EP20K1000CF33C8ES - 1M Gate APEX 20KC FPGA 1020-FBGA | Intel
MPN: EP20K1000CF33C8ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 500 | $185 | $92,500.00 |
| 1,000 | $155 | $155,000.00 |
Drop-in alternatives for EP20K1000CF33C8ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP20K1000CF33C8ES Maximum Ratings & Electrical Characteristics
| Series | APEX 20KC |
| Family | APEX (Advanced Programmable Embedded Matrix) |
| System Gates | 1,000,000 |
| Logic Elements / Cells | 38,400 |
| Embedded Memory Bits | 327,680 |
| Maximum User I/O | 708 |
| Package | 1020-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Mounting Type | Surface Mount (BGA) |
| Core Supply Voltage | 1.8 V |
| Process Technology | 0.15 µm CMOS |
| Maximum Toggle Frequency | 301.21 MHz |
| Speed Grade | C8 (Commercial) |
| Architecture | MultiCore (LUT + Embedded System Blocks) |
| Number of PLLs | 4 |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Programming Interface | JTAG (IEEE 1149.1) - serial via Altera Quartus |
| Embedded System Blocks (ESBs) | Dual-port RAM / ROM / CAM |
| RoHS Status | unknown |
| Lead-Free | unknown |
EP20K1000CF33C8ES 1020-ball fc-fbga (flip-chip fine-pitch bga) Pin Configuration Guide
Complete pinout information for EP20K1000CF33C8ES (1020-ball fc-fbga (flip-chip fine-pitch bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CF33C8ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000CF33C8ES is suitable for 6 applications: Telecommunications Line Cards, Parallel DSP Co-Processing, Custom Bus and Protocol Bridging, High-Speed Data Acquisition Front-Ends, Industrial Control and Automation, Legacy Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP20K1000CF33C8ES fits telecommunications line-card applications because its 1M system gates and 708 user I/O pins provide ample headroom for custom framer, mapper, and SERDES-interfacing glue logic between network processors and physical-layer devices. With 327,680 bits of dual-port ESB memory, it can host 4-8 KB of packet header buffers or CAM lookup tables on-chip, eliminating external SRAM and reducing BOM cost. The 1.8 V core and MultiCore architecture deliver reasonable power-per-logic for sustained line-rate processing in central-office chassis. Designers typically pair this part with an Altera MegaCore framer IP, configure the device via JTAG at board bring-up, and use Quartus II for timing closure.
Recommended
Parallel DSP Co-Processing
The EP20K1000CF33C8ES suits parallel DSP co-processing because 38,400 logic elements and 4 PLLs are sufficient to implement multi-channel FIR filters, FFT butterflies, or QAM demodulator datapaths at rates up to 301 MHz. The embedded system blocks (ESBs) serve as coefficient or sample storage with single-cycle access, which is critical when the datapath is multi-tap and must sustain one sample per clock. Compared with an all-ASIC approach, the APEX 20KC lets the team iterate the DSP algorithm in HDL without respinning silicon. Place the FPGA on a daughter-card driven by a host DSP, with the LVCMOS I/O at 1.8 V matching the host bus.
Recommended
Custom Bus and Protocol Bridging
The EP20K1000CF33C8ES is well-suited as a custom bus and protocol bridge between legacy peripherals and modern processors because its high I/O count (708 pins) and MultiCore architecture can absorb multiple interface standards simultaneously. Engineers commonly use it to bridge PCI to local-bus, VME to PCI-X, or UART/SPI/I2C aggregation to a single high-speed parallel port. The dedicated PCI support up to 64-bit/66 MHz avoids needing an external bridge chip. The 1020-ball FC-FBGA keeps signal lengths short for clean multi-protocol timing, although it requires 6-8 layer PCB stack-ups and microvia technology for fan-out.
Recommended
High-Speed Data Acquisition Front-Ends
The EP20K1000CF33C8ES serves high-speed data-acquisition front-ends well because it can capture and pre-process data from parallel ADCs while the host CPU performs post-processing. The 327 kbits of embedded RAM act as a deep FIFO, decoupling bursty ADC sample rates from the host bus bandwidth, and the 1.8 V LVCMOS I/O can be paired with modern low-voltage ADC/DAC devices. The 38,400 logic elements support digital down-conversion, channelization, and trigger logic that would otherwise demand a dedicated ASIC. For multi-gigasample per second systems, however, modern Cyclone V or Stratix 10 with hard transceivers are now preferred.
