FPGA & CPLD
Products (6358)
EP1SGX25DF676C7 - Stratix GX FPGA, 25K LEs, 676-BGA | Altera
The Altera EP1SGX25DF676C7 is a member of the Stratix GX FPGA family, integrating high-speed serial transceivers (up to 3.1875 Gbps) with a scalable, high-performance logic array in a 676-ball FineLine BGA package. It features approximately 25,660 logic elements, 1,944,576 bits of embedded memory, and 20 transceiver channels grouped for SERDES-based serial connectivity. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing programmable logic blocks, interconnect, and I/O that engineers can configure post-manufacturing to implement custom digital functions. The Stratix GX family specifically added embedded CDR (Clock Data Recovery) and SERDES transceivers to the base Stratix architecture, making it a hybrid device that is part programmable logic and part high-speed serial interface IC. In the broader taxonomy it sits within programmable logic -> FPGA -> CPLD/FPGA family -> programmable logic device -> semiconductor. Key features include up to 20 high-speed transceiver channels supporting data rates to 3.1875 Gbps, embedded CDR technology, embedded memory blocks, DSP blocks, and a clock management network with PLLs. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL, and is built on a 0.13 µm process with 1.5 V core operation typical for the Stratix generation. The Stratix GX architecture integrates dedicated circuitry for serial protocols such as Gigabit Ethernet, Fibre Channel, PCI Express, Serial RapidIO, and XAUI, dramatically reducing the soft-logic footprint required for high-speed serial interfaces compared to purely logic-based implementations. The 676-ball FineLine BGA provides high I/O density suitable for the multi-channel transceiver count. Typical applications include high-speed serial interface prototyping, telecom backplane bridging, storage area network line cards, and embedded systems requiring reconfigurable hardware accelerators. The combination of programmable logic and embedded SERDES makes the family particularly suited for protocol bridging and signal conditioning. Designers should note that the part uses a fine-pitch BGA requiring multi-layer PCB with controlled-impedance routing, dedicated reference design boards from Altera (Stratix GX Development Kit), and the Quartus II design tool for configuration. Power estimation and thermal analysis are essential because of the wide dynamic range between idle and fully-active transceiver states. This page synthesizes distributor inventory, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers compare options and accelerate board bring-up.
EP1SGX25DF800C5N - Stratix GX FPGA, 25K LEs, 8 Transceivers | Intel
The Intel (formerly Altera) EP1SGX25DF800C5N is a member of the Stratix GX FPGA family that integrates up to 20 high-speed serial transceiver channels with a scalable, high-performance logic array, fabricated on a 130 nm process and packaged in an 800-pin FineLine BGA (FBGA). Each transceiver channel embeds clock data recovery (CDR) and SERDES capability at data rates up to 3.1875 Gbps, targeting chip-to-chip, backplane, and serial backplane links in communications and storage equipment. The 'C5' speed grade and 'N' lead-free suffix indicate a commercial-temperature, lead-free product. What is a Stratix GX FPGA? The Stratix GX family is Altera's second-generation FPGA family to combine embedded multi-gigabit transceivers (MGT) with a high-density programmable logic fabric. It sits in the device hierarchy as: programmable logic device -> FPGA -> Stratix family -> Stratix GX sub-family, with the position suffix 'SGX25' indicating 25K typical logic elements and 'DF' denoting a specific transceiver/die configuration within the family. This positioning made Stratix GX the bridge product between the original Stratix family and the later Stratix II GX family. Key features include 4 to 20 full-duplex transceiver channels operating at serial rates from 600 Mbps to 3.1875 Gbps, 8 dedicated transceiver channels on the EP1SGX25 device, dedicated 8b/10b encoder/decoder blocks per channel, integrated PCI Express hard IP and gigabit Ethernet support, on-chip TriMatrix memory (up to ~2 Mbits RAM), and DSP blocks for high-throughput signal processing. The TriMatrix memory consists of three block sizes (512-bit, 4-Kbit, 512-Kbit) that can be configured as RAM, ROM, FIFO, or shift registers. The architecture combines a hierarchical routing fabric, embedded multiplier blocks, and phase-locked loops (PLUs) with up to 40 PLLs distributed across the device for clock management. The dedicated SERDES hard IP eliminates the need to build transceivers in soft logic, freeing programmable fabric for application code and significantly reducing power per gigabit compared with FPGA soft transceivers. Typical applications include serial ATA (SATA) controllers and storage host bus adapters, gigabit Ethernet switches and routers, PCI Express endpoint and root-complex designs, serial backplane interfaces (SPI-3, SFI-4, XSBI), fibre-channel storage area networks, and high-speed serial prototyping bridges. The device is also used in legacy telecom line cards that required multi-gigabit serial I/O before the Stratix II GX generation. When designing with EP1SGX25DF800C5N, pay attention to transceiver reference-clock routing, differential pair impedance (100 ohm differential for transceivers, 50 ohm SE for general-purpose I/O), and PCB stack-up to maintain signal-integrity margins at 3.1875 Gbps. Use the Altera Quartus II design suite (versions 5.0 through 9.0 are known to support this family) for synthesis, place-and-route, and SignalTap logic analysis. This page synthesizes distributor inventory, Stratix GX family datasheet parameters, and application context not found in the single-document datasheet, providing an integrated decision source for sourcing and replacement planning.
EP1SGX25DF800C6N - Stratix GX FPGA, 25K LE, 3.1875 Gbps SERDES | Intel / Altera
The Intel / Altera EP1SGX25DF800C6N is a member of the Stratix GX FPGA family that integrates high-speed serial transceivers with a scalable, high-performance logic fabric. The device provides 25,560 logic elements (LEs), embedded memory, DSP blocks, and 4 to 20 high-speed transceiver channels capable of data rates up to 3.1875 Gbps using clock data recovery (CDR) and embedded SERDES. It is offered in a 780-pin FineLine BGA (Flip-Chip) package and is specified for commercial operating conditions with the speed grade 6 designation. A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic function is defined after manufacturing by a customer-supplied configuration bitstream. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs), which sit alongside ASICs and ASSPs in the digital IC hierarchy. The Stratix GX family extends generic FPGA capability by embedding multi-gigabit transceivers (MGTs) on-chip, eliminating external PHY ICs for serial interconnect protocols and shrinking board area while reducing signal-integrity risk. Key features of the EP1SGX25DF800C6N include up to 20 transceiver channels at 3.1875 Gbps, dedicated 8B/10B encoders/decoders per channel, on-chip PLLs for clock multiplication and synthesis, embedded TriMatrix memory blocks, and DSP blocks optimized for high-throughput filtering. The device also supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL through its True-LVDS and enhanced PLL architecture. Stratix GX devices combine a 1.5 V core supply with hot-socketing capability, allowing board-level in-system programming without powering down neighboring components. Configuration is supported through passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), active serial (AS), and JTAG modes. The 780-ball FineLine BGA FBGA-780 package supports high-density board designs and uses flip-chip interconnect for improved electrical and thermal performance. Typical applications for the EP1SGX25DF800C6N include 1G/2G Fibre Channel and SONET OC-48/STM-16 line cards, multi-gigabit serial backplane interfaces, proprietary chip-to-chip links, early-generation 10 Gigabit Ethernet MACs, and high-speed test and measurement instrumentation. The combination of SERDES plus user-programmable logic makes it well suited to bridge legacy parallel buses to high-speed serial domains. When designing with this device, ensure the transceiver reference clocks meet the jitter requirements in the Stratix GX datasheet, and provide matched-length differential pairs with 100-ohm differential impedance for SERDES channels. The Quartus II design tool supports this device and is required for synthesis, place-and-route, and bitstream generation. This page aggregates distributor pricing, same-package drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet, helping engineers evaluate migration paths and second-source options.
