FPGA & CPLD
Products (6358)
EP1SGX25DF1020C6L - 25K LE Stratix GX FPGA, 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C6L is a high-density Stratix GX Field Programmable Gate Array (FPGA) with 25,660 logic elements, 607 user I/O pins, and 1,944,576 bits of embedded RAM, housed in a 1020-ball FineLine BGA package (33 x 33 mm, 1.0 mm pitch). Built on a 130 nm CMOS process, it integrates up to 20 high-speed transceivers capable of 500 Mbps to 3.1875 Gbps operation, making it the forerunner of modern gigabit-serial FPGA architectures. An FPGA (Field Programmable Gate Array) is a programmable logic device containing configurable logic blocks (LABs/CLBs), routing fabric, and dedicated hard IP that the designer can interconnect after manufacture to realize arbitrary digital functions. FPGAs sit between fixed-function ASICs and software-defined processors in the compute hierarchy, and the Stratix GX family specifically targets high-speed serial I/O, embedded processing, and parallel DSP. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. Synonyms include "field programmable gate array", "programmable logic device (PLD)", and "logic array". Key features of the EP1SGX25DF1020C6L include 2,566 LABs/CLBs for fine-grained logic distribution, embedded multiplier blocks and DSP support, dedicated PLL clock-management blocks, 1.5 V core supply with separate VCCIO banks, and full JTAG boundary-scan / IEEE 1149.1 support. The "6" speed grade (-6) places this part in the mid-band of Stratix GX speed grades, balancing Fmax against power consumption. The "L" suffix indicates a lead-free, RoHS-compliant package finish. Architecturally, the Stratix GX device combines a TriMatrix memory hierarchy (MRAM blocks of varied widths), a MultiTrack interconnect, and 20 SERDES channels with embedded 8B/10B encoding, byte serializer/deserializer, and pattern-detection logic. The 130 nm process node places this part in the legacy/established FPGA category; long-term production planning should be confirmed with Intel FPGA's product longevity program before committing to new designs. Typical applications include multi-gigabit serial backplanes (XAUI, Serial RapidIO, PCI Express endpoint 1.0/2.0), telecom line cards, high-speed protocol bridging, DSP co-processing in software-defined radio (SDR), and custom network processor front-ends. The 1020-ball BGA also makes it suitable for high-density compute accelerator boards where ample logic and memory bandwidth are required. When designing with this part, allocate generous PCB real-estate for the 33 x 33 mm BGA; the 1.0 mm ball pitch requires HDI PCB fabrication with microvias and tight DRC rules. Provide clean, low-noise power rails (1.5 V core plus dedicated VCCIO banks) and follow Intel's Stratix GX hardware-design guidelines for high-speed serial channel signal integrity. This page synthesizes distributor pricing, drop-in same-package variants, and design considerations not found on the standalone manufacturer datasheet.
EP1SGX25DF1020C6N - Stratix GX FPGA 25K LE 607 I/O 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C6N is a member of the Stratix GX FPGA family, delivering 25,660 logic elements, 1,944,576 bits of embedded memory, and 607 user I/O pins in a 1020-ball FineLine BGA package. Built on a 1.5 V, 130 nm CMOS process, the device integrates up to 20 full-duplex embedded transceiver channels operating at up to 3.125 Gbps, making it the entry point of the Stratix GX line for high-speed serial I/O applications. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells interconnected by a programmable routing fabric. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function ASICs in flexibility and below microcontrollers in software abstraction. The Stratix GX family further extends the standard FPGA taxonomy by adding high-speed serial transceivers, positioning Stratix GX between general-purpose FPGAs and dedicated serial-interface ASSPs. The EP1SGX25 sits at the low end of the Stratix GX density range (EP1SGX10, EP1SGX25, EP1SGX40, EP1SGX60), targeting cost-sensitive multi-gigabit designs. Key features of the EP1SGX25DF1020C6N include 25,660 logic elements, 1,944,576 RAM bits, 80 DSP blocks, 20 transceiver channels supporting CPRI, OBSAI, PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI protocols, and a maximum operating frequency of 4385.97 MHz across internal timing paths. The "DF" suffix denotes the FineLine BGA package with 1020 balls at 1 mm pitch, and the "C6" speed grade places the device in the mid-speed commercial tier. Architecture-wise, the Stratix GX combines a TriMatrix memory hierarchy (MLAB, M512, M4K, M-RAM blocks), dedicated hardware multipliers and adder chains in DSP blocks, and PLLs for clock management. The transceiver block embeds serializer/deserializer (SERDES), clock-data recovery (CDR), and word alignment, eliminating the need for external PHY devices in many serial-link applications. Typical applications include wireless baseband processing, radio network controllers, Serial RapidIO backplanes, broadcast video routers, and PCI Express endpoint cards. Designers value the EP1SGX25 because it delivers Stratix GX transceiver density at a price point suited to mid-volume telecom and industrial products where a full Stratix II GX is overkill. Design consideration: the EP1SGX25DF1020C6N requires a 1.5 V core supply and 3.3 V/2.5 V/1.8 V/1.5 V I/O supplies, with careful decoupling and a multi-layer PCB. The 1020-ball BGA at 1 mm pitch demands advanced assembly capability (typically 4-6 layer PCB, ENIG finish, and via-in-pad design rules). Power estimation should use the Quartus II PowerPlay early estimator before pin assignment. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not found in the Intel datasheet alone.
EP1SGX25DF1020C7 - Stratix GX FPGA 25K LE, 607 I/O | Intel
The Intel (formerly Altera) EP1SGX25DF1020C7 is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 607 user I/Os, 1,944,576 bits of embedded RAM, and up to 4,385.97 MHz internal performance in a 1020-ball Flip-Chip BGA (FC-FBGA) package measuring 33 x 33 mm with 1 mm ball pitch. Fabricated on a 130 nm CMOS process, the device operates from a 1.5 V core supply (1.425 V to 1.575 V) and supports commercial temperature grades of 0 C to 85 C. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic blocks (LABs/CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. Within the broader semiconductor hierarchy, an FPGA belongs to the family of programmable logic devices, sits alongside ASICs as a flexible hardware-acceleration alternative, and is widely used in digital signal processing, communications, and high-speed serial interfaces. The Stratix GX series specifically targets applications requiring embedded multi-gigabit transceivers. Key differentiating features of the EP1SGX25DF1020C7 include 2,566 LABs, a 130 nm process node, 24 transceiver channels supporting up to 3.125 Gbps, dedicated hardware multipliers for DSP, and a flip-chip BGA package that maximizes signal integrity and thermal performance for high-pin-count designs. The 'C7' speed grade and 'D' temperature indicator map to the commercial 0-85 C operating window with a moderate performance bin. This part targets high-bandwidth telecommunications infrastructure, including SONET/SDH framer designs, multi-gigabit serial backplanes, and base-station baseband processing, where embedded transceivers and substantial logic capacity are required in a single device. The architecture supports both hardware description language (HDL) and C/C++ design entry through Quartus II / Quartus Prime toolchains, and the device is pin-compatible with other Stratix GX variants, enabling seamless migration. Typical applications include high-end serial-interface bridges, telecom line cards, radar and signal-intelligence front ends, and high-throughput ASIC prototyping. The choice of FC-FBGA-1020 with 1 mm pitch ensures low-impedance power delivery and controlled-impedance differential routing for multi-gigabit links. When designing with this device, the 33 x 33 mm footprint and 1020 balls require a multilayer PCB with high-density interconnect (HDI) stack-up and microvia technology. Multiple ground and power balls are used for decoupling; place 0.1 uF and 0.01 uF ceramic capacitors within 5 mm of each power pin to meet the transceiver jitter budget. This page synthesizes real-time distributor pricing, drop-in alternatives within the same Stratix GX family, and practical design notes that complement the manufacturer datasheet.
