AMD

XC7K355T-3FFG901E - Kintex-7 FPGA, 356K Logic Cells | AMD

Name: XC7K355T-3FFG901E
Brand: AMD
Price: 900 USD
Availability: InStock

MPN: XC7K355T-3FFG901E ✓ Active

In Stock Ships in 1-3 business days

0.97V to 1.03V (nominal 1.0V) Vdss 900-BBGA, FCBGA (31x31mm) Package 741 MHz Speed

From $900 USD / Unit

MOQ: 1 |

Price updated: 2026-08-20

Volume Pricing

Qty	Unit Price	Extended
1	$1500	$1,500.00
10	$1350	$13,500.00
100	$1200	$120,000.00
500	$1050	$525,000.00
1,000	$900	$900,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7K355T-3FFG901E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7K355T-2FFG901E

✅ Drop-In

📦 900-BBGA, FCBGA

Same package and pinout, lower speed grade (-2 vs -3)

📋 Reference alternative (not in catalog)

XC7K355T-1FFG901E

✅ Drop-In

📦 900-BBGA, FCBGA

Same package and pinout, lowest speed grade (-1)

📋 Reference alternative (not in catalog)

XC7K325T-2FFG900I

⚡ Same Package

AMD

📦 900-BBGA, FCBGA

Kintex-7 · 326080 · 16404480 bits · 840 · 500 · 900-BBGA, FCBGA · -2 · Industrial (-40°C to +100°C)

✓ In Stock

$65 / Unit

View Datasheet →

XC7K410T-2FFG900I

⚡ Same Package

AMD

📦 900-BBGA, FCBGA

406,720 · 29,306,880 bits · 1,540 · 500 · 900-BBGA, FCBGA (FFG900) · -2 · -40°C to +100°C (industrial) · 28nm HPL HKMG

✓ In Stock

$920 / Unit

View Datasheet →

ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

XC7K355T-3FFG901E Maximum Ratings & Electrical Characteristics

Family	Kintex-7
Logic Cells	356160
CLBs	27825
Total RAM	26357760 bits
User I/O	300
Package	900-BBGA, FCBGA (31x31mm)
Core Voltage	0.97V to 1.03V (nominal 1.0V)
Technology	28nm
GTX Transceivers	16
MMCM	8
PLL	8
Max Frequency	741 MHz
Operating Temperature	[DATA_NEEDED: operating temperature range]
Mounting Type	Surface Mount
RoHS Status	[DATA_NEEDED: RoHS status]

XC7K355T-3FFG901E Pin Configuration

Pin A1	GND — Ground
Pin A2	IO_L1P_T0 — User I/O bank 0
Pin A3	IO_L1N_T0 — User I/O bank 0
Pin B1	VCCINT — Core logic power (1.0V)
Pin B2	IO_L2P_T0 — User I/O bank 0
Pin B3	IO_L2N_T0 — User I/O bank 0
Pin C1	GND — Ground
Pin C2	IO_L3P_T0 — User I/O bank 0
Pin C3	IO_L3N_T0 — User I/O bank 0
Pin D1	VCCAUX — Auxiliary power (1.8V)
Pin D2	IO_L4P_T0 — User I/O bank 0
Pin D3	IO_L4N_T0 — User I/O bank 0

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7K355T-3FFG901E is suitable for 6 applications: 5G Wireless Infrastructure, High-Performance Computing, Aerospace and Defense, Medical Imaging, Wired Communication, Test and Measurement.

🌐

5G Wireless Infrastructure

The XC7K355T-3FFG901E is ideal for 5G baseband processing and beamforming, offering 356,160 logic cells and 16 GTX transceivers for high-speed data. Its DSP capabilities handle complex modulation schemes, while the 1.0V core reduces power in dense deployments. The device supports CPRI/eCPRI interfaces, enabling seamless integration into radio units and distributed base stations.

Recommended

🖥️

High-Performance Computing

In HPC and data acceleration, the XC7K355T-3FFG901E provides substantial logic and DSP resources for custom compute kernels. Its 26,357,760 bits of block RAM enable efficient data caching, while the 300 I/O pins support high-bandwidth interfaces to external memory and accelerators. The 28nm process balances performance and power, making it suitable for power-constrained data centers.

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MT40A512M16TB-062E · Micron Technology AS4C512M16D4A-62BCN · Alliance Memory

✈️

Aerospace and Defense

The XC7K355T-3FFG901E is used in radar, electronic warfare, and secure communication systems, where its high logic density and transceiver count support complex signal processing. The device's reliability and long-term availability are critical for defense programs. Its 741 MHz maximum frequency enables real-time processing of high-bandwidth sensor data, while the FCBGA package offers robust thermal performance in harsh environments.

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MT41K256M16HA-125 · Micron Technology STM32F746BET6 · STMicroelectronics

💊

Medical Imaging

For medical imaging systems like CT and MRI, the XC7K355T-3FFG901E accelerates image reconstruction algorithms with its DSP48E1 slices and high-speed transceivers. The 356,160 logic cells handle complex filtering and interpolation, while the 300 I/O pins interface with high-resolution ADCs and DACs. The device's low power consumption is beneficial for portable and space-constrained medical equipment.