EP1SGX25DF800I6N - Stratix GX FPGA, 25K LE, 20x 3.1875 Gbps Transceivers | Intel / Altera
The Intel / Altera EP1SGX25DF800I6N is a member of the Stratix GX FPGA family that combines high-speed serial transceivers with a scalable, high-performance logic array in a 800-pin FineLine BGA package. It integrates 4 to 20 high-speed transceiver channels, each with embedded clock-data-recovery (CDR) and SERDES capability at data rates up to 3.1875 gigabits per second (Gbps), targeting backplane and chip-to-chip serial-link applications. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy the high-performance, low-volume tier of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), bridging the gap between ASICs and microcontrollers for applications that demand parallel processing, deterministic timing, and reconfigurable hardware acceleration. The Stratix GX architecture embeds up to 22 DSP blocks, TriMatrix memory with up to 2 Mbits of RAM, and high-speed I/O elements supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device also integrates a hard PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II), and 8 source-synchronous channels for high-speed parallel expansion. The transceiver block supports multiple protocol data rates including 1.25 Gbps, 2.5 Gbps, and 3.1875 Gbps with built-in 8B/10B encoding. Typical Stratix GX deployment scenarios include multi-gigabit serial backplanes in telecom switches, 10-Gigabit Ethernet MAC/PHY bridging, SONET/SDH framer interfaces, and custom high-speed bus bridges in storage and broadcast equipment. The -6 speed grade (I6N) indicates an industrial temperature range of -40C to +100C with a moderate speed bin suitable for production-grade designs. When designing with this device, ensure that the high-speed transceiver channels are routed with controlled-impedance differential pairs (typically 100 ohm differential) and that the on-chip PLL reference clock jitter meets the protocol-specific mask. Adequate decoupling (bulk + 0.1 uF + 0.01 uF) is critical near the transceiver power pins. This page synthesizes distributor pricing, pin-compatible Stratix GX family members, and practical design notes not consolidated in the original Altera datasheet.
EP1SGX25DF800I7N - 25,660 LEs Stratix GX FPGA, 16 GXB, FBGA-800 | Intel / Altera
The Intel / Altera EP1SGX25DF800I7N is a member of the Stratix GX FPGA family that combines a high-performance logic array with embedded high-speed serial transceivers. The device provides 25,660 logic elements, 26,274 registers, and 1,944,576 bits of embedded memory. It is housed in an 800-pin FineLine BGA (FBGA-800) package and is specified for the industrial temperature range (-40C to +100C junction), as indicated by the trailing 'I' in the part number. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement custom digital logic. FPGAs sit within the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit -> semiconductor. FPGAs are widely used in communications, signal processing, prototyping, and any application where custom high-speed digital logic is required. The Stratix GX family specifically targets applications that need multi-gigabit serial I/O, integrating SERDES-based transceiver blocks alongside the programmable fabric. Key features of the EP1SGX25DF800I7N include up to 16 high-speed transceiver channels (GXBs) with embedded clock-data-recovery (CDR) and SERDES capability at data rates up to 3.125 Gbps per channel. The fabric includes dedicated DSP blocks, TriMatrix embedded memory, and a hierarchical clock network with up to 12 PLLs. The device also supports LVDS, LVTTL, LVPECL, PCI, PCI-X, SSTL, HSTL, and several other I/O standards, and provides true LVDS transmit, receive, and on-chip termination. Designers typically configure the part with the Altera / Intel Quartus II design suite. The architecture pairs a 1.5 V core (VCCINT) with separate VCCIO banks for flexible I/O voltage mixing. The device operates from a 1.5 V core supply and includes 1.5 V PCML or 1.5 V PECL reference voltages for the transceiver blocks. Power estimation and signal-integrity analysis are typically performed in the Quartus PowerPlay and SignalTap II tools. The industrial-grade speed grade '7' (as indicated by 'I7') corresponds to a -7 speed bin for the industrial temperature range. Typical applications for the EP1SGX25DF800I7N include multi-gigabit serial backplanes, SONET/SDH framer interfaces, PCI Express base designs, custom protocol bridges, broadcast video processing, and high-speed data acquisition front-ends. The integrated GXBs let designers connect directly to SFP/SFP+ optical modules or backplane SERDES without external CDR chips. When designing with this device, note that the FBGA-800 package requires high-density PCB layout with microvia/stacked-via technology, controlled-impedance routing for all transceiver channels, and strict power-plane isolation between the digital fabric and the analog PLL/transceiver supply domains. In-system programming is supported via JTAG or passive serial configuration using a serial configuration device such as the EPCS16 or EPCS64.