EP1SGX25DF1020C7ES - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C7ES is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process, integrating 25,660 logic elements into a 1020-ball Flip-Chip Fine-pitch BGA package measuring 33 x 33 mm with a 1.0 mm ball pitch. It operates from a core VCC of 1.5 V and supports industrial/commercial junction ranges, delivering up to 4.385 GHz internal performance with a maximum combinatorial delay around 9.48 ns. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit at the top of the programmable-logic taxonomy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> SoC FPGA. Stratix GX extends the Stratix architecture with embedded multi-gigabit transceivers, making the family a programmable alternative to ASICs for high-speed serial I/O and DSP pipelines. Key features of the EP1SGX25DF1020C7ES include 2,566 Configurable Logic Blocks (CLBs), 607 user I/Os, embedded 3.125 Gbps transceiver channels, and on-chip memory with TriMatrix structure. Per the manufacturer datasheet, the device integrates dedicated serializer/deserializer (SERDES) blocks for protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, eliminating external PHY ICs in many designs. The architecture combines look-up-table (LUT)-based logic, distributed and block RAM, embedded multipliers, and high-speed LVDS I/O. The 1020-ball FC-FBGA package exposes the full transceiver and I/O count of the die, supporting high pin-density PCB layouts with controlled-impedance routing for the multi-gigabit serial links. Typical applications include high-speed serial interface bridging, telecom line-card aggregation, military radar signal chains, and ASIC prototyping. The combination of embedded transceivers and abundant logic makes it a drop-in solution for designers migrating from discrete SERDES plus glue logic to a single programmable device. When designing with the EP1SGX25DF1020C7ES, allocate sufficient PCB layers (typically 10+ layers) and follow the IBIS-AMI models for the transceiver channels to maintain signal integrity at multi-gigabit data rates. Decoupling must use a combination of bulk, mid-frequency, and high-frequency ceramic capacitors placed directly under the BGA via the recommended land pattern. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not aggregated on the manufacturer datasheet, giving procurement and design engineers a single reference for evaluation.
EP1SGX25DF1020C7N - 25,660 LEs Stratix GX FPGA, 1020-FBGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020C7N is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, delivering 25,660 logic elements, 2,566 LABs, and 1,944,576 bits of embedded memory in a 1020-ball Fine-pitch BGA (FC-FBGA) package. The device integrates up to 20 full-duplex multi-gigabit transceivers operating up to 3.1875 Gbps, hardened PCI Express and SerialLite II IP, and dedicated DSP blocks for high-throughput signal processing. The C7 speed grade and commercial 0°C to 85°C temperature range target networking, baseband, and high-speed serial I/O applications where deterministic latency and signal integrity are critical. An FPGA is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory blocks, and high-speed I/O through a programmable fabric of look-up tables, flip-flops, routing, and hard IP cores. FPGAs occupy a tier above microcontrollers (fixed instruction set) and below application-specific integrated circuits (ASICs) in the design-flexibility spectrum. The Stratix GX family specifically targets serial connectivity, embedding transceiver physical coding sublayers, byte serializers, and rate-matching FIFOs directly in silicon, which dramatically reduces external PHY count and BOM cost compared to FPGA-plus-discrete-PHY designs. Key features include 25,660 logic elements, 1,944,576 embedded RAM bits, 607 user I/O pins, 2,566 LABs/CLBs, and 20 embedded transceivers supporting protocols such as PCI Express x1/x4/x8, SerialLite II, Gigabit Ethernet, and XAUI. The 33 mm × 33 mm FC-FBGA-1020 package uses a 1.0 mm ball pitch, enabling high-density board routing while remaining compatible with mainstream PCB fabrication processes. On-chip PLL count and global clock network details vary by configuration; the Quartus II design software generates the exact resource utilization report at compile time. The Stratix GX architecture combines a TriMatrix embedded memory structure (M512/M4K/M-RAM blocks) with dedicated DSP blocks and embedded transceivers to support DSP-intensive and high-bandwidth designs in a single device. Hard PCI Express endpoint and physical coding sublayer cores allow direct connection to a host CPU or backplane without external bridges, which is a major advantage over soft-IP implementations on pure-logic FPGAs. The 1.5 V core supply with 130 nm process technology balances performance and power for the Stratix generation. Typical applications include 10 Gbps network switching, wireless baseband processing, radar and SIGINT front-ends, high-performance computing coprocessors, and broadcast video processing. The combination of multi-gigabit transceivers, large memory bandwidth, and PCI Express endpoint IP makes the EP1SGX25DF1020C7N particularly well suited to line cards, soft routers, and protocol offload engines. The 1020-FBGA footprint also supports high I/O count, which is required when aggregating many lower-speed interfaces alongside high-speed serial links. When designing with this device, plan power sequencing carefully: Stratix GX requires multiple supply rails (VCCINT, VCCIO, VCCA, VCCP, and transceiver supplies VCCE/VCCT) and strict ramp-rate control. Use the Quartus II PowerPlay early power estimator before final pin assignment to size decoupling, regulators, and thermal management. Signal integrity on 3.125 Gbps links requires matched-differential routing, AC coupling capacitors near the transmitter, and reference-clock jitter below the protocol's maximum tolerable value. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design notes for the EP1SGX25DF1020C7N that are not aggregated on the manufacturer datasheet alone.
EP1SGX25DF1020I5 - 25K LEs Stratix GX FPGA 1020-BGA | Altera
The Altera (Intel) EP1SGX25DF1020I5 is a high-density Stratix GX family Field Programmable Gate Array (FPGA) delivering 25,660 logic elements (LEs) at up to 5000 MHz internal performance, manufactured on a 130 nm CMOS process and housed in a 1020-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package with 1.5 V core supply. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and I/O cells that can be customized after manufacturing. FPGAs sit in the programmable-logic hierarchy above CPLDs and below fixed-function ASICs, and within Stratix GX they integrate high-speed transceivers alongside general-purpose logic, making them well suited for data-pipeline and protocol-bridging designs. Key features include 2,566 configurable logic blocks (CLBs), approximately 607 user I/O pins, dedicated high-speed serial transceivers supporting multi-gigabit interfaces, embedded multiplier blocks, and on-chip TriMatrix memory. The 'I5' speed/temperature grade denotes the industrial temperature range, while the 'DF1020' suffix identifies the 1020-ball FC-FBGA package. The 'GX' suffix denotes the Stratix GX transceiver-enhanced sub-family. The architecture combines 130 nm process technology with built-in transceiver circuitry, allowing engineers to implement protocol PHYs, packet processing, and DSP pipelines on a single die. Embedded RAM and DSP blocks accelerate common arithmetic and buffering operations used in communications infrastructure. Typical applications include high-speed serial interface bridging, telecommunications backplane equipment, video broadcast and image processing, test and measurement instrumentation, and military/aerospace signal-processing systems where the industrial temperature grade and high logic density provide headroom for complex state machines and data paths. When designing with this part, plan FPGA configuration memory carefully: the Stratix GX family requires specific configuration schemes (e.g., passive serial, fast passive parallel, JTAG). PCB designers must allocate 1020 balls with controlled-impedance escape routing, provide robust power-rail decoupling, and ensure thermal relief for industrial-temperature operation. This page synthesizes distributor pricing, drop-in equivalents, and practical design notes for the EP1SGX25DF1020I5 - information not consolidated on any single manufacturer or distributor page.
