A3P600-1FG144 - FPGA 600K gates, 144-LBGA | Microchip
MPN: A3P600-1FG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $60.22 | $60.22 |
| 10 | $56.8 | $568.00 |
| 100 | $52.1 | $5,210.00 |
| 500 | $48.3 | $24,150.00 |
| 1,000 | $44.6 | $44,600.00 |
Drop-in alternatives for A3P600-1FG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P600-1FG144I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$36.8 / Unit
View Datasheet →A3P600-1FGG144
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$42.88 / Unit
View Datasheet →A3P600-1FGG144I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$45 / Unit
View Datasheet →A3P600-2FG144
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$27.2 / Unit
View Datasheet →A3P600-FG144
✅ Drop-In✓ In Stock
$15.6 / Unit
View Datasheet →A3P600-FG144I
✅ Drop-In✓ In Stock
$15.6 / Unit
View Datasheet →A3P600-1FG144 Maximum Ratings & Electrical Characteristics
| FPGA Family | ProASIC3 |
| System Gates | 600000 |
| CLBs / VersaTiles | 13824 |
| Total RAM Bits | 110592 |
| Number of User I/O | 97 |
| Supply Voltage - Nominal | 1.5 V |
| Supply Voltage - Range | 1.425 V to 1.575 V |
| Maximum System Performance | 272 MHz |
| Package / Case | 144-LBGA (13x13 mm) |
| Supplier Device Package | 144-FPBGA (13x13) |
| Package Pitch | 1 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C to +85°C (TJ) |
| Logic Family | CMOS |
| Number of Pins | 144 |
| RoHS Status | RoHS non-compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
| Packaging | Tray |
A3P600-1FG144 1 mm Pin Configuration Guide
Complete pinout information for A3P600-1FG144 (1 mm package) with 144 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-1FG144.
Refer to the datasheet for full pin configuration.
Estimated pin count: 144 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-1FG144 is suitable for 6 applications: Industrial Automation and Control, Communications Infrastructure, Medical Imaging and Instrumentation, Defense and Aerospace Electronics, Test and Measurement Equipment, IoT Edge and Smart Systems.
Industrial Automation and Control
A3P600-1FG144 fits industrial automation applications that require deterministic, instant-on logic without an external configuration device. Its 97 user I/O pins can interface to sensors, encoders, and motor-drive signals, while 110,592 RAM bits provide small FIFOs for data buffering. The flash-based ProASIC3 fabric wakes from power-up immediately, which is important for safety-related and real-time control systems. Designers should choose the -1FG144I variant if the control cabinet ambient temperature exceeds 85 °C. Because the device is single-chip and does not require a configuration flash, it reduces BOM count and board area in high-reliability industrial PCBs.
Recommended
Communications Infrastructure
In communications line cards and network switches, A3P600-1FG144 can perform protocol bridging, clock-domain crossing, and sideband logic. The 600K system gates and 97 I/O pins are sufficient for parallel bus interfaces such as local control buses or status monitoring. Four I/O banks allow assignment of different voltage standards, simplifying connection to 1.8 V, 2.5 V, or 3.3 V logic. Flash-based operation removes the need for a separate configuration device in space-constrained modules. The -2 speed grade variant, A3P600-2FG144, provides additional timing margin for high-speed interface logic when the system clock is near the 272 MHz rated performance.
Recommended
Medical Imaging and Instrumentation
Medical imaging systems such as ultrasound front ends and diagnostic monitors require compact, low-latency logic for sensor data aggregation and display control. A3P600-1FG144 provides 97 I/O lines and 110,592 RAM bits, enabling local image-line buffering and glue logic between ADCs, DSPs, and display controllers. Its commercial temperature range is acceptable for temperature-controlled medical equipment. The non-volatile flash configuration ensures that the FPGA starts reliably in a known state, which is valuable for medical safety. For designs requiring lead-free assembly, select A3P600-1FGG144 to maintain RoHS compliance.
Recommended
Defense and Aerospace Electronics
ProASIC3 flash FPGAs are often used in defense and aerospace systems because they are live at power-up and do not require an external boot memory, which can reduce vulnerability to configuration readback attacks. A3P600-1FG144 delivers 600K system gates, 97 I/O pins, and 110,592 RAM bits in a 13x13 mm FBGA package, fitting well into radar processors, avionics data concentrators, and secure communication modules. The industrial-temperature variant A3P600-1FG144I is preferred for unpressurized or high-altitude environments. Engineers should verify that the non-RoHS FG package is acceptable for the target supply chain or use the FGG package for green manufacturing.