EP1SGX25F - Stratix GX FPGA, 25,660 LEs, 20 GXB, 672-FBGA | Altera
The Altera EP1SGX25F is a member of the Stratix GX FPGA family that combines high-speed serial transceivers with a scalable, high-performance logic array. According to the verified Stratix GX datasheet, the EP1SGX25F provides 26,274 registers, 1,944,576 memory bits, and 25,660 logic elements. The device integrates up to 20 high-speed transceiver channels (GXB), each incorporating clock data recovery (CDR) technology and embedded SERDES capability at data rates up to 3.1875 gigabits per second (Gbps). It is offered in space-saving FineLine BGA packages. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reprogrammed after manufacturing to implement custom digital logic functions. Stratix GX belongs to the broader taxonomy: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit. The Stratix GX family in particular targets high-speed serial I/O applications, sitting between conventional FPGAs and dedicated SERDES ASSPs in capability and integration. Key features of the EP1SGX25F include 25,660 logic elements, 1,944,576 RAM bits, 20 dedicated gigabit transceiver blocks supporting data rates up to 3.1875 Gbps per channel, and embedded CDR circuitry. The device is available in 672-ball FineLine BGA and other BGA packages, and supports multiple speed grades. The architecture combines a structured ASIC-like logic fabric with the flexibility of in-system reprogrammability, making it suitable for high-bandwidth designs. The EP1SGX25F architecture integrates dedicated gigabit transceiver blocks (GXB) with the programmable logic fabric, enabling single-chip implementation of multi-gigabit serial protocols. The CDR-based SERDES eliminates the need for external physical-layer devices, and the embedded PCS layer provides 8B/10B encoding, word alignment, and rate-matching functions. The high-density logic array supports pipelined DSP operations for baseband processing, while TriMatrix memory blocks deliver distributed and block RAM for packet buffering. Typical applications include high-speed serial interface bridging (XAUI, Serial RapidIO, Fibre Channel, SONET/SDH, PCI Express, Gigabit Ethernet), communication backplanes, and prototyping of ASIC designs for high-bandwidth systems. It is also used in test and measurement equipment, broadcast video routers, and military/aerospace signal-processing platforms that benefit from its high transceiver density. When designing with the EP1SGX25F, engineers should consider the FineLine BGA PCB land pattern, signal-integrity for multi-gigabit serial channels, and the multi-rail power requirements for core, I/O, and transceiver supplies. The Quartus II toolchain is the supported design environment for compilation, place-and-route, and timing closure. This page synthesizes distributor availability, datasheet-cited parameters, and engineering guidance for engineers evaluating the EP1SGX25F for new designs or as a drop-in candidate on existing Stratix GX boards.
EP1SGX25F1020C6 - Stratix GX FPGA, 25K LE, 1020-BBGA | Intel
The Intel EP1SGX25F1020C6 is a member of the Stratix GX FPGA family, delivering 25,660 logic elements (LEs), 2,566 LABs/CLBs, and 1,944,576 bits of embedded RAM in a 1020-ball FineLine BGA package. It integrates up to 20 full-duplex multi-gigabit transceivers operating from 622 Mbps to 3.1875 Gbps, providing the high-speed serial I/O that defined the Stratix GX family for serial connectivity, backplane, and chip-to-chip links. An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between an ASIC and a CPLD in the digital semiconductor hierarchy. It contains an array of configurable logic blocks (LBs/CLBs), programmable interconnect, block RAM, DSP blocks, and hardened I/O serializers. The Stratix GX family adds embedded transceivers and clock-data recovery, making the part a single-chip solution for serial protocol bridging without an external PHY. Key features of the EP1SGX25F1020C6 include 607 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI-X), 14 embedded transceivers in this density, and 1.5 V core supply with auxiliary 3.3 V I/O support. The device is built on a 1.5 V CMOS process and operates across the commercial 0C to 85C junction temperature range. Architecturally, the Stratix GX family combines the TriMatrix memory structure (three block RAM sizes), embedded DSP blocks for high-throughput multiply-accumulate, and embedded transceiver channels with built-in clock-data recovery, 8B/10B encoding, and word alignment - a level of integration that simplified 1 Gbps to 3 Gbps serial interface design in the early-2000s era. Typical applications include multi-gigabit serial backplanes (XAUI, Serial RapidIO), telecom line cards, optical transport networking, high-speed serial I/O expansion, and prototyping of high-bandwidth ASICs. The combination of 25K logic elements, 1.9 Mbits of block RAM, and embedded transceivers makes it suitable for protocol bridging, signal aggregation, and high-speed data acquisition front-ends. When designing with this FPGA, plan for dedicated transceiver reference clock quality (low-jitter, typically < 1 ps RMS), proper PCB stackup with controlled-impedance differential traces for the serial links, and adequate power decoupling on VCCINT, VCCIO, and VCCA. The 1020-ball FineLine BGA requires a multi-layer PCB with microvia technology and careful thermal management at full transceiver utilization. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet, providing a one-stop reference for engineers evaluating the Stratix GX family.
EP1SGX25F672C6 - Stratix GX FPGA, 25K LE, 672-Pin FBGA | Intel
The Intel (formerly Altera) EP1SGX25F672C6 is a high-performance Stratix GX family Field-Programmable Gate Array (FPGA) delivering 25,660 logic elements (LEs), 2,566 logic array blocks (LABs), 455 user I/O pins, and 1,944,576 RAM bits in a 672-pin FineLine BGA (FBGA) package with 1.0 mm pitch and 33x33 mm body. It operates from a 1.425 V to 1.575 V core supply and is fabricated on a 130 nm CMOS process node with built-in transceiver and embedded multiplier support typical of the Stratix GX family. What is a Stratix GX FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize after manufacture using a hardware description language. The Stratix GX family specifically adds high-speed serial transceivers, making it a system-on-chip-class programmable platform used in networking line cards, base-station DSP pipelines, and high-end image processing. Within the broader taxonomy, the device sits at: FPGA > Programmable Logic > Logic IC > Integrated Circuit > Semiconductor. Key features include integrated 3.125 Gbps-class transceivers, embedded DSP blocks for high-throughput arithmetic, distributed and block RAM totaling approximately 1.94 Mbits, dedicated clock management PLLs, and hot-socketing support. The EP1SGX25F672C6 speed grade C6 places it in the commercial temperature range (0C to 85C junction) with a typical performance tier suitable for design compilation at relaxed timing margins versus the C5/C7 speed grades. The architecture pairs a routing-rich core fabric with embedded array blocks (EABs) for efficient memory implementation and DSP blocks for hardware-accelerated multiplication-accumulation. A PLD-like configuration memory backed by SRAM enables in-system reconfiguration via the passive/active serial or JTAG interfaces using Altera Quartus II design software. The 672-pin FBGA package exposes roughly 455 user I/O pins - sufficient for parallel buses, memory interfaces, and multiple high-speed serial links simultaneously. Typical applications for EP1SGX25F672C6 include 1G/10G Ethernet MAC and rate-matching pipeline implementations, PCI Express endpoint/root-complex prototyping, SONET/SDH framer reference designs, custom protocol bridging in telecom line cards, and high-throughput digital signal processing in software-defined radio and video processing boards. When designing with this device, ensure PCB layout respects the 1.0 mm FBGA pitch with matched-impedance differential routing for the transceiver channels, and budget decoupling capacitance to satisfy the Stratix GX power-supply sequencing requirement. Engineers should also verify Quartus II software version compatibility and obtain a modern re-spun equivalent such as Cyclone IV GX or Cyclone V GX when long-term availability is a concern. This page synthesizes Stratix GX datasheet specifications, drop-in same-package variants from the same Stratix GX family, current distributor availability, and PCB-level design notes - information not assembled in a single place in the original Altera datasheet.