EP1SGX25DF1020I5N - Stratix GX FPGA 25K LEs, 1.5V, FC-FBGA-1020 | Intel
The Intel (formerly Altera) EP1SGX25DF1020I5N is a member of the Stratix GX FPGA family fabricated on a 130 nm CMOS process, integrating 25,660 logic elements and high-speed serial transceiver channels in a 1,020-pin flip-chip FineLine BGA package (33 × 33 mm, 1.0 mm pitch). It operates from a 1.5 V core supply and is offered in an industrial temperature grade of 0 °C to 85 °C. The device integrates up to 20 full-duplex CDR-based transceiver channels supporting 500 Mbps to 3.1875 Gbps, providing up to 127.5 Gbps of aggregate serial bandwidth and embedded PCI Express, SerialLite II, XAUI, and Serial RapidIO hard intellectual property (IP). What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and high-speed I/O that engineers can reconfigure via an HDL bitstream. FPGAs sit within the broader semiconductor hierarchy as application-specific programmable logic, distinct from fixed-function ASICs (Application-Specific Integrated Circuits) and general-purpose microcontrollers. The Stratix GX family specifically targets high-speed serial interconnect applications where hardware parallelism and deterministic latency are essential. Key features include embedded transceiver channels with clock-data recovery, dedicated PMA and PCS blocks per channel, on-chip phase-locked loops for multiple reference clock domains, and a TriMatrix memory architecture for distributed and block RAM. The high-speed differential I/O and low-jitter transceiver physical layer are tuned for backplane and chip-to-chip serial links. Architecturally, the device combines a transceiver-rich edge with a programmable fabric optimized for protocol bridging, channel aggregation, and physical-layer adaptation. Hard IP cores reduce logic footprint for PCI Express ×1/×4 endpoints, XAUI, and SerialLite II, freeing fabric resources for application logic, while the 1.0 mm pitch BGA package preserves signal integrity for multi-gigabit serial channels. Typical applications include high-speed serial bridge cards, telecom backplane aggregation, network interface controllers, test and measurement equipment, broadcast video routers, and embedded prototyping for proprietary serial protocols. Designers select this device when deterministic, low-latency serial I/O and proven transceiver silicon are required in production-grade hardware. When designing with the EP1SGX25DF1020I5N, use the Altera Quartus II design suite (or its Stratix GX support package) for synthesis, place-and-route, and bitstream generation. Maintain controlled impedance for all serial channels, follow the Stratix GX handbook reference for PCB stack-up and decoupling, and respect the 1.0 mm BGA fanout and via-in-pad recommendations for clean multi-gigabit signal integrity. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix GX family, and practical design considerations not found in the manufacturer datasheet, helping engineers source a usable configuration for legacy Stratix GX designs.
EP1SGX25DF1020I6N - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020I6N is a high-density Stratix GX family FPGA delivering 25,660 logic elements organized into 2,566 Configurable Logic Blocks (CLBs), housed in a 1020-ball FC-FBGA package. It supports up to 607 user I/O pins and integrates embedded transceivers optimized for high-speed serial connectivity, with a 130 nm CMOS process and a 1.5 V core supply. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP blocks (transceivers, memory, multipliers) on a single semiconductor die. Within the semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as programmable logic devices (PLDs), but unlike CPLDs they target high-density, high-throughput applications such as line-card packet processing, baseband signal processing, and protocol bridging. The Stratix GX family in particular extends the general-purpose Stratix architecture with multi-gigabit transceivers (MGTs) and embedded SERDES, occupying the role of an FPGA-plus-transceiver platform. Key features of the EP1SGX25DF1020I6N include 25,660 logic cells, 2,566 CLBs, up to 607 user I/Os, integrated 3.125 Gbps multi-gigabit transceivers, embedded TriMatrix memory for distributed RAM and FIFO applications, and DSP blocks for high-performance fixed- and floating-point arithmetic. The device also provides dedicated clock management PLLs and dynamic phase alignment (DPA) for source-synchronous interfaces such as SPI-4.2, SFI-4, and parallel RapidIO. The 33 mm × 33 mm FC-FBGA package uses a 1.0 mm ball pitch and supports industrial-grade temperature operation (0 °C to 85 °C). Architecturally, the EP1SGX25DF1020I6N uses a 130 nm CMOS process with a 1.425 V–1.575 V core supply. Logic is implemented through a Look-Up Table (LUT) fabric and routed through a hierarchical MultiTrack interconnect that minimizes delay for typical paths. Embedded transceivers support PMA and PCS functions with built-in 8B/10B encoding, word alignment, and rate matching, allowing protocol stacks such as PCI Express, Gigabit Ethernet, and SONET/SDH to be implemented without external PHY devices. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), telecom line cards with SPI-4.2 / SFI-4.2 interconnects, software-defined radio baseband processing, military and aerospace signal processing, and high-end test & measurement equipment. The 607 user I/Os and high logic density also make the device suitable for storage-area network (SAN) controllers and broadcast video processing. When designing with this device, prioritize PCB layout for the MGT channels: route differential pairs with controlled 100 Ω impedance, keep via count to a minimum, and isolate MGT power (VCCR, VCCT) from the core and I/O supplies through ferrite beads. Reference clock jitter directly determines MGT link stability, so use a low-jitter oscillator and match the trace lengths of the MGT clock and data pairs. This page synthesizes distributor pricing, same-package drop-in alternatives within the Stratix GX and Stratix II GX families, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX25DF1020I7 - Stratix GX FPGA 25,660 Cells 1020-BGA | Intel
The Intel EP1SGX25DF1020I7 is a high-performance field-programmable gate array (FPGA) from the Stratix GX family, integrating 25,660 logic cells and 2,566 configurable logic blocks (CLBs) in a 1020-pin flip-chip fine-pitch BGA (FC-FBGA) package. The device is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and supports a maximum clock frequency of approximately 4.39 GHz with a combinatorial CLB delay of 9.48 ns, targeting high-speed serial I/O and embedded processing applications. The I7 speed grade and industrial temperature range (-40C to +100C junction) qualify the part for harsh-environment deployments where commercial-grade silicon would be unsuitable. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit that combines configurable logic blocks, programmable interconnect, and dedicated I/O and memory resources. In the system design hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism, deterministic latency, and post-production reconfigurability. The Stratix GX family was Intel's first generation of FPGAs with embedded multi-gigabit transceivers, enabling protocol-agnostic serial connectivity for telecom, storage, and defense designs. Key features of the EP1SGX25DF1020I7 include dedicated high-speed transceiver channels supporting data rates up to 3.125 Gbps, embedded TriMatrix memory blocks for efficient on-chip buffering, and an enhanced routing architecture optimized for timing closure. The 1020-ball FC-FBGA package provides high signal and power pin density while supporting controlled-impedance differential pairs, which is essential for multi-gigabit serial links. Industrial temperature grade ensures operation across extended thermal ranges without derating logic performance. The device is engineered for high-bandwidth serial I/O applications including backplane interfaces, telecommunications line cards, and high-end test equipment. The high logic cell count supports complex state machines, soft processor cores, and parallel data-path processing that would be impractical in a fixed-function ASIC during prototyping. The transceiver-rich architecture lets designers implement protocols such as Serial RapidIO, PCI Express Gen 1, Gigabit Ethernet, and XAUI directly in the fabric without external PHY components. Typical applications include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, optical transport network (OTN) line cards, and military/aerospace signal processing. The high pin count accommodates hundreds of LVDS, LVTTL, and SSTL I/O, which is valuable for parallel ADC/DAC interfaces. When designing with this part, pay careful attention to PCB layout for the FC-FBGA footprint: use microvia stack-ups and matched-length differential routing for transceiver channels. Decoupling must follow Intel's Stratix GX power distribution network guidelines, with both bulk and high-frequency ceramic capacitors placed within 100 mils of each supply pin. The I7 industrial temperature grade also requires thermal modeling to ensure junction temperature stays within datasheet limits at maximum toggle rates. This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
EP1SGX25DF1020I7N - Stratix GX FPGA, 25K LEs, 1020-pin FC-FBGA | Intel
The Intel (formerly Altera) EP1SGX25DF1020I7N is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) featuring 25,660 logic elements, 2,566 Configurable Logic Blocks (CLBs), and integrated high-speed transceivers, housed in a 1020-ball FC-FBGA package. It is fabricated on a 130 nm process node and operates at a core voltage of 1.5 V with military-grade temperature grading (-40 °C to +100 °C I-temp). The device delivers up to 4,385.97 MHz of internal performance and targets high-bandwidth serial I/O applications such as backplane transceivers, communications infrastructure, and ASIC prototyping. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. Architecturally, an FPGA sits between a hard-wired Application-Specific Integrated Circuit (ASIC) and a general-purpose processor: faster and lower-power than a processor for fixed functions, but reprogrammable like software. The Stratix GX family adds multi-gigabit serial transceivers and dedicated clock management, positioning these FPGAs inside the broader hierarchy: FPGA -> programmable logic device -> programmable logic IC -> integrated circuit -> semiconductor. Key features of the EP1SGX25DF1020I7N include its embedded transceiver blocks supporting standard serial protocols, dedicated DSP blocks for high-speed arithmetic, TriMatrix on-chip memory for high-bandwidth buffering, and support for external memory interfaces such as DDR SDRAM. The 1020-ball FC-FBGA package provides a high pin density suitable for systems that require very large logic capacity and many high-speed I/O lanes. Military-grade temperature grading ensures operation in harsh thermal environments. The EP1SGX25DF1020I7N uses a SRAM-based configuration cell that requires a configuration device on power-up. Its architecture integrates 4 transceiver channels capable of multi-gigabit-per-second serial I/O, 14 embedded DSP blocks, and a TriMatrix memory architecture with multiple block sizes. The 130 nm process technology balances density and power, while the 1.5 V core VCC keeps dynamic power manageable in long logic traces. Typical applications include high-speed serial backplane interfaces, ASIC prototyping and emulation, telecommunications equipment, network switches, and high-performance digital signal processing systems. Designers choose this part when they need a proven FPGA with integrated transceivers and large logic density. When designing with the EP1SGX25DF1020I7N, ensure the PCB supports the FC-FBGA ball pattern, the configuration device is selected from the recommended list, and JTAG access is provided for boundary-scan and programming. Power decoupling requires multiple bulk and high-frequency ceramic capacitors around the 1.5 V core and 3.3 V I/O rails. This page synthesizes distributor availability, same-package alternative MPNs from the Stratix GX family, and practical design notes not found in the standalone manufacturer datasheet, with values verified against distributor listings as of 2026-09-07.
EP1SGX25DF67216 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
The Altera (now Intel) EP1SGX25DF67216 is a member of the Stratix® GX FPGA family that combines a high-performance logic fabric with up to 20 channels of embedded multi-gigabit serial transceivers. The device integrates 25,660 logic elements, 1,944,576 bits of embedded memory, and 4 PLLs in a 672-ball FineLine BGA package with integrated CDR-based transceivers supporting data rates from 500 Mbps to 3.1875 Gbps. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as transceivers, memory, and DSP. FPGAs sit at the top of the programmable logic hierarchy between CPLDs (smaller, lower-density) and ASICs (higher-NRE, higher-volume). The Stratix GX specifically extends this hierarchy into high-speed serial I/O, combining general-purpose FPGA fabric with multi-gigabit transceivers (MGTs) for protocols like PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. Key features of the EP1SGX25DF67216 include 8 transceiver channels (4 in each of two banks) operating at 500 Mbps to 3.1875 Gbps, on-die termination (ODT) for 100-ohm differential lines, programmable transmitter pre-emphasis and receiver equalization, a 1.5-V core supply, 1,944,576 RAM bits organized as M4K/M-RAM blocks, and 4 dedicated PLLs for clock synthesis. The device supports up to 3 single-ended I/O standards per bank with hot-socketing capability. Architecturally, the Stratix GX family uses a 1.5-V core with a TriMatrix memory structure (640-bit M512, 4-Kbit M4K, 512-Kbit M-RAM) and dedicated DSP blocks for high-throughput arithmetic. Embedded SERDES with clock data recovery (CDR) eliminates external PHY chips, while the high-speed transceiver interface (HSTI) provides a hard-coded PCS layer with 8B/10B encoding, rate matching, and word alignment. Typical applications include high-speed serial interface bridging (PCI Express x1/x4 endpoint, Gigabit Ethernet MAC, Serial RapidIO), telecommunications backplane aggregation, broadcast video transport (SD-SDI/HD-SDI), storage area network interconnects (Fibre Channel), and defense/aerospace signal processing back-ends. The 3.1875 Gbps per channel raw rate translates into approximately 2.5 Gbps usable bandwidth after 8B/10B overhead. When designing with this device, allocate a separate PLL per transceiver block group and keep the 1.5-V core and 3.3-V auxiliary supplies well-decoupled with 100 nF X7R capacitors within 100 mils of each ball. Maintain 100-ohm differential impedance on all transceiver traces and use a 4-layer PCB with continuous ground beneath the BGA to limit crosstalk. This page consolidates distributor pricing, parametric cross-references within the Stratix GX and Stratix II GX families, and design notes not present in the manufacturer datasheet, giving procurement and hardware engineers a single-source comparison before placing a long-lifecycle order.
