K4B4G1646E-BMK0 - 4Gb DDR3L SDRAM 1600Mbps | Samsung
N.º da peça: K4B4G1646E-BMK0 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.5 | $6.500,00 |
K4B4G1646E-BMK0 Visão geral
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by approximately 15% while maintaining similar performance. It is part of the DDR3 memory family, which uses an 8n-prefetch architecture to achieve high data rates, and is widely used in servers, laptops, and embedded systems.
Key features include a data rate of 1600 Mbps, a 16-bit I/O width, and support for various functions such as auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination (ODT), and data mask. The device operates over a temperature range of -40°C to +95°C, making it suitable for industrial and automotive applications.
The K4B4G1646E uses Samsung's E-die process technology, which offers improved performance and power efficiency compared to earlier die revisions. It supports programmable CAS latency, burst length of 8, and on-die termination for signal integrity. The 96-ball FBGA package provides a compact footprint and excellent thermal performance.
Typical applications include main memory in embedded systems, networking equipment, industrial PCs, and automotive infotainment. Its low voltage and wide temperature range make it ideal for power-sensitive and harsh environments.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The ZQ calibration pin requires a 240-ohm resistor to ground for proper operation.
Alternativas drop-in para K4B4G1646E-BMK0 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com K4B4G1646E-BMK0 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Data Rate, Supply Voltage, Burst Length.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4B4G1646E-BMMA
✅ Drop-In✓ Em estoque
$16.0781 / unidade
Ver ficha técnica →K4B4G1646E-BYK0
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.8 / unidade
Ver ficha técnica →K4B4G1646E-BYMA
✅ Drop-In✓ Em estoque
$14.3182 / unidade
Ver ficha técnica →K4B4G1646D-BMK0
✅ Drop-In✓ Em estoque
$5.9 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →H5TC4G63AFR-PBA
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.9773 / unidade
Ver ficha técnica →IS43TR16256AL-125KBL
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.6 / unidade
Ver ficha técnica →K4B4G1646E-BMK0 Classificações máximas e características elétricas
| Density | 4 Gb |
| Organização da memória | 256M x 16 |
| Speed Grade | 1600 Mbps |
| Voltage | 1.35 V |
| Temperatura de operação | -40°C to +95°C |
| Encapsulamento | 96-FBGA |
| Interface | Parallel |
| Clock Frequency | 800 MHz |
| Taxa de dados | 1600 Mbps |
| Tipo de memória | DDR3L SDRAM |
| Tipo de montagem | Surface Mount |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| ZQ Calibration | Yes |
| Dynamic ODT | Yes |
| Data Mask | Yes |
Configuração de pinos do K4B4G1646E-BMK0
| Pino A1 | VDD — Power supply |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDD — Power supply |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino B1 | VDDQ — I/O power supply |
| Pino B2 | DQ8 — Data input/output 8 |
| Pino B3 | DQ9 — Data input/output 9 |
| Pino B4 | VSSQ — I/O ground |
| Pino B5 | DQ10 — Data input/output 10 |
| Pino B6 | DQ11 — Data input/output 11 |
| Pino B7 | VDDQ — I/O power supply |
| Pino B8 | DQ12 — Data input/output 12 |
| Pino B9 | DQ13 — Data input/output 13 |
| Pino B10 | VSSQ — I/O ground |
| Pino B11 | DQ14 — Data input/output 14 |
| Pino B12 | DQ15 — Data input/output 15 |
Aplicações típicas
K4B4G1646E-BMK0 é adequado para 6 aplicaçãos: Industrial PCs, Networking Equipment, Automotive Infotainment, Embedded Computing, Medical Devices, Test & Measurement.
Industrial PCs
The K4B4G1646E-BMK0 provides 4Gb of DDR3L memory for industrial PCs, offering reliable operation over -40°C to +95°C. Its 1.35V operation reduces power consumption and heat generation, which is critical in sealed enclosures. The 1600 Mbps data rate ensures fast processing for control and monitoring tasks. With a 96-FBGA package, it fits compact motherboards. Recommended companion products include the NDL46PFP-8KET for storage and the STM32F767BGT6 for system control.