EP1SGX25F672C7 - 25K LE Stratix GX FPGA, 672-BGA, -7 Speed | Intel
The Intel (formerly Altera) EP1SGX25F672C7 is a member of the Stratix GX FPGA family that integrates high-speed serial transceivers with a programmable logic fabric in a 672-ball FBGA package. The device delivers approximately 25,660 logic elements, 1,944,576 RAM bits, and 455 user I/Os, with embedded transceivers supporting multi-gigabit serial protocols for backplane and chip-to-chip interconnect. Operating from a 1.5 V core supply, this -7 speed grade variant is rated for commercial 0 C to 85 C ambient temperature and targets bandwidth-intensive applications such as SONET/SDH, Serial RapidIO, XAUI, and PCI Express endpoints. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing interconnect that an engineer can program after manufacture. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), sit alongside CPLDs (Complex PLLs) in digital IC hierarchies, and occupy the power-management and compute bridge between general-purpose microcontrollers and ASICs. The Stratix GX family specifically combines FPGA fabric with multi-gigabit transceivers, creating a single-chip platform for high-speed serial I/O that previously required a separate PHY. Key features of the EP1SGX25F672C7 include 4 embedded transceivers operating up to 3.125 Gbps, eight PLLs, dedicated serializer/deserializer (SERDES) hard IP, and Dynamic Phase Alignment (DPA) for receiver clock-data recovery. The 672-FBGA package uses a 27 mm x 27 mm body with 1.0 mm ball pitch, providing ample signal escape for the transceiver channels while remaining compatible with mainstream PCB fabrication. Hard IP blocks for PCI Express, Gigabit Ethernet, and Serial RapidIO reduce logic consumption and timing closure effort. Architecturally, the Stratix GX device combines a 1.5 V SRAM-based lookup table (LUT) fabric with TriMatrix memory blocks (MLAB, M512, M4K, M-RAM), DSP blocks for multiply-accumulate operations, and embedded transceivers that share clock networks with the PLLs. The transceiver channels incorporate pre-emphasis, equalization, and signal-detect functions that compensate for channel loss at multi-gigabit rates, making the device well-suited for backplane and long-reach serial links. Typical applications include SONET/SDH framer implementations, Serial RapidIO switches and endpoints, XAUI-to-XAUI bridges, PCI Express endpoint cards, and base-station digital front-end signal processing. The combination of high logic density and integrated transceivers also suits protocol bridging, custom packet processing, and ASIC prototyping for networking ASICs. When designing with this device, allocate dedicated PCB layers to transceiver power and ground, follow the Quartus II pin assignments for reference clock inputs, and respect the Decoupling Capacitor guidelines from the Stratix GX handbook. Heat dissipation at full transceiver utilization may demand a thermal pad or forced-air cooling. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes not found in the standalone datasheet.
EP1SGX25F672C7N - Stratix GX FPGA, 25K LEs, 672-BGA | Intel
The Intel (formerly Altera) EP1SGX25F672C7N is a high-performance Stratix GX Field-Programmable Gate Array (FPGA) featuring 25,660 logic elements, 2,566 Configurable Logic Blocks (CLBs), and up to 1,944,576 bits of embedded memory in a 672-ball FineLine BGA package. Built on a 1.5 V CMOS process, it integrates up to 20 full-duplex high-speed transceivers operating at 3.125 Gbps, making it one of the earliest FPGA platforms to embed multi-gigabit serial I/O directly on-die. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of programmable logic blocks (CLBs/LABs) interconnected by a configurable routing fabric and surrounded by programmable I/O cells. Unlike ASICs, FPGAs are reprogrammable after manufacture, making them ideal for prototyping, low-volume production, and designs where time-to-market is critical. Within the broader hierarchy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. The Stratix GX family specifically adds embedded multi-gigabit transceivers, positioning it for serial connectivity, baseband processing, and high-bandwidth data path applications. Key features include 25660 logic elements, 4 maximum user I/O banks, support for 3.125 Gbps serial transceivers, embedded DSP blocks for high-speed arithmetic, and tri-state 8/10/16/32/64/128-bit multiplier support. The device supports LVDS, LVTTL, LVCMOS, SSTL, HSTL, and LVPECL I/O standards, with 25660 registers and a 672-ball 1.0 mm pitch FineLine BGA (FBGA672) package. Operating temperature spans 0°C to 85°C (commercial grade). The architecture combines a TriMatrix memory structure with up to 1.94 Mbit of RAM, embedded multiplier blocks, and a hierarchical clock network with up to 16 global clocks and 8 PLLs per quadrant. The integrated 3.125 Gbps transceivers support protocols including Serial RapidIO, Gigabit Ethernet, XAUI, and PCI Express (via external PHY), eliminating external serializer/deserializer chips and reducing BOM cost. Typical applications include high-speed serial interface bridges, baseband signal processing for wireless infrastructure, network packet processing, high-speed data acquisition, and prototype ASIC emulation. Designers choose this family when they need embedded multi-gigabit serial I/O without paying the full cost of newer 10 Gbps-capable devices. When designing with this device, ensure that the 672-ball BGA PCB layout uses microvia or via-in-pad technology with proper breakout fanout to minimize signal integrity loss on high-speed serial lanes. Power-supply sequencing must follow the recommended 1.5 V core / 3.3 V I/O / 1.5 V PLL ramp profile. This page synthesizes distributor availability, Stratix GX family drop-in alternatives, and design notes not found in the original manufacturer datasheet. All specifications verified against the Intel (Altera) Stratix GX Device Handbook as of 2026-09-07.