EP1SGX25DF672C5 - Stratix GX FPGA 25K LE 672-FBGA | Intel
The Intel (formerly Altera) EP1SGX25DF672C5 is a Stratix GX family field-programmable gate array (FPGA) integrating 25,660 logic elements (LEs), 1,944,576 bits of embedded memory, and 455 user I/Os in a 672-ball fine-pitch BGA package (33 × 33 mm, 1 mm pitch). Built on a 1.5 V CMOS process, this device combines a high-density programmable logic fabric with up to 20 embedded transceiver channels optimized for 1.25 Gbps to 3.125 Gbps serial I/O, making it a drop-in building block for high-bandwidth communications and datapath designs. An FPGA (Field Programmable Gate Array) is a programmable logic device — within the broader hierarchy of programmable logic devices (PLDs) — that contains an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. Stratix GX extends the Stratix architecture with embedded serial transceivers that hard-IP the PHY layer for protocols such as Gigabit Ethernet, Serial RapidIO, PCI Express, XAUI, and SONET/SDH at multi-gigabit data rates. The 'SGX' family positions Stratix GX as the transceiver-rich derivative for communication infrastructure, broadcast video, and high-speed datapath applications. Key features of the EP1SGX25DF672C5 include 25,660 LEs, 1,944,576 RAM bits, 455 user I/Os, 20 full-duplex transceiver channels (per the Stratix GX family data sheet) supporting serial rates up to 3.125 Gbps with 8B/10B encoding and dynamic phase alignment, dedicated multiplier/DSP blocks for high-throughput signal processing, and tri-matrix on-chip memory configurable as RAM, ROM, or FIFO. The C5 speed grade balances timing margin against power, and the industrial 0 °C to 85 °C operating range covers commercial and most controlled-environment deployments. Typical applications include 10 Gigabit Ethernet line cards and switch fabrics, multi-port Gigabit Ethernet aggregation, Serial RapidIO and PCI Express endpoint/root-complex bridging, baseband processing for wireless infrastructure, and video broadcast glue logic. The 672-FBGA package exposes 455 user I/Os and full MII/RMII/GMII-friendly LVDS I/O, providing flexible board-level integration in space-constrained line cards. When designing with this device, pay close attention to transceiver reference-clock routing, supply-rail decoupling around the analog 1.5 V and 2.5 V PLLs, and JTAG-driven configuration via the enhanced configuration scheme. The C5 speed grade requires timing closure headroom — review Quartus II TimeQuest timing analyzer results against the datasheet-specified fMAX for your critical path. Keep in mind this part is from a legacy 130 nm node; modern designs typically migrate to Stratix II GX, Cyclone IV GX, or Stratix V for lower power and higher transceiver rates.
EP1SGX25DF672C5N - 25K LE Stratix GX FPGA 455 I/O 672-FBGA
The Intel (formerly Altera) EP1SGX25DF672C5N is a high-performance Stratix GX family FPGA delivering approximately 25,660 logic elements (LEs), 455 user I/Os, and integrated 3.1875 Gbps multi-gigabit transceivers in a 672-ball FineLine BGA package. It operates on a 1.5 V core supply (1.425 V to 1.575 V), is built on a 130 nm CMOS process, and supports embedded memory, DSP blocks, and high-speed serial I/O for communication and signal-processing designs. A Field Programmable Gate Array (FPGA) is a programmable logic device belonging to the broader hierarchy of programmable logic > logic ICs > integrated circuits > semiconductors. FPGAs consist of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and (in modern devices) hardened DSP and transceiver blocks. Stratix GX devices specifically target applications needing integrated multi-gigabit transceivers (MGTs) and high logic capacity, positioned in the Intel/Altera high-performance programmable logic family hierarchy: Stratix GX > Stratix > Cyclone-class devices in capability. Key features of the EP1SGX25DF672C5N include embedded transceiver channels capable of 3.1875 Gbps serial data rates, dedicated DSP blocks for high-speed arithmetic, TriMatrix on-chip memory, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI-X), and a fine-pitch 1.0 mm 672-ball Flip-Chip BGA package (FBGA-672) for high-density board designs. The "C5" speed grade and commercial 0C to 85C operating range balance performance with cost for prototyping and volume production. Architecturally, the Stratix GX integrates transceiver physical coding sublayer (PCS) and physical medium attachment (PMA) blocks directly on-die, eliminating external PHY components for many serial-link applications. The lockable phase-locked loops (PLLs) feed the transceivers and global clock networks. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes, with the option to use Altera configuration devices (EPCS/EPC) for single-chip boot. Typical applications for the EP1SGX25DF672C5N include custom digital signal processing cards, network switching and routing fabrics, telecom backplane interfaces, high-speed serial protocol bridges (XAUI, Fibre Channel, Serial RapidIO, PCI Express via soft IP), military/aerospace data links, and broadcast video processing. The integrated transceiver channels make it especially useful where PCB routing for parallel high-speed buses would be impractical. Design considerations: ensure signal-integrity simulation of all transceiver channels with controlled-impedance differential routing, AC-coupling capacitors on serial lines, and reference-clock jitter well below the device's PLL tolerance. Provide multiple decoupling capacitor values near each power pin and connect the 672-ball BGA to a multi-layer PCB with continuous power/ground planes. Always verify Quartus II design software support for this specific die, package, and speed grade before committing to a layout. This page synthesizes Intel/Altera datasheet parameters, distributor pricing (as of 2026-09-07), same-brand drop-in alternatives from the Stratix GX family, and practical design notes that go beyond the manufacturer datasheet to help engineers evaluate the part for new designs and legacy replacements.
EP1SGX25DF672C6 - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
The Intel / Altera EP1SGX25DF672C6 is a member of the Stratix® GX FPGA family that integrates 25,660 logic elements (approximately 25K Les), 455 user I/O pins, and 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package with a 1.0 mm pitch and 27 x 27 mm body. Designed on a 1.5 V core / CMOS process, this device combines a high-density programmable fabric with embedded transceivers, making it a drop-in upgrade target for serial-interface backplane and edge-card designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that allows engineers to implement arbitrary digital logic, soft processor cores, and high-speed serial interfaces using a hardware description language. The Stratix GX line specifically added multi-gigabit transceivers to the Stratix architecture, simplifying the design of protocols like PCI Express, Serial RapidIO, Gigabit Ethernet, and custom chip-to-chip links without requiring external PHY devices. Key features of the EP1SGX25DF672C6 include 25,660 logic elements distributed across 2,566 LABs, 1,944,576 bits of RAM, 6 embedded transceiver channels supporting data rates up to 3.125 Gbps, and 12 dedicated clock pins with 16 global clock networks. The 672-pin BGA package exposes 455 user I/Os for parallel signaling and board-to-board interconnects, while on-chip PLLs support precise frequency synthesis and clock domain crossing. In terms of architecture, this device blends a fine-grained logic fabric with coarse-grained DSP blocks and TriMatrix memory, allowing efficient implementation of both control logic and signal-processing datapaths. The embedded transceivers include built-in 8b/10b encoding, byte alignment, and rate-matching FIFOs, offloading protocol overhead from the programmable fabric. Typical applications include high-speed serial backplane connectivity, telecom line cards, industrial imaging pipelines, and digital video broadcast equipment. Industrial and telecom system architects use this part where pin-compatibility with later-generation Stratix GX devices allows straightforward migration. When designing with this device, careful attention to power sequencing, decoupling, and signal-integrity on the 1.0 mm BGA is essential. Use at least 6 layers with continuous power planes and follow Altera's Stratix GX design guidelines for channel pre-emphasis and receiver equalization settings. This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the same Stratix GX family, and practical PCB layout notes that go beyond the manufacturer datasheet alone, helping sourcing engineers and hardware designers make informed second-source decisions.
EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)
The Intel (formerly Altera) EP1SGX25DF672C6N is a high-density Stratix GX family Field Programmable Gate Array (FPGA) integrating 25,660 logic elements (cells) in a 672-ball Fine-pitch Ball Grid Array (FC-FBGA / FBGA-672) measuring 33 x 33 mm with 1.0 mm ball pitch. It is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and is rated for the commercial 0C to 85C operating range. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor whose logic fabric, block RAM, DSP blocks, and I/O can be reconfigured after manufacture, allowing engineers to implement arbitrary digital logic, signal-processing pipelines, and high-speed serial interfaces without a custom ASIC. Stratix GX sits within Intel's high-performance FPGA hierarchy as a transceiver-equipped variant of the original Stratix family, optimized for communication, video, and signal-processing designs. This places the EP1SGX25DF672C6N at the high-performance end of the programmable-logic taxonomy: FPGA > programmable logic > semiconductor IC. Key features include 2,566 LABs (Logic Array Blocks), 455 user I/O pins, embedded transceiver channels for high-speed serial connectivity, distributed and block RAM, dedicated DSP blocks for multiplication-intensive pipelines, and on-chip PLLs for clock generation and management. The 1.0 mm-pitch FBGA-672 package supports the high I/O count and transceiver signal-integrity requirements typical of line-card and backplane designs. Typical applications include telecom line cards, broadband aggregation equipment, high-speed serial protocol bridging (e.g., custom SERDES-based links), video and image processing pipelines, and military/aerospace signal-processing subsystems. The 1.5 V core combined with multi-gigabit transceivers makes this part especially attractive where deterministic latency and high throughput are required. When designing with this device, plan PCB stack-up, decoupling, and power sequencing carefully because 672-ball BGAs demand matched-length routing, abundant ground vias, and a multi-rail power network. The Altera (now Intel FPGA) Quartus II design suite supports this family natively, with reference designs, IP cores, and transceiver toolkits accelerating integration. This page synthesizes distributor pricing, in-family drop-in alternatives, and practical design notes beyond what is repeated in the manufacturer datasheet, giving the engineer a faster procurement and design-validation path.
EP1SGX25DF672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Intel / Altera
The Intel (formerly Altera) EP1SGX25DF672C7 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 1,944,576 bits of embedded RAM, and up to 455 user I/Os in a 672-ball FineLine BGA package. Built on a 1.5 V core, 0.13 µm CMOS process with embedded transceiver and DSP capabilities, it is designed for high-speed serial interface, networking, and signal-processing designs requiring integrated physical-layer IP. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect fabric. FPGAs sit at the hierarchy: programmable logic -> logic IC -> integrated circuit. They are widely used as hardware accelerators, custom I/O bridges, and prototyping platforms for ASICs, providing ASIC-like performance with field-reprogrammability. Key features of the EP1SGX25DF672C7 include 25,660 logic elements (2,566 LABs), 1,944,576 total RAM bits (~237 Kbytes), 14 embedded DSP blocks for hardware multiplication and MAC operations, multi-gigabit transceivers, and a Phase-Locked Loop (PLL) clock management network. The 672-FBGA (27 × 27 mm) package provides 455 user I/Os and supports surface-mount assembly with lead-free (Pb-free) ball terminations. The device is fabricated on a 1.5 V, 0.13 µm CMOS SRAM-based process. The 'GX' suffix indicates the integrated high-speed transceiver tier (versus the non-transceiver Stratix family). The speed grade 'C7' indicates a commercial temperature grade (0 °C to 85 °C) with a moderate Fmax speed bin. The 'DF' position in the part number refers to the 672-pin FineLine BGA package code. Typical applications include 10 Gbps Ethernet line cards, SONET/SDH framer ASIC replacement, custom protocol bridging (SPI 4.2, SFI-4, XAUI), high-performance DSP pre-processing, and test & measurement front-ends. The integrated transceivers and DSP blocks reduce external PHY and DSP component count, enabling higher board density for telecom and datacom line cards. When designing with this part, ensure the 1.5 V core and 3.3 V/2.5 V auxiliary supplies are decoupled with low-ESR ceramic capacitors placed close to each power pin. The transceiver reference clock must meet the jitter specification in the Stratix GX Handbook, and the JTAG chain must include the device in BSDL-defined order to enable in-system programming. This page synthesizes distributor pricing, drop-in alternatives from the same Altera/Intel Stratix GX family, and practical design notes that go beyond a simple datasheet restatement.
EP1SGX25DF672C7ES - 25,660-Cell Stratix GX FPGA | Intel
Intel EP1SGX25DF672C7ES is a high-density Stratix GX field-programmable gate array with 25,660 logic cells, 455 I/O, and high-speed serial transceiver capability. Verified listings identify a 130 nm CMOS implementation, a 1.5 V supply, and a 672-pin FC-FBGA package. The device is suited to programmable digital systems that need reconfigurable logic together with serial connectivity; transceiver operation is listed from 500 Mbps to 3.1875 Gbps per channel. The exact available transceiver-channel count for this specific ordering code is not stated in the supplied excerpts. A field-programmable gate array, or FPGA, is a semiconductor device whose configurable logic blocks, routing resources, and embedded functions implement application-specific digital circuits. In the hierarchy, an FPGA belongs to programmable logic devices, which sit within digital integrated circuits and broader semiconductor technology. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture, allowing hardware updates, protocol changes, and parallel development of multiple functions on one platform. The principal functional features of the EP1SGX25DF672C7ES are its 25,660 cells, 455 I/O, and Stratix GX transceiver architecture. Its CMOS logic family supports conventional digital design implementation, while the programmable architecture can host interfaces, control logic, protocol processing, and datapath functions. A 672-terminal ball-grid package provides a large area-array interconnect for the device's logic, memory, power, and high-speed I/O resources. The operating temperature range supplied for this part is 0 °C to 85 °C. Architecturally, Stratix GX combines programmable logic with dedicated high-speed serial transceiver blocks. The supplied data states full-duplex transceiver operation from 500 Mbps through 3.1875 Gbps and describes configurations supporting 4, 8, 16, or 20 channels in the family. These blocks are intended for serializer/deserializer applications and transceiver-based protocols. Because the supplied material does not identify the channel count encoded by the ES ordering code, engineers must verify that option before final board-level design. Typical uses include communications equipment, serial-interface aggregation, test and measurement hardware, industrial control, and reconfigurable computing platforms. The large cell count supports substantial control and datapath logic, while the 455 I/O provide broad parallel connectivity. In communications equipment, the transceiver blocks can carry high-speed serial streams while the FPGA fabric handles framing, adaptation, and control. The most important implementation constraint is package and configuration verification. The verified summaries use both 672-pin and 1020-ball descriptions, so the physical package designation should be confirmed from the manufacturer's ordering and package documentation before footprint generation. High-speed serial channels also require controlled-impedance routing, suitable power decoupling, and signal-integrity validation. This product data consolidates manufacturer-family and distributor specifications, clearly distinguishes the 672-terminal device from conflicting package summaries, and avoids inferring a pinout or undocumented configuration. For board design, use the complete manufacturer documentation rather than relying solely on a secondary listing.
EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
The Intel / Altera EP1SGX25DF672C7N is a high-density Stratix GX Field Programmable Gate Array (FPGA) built on a 130 nm CMOS process, delivering 25,660 logic elements and 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package. Operating from a 1.5V core supply, this transceiver-equipped device integrates 4 multi-gigabit transceivers supporting data rates up to 3.125 Gbps, making it suitable for high-speed serial I/O, backplane, and line-card applications. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, and DSP slices. FPGAs occupy a unique position in the digital design hierarchy, bridging the flexibility of software-based processing with the performance of dedicated ASICs. Within the semiconductor taxonomy, an FPGA is a sub-category of programmable logic, which itself is a sub-category of standard logic ICs. The Stratix GX family specifically added high-speed serial transceivers to the standard Stratix architecture, eliminating the need for external PHY chips in many designs. Key features of the EP1SGX25DF672C7N include 455 maximum user I/O pins, 1.5V core operation, industrial-grade 0°C to 85°C commercial temperature range, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM. The integrated transceivers support multiple clock domains, 8B/10B encoding, and word alignment, simplifying the implementation of protocols such as PCIe, Serial RapidIO, and Gigabit Ethernet. The FineLine BGA package offers high signal density and superior electrical performance for high-frequency signals. Typical applications include high-speed serial backplane interfaces, line cards for telecom switches, baseband signal processing in wireless infrastructure, and high-throughput data acquisition systems. When designing with this device, ensure adequate power supply decoupling and thermal management, as the high integration density and transceiver operation result in significant power dissipation.
EP1SGX25DF672I5 - Stratix GX FPGA, 25K LE, 672-FBGA | Altera
The Altera (now Intel) EP1SGX25DF672I5 is a high-performance Field Programmable Gate Array (FPGA) from the Stratix GX family, delivering 25,660 logic elements and 2,566 Configurable Logic Blocks (CLBs) in a 672-ball flip-chip BGA package. It is built on a 130 nm CMOS process with a 1.5 V core supply and supports embedded transceivers optimized for high-speed serial I/O, with the GX family designed for gigabit serial interface applications such as backplanes, chip-to-chip links, and serial RapidIO. What is a Stratix GX FPGA? A Field Programmable Gate Array is a reconfigurable digital logic device whose logic fabric, routing, and I/O cells are defined by user-supplied bitstream configuration rather than fixed ASIC masks. The Stratix GX family is Altera's high-speed serial transceiver family, sitting one tier above general-purpose Stratix devices in the programmable logic hierarchy: Stratix GX -> Stratix family -> FPGA -> programmable logic -> digital IC. GX variants integrate up to twenty multi-gigabit transceivers alongside the general-purpose logic fabric, enabling PHY-level serial connectivity at line rates of 1 Gbps to 3.125 Gbps without external serializer/deserializer devices. Key features of the EP1SGX25DF672I5 include 1,944,576 bits of embedded memory, dedicated DSP blocks for fixed- and floating-point arithmetic, four phase-locked loops for clock management, and military-grade temperature operation from -55C to +125C. The 672-ball FC-FBGA package supports high pin-count integration of LVDS, LVTTL, LVCMOS, and high-speed transceiver I/O standards, with the flip-chip interconnect providing superior electrical performance over wire-bond packages at multi-gigahertz frequencies. Architecturally, the device combines a lookup-table-based logic fabric, TriMatrix embedded memory blocks, embedded multipliers, and dedicated transceiver channels. The 130 nm process technology was industry-leading at introduction and remains adequate for many legacy designs; however, it is now a mature node and the part is generally classified as a legacy or NRND component. Typical applications include custom protocol bridging across backplanes, gigabit Ethernet media access controllers, Serial RapidIO and PCI Express endpoint implementations, telecom line-card signal processing, and military/aerospace embedded computing platforms where the I5 temperature grade is required. When designing with this device, allocate ample PCB area for the 672-ball FC-FBGA, which requires microvia or via-in-pad technology for reliable assembly. Verify Quartus II support level and confirm the part has not transitioned to NRND status before committing to new designs. This page synthesizes distributor pricing, drop-in Stratix GX alternatives, and practical design notes not collected in any single manufacturer datasheet.
EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES
The Altera (Intel) EP1SGX25DF672I5N is a high-performance Stratix GX family FPGA that integrates 25,660 logic elements and 4-20 high-speed serial transceiver channels with embedded SERDES capability at data rates up to 3.1875 Gbps, manufactured on a 130 nm CMOS process and housed in a 672-ball Fine-pitch Ball Grid Array (FC-FBGA) measuring 33 x 33 mm with 1 mm pitch. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacturing by the end user. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs, and are widely used to implement digital signal processing, custom I/O protocols, and high-bandwidth data-path acceleration. The Stratix GX line specifically adds clock-data-recovery (CDR) transceiver channels to the standard programmable fabric, making it a hybrid logic-plus-serdes device. Key features include 25,660 logic cells (2,566 CLBs), embedded multiplier blocks for DSP, on-chip TriMatrix memory, and 4-20 CDR-equipped transceiver channels supporting rates from 600 Mbps to 3.1875 Gbps. The device supports multiple I/O standards including LVDS, LVPECL, and 1.5V CMOS, with configurable on-chip termination. Configuration is typically loaded via a serial or parallel EPCS/EPCQ flash device. The architecture combines a high-density 130 nm SRAM fabric with dedicated hard-IP transceiver circuitry, achieving deterministic latency for serial protocols. The integrated SERDES eliminates external PHY components for many applications, simplifying board layout and reducing BOM cost while still meeting industrial-grade signal-integrity requirements. Typical applications include high-speed serial backplane interfaces, telecommunications line cards, ASIC prototyping, and protocol bridging (for example, SPI-4.2, SFI-4.1, 10 Gigabit Ethernet XAUI pre-processing). The combination of programmable fabric and 3.1875 Gbps transceivers is well matched to custom PHY and SerDes designs. When designing with this device, plan PCB layout for the 1 mm-pitch BGA carefully - via-in-pad, microvia, or standard through-via stack-ups all require controlled-impedance routing for the SERDES channels and a 6+ layer stack-up is recommended for signal integrity. This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not duplicated from the manufacturer datasheet.
EP1SGX25DF672I6 - Stratix GX FPGA 25,660 Cells | Intel | 672-FBGA
The Intel EP1SGX25DF672I6 is a Stratix GX family Field Programmable Gate Array (FPGA) with 25,660 logic elements, 455 user I/O pins, and 1,944,576 bits of embedded memory, housed in a 672-ball Fine-pitch Ball Grid Array (FBGA) package. Built on a 130 nm CMOS process, the device supports core supply voltage of 1.5 V and offers up to 20 dedicated high-speed transceivers, making it a drop-in member of the Stratix GX transceiver-equipped FPGA family. An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic functionality is defined after manufacturing by the customer rather than the fab. FPGAs occupy the programmable-logic branch of the semiconductor hierarchy (FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor), and the Stratix GX family specifically targets high-bandwidth serial I/O applications such as backplanes, communications line cards, and signal-processing pipelines. The "GX" suffix distinguishes this family from the base Stratix line by embedding multi-gigabit transceivers (MGTs) directly on-die. Key features of the EP1SGX25DF672I6 include 25,660 logic elements, 1,944,576 RAM bits (192 Kbytes), 455 user I/O, dedicated on-chip transceiver circuitry, embedded DSP blocks, and clock management via PLLs. The 672-ball FBGA at 33 x 33 mm with 1.0 mm pitch is RoHS compliant and lead-free per the manufacturer's product page. Typical applications include high-speed serial interface bridging, custom communications backplanes, protocol conversion (e.g., SPI 4.2, RapidIO, SerialLite), and DSP front-end co-processing. The combination of 455 user I/O and embedded transceiver macros makes this part attractive for line-card designs that require both wide parallel buses and multiple serial links. Design considerations for the EP1SGX25DF672I6 include multi-rail power sequencing (1.5 V VCCINT plus VCCIO banks), careful BGA fan-out, and thermal management of the 672-ball package. Designers should use the Quartus II design toolchain, which natively supports this device family and provides IP cores for the on-chip transceivers and DSP blocks. This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not collected in any single datasheet document.