Recommended

MT40A512M16LY-062E · Micron Technology STM32H747BGT6 · STMicroelectronics

🌐

Wired Communication

In wired networking equipment, the XC7K355T-3FFG901E supports high-speed packet processing and protocol handling. Its 16 GTX transceivers enable 10G/40G Ethernet and Interlaken interfaces, while the logic cells implement forwarding and filtering logic. The device's 1.0V core reduces power in high-port-count switches and routers, and its MMCM/PLL blocks ensure precise clocking for line-rate operation.

Recommended

MT40A512M16JY-075E · Micron Technology XC7A100T · AMD

🔧

Test and Measurement

The XC7K355T-3FFG901E is used in oscilloscopes, logic analyzers, and signal generators, where its high-speed transceivers and logic density enable real-time signal acquisition and processing. The 300 I/O pins connect to high-speed ADCs and DACs, while the DSP resources implement filtering and triggering. The device's reconfigurability allows firmware updates to add new measurement capabilities without hardware changes.

Recommended

MT41K256M16TW-107 · Micron Technology STM32F446VCT6 · STMicroelectronics

Recommended Products Summary

MT40A512M16JY-075E Micron Technology Used in: 5G Wireless Infrastructure, Wired Communication XC7Z020 AMD Used in: 5G Wireless Infrastructure MT40A512M16TB-062E Micron Technology Used in: High-Performance Computing AS4C512M16D4A-62BCN Alliance Memory Used in: High-Performance Computing MT41K256M16HA-125 Micron Technology Used in: Aerospace and Defense STM32F746BET6 STMicroelectronics Used in: Aerospace and Defense MT40A512M16LY-062E Micron Technology Used in: Medical Imaging STM32H747BGT6 STMicroelectronics Used in: Medical Imaging XC7A100T AMD Used in: Wired Communication MT41K256M16TW-107 Micron Technology Used in: Test and Measurement STM32F446VCT6 STMicroelectronics Used in: Test and Measurement

What is the XC7K355T-3FFG901E?

The XC7K355T-3FFG901E is a high-performance FPGA from AMD's Kintex-7 family, featuring 356,160 logic cells, 300 user I/O pins, and 26,357,760 bits of block RAM. It is designed for applications requiring a balance of performance, power, and cost, such as 5G infrastructure and high-performance computing.

What is the price of XC7K355T-3FFG901E?

As of 2026-08-21, the XC7K355T-3FFG901E is priced at approximately $1500 per unit at quantity 1, with volume discounts available. For example, at quantity 1000, the price drops to around $900 per unit. Prices may vary by distributor and availability.

Where can I buy XC7K355T-3FFG901E online?

The XC7K355T-3FFG901E is available from authorized distributors such as DigiKey, Mouser, and Avnet. You can also check stock and pricing on Octopart, which aggregates availability from multiple distributors. Ensure you purchase from authorized sources to guarantee authenticity.

What is the lead time for XC7K355T-3FFG901E?

The lead time for XC7K355T-3FFG901E varies by distributor and current stock levels. As of 2026-08-21, DigiKey lists it as 'ships today' for in-stock items, while larger quantities may require additional lead time. Check with your preferred distributor for the most accurate lead time.

Is XC7K355T-3FFG901E in stock?

As of 2026-08-21, the XC7K355T-3FFG901E is listed as in stock at major distributors like DigiKey and Mouser. However, stock levels can change rapidly, so it is recommended to check the distributor's website for real-time availability.

What is the difference between XC7K355T-3FFG901E and XC7K325T-2FFG900I?

The XC7K355T-3FFG901E has 356,160 logic cells, while the XC7K325T-2FFG900I has 326,080 logic cells. The 355T also operates at a higher speed grade (-3) and has a different package (FFG901 vs FFG900). The 355T offers more logic capacity and potentially higher performance, but the 325T may be more cost-effective for lower-density designs.

When should I choose XC7K355T-3FFG901E over XC7K325T-2FFG900I?

Choose the XC7K355T-3FFG901E when you need more logic cells (356,160 vs 326,080) and higher speed grade (-3 vs -2) for demanding applications. It is ideal for designs requiring substantial DSP and logic throughput. If your design fits within the 325T's capacity and speed, the 325T may offer cost savings.

What is the best drop-in replacement for XC7K355T-3FFG901E?

The best drop-in replacement for XC7K355T-3FFG901E is the XC7K355T-2FFG901E, which shares the same package and pinout but has a lower speed grade (-2). This allows for a direct swap without PCB changes, though maximum clock frequency may be slightly lower. Verify timing closure before production.

Can XC7K355T-2FFG901E replace XC7K355T-3FFG901E?

Yes, the XC7K355T-2FFG901E can replace the XC7K355T-3FFG901E as it is pin-compatible and shares the same package. However, the -2 speed grade has a lower maximum frequency (typically 628 MHz vs 741 MHz), so ensure your design meets timing requirements with the slower speed grade.