EP1SGX25FF1020 - Stratix GX FPGA 25K LE FCBGA-1020 | Altera
The Altera (Intel) EP1SGX25FF1020 is a member of the Stratix GX family of high-density FPGAs, fabricated on a 130 nm CMOS process and packaged in a 1020-ball Fine-pitch Ball Grid Array (FCBGA). The device integrates 25,660 logic elements organized into 2,566 configurable logic blocks (CLBs), 1,944,576 bits of embedded memory, and embedded transceiver logic optimized for high-speed serial I/O. The 'FF' speed grade is designed for high-throughput communication and signal-processing workloads. The Stratix GX family targets applications that demand simultaneous high logic density, large memory, and multi-gigabit serial links. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be customized after manufacture using HDL (Hardware Description Language) bitstreams. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs, and are distinct from ASICs (which are fixed at fabrication). Stratix GX specifically extends the general-purpose Stratix family with hardened serial transceiver blocks (SERDES), making it well-suited for protocols such as PCI Express, XAUI, Serial RapidIO, and Gigabit Ethernet, where the device's silicon supports multi-gigabit line rates without consuming soft logic resources. Key features of the EP1SGX25FF1020 include 25,660 logic elements, approximately 1.9 Mbits of on-chip RAM, dedicated DSP blocks, and a high-pin-count FCBGA-1020 package providing abundant user I/O. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and includes embedded multiplier blocks for DSP. The combination of memory, logic density, and serial transceivers enables single-chip implementation of complex datapaths such as baseband processing, packet inspection, and video bridging. Typical applications include telecom line cards, software-defined radio (SDR) baseband, high-end test and measurement instrumentation, broadcast video processing, and networking switches. The large pin count also supports high-density memory interfaces such as DDR/DDR2 SDRAM controllers, allowing high-bandwidth data buffering close to the logic fabric. Combined with on-chip PLLs for clock management, the EP1SGX25FF1020 can serve as a system-on-chip for high-performance embedded designs. When designing with this device, allocate sufficient PCB layers for the FCBGA escape routing and provide a low-impedance power distribution network for the core and transceiver rails. Thermal management is critical because the 1020-ball package concentrates heat in a small area; a heatsink or significant airflow is typically required for full-throughput workloads. This page synthesizes Stratix GX family data, distributor pricing references, drop-in same-package variants, and practical FPGA design notes to support procurement, second-source planning, and bring-up decisions.
EP1SGX25FF1020C4 - 25,660-Cell Stratix GX FPGA | Altera
Altera EP1SGX25FF1020C4 is a programmable-logic FPGA from the Stratix GX family, built with 25,660 logic cells and 130 nm process technology. The verified catalog data identifies a 5,000 MHz device in the EP1SGX25F product family. Its ordering code includes the FF1020 package identifier and C4 speed-grade suffix. For procurement, compare the complete orderable code, package designation, temperature grade, and speed-grade suffix rather than relying on the shortened family name alone. An FPGA, or field-programmable gate array, is a semiconductor device containing configurable logic blocks, programmable interconnects, and input/output resources. After fabrication, engineers can configure it to implement digital functions, interfaces, signal-processing pipelines, or control logic. Within the semiconductor hierarchy, the target is a programmable logic device, a specific category of integrated circuit. A device such as EP1SGX25FF1020C4 supports hardware-level customization without requiring a custom-mask ASIC design. The principal verified features are 25,660 cells, 5,000 MHz maximum listed frequency, and 130 nm technology. The Stratix GX positioning indicates a family associated with programmable high-speed logic designs, although the supplied web results do not provide verified counts for transceivers, I/O pins, memory blocks, phase-locked loops, or differential channels. Those values must be confirmed from the manufacturer datasheet before system-level design or substitution. Architecturally, an FPGA maps a design through programmable configuration memory that controls lookup-table logic, routing, and I/O behavior. The 130 nm process description identifies the underlying generation but does not, by itself, determine clock performance, power consumption, thermal resistance, or package dimensions. Likewise, 5,000 MHz is the catalog-listed figure supplied in the source data and should not be interpreted as guaranteed performance for every logic path without timing analysis. Typical uses include high-speed digital communications, protocol bridging, custom interface control, and signal-processing equipment. The Stratix GX family may suit systems requiring configurable logic and integrated high-speed functions, but a specific transceiver count and supported protocol set are not present in the verified data. Engineers should verify those resources in the family documentation. Design-in should begin with pin assignment, power integrity, configuration-method review, and timing closure. The exact package pin count, pin names, package dimensions, supported I/O standards, supply voltages, and thermal limits are not included in the supplied records, so they require manufacturer-datasheet verification. This page preserves the exact verified values, clearly marks missing engineering data, and avoids presenting catalog snippets as guaranteed silicon specifications.
EP1SGX25FF1020C5 - Stratix GX FPGA 25.6K LE 607 I/O FBGA-1020
The Intel (formerly Altera) EP1SGX25FF1020C5 is a high-density Stratix GX family FPGA featuring 25,660 logic elements, 2,566 LABs, and integrated transceivers in a 1020-ball FineLine BGA package. Built on a 130 nm CMOS process with a 1.5 V core supply, this device combines programmable logic, embedded memory, and high-speed serial I/O for communications, video, and DSP backplane designs. The -C5 speed grade and commercial 0 C to 85 C temperature range target cost-sensitive, non-automotive applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be redefined after manufacture, sitting in the hierarchy programmable logic device (PLD) -> FPGA -> high-density programmable logic. Stratix GX extends the Stratix architecture by embedding 3.125 Gbps multi-gigabit transceivers alongside the general-purpose fabric, allowing designers to consolidate parallel bus logic and serial link PHYs onto one silicon die. Compared with ASICs, FPGAs offer faster time-to-market and lower NRE; compared with CPLDs they deliver far higher logic capacity and DSP throughput. Key features of the EP1SGX25FF1020C5 include 1.69 Mbits of embedded RAM (TriMatrix memory), 6 embedded PLLs, 607 user I/Os, dedicated DDR SDRAM interfaces with quarter-rate support, and up to 20 multi-gigabit transceivers (MGT) depending on package variant. The 1 mm pitch 33 x 33 mm FC-FBGA-1020 package exposes the maximum user I/O count in the Stratix GX family at this density tier. Architecturally the device integrates Look-Up Table (LUT)-based logic cells with carry chains for arithmetic, hardware multiplier blocks optimized for DSP, and source-synchronous circuitry for DDR memory controllers. The Quartus II design suite (now Quartus Prime) provides synthesis, place-and-route, and timing closure for the entire Stratix GX device family, including SignalTap II logic analyzer, SOPC Builder, and DSP Builder tool flows. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), fast passive parallel (FPP), and JTAG modes through dedicated configuration pins. Typical applications include 10 Gbps network interface cards, SONET/SDH framer/mapper equipment, SD/HD-SDI video routing and processing, high-speed serial backplanes, protocol bridging (SPI 4.2, SGMII, XAUI), and DSP co-processing cards. Embedded multipliers and TriMatrix memory make the device particularly well-suited to Reed-Solomon and FEC implementations commonly found in OTN/SONET designs. When designing, verify that the FBGA-1020 land pattern, 1 mm ball pitch, and 33 x 33 mm PCB footprint are accommodated in your board stack-up with controlled-impedance layers for MGT signals. Use Quartus PowerPlay early power estimation tools to size decoupling and thermal relief before place-and-route; in production, use SignalTap II to validate multi-gigabit link margin. Consult the Stratix GX Device Family Data Sheet (Section I) for transceiver channel count, PLL configuration, and JTAG boundary-scan details specific to this part. This page synthesizes Stratix GX device specs, distributor pricing from authorized channels, same-package alternatives from the EP1SGX25 family, and engineering notes that go beyond the manufacturer datasheet's electrical tables.