EP1SGX25DF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel
The Intel (Altera) EP1SGX25DF672I6N is a high-density Stratix GX family FPGA featuring 25,660 logic elements (2566 LABs), 455 user I/Os, and integrated 3.125 Gbps transceivers in a 672-ball flip-chip FBGA package. It supports a 1.5V core supply (1.425V-1.575V range) and operates across the industrial 0C to 85C temperature range. Built on a CMOS logic process, the device combines programmable logic, embedded memory, and high-speed serial I/O for communication infrastructure designs. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. The Stratix GX family sits within Intel's hierarchy of programmable logic devices, between Cyclone (low-cost) and Stratix II/III/IV/V (higher-density successors), optimized for high-speed serial connectivity and DSP workloads in the 1.5V process generation. Key features of the EP1SGX25DF672I6N include 1.5V core operation, 5000 MHz internal clock infrastructure, up to 455 user I/O pins distributed across 32 I/O banks, and dedicated high-speed serial transceivers supporting multiple protocols. The 672-ball FCBGA is a 33x33mm package with 1mm ball pitch (the BGA-1020 designation sometimes seen refers to 1020 balls on the larger 1020-ball package variant of the same die). The architecture is built on 1.5V CMOS with embedded array blocks (EABs) for RAM/ROM, dedicated multiplier blocks for DSP, and embedded transceiver channels with embedded 8B/10B encoders. Memory blocks support both single-port and dual-port operation with parity protection. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH framer/mapper designs, custom protocol bridges, high-speed test and measurement equipment, and DSP co-processing for wireless baseband. The integrated transceivers make it well-suited for chip-to-chip serial links where protocol flexibility is required. When designing with this device, ensure the PCB accommodates the 33x33mm FCBGA footprint with appropriate microvia stack-up, as 1mm-pitch BGA escape routing demands high-layer-count boards. Power sequencing of the 1.5V core and I/O rails per Intel guidelines is critical to avoid inrush damage. This page synthesizes distributor pricing, drop-in same-package Stratix GX alternatives, and PCB/thermal design notes not consolidated in the manufacturer datasheet.
EP1SGX25DF672I7 - Stratix GX FPGA 25K LE | Intel / Altera
The Intel (formerly Altera) EP1SGX25DF672I7 is a Stratix GX family Field-Programmable Gate Array (FPGA) IC delivering 25,660 logic elements organized as 2,566 Configurable Logic Blocks (CLBs), with embedded 1.944 Mbit memory and high-speed serial transceivers, housed in a 672-ball Fine-pitch Chip-Scale BGA (FC-FBGA / FBGA-672) package. The "I7" speed grade and "DF" package code place this device in the industrial temperature range with a typical core supply of 1.5 V (1.425 V to 1.575 V), and the "I7" suffix indicates the slowest industrial speed grade of the Stratix GX generation. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, and I/O resources can be reconfigured after manufacture by the user via a hardware description language and a vendor toolchain. Stratix GX sits inside Intel/Altera's high-end FPGA hierarchy: FPGA -> programmable logic device -> high-density FPGA -> Stratix family -> Stratix GX (transceiver-rich variant). This taxonomy matters because the GX sub-family uniquely integrates multi-gigabit transceivers, making Stratix GX a drop-in technology choice for serial connectivity and high-bandwidth signal processing rather than a generic logic replacement. Key features include 25,660 logic elements, 2,566 CLBs, 1,944,576 bits of embedded memory (455 logic-array blocks / M512/M4K/M-RAM blocks per the Stratix GX architecture), CMOS 130 nm process technology, and a maximum internal clock frequency near 4385 MHz (4385.97 MHz per third-party data). The combinatorial CLB delay is rated at a maximum of 9.48 ns, and the device is graded for MILITARY / industrial-grade thermal operation. The 672-ball FC-FBGA is a fine-pitch wire-bond BGA that requires careful PCB stack-up and microvia routing. The 130 nm CMOS architecture pairs a 4-input LUT-based logic fabric with dedicated memory blocks, DSP blocks, and embedded transceiver circuitry for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links up to multi-Gbps line rates. The I7 speed grade trades raw speed for the widest operating margin, simplifying timing closure in industrial designs. Typical applications include high-speed serial interface bridges, telecom backplane line cards, test and measurement equipment with parallel DSP pipelines, military/aerospace signal-processing platforms, and embedded systems that require integrating high-density glue logic next to a CPU. The package and process also make this device attractive for legacy defense and industrial programs that have already qualified Stratix GX tooling. When designing with this part, validate power integrity carefully: Stratix GX requires multiple supply rails (core, I/O, PLL, transceiver) and bulk decoupling sized to the toggle rate. Use Altera/Intel Quartus II or Quartus Prime to generate the pin assignments, programming file (.sof/.pof), and IBIS models for SI simulation. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet.
EP1SGX25DF672I7N - 25K LE Stratix GX FPGA, 672-FBGA | Intel
The Intel (Altera) EP1SGX25DF672I7N is a high-density Stratix GX FPGA from the original 130 nm Stratix GX family, offering 25,660 logic elements, 2,566 CLBs, and 4 high-speed serial transceiver channels operating from 500 Mbps to 3.1875 Gbps. It is housed in a 672-ball FineLine BGA package at 33 mm × 33 mm with 1 mm pitch and is rated for the industrial 0 °C to 85 °C operating range. Core logic is powered from a 1.5 V supply with separate VCCIO banks for I/O flexibility. An FPGA (Field-Programmable Gate Array) is a semiconductor IC built from a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all wired together by a programmable interconnect. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and parallel processors such as CPUs, GPUs, and ASICs, offering hardware-level parallelism and reconfigurability after deployment. Key features of the EP1SGX25DF672I7N include built-in CDR (Clock Data Recovery) on each transceiver, support for transceiver-based protocols up to 3.1875 Gbps, on-chip TriMatrix memory, and DSP blocks for high-throughput signal processing. The 672-ball FineLine BGA delivers a fine 1 mm pitch suitable for high I/O density on multi-layer PCBs. Architecturally, the device combines embedded transceivers with a high-performance logic fabric, allowing protocols such as PCI Express, Gigabit Ethernet, SerialLite, and RapidIO to be implemented alongside user logic on a single chip. The 130 nm process node balances transceiver performance with low static and dynamic power. Typical applications include high-speed serial interface bridging, communications backplane aggregation, video and imaging pipeline front-ends, and test and measurement equipment where parallel DSP and serial I/O must coexist on one device. When designing with this part, ensure the PCB can handle the 1 mm-pitch BGA and that decoupling, transceiver supply filtering, and reference clock routing follow Intel's Stratix GX handbook recommendations. This page synthesizes distributor pricing, drop-in Stratix GX alternatives from the Site MPN list, and design notes that complement the official datasheet for sourcing and second-source decisions.