Recommended
Test and Measurement Equipment
A3P600-1FG144 can serve as a logic hub in oscilloscopes, signal generators, and data-acquisition systems, handling trigger logic, interface conversion, and control sequencing. The 97 user I/O pins allow direct connection to ADCs, DACs, front-panel buttons, and status LEDs. The embedded 110,592 RAM bits provide small capture buffers or command FIFOs. Because the device is reprogrammable, the same PCB can be reused for multiple instrument variants by changing the FPGA bitstream. Designers should place decoupling capacitors close to each supply ball and carefully plan BGA fanout to maintain signal integrity on dense test-instrument boards.
Recommended
IoT Edge and Smart Systems
For IoT edge gateways and smart industrial sensors, A3P600-1FG144 offers a single-chip programmable logic solution that starts instantly and avoids external configuration flash. Its 97 I/O pins can interface with sensors, memory, and low-speed radios, while 110,592 RAM bits support protocol framing and small data queues. The 144-LBGA package is compact enough for space-constrained edge modules. The main trade-off is commercial temperature range and non-RoHS package finish; for wide-temperature outdoor IoT devices, use A3P600-1FG144I or the green FGG144 variant. Power consumption is modest compared to SRAM FPGAs with external flash.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-1FG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-1FG144I | A3P600-1FGG144 | A3P600-1FGG144I | A3P600-2FG144 | A3P600-FG144 | A3P600-FG144I |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LBGA (13x13 mm) | 144-LBGA (13x13 mm) | 144-LBGA (13x13 mm) | 144-LBGA (13x13 mm) | 144-LBGA (13x13 mm) | 144-LBGA (13x13 mm) | 144-LBGA (13x13 mm) |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O Count | 97 | 97 | 97 | 97 | 97 | 97 | 97 |
| Total RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
| Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) |
| Operating Temperature | 0°C to +85°C | -40°C to +100°C | 0°C to +85°C | -40°C to +100°C | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C |
| Speed Grade | -1 (272 MHz system performance) | -1 (272 MHz system performance) | -1 (272 MHz system performance) | -1 (272 MHz system performance) | -2 (higher maximum system performance) | Standard speed grade | Standard speed grade |
| RoHS Status | RoHS non-compliant (FG package) | RoHS non-compliant (FG package) | RoHS compliant (FGG package) | RoHS compliant (FGG package) | RoHS non-compliant (FG package) | RoHS non-compliant (FG package) | RoHS non-compliant (FG package) |
Key Differentiators
- Flash-based single-chip FPGA with instant-on capability (vs SRAM-based FPGAs in the same logic-density class)
- Multiple package-grade choices in the A3P600 family (vs A3P600-1FG144I)
- Flexible I/O banking with four dedicated VCCIBX supplies (vs A3P600-FG144)
Design Notes
Decouple the 1.5 V core supply with low-ESR ceramic capacitors placed as close to the FPGA package as possible. Use a 4.7 uF to 10 uF bulk capacitor plus 0.1 uF high-frequency capacitors per supply pin group. Also decouple each VCCIBX bank supply pin to the corresponding ground. Proper power integrity is critical for reliable FPGA operation and consistent timing.
The 144-FBGA package uses a 1 mm ball pitch. Use Microchip's recommended land pattern and via fanout for the LBGA. For solderability, follow the package-specific reflow profile in the ProASIC3 datasheet. Since the FG144 package is non-RoHS, verify with your contract manufacturer whether a leaded assembly process is available; otherwise switch to the pin-compatible FGG144 green package.
Do not ignore I/O bank supply assignment: the A3P600 device has four I/O banks with dedicated VCCIBX pins, and only compatible voltage standards should be assigned to the same bank. Also confirm the JTAG/configuration pins and the power-up sequence before layout freeze. Flash-based FPGAs do not require external configuration memory, but reserved pins such as TCK/TMS/TDI/TDO must be handled correctly for programming and boundary scan.
Compliance Information
Microchip USA lists A3P600-1FG144 as RoHS non-compliant. For RoHS-compliant assembly, select the pin-compatible A3P600-1FGG144 (green package) variant. AEC-Q100 is not applicable to standard ProASIC3 FPGAs.