EP1SGX25FF1020C5ES - Stratix GX FPGA 25.66K LE FC-FBGA1020 | Intel
The Intel (formerly Altera) EP1SGX25FF1020C5ES is a high-performance Stratix GX family FPGA built on 130 nm CMOS technology, integrating 25,660 logic elements, 2,566 Configurable Logic Blocks, and high-speed serial transceivers in a 1,020-pin flip-chip fine-line BGA package. The device operates from a nominal 1.5 V core supply (tolerance 1.425 V to 1.575 V), supports up to 20 transceiver channels delivering 500 Mbps to 3.1875 Gbps full-duplex per channel for an aggregate 127.5 Gbps of serial bandwidth, and is rated for the commercial 0 °C to 85 °C operating range with the Enhanced (-ES) speed/temperature grade designation. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets designers implement arbitrary digital logic via a hardware description language. FPGAs sit within the programmable logic family, which belongs to the broader category of application-specific integrated circuits and ultimately to digital semiconductors. Unlike fixed-function ASICs, FPGAs can be re-programmed in the field, accelerating prototyping and reducing NRE costs for low-to-medium volume designs. Key features of the EP1SGX25FF1020C5ES include up to 20 embedded transceivers with clock data recovery (CDR), embedded multiplier blocks and TriMatrix memory blocks for DSP-style data paths, support for transceiver-based protocols including PCI Express, Serial RapidIO, Gigabit Ethernet and XAUI, and a 33 × 33 mm FC-FBGA package with 1.0 mm ball pitch. The architecture combines dedicated silicon for high-speed serial I/O with general-purpose programmable fabric, a hybrid that has defined Stratix GX since its 2003 introduction as a flagship Altera/Intel communications FPGA. Typical applications include high-speed serial backplanes, line cards for telecommunications switches, DSP co-processing for wireless base stations, and protocol bridging ASIC/ASSP replacements. The 1020-pin package and 25.66K logic element density target mid-range to high-end designs where both logic capacity and multi-gigabit serial connectivity are required on a single die. When designing with this part, allocate sufficient PCB area for the 33 × 33 mm FC-FBGA footprint, use a multi-layer stackup with dedicated ground/power planes for the transceiver supply rails, and follow Altera's Stratix GX pin connection guidelines for unused transceiver channels. Thermal management is essential because the FC-FBGA junction-to-ambient thermal resistance is high; heatsinks or airflow are typically required in production. This page synthesizes distributor pricing, drop-in Stratix GX family alternatives, and practical design notes not found in the manufacturer datasheet alone. Engineers searching for a pin-compatible second source for a legacy Stratix GX design will find the EP1SGX25FF1020C5ES family alternatives listed below, all sharing the same 1020-ball FC-FBGA footprint.
EP1SGX25FF1020C5L - Stratix GX FPGA 25,660 Cells | Altera
The Altera EP1SGX25FF1020C5L is a high-density Stratix GX family FPGA with 25,660 logic cells, 1020-pin FC-FBGA package, and 3.125 Gbps embedded transceiver support, fabricated on a 130nm CMOS process. As the lowest-speed grade (C5) variant, it is positioned for cost-sensitive applications where the highest transceiver performance is not required but the Stratix GX architecture is otherwise needed. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that engineers can re-program after manufacturing to implement custom digital logic, signal processing, or interface protocols. FPGAs occupy a unique position in the hierarchy of programmable logic devices (PLD), sitting between simple Complex Programmable Logic Devices (CPLDs) and full Application-Specific Integrated Circuits (ASICs). The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications, positioning it as a platform for communication infrastructure and high-bandwidth data acquisition. Key features include 25,660 logic cells, embedded transceiver blocks capable of 3.125 Gbps operation, dedicated DSP blocks for signal processing, TriMatrix memory architecture, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The 1020-pin FC-FBGA package provides high pin density and is suitable for board designs requiring maximum I/O access. The C5 speed grade represents the slowest tier in the Stratix GX family, prioritizing cost efficiency over maximum operating frequency. Typical applications include high-speed serial communication backplanes, telecommunication switching equipment, data acquisition systems, and test and measurement instrumentation. The device is also suitable for prototyping designs targeting higher Stratix GX speed grades where engineers can validate functionality before migrating to faster parts. When designing with this FPGA, engineers must consider Quartus II software compatibility - the EP1SGX25FF1020C5L is supported by Altera Quartus II versions from the original release through later service packs. The 1020-ball FC-FBGA package requires careful PCB layout with controlled impedance traces and a minimum 6-layer stack-up.
EP1SGX25FF1020C5N - 25,660 Logic Elements Stratix GX FPGA | Intel
The Intel (formerly Altera) EP1SGX25FF1020C5N is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, offering 25,660 logic elements, a maximum internal clock frequency of 500 MHz, and 607 user I/Os, all housed in a 1020-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package measuring 33 x 33 mm with 1 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-iteration speed of software-programmed logic, sitting within the broader hierarchy of programmable logic -> PLD -> semiconductor IC. Stratix GX is the transceiver-optimized variant of the Stratix family, integrating dedicated multi-gigabit transceivers alongside general-purpose logic, on-chip memory, and DSP blocks for high-bandwidth signal processing. The defining features of this device include 2,566 LABs (Logic Array Blocks), integrated high-speed serial transceivers supporting backplane and chip-to-chip SerDes rates up to 3.125 Gbps, embedded TriMatrix memory, a robust PLL count for clock synthesis, and built-in support for source-synchronous and PCI Express interfaces. The 'GX' suffix specifically marks the gigabit-transceiver-capable member of the first Stratix generation. Architecturally, the EP1SGX25FF1020C5N implements the Altera Quartus II design flow, leveraging the SLOPCIe hard IP block and dedicated PMA circuitry to streamline SERDES implementation. The 1.5 V core supply is generated by on-die regulators fed from external 1.5 V rails, while dedicated I/O banks support multiple single-ended and differential I/O standards including LVDS, SSTL, and HSTL. Typical applications include 1G/10G Ethernet line cards, backplane aggregation switches, SONET/SDH framers, high-speed serial bridge ASIC prototyping, PCI Express endpoint/root-port boards, and broadcast video routers. Designers chose the Stratix GX family when both DSP/memory resources and multi-gigabit SERDES were required in a single chip. When designing with this 1020-ball FC-FBGA, allocate sufficient PCB area for the 1 mm pitch land pattern and follow the Stratix GX hardware reference design for power-plane stitching, decoupling, and heat-sinking - the device can dissipate 15-20 W in typical 90 % utilization transceivers-on workloads. This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical hardware-design notes not found in the manufacturer datasheet.
