attach a small heatsink with thermal interface material. Estimated: at 8 W dissipation with a junction-to-ambient thermal resistance of approximately 15-20 C/W on a 4-layer PCB, the junction temperature rises ~120-160 C above ambient, so active cooling or airflow is recommended in enclosed industrial cabinets.
Route the 672-UFBGA ball grid with 1.0 mm pitch using microvia or via-in-pad technology on a high-density-interconnect PCB stackup (typically 8-12 layers). Break out inner rows through staggered vias on inner layers. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS, DDR3, and transceiver pairs. Provide a continuous reference plane under each impedance-controlled signal layer. The HPS DDR3 controller requires matched-length routing with 25-50 mil tolerance across the byte group; use the Quartus Prime pin planner to validate length-matching before tape-out.
Common pitfalls when designing with the 5CSXFC4C6U23A7N include: (1) using incorrect MSEL pull-up/pull-down values for the desired configuration mode (AS, PS, JTAG, FPP) - these are mode-strapped at power-up and cannot be changed at runtime without reconfiguration; (2) failing to provide proper POR (power-on-reset) sequencing between VCCINT, VCCAUX, and VCCIO rails, which can cause JTAG chain failures; (3) omitting the HPS cold-reset handshake that must be coordinated with FPGA configuration completion; (4) under-estimating the required decoupling for simultaneous HPS + FPGA switching, leading to VCCINT droop and bitstream CRC errors. Reference the Cyclone V pin connection guidelines and AN 692 for power-sequencing recommendations.
Compliance Information
RoHS compliant per Altera/Intel product page. A7 speed/temperature grade indicates automotive temperature range; explicit AEC-Q100 qualification report should be requested from Intel. Lead-free BGA balls standard. REACH and halogen-free status not explicitly listed in verified web data.