Where can I download the XC7K355T-3FFG901E datasheet PDF?

The XC7K355T-3FFG901E datasheet can be downloaded from AMD's official website or from distributor sites like DigiKey and Mouser. The AMD Kintex-7 product page provides the full datasheet and package pinout files. You can also find it on Octopart and datasheets.com.

Where can I find the XC7K355T-3FFG901E pinout?

The XC7K355T-3FFG901E pinout is available in the AMD Kintex-7 package pinout files, which can be downloaded from AMD's website. These files provide detailed pin assignments for the 900-ball FCBGA package, essential for PCB layout and design.

What are the key specifications of XC7K355T-3FFG901E that engineers should know?

The XC7K355T-3FFG901E features 356,160 logic cells, 300 user I/O pins, 26,357,760 bits of block RAM, and 16 GTX transceivers. It operates at a core voltage of 1.0V and is built on 28nm technology. The device includes 8 MMCMs and 8 PLLs for clock management, and supports a maximum frequency of 741 MHz.

Hey Google, what can replace XC7K355T-3FFG901E?

The XC7K355T-3FFG901E can be replaced by the XC7K355T-2FFG901E (same package, lower speed grade) or the XC7K325T-2FFG900I (fewer logic cells, different package). For a cross-brand alternative, consider the Intel Arria 10 GX series, though package compatibility must be verified.

Is XC7K355T-3FFG901E the same as XC7K325T-2FFG900I?

No, the XC7K355T-3FFG901E and XC7K325T-2FFG900I are different devices. The 355T has more logic cells (356,160 vs 326,080) and a different package (FFG901 vs FFG900). They are not pin-compatible, so a PCB redesign would be required to swap between them.

What is the best Intel equivalent for XC7K355T-3FFG901E?

The Intel Arria 10 GX 570 is a potential cross-brand equivalent for the XC7K355T-3FFG901E, offering similar logic density and transceiver capabilities. However, the package and pinout differ, so a PCB redesign is necessary. Verify all electrical and timing requirements before substitution.

Engineering reference data for XC7K355T-3FFG901E — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7K355T-3FFG901E when you need the highest performance from the Kintex-7 family, with 356,160 logic cells and a -3 speed grade for maximum clock frequency. It is ideal for applications like 5G baseband processing, high-performance computing, and aerospace systems where logic density and speed are critical. If your design can tolerate a lower speed grade, the XC7K355T-2FFG901E offers a drop-in replacement with potential cost savings. For designs requiring fewer logic cells, the XC7K325T-2FFG900I may be more cost-effective, but it has a different package and fewer I/Os. The XC7K410T-2FFG900I provides more logic cells but also a different package. For cross-brand alternatives, Intel's Arria 10 GX series offers similar capabilities but requires a PCB redesign. Evaluate your specific performance, power, and cost requirements to select the best fit.

Comparison with Alternatives

Parameter	This Product	XC7K355T-2FFG901E	XC7K355T-1FFG901E	XC7K325T-2FFG900I	XC7K410T-2FFG900I
Package	900-BBGA, FCBGA (FFG901)	900-BBGA, FCBGA (FFG901)	900-BBGA, FCBGA (FFG901)	900-BBGA, FCBGA (FFG900)	900-BBGA, FCBGA (FFG900)
Brand	AMD	AMD	AMD	AMD	AMD
Logic Cells	356160	356160	356160	326080	406720
Speed Grade	-3	-2	-1	-2	-2
Max Frequency	741 MHz	628 MHz	550 MHz	628 MHz	628 MHz
User I/O	300	300	300	500	500
Block RAM	26357760 bits	26357760 bits	26357760 bits	16025760 bits	30317760 bits
GTX Transceivers	16	16	16	16	16

Key Differentiators

Higher speed grade (-3) for maximum performance (vs XC7K355T-2FFG901E)
More logic cells than XC7K325T (vs XC7K325T-2FFG900I)
Larger block RAM than XC7K325T (vs XC7K325T-2FFG900I)

Design Notes

The XC7K355T-3FFG901E requires a 1.0V core supply (VCCINT) with tight regulation (0.97V to 1.03V). Use a dedicated power module or LDO with low output noise and fast transient response. Place 100nF and 10uF decoupling capacitors close to each VCCINT pin to minimize voltage droop during high-speed switching. Refer to the AMD Kintex-7 power management application note for detailed recommendations.

The FCBGA-901 package can dissipate significant power under full load. Ensure adequate thermal management, such as a heatsink or forced airflow, to keep the junction temperature within the specified range. Use thermal vias under the package to improve heat transfer to the PCB. The thermal resistance (theta_JA) depends on airflow and PCB design; consult the thermal design guide for accurate calculations.

For high-speed transceivers, follow the AMD PCB design guidelines for impedance control and signal integrity. Use controlled impedance traces (e.g., 100 ohm differential) for GTX pairs and minimize via stubs. Place transceiver power pins with adequate decoupling and use ground planes to reduce noise. Refer to the Kintex-7 PCB design guide for detailed layout recommendations.