K4A8G045WB-BCPB - 8Gb DDR4 SDRAM | Samsung | 78-FBGA
MPN: K4A8G045WB-BCPB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.27 | $9.27 |
| 10 | $8.5 | $85.00 |
| 100 | $7.8 | $780.00 |
| 500 | $7.2 | $3,600.00 |
| 1,000 | $6.8 | $6,800.00 |
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View Datasheet →K4A8G045WB-BCPB Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 8Gb |
| Organization | 2G x 4 |
| Speed Grade | PC4-2133 (2133 Mbps/pin) |
| Supply Voltage | 1.2V |
| Package | 78-ball FBGA |
| Number of Terminals | 78 |
| Refresh Cycles | 8192 |
| Data Rate | 2133 MT/s |
| CAS Latency | [DATA_NEEDED: CAS Latency] |
| Operating Temperature Range | [DATA_NEEDED: Operating Temperature Range] |
| RoHS | Compliant |
| Lead-Free | Yes |
| Mounting Type | Surface Mount |
| Package Shape | RECTANGULAR |
K4A8G045WB-BCPB Pin Configuration
| Pin A1 | VDD — Power supply (1.2V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin B1 | VDDQ — DQ power supply |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin B4 | VSSQ — DQ ground |
| Pin C1 | A0 — Address input 0 |
| Pin C2 | A1 — Address input 1 |
| Pin C3 | A2 — Address input 2 |
| Pin C4 | A3 — Address input 3 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A8G045WB-BCPB is suitable for 6 applications: Server Memory Modules, High-Performance Computing, Networking Equipment, Industrial Computing, Automotive Infotainment, Consumer Electronics.
Server Memory Modules
The K4A8G045WB-BCPB is ideal for server memory modules (RDIMMs, LRDIMMs) where high capacity and reliability are critical. Its x4 organization allows for more devices per rank, enabling higher module capacities with ECC support. The 2133 MT/s speed provides balanced performance for enterprise workloads, while the 1.2V supply reduces power consumption in data centers. When used in a memory module, it is paired with a register clock driver (RCD) and power management IC (PMIC) to ensure signal integrity and stable operation. The device's 8192 refresh cycles ensure data retention under heavy load. Designers should consider thermal dissipation in dense server environments, as high-speed operation generates heat. Proper layout and decoupling are essential to maintain signal integrity at 2133 MT/s.
Recommended
High-Performance Computing
In high-performance computing (HPC) systems, the K4A8G045WB-BCPB provides the memory bandwidth needed for complex simulations and data analytics. Its 2133 MT/s data rate and 8Gb density enable large memory pools in a compact footprint. The x4 organization supports advanced error correction (ECC) when used in registered modules, enhancing system reliability. The device's low 1.2V operating voltage helps manage power budgets in large clusters. When designing HPC systems, engineers should ensure the memory controller supports x4 DDR4 devices and can handle the timing requirements. The FBGA package offers good thermal performance, but adequate airflow and heatsinking are recommended for sustained high-speed operation. The device's compatibility with standard DDR4 interfaces simplifies integration into existing platforms.
Recommended
Networking Equipment
The K4A8G045WB-BCPB is suitable for networking equipment such as routers, switches, and firewalls, where high-speed packet processing requires fast memory access. Its 2133 MT/s data rate ensures low latency for routing tables and buffering. The 8Gb density provides ample storage for large forwarding databases. The x4 organization allows for efficient use in memory modules with ECC, which is important for network reliability. The device's low power consumption is beneficial in always-on networking gear. When integrating this memory, designers should consider the memory controller's support for x4 devices and ensure proper termination and layout to minimize signal reflections. The FBGA package's small size helps in compact networking hardware designs.
Recommended
Industrial Computing
In industrial computing applications, the K4A8G045WB-BCPB offers reliable memory for control systems, HMI, and data acquisition. Its 8Gb density and 2133 MT/s speed provide sufficient performance for real-time processing. The device's wide operating temperature range (if specified) makes it suitable for harsh environments. The x4 organization is often used in industrial-grade memory modules with ECC for data integrity. The low 1.2V supply reduces heat generation, which is critical in sealed enclosures. When designing industrial systems, engineers should ensure the memory is rated for the required temperature range and consider conformal coating for protection against moisture and dust. The FBGA package's robustness ensures long-term reliability in vibration-prone environments.