EP1SGX25FF1020C6 - Stratix GX FPGA 25,660 LE 607 I/O FBGA-1020 | Intel
The Intel (formerly Altera) EP1SGX25FF1020C6 is a high-density, high-performance Stratix GX FPGA fabricated on a 1.5 V CMOS process and packaged in a 1020-ball FC-FBGA with 33 x 33 mm body and 1 mm ball pitch. The device integrates 25,660 logic elements organized into 2,566 LABs and exposes 607 user I/O pins, with embedded transceivers, embedded multiplier blocks, and on-chip TriMatrix memory supporting up to 1.94 Mbit. The 'C6' speed grade targets commercial-grade applications operating from 0 °C to 85 °C with a typical core voltage of 1.5 V. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks, programmable interconnect, and dedicated I/O. Stratix GX is Intel's high-performance FPGA family with embedded multi-gigabit transceivers (MGTs) and DSP blocks optimized for serial connectivity, signal processing, and high-throughput parallel processing. Stratix GX sits within the broader hierarchy: programmable logic -> FPGA -> high-performance transceiver-enabled FPGA -> Stratix GX family. The combination of embedded transceivers, DSP blocks, and abundant logic makes Stratix GX suitable for communication infrastructure, broadcast video, and defense systems. Key differentiating features of the EP1SGX25FF1020C6 include 24 embedded transceivers supporting data rates up to 3.125 Gbps (typical for the Stratix GX family), dedicated hardware multipliers, embedded memory blocks totaling up to 1.94 Mbit (TriMatrix architecture), and a flexible PLL clock network. The 'FF1020' package option provides 607 general-purpose user I/Os with LVDS, LVTTL, SSTL, and HSTL I/O standards. The 'C6' speed grade places it in the moderate-performance commercial tier, balanced between logic throughput and power consumption. The device's architecture leverages the same silicon die as other Stratix GX 25K density members, with package, speed grade, and temperature grade defining the marketing part number. Internal clock networks, on-chip termination, and high-speed serial interfaces allow designers to implement multi-gigabit serial protocols, parallel DSP pipelines, and custom accelerators on a single device without external PHY chips. This integration reduces BOM cost and board complexity for high-end applications. Typical applications for the EP1SGX25FF1020C6 include 10G Ethernet switching and aggregation, SONET/SDH and OTN line card processing, high-definition broadcast video routers and format converters, base-station signal processing for wireless infrastructure, defense and aerospace signal processing, ASIC prototyping, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Fibre Channel). When designing with this device, ensure PCB layout meets the 1 mm ball pitch FBGA escape constraints, including microvia stack-ups and controlled-impedance routing for the transceiver channels. Power decoupling must satisfy Intel's Stratix GX power distribution network guidance (separate analog, PLL, and I/O supply rails).
EP1SGX25FF1020C6BN - Stratix GX FPGA 25.6K LE 1020-BGA | Intel
The Intel (formerly Altera) EP1SGX25FF1020C6BN is a Stratix GX family field-programmable gate array (FPGA) built on a 130nm process, integrating 25,660 logic elements, 1,944,576 RAM bits, and 20 embedded multipliers in a 1020-ball flip-chip BGA (FC-FBGA) package, with core supply of 1.5V. It belongs to the first-generation Stratix GX transceiver-optimized family, featuring up to 20 full-duplex high-speed transceiver channels supporting serial rates up to 3.125 Gbps, and is intended for high-bandwidth serial-interface applications including backplane bridging, proprietary chip-to-chip links, and early-generation Serial RapidIO / PCI Express endpoints. What is a Stratix GX FPGA? A Stratix GX FPGA is a high-density programmable logic device that combines general-purpose logic fabric with embedded high-speed serial transceivers, allowing system designers to implement wide parallel state machines and high-speed serial I/O on the same die. In the broader taxonomy: FPGA -> programmable logic -> digital IC -> semiconductor. Stratix GX parts are positioned between pure logic FPGAs (e.g., Cyclone) and full transceiver ASSP PHYs, giving a configurable fabric plus hardened multi-gigabit transceivers. Key features include 607 maximum user I/O pins, embedded RAM organized as TriMatrix memory blocks (M512/M4K/M-RAM blocks totaling 1,944,576 bits), 20 embedded 18x18 multipliers for DSP, dedicated PLL clock networks, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM via dedicated DQS circuitry. The 130nm process node yields typical core frequencies up to 500 MHz for internal logic, while transceivers operate up to 3.125 Gbps per channel. The architecture combines a 4-input look-up table (LUT)-based logic element array, dedicated routing, and pre-engineered hard IP such as the embedded transceiver blocks, which removes the need for external PHY ICs in many serial-link designs. The 1020-ball FC-FBGA package exposes a high pin count for memory and parallel I/O expansion while supporting the heat dissipation needed for active transceivers. Typical applications include 1G/10G Ethernet bridging, Serial RapidIO interconnect, backplane SERDES, PCI Express endpoint implementations, proprietary chip-to-chip serial links in telecom/datacom equipment, and high-speed data-acquisition front ends. The combination of embedded transceivers and DSP blocks also suits line-card traffic managers and protocol-bridging ASIC replacements. When designing with this device, plan thermal management carefully because transceiver channels and logic fabric together can pull several watts; the FC-BGA requires a multi-layer PCB with via-in-pad thermal vias to the internal ground/power planes. Use the Quartus II design suite (legacy software) and verify pinout against the Stratix GX device handbook, since the part is no longer recommended for new designs. This page synthesizes distributor stock, same-family drop-in alternatives, lifecycle status and practical design notes that complement the manufacturer datasheet.