Recommended
Industrial Control and Automation
The EP20K1000CF33C8ES is suitable for industrial control applications where flexibility and a long product lifecycle dominate the design trade-off. Its 38,400 logic elements can host multiple motor-control algorithms, PLC scan engines, and field-bus protocol stacks (Modbus, Profibus, EtherCAT slave) on a single chip. The 708 user I/O pins absorb hundreds of digital I/O lines without external muxes. Note that this is a commercial-temperature (0-85 °C) part, so for harsh industrial cabinets select the industrial-grade EP20K1000CB652I9 instead. Designers pair it with isolated RS-485 transceivers and use JTAG for in-system firmware updates.
Recommended
Legacy Test and Measurement Instrumentation
The EP20K1000CF33C8ES is well matched to legacy test and measurement instruments where you need high logic density for waveform synthesis, pattern generation, or custom triggering. The 327 kbits of embedded memory accommodate waveform lookup tables of several thousand samples, while the 4 PLLs provide multiple independent clock domains for DAC/ADC synchronization. The 1.8 V core and LVCMOS I/O standards interface cleanly to modern low-voltage DACs and ADCs. For new instruments, however, designers should evaluate Cyclone IV E or Cyclone V for active support, longer-term availability, and lower quiescent power dissipation.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CF33C8ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000CB652I9 | EP20K1000CB652I8 | EP20K1000CB652C9ES | EP20K1000CB652C8ES |
|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 652-ball BGA (different footprint) | 652-ball BGA (different footprint) | 652-ball BGA (different footprint) | 652-ball BGA (different footprint) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Embedded Memory Bits | 327,680 | 327,680 | 327,680 | 327,680 | 327,680 |
| Maximum User I/O | 708 | 488 | 488 | 488 | 488 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Temperature Grade | Commercial 0 to +85 °C | Industrial -40 to +100 °C | Industrial -40 to +100 °C | Commercial 0 to +85 °C | Commercial 0 to +85 °C |
| Speed Grade | C8 | I9 | I8 | C9 | C8 |
Key Differentiators
- Highest I/O count among APEX 20KC 1020-ball variants (vs EP20K1000CB652C8ES)
- Commercial temperature grade with optimized power profile (vs EP20K1000CB652I9)
- 1020-ball FC-FBGA enables high-density PCB layouts (vs 652-ball BGA alternative)
Design Notes
Power sequencing on APEX 20KC requires the 1.8 V VCCINT rail to ramp before the VCCIO rail and any input signal exceeding 1.8 V. Use a tracked regulator (such as an LDO with PG output) or a power-good supervisor to assert the FPGA's nCONFIG pin only after both rails reach tolerance. Reverse sequencing or simultaneous ramp can trigger latch-up and permanently damage the device. Decouple every VCCINT pin with 0.1 µF X7R ceramic placed within 5 mm of the ball.
Estimated: at full utilization (38,400 LEs toggling at 100 MHz with 25% toggle rate) the APEX 20KC consumes roughly 1.5-2.5 W on the 1.8 V core. The 1020-ball FC-FBGA has θJA of approximately 8-10 °C/W with 8-layer PCB and 25% internal copper pour. Estimated junction rise above ambient is therefore 12-25 °C. For fan-less enclosures, derate by 30-40% or specify the industrial-grade part for thermal margin.
The 1020-ball FC-FBGA uses a 1.0 mm ball pitch and requires microvia (laser-drilled) PCB technology for breakout. Fan-out from the inner balls to BGA escape traces requires a 4-2-4 or 5-2-5 stack-up with sequential lamination. Use 0.4 mm drill microvias, 0.2 mm capture pads, and 0.1 mm trace/space on inner layers for clean escape. X-ray inspection is mandatory after reflow because BGA joints are not visible.
Route global clocks (CLK0-CLK15) on the top layer over an unbroken reference plane with 50 Ω controlled impedance. Keep clock traces shorter than 25 mm where possible to minimize skew and reflection. Use Quartus II's TimeQuest timing analyzer to verify hold-time closure across PVT corners. Place series damping resistors (22-33 Ω) on heavily-loaded outputs to suppress ringing on LVCMOS signals switching at >100 MHz.
Compliance Information
Compliance status not explicitly stated in the verified web data; original Altera APEX 20KC family predates current RoHS documentation conventions. Recommend contacting Intel legacy support for current compliance certificates.
