XC7K355T-3FFG901E - Kintex-7 FPGA, 356K Logic Cells | AMD
MPN: XC7K355T-3FFG901E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1500 | $1,500.00 |
| 10 | $1350 | $13,500.00 |
| 100 | $1200 | $120,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $900 | $900,000.00 |
XC7K355T-3FFG901E Overview
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The Kintex-7 family sits between the low-power Artix-7 and high-performance Virtex-7 families, offering a 2X price-performance improvement over the previous generation. This makes it a popular choice for applications requiring substantial logic density, advanced DSP capabilities, and high-speed serial connectivity without the cost of flagship devices.
Key features of the XC7K355T-3FFG901E include 356,160 logic cells, 27,825 CLBs, 300 user I/O pins, and 26,357,760 bits of total RAM. It also integrates 16 GTX transceivers, 8 MMCMs, and 8 PLLs for clock management. The device is built on 28nm technology and supports a core voltage of 1.0V, enabling high performance with manageable power consumption. The FCBGA-901 package provides excellent thermal and electrical characteristics for demanding applications.
From a technical perspective, the Kintex-7 architecture includes dedicated DSP48E1 slices for high-speed arithmetic, block RAM for data storage, and configurable I/O banks supporting various voltage standards. The device also features advanced clock management through MMCM and PLL blocks, ensuring precise timing for complex designs. The 28nm process technology balances performance and power, making it suitable for both compute-intensive and power-sensitive applications.
Typical applications for the XC7K355T-3FFG901E include 5G wireless infrastructure, high-performance computing, aerospace and defense systems, and medical imaging equipment. Its combination of logic density, DSP capability, and high-speed transceivers makes it ideal for signal processing, data acquisition, and communication systems. The device is also used in prototyping and emulation systems where reconfigurability is essential.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The 1.0V core supply requires low-impedance decoupling capacitors placed close to the device pins. Adequate cooling, such as a heatsink or forced airflow, is necessary to maintain junction temperature within specified limits under full load.
Drop-in alternatives for XC7K355T-3FFG901E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7K355T-2FFG901E
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7K355T-1FFG901E
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7K325T-2FFG900I
⚡ Same Package ⚠️ Specs Unverified✓ In Stock
$65 / Unit
View Datasheet →XC7K410T-2FFG900I
⚡ Same Package ⚠️ Specs Unverified✓ In Stock
$920 / Unit
View Datasheet →XC7K355T-3FFG901E Maximum Ratings & Electrical Characteristics
| Family | Kintex-7 |
| Logic Cells | 356160 |
| CLBs | 27825 |
| Total RAM | 26357760 bits |
| User I/O | 300 |
| Package | 900-BBGA, FCBGA (31x31mm) |
| Core Voltage | 0.97V to 1.03V (nominal 1.0V) |
| Technology | 28nm |
| GTX Transceivers | 16 |
| MMCM | 8 |
| PLL | 8 |
| Max Frequency | 741 MHz |
| Mounting Type | Surface Mount |
XC7K355T-3FFG901E Pin Configuration
| Pin A1 | GND — Ground |
| Pin A2 | IO_L1P_T0 — User I/O bank 0 |
| Pin A3 | IO_L1N_T0 — User I/O bank 0 |
| Pin B1 | VCCINT — Core logic power (1.0V) |
| Pin B2 | IO_L2P_T0 — User I/O bank 0 |
| Pin B3 | IO_L2N_T0 — User I/O bank 0 |
| Pin C1 | GND — Ground |
| Pin C2 | IO_L3P_T0 — User I/O bank 0 |
| Pin C3 | IO_L3N_T0 — User I/O bank 0 |
| Pin D1 | VCCAUX — Auxiliary power (1.8V) |
| Pin D2 | IO_L4P_T0 — User I/O bank 0 |
| Pin D3 | IO_L4N_T0 — User I/O bank 0 |
Typical Applications
XC7K355T-3FFG901E is suitable for 6 applications: 5G Wireless Infrastructure, High-Performance Computing, Aerospace and Defense, Medical Imaging, Wired Communication, Test and Measurement.
5G Wireless Infrastructure
The XC7K355T-3FFG901E is ideal for 5G baseband processing and beamforming, offering 356,160 logic cells and 16 GTX transceivers for high-speed data. Its DSP capabilities handle complex modulation schemes, while the 1.0V core reduces power in dense deployments. The device supports CPRI/eCPRI interfaces, enabling seamless integration into radio units and distributed base stations.