Recomendado
Networking Equipment
In networking equipment like routers and switches, the K4B4G1646E-BMK0 offers high-bandwidth memory for packet buffering and forwarding tables. Its 1600 Mbps data rate and 16-bit interface provide sufficient throughput for gigabit and 10-gigabit networks. The low 1.35V supply reduces power in 24/7 operation. The wide temperature range ensures reliability in telecom cabinets. Companion products include the XC7Z020 FPGA for packet processing and the W634GU6RB12I for additional memory.
Recomendado
Automotive Infotainment
The K4B4G1646E-BMK0 is suitable for automotive infotainment systems, providing 4Gb of memory for navigation, media playback, and connectivity. Its -40°C to +95°C range covers automotive temperature grades, and the 1.35V operation is efficient for battery-powered vehicles. The 1600 Mbps speed supports smooth graphics and audio. The 96-FBGA package withstands vibration. Recommended companions include the STM32F746BET6 for display control and the L9978 for power management.
Recomendado
Embedded Computing
For embedded computing modules, the K4B4G1646E-BMK0 offers a balance of capacity and power efficiency. Its 4Gb density is ideal for running Linux or real-time operating systems. The 1.35V supply extends battery life in portable devices. The 1600 Mbps data rate supports responsive user interfaces. The wide temperature range allows deployment in outdoor or industrial settings. Companion products include the STM32MP1 series processors and the AS4C256M16D3LB-12BIN for additional memory.
Recomendado
Medical Devices
In medical devices such as patient monitors and diagnostic equipment, the K4B4G1646E-BMK0 provides reliable memory for data acquisition and display. Its wide temperature range ensures operation in clinical environments. The low voltage reduces heat, which is important for patient comfort. The 1600 Mbps speed handles real-time data streams. The 96-FBGA package is compact for portable devices. Recommended companions include the STM32L476VGT6 for low-power processing and the MAX17633BATP+T for power management.
Recomendado
Test & Measurement
The K4B4G1646E-BMK0 is used in test and measurement equipment like oscilloscopes and signal analyzers, where high-speed data capture requires large memory buffers. Its 1600 Mbps data rate supports fast sampling, and the 4Gb capacity stores long waveforms. The 1.35V supply reduces power in benchtop instruments. The wide temperature range ensures accuracy in varying lab conditions. Companion products include the XC7A100T FPGA for signal processing and the ADC12DJ3200 for high-speed conversion.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4B4G1646E-BMK0 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4B4G1646E-BMMA | K4B4G1646E-BYK0 | K4B4G1646E-BYMA | K4B4G1646D-BMK0 | MT41K256M16HA-125 | H5TC4G63AFR-PBA | IS43TR16256AL-125KBL |
|---|---|---|---|---|---|---|---|---|
| Package | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | SK Hynix | ISSI |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Speed Grade | 1600 Mbps | 1600 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps |
| Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | -40°C to +95°C | -40°C to +95°C |
| Die Revision | E-die | E-die | E-die | E-die | D-die | N/A | N/A | N/A |
Principais diferenciais
- E-die process technology (vs K4B4G1646D-BMK0)
- Wide temperature range (vs MT41K256M16HA-125)
- Samsung brand reliability (vs IS43TR16256AL-125KBL)
Notas de projeto
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for DQ and address lines to reduce signal integrity issues. Follow the layout guidelines in the Samsung datasheet for the 96-FBGA package.
The K4B4G1646E-BMK0 operates up to +95°C. Ensure adequate airflow or heatsinking in high-temperature environments. The 96-FBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values and design accordingly.
Do not exceed the absolute maximum ratings for VDD and VDDQ. Ensure the ZQ pin is connected to a 240-ohm resistor to ground for proper calibration. Incorrect termination on DQ and DQS lines can cause data errors; use on-die termination (ODT) settings as recommended.
Informações de conformidade
Samsung memory components are generally RoHS compliant. AEC-Q100 not applicable for standard memory ICs.