Recommended
Automotive Infotainment
The K4A8G045WB-BCPB can be used in automotive infotainment systems, providing fast memory for navigation, multimedia, and connectivity features. Its 2133 MT/s speed ensures smooth operation of graphical interfaces and video playback. The 8Gb density allows for storing large maps and media files. The device's low power consumption is beneficial for vehicle power budgets. However, automotive applications require AEC-Q100 qualification, which this standard part may not have. Designers should verify if an automotive-grade variant is available. The FBGA package's small size is advantageous for space-constrained dashboard electronics. For automotive use, ensure the memory can operate over the extended temperature range (-40C to +105C) and meets reliability standards.
Recommended
Consumer Electronics
In consumer electronics like smart TVs, set-top boxes, and gaming consoles, the K4A8G045WB-BCPB provides the memory performance needed for smooth user experiences. Its 2133 MT/s speed supports high-definition video streaming and responsive app loading. The 8Gb density is sufficient for modern operating systems and applications. The x4 organization is less common in consumer devices, which typically use x8 or x16 parts, so designers should ensure compatibility. The low 1.2V supply helps extend battery life in portable devices. The FBGA package's compact size is ideal for slim consumer products. When designing consumer electronics, cost is a key factor, and this part's pricing should be competitive. Consider using x8 or x16 alternatives if the memory controller does not support x4.
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Engineering reference data for K4A8G045WB-BCPB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A8G045WB-BCRC | K4A8G085WB-BIWE | K4A8G085WB-BICH | K4A8G165WB-BCPB | K4A8G165WB-BCTD | H5AN8G6NDJR-XNC | MT40A512M16JY-07EAIT:B |
|---|---|---|---|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | SK Hynix | Micron Technology |
| Density | 8Gb | 8Gb | 8Gb | 8Gb | 8Gb | 8Gb | 8Gb | 8Gb |
| Organization | 2G x 4 | 2G x 4 | 1G x 8 | 1G x 8 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Speed Grade | PC4-2133 | PC4-2400 | [DATA_NEEDED] | [DATA_NEEDED] | PC4-2133 | [DATA_NEEDED] | PC4-2400 | PC4-2400 |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V |
| Refresh Cycles | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- x4 organization enables higher capacity memory modules (vs K4A8G085WB-BIWE (x8))
- Samsung B-die known for overclocking potential (vs H5AN8G6NDJR-XNC (SK Hynix))
- Lower power consumption at 1.2V (vs MT40A512M16JY-07EAIT:B (Micron))
Design Notes
The K4A8G045WB-BCPB requires a stable 1.2V supply (VDD) and 1.2V DQ supply (VDDQ). Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each power pin to minimize voltage ripple. The reference voltage VREFCA should be generated from a low-noise source and bypassed with a 0.1uF capacitor. Ensure the power supply can handle peak current during refresh and active operations.
Follow the layout guidelines in the Samsung datasheet for DDR4 routing. Maintain controlled impedance for DQ, DQS, and address/command signals (typically 40-50 ohms single-ended, 80-100 ohms differential). Keep trace lengths matched within the byte lanes to minimize skew. Use ground planes to provide a solid return path and reduce EMI. Place termination resistors (ODT) according to the memory controller's settings.
The FBGA package has a thermal resistance that depends on PCB design and airflow. For high-speed operation, ensure adequate cooling, especially in dense server environments. Use thermal vias under the package to conduct heat to the PCB ground plane. Monitor the junction temperature to stay within the specified operating range. If the device is used in automotive or industrial applications, consider the ambient temperature extremes and derating.
Compliance Information
RoHS compliance is indicated by distributor data. AEC-Q100 qualification is not specified for this standard part; automotive-grade variants may exist.