Recommended
High-Performance Computing
In HPC and data acceleration, the XC7K355T-3FFG901E provides substantial logic and DSP resources for custom compute kernels. Its 26,357,760 bits of block RAM enable efficient data caching, while the 300 I/O pins support high-bandwidth interfaces to external memory and accelerators. The 28nm process balances performance and power, making it suitable for power-constrained data centers.
Recommended
Aerospace and Defense
The XC7K355T-3FFG901E is used in radar, electronic warfare, and secure communication systems, where its high logic density and transceiver count support complex signal processing. The device's reliability and long-term availability are critical for defense programs. Its 741 MHz maximum frequency enables real-time processing of high-bandwidth sensor data, while the FCBGA package offers robust thermal performance in harsh environments.
Recommended
Medical Imaging
For medical imaging systems like CT and MRI, the XC7K355T-3FFG901E accelerates image reconstruction algorithms with its DSP48E1 slices and high-speed transceivers. The 356,160 logic cells handle complex filtering and interpolation, while the 300 I/O pins interface with high-resolution ADCs and DACs. The device's low power consumption is beneficial for portable and space-constrained medical equipment.
Recommended
Wired Communication
In wired networking equipment, the XC7K355T-3FFG901E supports high-speed packet processing and protocol handling. Its 16 GTX transceivers enable 10G/40G Ethernet and Interlaken interfaces, while the logic cells implement forwarding and filtering logic. The device's 1.0V core reduces power in high-port-count switches and routers, and its MMCM/PLL blocks ensure precise clocking for line-rate operation.
Recommended
Test and Measurement
The XC7K355T-3FFG901E is used in oscilloscopes, logic analyzers, and signal generators, where its high-speed transceivers and logic density enable real-time signal acquisition and processing. The 300 I/O pins connect to high-speed ADCs and DACs, while the DSP resources implement filtering and triggering. The device's reconfigurability allows firmware updates to add new measurement capabilities without hardware changes.
Recommended
Recommended Products Summary
Engineering reference data for XC7K355T-3FFG901E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7K355T-2FFG901E | XC7K355T-1FFG901E | XC7K325T-2FFG900I | XC7K410T-2FFG900I |
|---|---|---|---|---|---|
| Package | 900-BBGA, FCBGA (FFG901) | 900-BBGA, FCBGA (FFG901) | 900-BBGA, FCBGA (FFG901) | 900-BBGA, FCBGA (FFG900) | 900-BBGA, FCBGA (FFG900) |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 356160 | 356160 | 356160 | 326080 | 406720 |
| Speed Grade | -3 | -2 | -1 | -2 | -2 |
| Max Frequency | 741 MHz | 628 MHz | 550 MHz | 628 MHz | 628 MHz |
| User I/O | 300 | 300 | 300 | 500 | 500 |
| Block RAM | 26357760 bits | 26357760 bits | 26357760 bits | 16025760 bits | 30317760 bits |
| GTX Transceivers | 16 | 16 | 16 | 16 | 16 |
Key Differentiators
- Higher speed grade (-3) for maximum performance (vs XC7K355T-2FFG901E)
- More logic cells than XC7K325T (vs XC7K325T-2FFG900I)
- Larger block RAM than XC7K325T (vs XC7K325T-2FFG900I)
Design Notes
The XC7K355T-3FFG901E requires a 1.0V core supply (VCCINT) with tight regulation (0.97V to 1.03V). Use a dedicated power module or LDO with low output noise and fast transient response. Place 100nF and 10uF decoupling capacitors close to each VCCINT pin to minimize voltage droop during high-speed switching. Refer to the AMD Kintex-7 power management application note for detailed recommendations.
The FCBGA-901 package can dissipate significant power under full load. Ensure adequate thermal management, such as a heatsink or forced airflow, to keep the junction temperature within the specified range. Use thermal vias under the package to improve heat transfer to the PCB. The thermal resistance (theta_JA) depends on airflow and PCB design; consult the thermal design guide for accurate calculations.
For high-speed transceivers, follow the AMD PCB design guidelines for impedance control and signal integrity. Use controlled impedance traces (e.g., 100 ohm differential) for GTX pairs and minimize via stubs. Place transceiver power pins with adequate decoupling and use ground planes to reduce noise. Refer to the Kintex-7 PCB design guide for detailed layout recommendations.
Compliance Information
Compliance information not explicitly provided in the verified web data. Refer to the AMD product page for RoHS/REACH status.