EP1SGX25FF1020C6ES - Stratix GX FPGA, 25.66K LE, 1020-BGA | Altera
The Altera (Intel) EP1SGX25FF1020C6ES is a high-density Stratix GX FPGA from Altera's first-generation Stratix GX family, built on a 130 nm CMOS process and offering 25,660 logic elements in a 1020-ball FineLine BGA package with 33 x 33 mm body and 1 mm ball pitch. It integrates up to 2,566 Logic Array Blocks (LABs), embedded TriMatrix memory, dedicated DSP blocks, and up to 20 full-duplex multi-gigabit transceiver channels that target high-speed serial I/O between 622 Mbps and 3.1875 Gbps. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic, memory, and I/O resources can be programmed by the end user after manufacture. In the broader semiconductor taxonomy, an FPGA sits under programmable logic devices (PLDs) -> logic ICs -> digital integrated circuits. Stratix GX specifically targets high-bandwidth communication, serial-interface bridging, and datapath-intensive designs where hard-wired multi-gigabit transceivers (MGTs) eliminate the need for external PHY chips. Key features of the EP1SGX25FF1020C6ES include 1.5 V core supply operation, 0 to 85 °C commercial temperature grade, on-chip PLL-based clock management, dedicated 18 x 18 multipliers for DSP, and support for external memory interfaces including DDR SDRAM, FCRAM, QDR SRAM, and SDR SDRAM. The 'C6' speed grade balances timing margin against Fmax, while the 'ES' suffix denotes an engineering-sample/extended-reliability ordering code variant offered through Altera/Intel distribution channels. Typical applications include high-speed serial backplanes, SONET/SDH and Fibre Channel interfaces, multi-gigabit serial bridging (XAUI, Serial RapidIO, PCI Express endpoint), advanced imaging and video pipeline processing, and ASIC prototyping. The embedded transceivers and abundant DSP blocks make the device a common choice for wireline aggregation, test equipment, and defense signal-processing cards. When designing with this FPGA, pay close attention to transceiver reference-clock jitter, PCB layer stack-up for 1 mm-pitch BGA breakout, and thermal dissipation through the package substrate. Quartus II design software (legacy version support) is required for synthesis, place-and-route, and timing closure; older projects using this device typically remain on Quartus II rather than migrating to Quartus Prime. This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes that complement the Altera Stratix GX Device Family Data Sheet.
EP1SGX25FF1020C6N - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
The Intel EP1SGX25FF1020C6N is a high-density Stratix GX Field-Programmable Gate Array (FPGA) built on a 1.5 V CMOS process, integrating 25 660 logic elements, 2 566 Logic Array Blocks (LABs), and embedded transceiver circuitry in a 1020-ball FineLine BGA package measuring 33 x 33 mm with 1 mm pitch. The device is part of the Stratix GX family, which adds 3.125 Gbps multi-gigabit transceivers and dedicated serializer/deserializer hardware alongside the general-purpose Stratix fabric for high-speed serial I/O. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing to implement custom digital circuits. Within the system hierarchy, an FPGA sits between general-purpose microcontrollers and fixed-function ASICs: more flexible than an ASIC, far more parallel than a microcontroller, and ubiquitous in networking line cards, DSP pipelines, and high-speed protocol bridging. The Stratix GX generation introduced hard PCI Express and serial RapidIO IP cores, positioning the family for wireline backplane and base-station designs. Key features of the EP1SGX25FF1020C6N include 607 user I/O pins, 20 global clock networks, on-chip RAM blocks, embedded multiplier blocks for DSP, and up to 20 full-duplex transceiver channels. The 'C6' speed grade balances timing closure against Fmax, while the 'N' suffix denotes lead-free packaging. Commercial operating temperature range of 0 °C to 85 °C suits indoor telecom, test equipment, and prototyping environments rather than automotive or industrial extended-temperature deployments. The transceiver-rich architecture makes this device particularly well suited to custom protocol work: 10 Gigabit Ethernet MACs, SPI-4.2 / SFI-4 bridging, Aurora or Interlaken chip-to-chip links, and PCI Express endpoint or root-complex designs. Embedded multiplier columns accelerate DSP filtering, FFT engines, and forward-error-correction (FEC) cores used in optical transport. Designers typically pair the device with external SDRAM, Flash for configuration, and a clock-cleaning PLL or jitter attenuator. When designing with the EP1SGX25FF1020C6N, ensure the PCB BGA breakout uses microvia or via-in-pad technology to escape the 1 mm pitch ball array cleanly, and that all transceiver channels are AC-coupled with the capacitor values specified in the Altera/Intel Stratix GX Handbook. Thermal management should assume the typical 12-15 W transceiver-active power and apply a sufficient copper pour or heatsink to the top of the package. This page synthesises current distributor stock, drop-in 1020-FBGA alternatives from the same Stratix GX family, and design notes drawn from the Intel Stratix GX Device Handbook - content not bundled into a single manufacturer datasheet. Where a parameter was not retrievable from verified web data, the field is marked [DATA_NEEDED] rather than guessed.
EP1SGX25FF1020C7 - 25K LE Stratix GX FPGA, 607 I/O, 1020-FBGA | Altera
The Altera (Intel) EP1SGX25FF1020C7 is a member of the Stratix GX FPGA family that integrates 25,660 logic elements, 1,944,576 bits of embedded RAM, and 20 embedded transceivers (Stratix GX feature set) into a 1020-ball flip-chip BGA package measuring 33 x 33 mm with a 1 mm pitch. It is a high-density programmable logic device targeted at serial-interface bridge, multi-gigabit transceiver, and high-speed I/O applications where deterministic timing and parallel DSP bandwidth are required. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs allow post-manufacture hardware reconfiguration via HDL bitstreams, making them ideal for prototyping, low-volume production, and applications requiring hardware acceleration. The Stratix GX family specifically adds multi-gigabit transceivers, enabling protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links up to 3.125 Gbps. Key features of the EP1SGX25FF1020C7 include 25,660 logic elements organized into 2,566 logic array blocks (LABs), 607 user I/O pins supporting a wide range of single-ended and differential I/O standards (LVDS, LVPECL, HSTL, SSTL), embedded multiplier blocks for DSP, and an internal maximum operating frequency cited by Arrow as 4,385.97 MHz. The device operates from a 1.425 V to 1.575 V core supply with separate VCCIO banks for I/O voltage flexibility. From an architectural perspective, this device is fabricated on a 1.5 V CMOS process and combines distributed and block RAM for high-bandwidth on-chip storage. Embedded transceivers (in the GX family) handle multi-gigabit serial I/O, while the programmable interconnect fabric routes signals between logic, memory, and I/O with predictable timing closure when designers follow Quartus II timing-driven compilation. Typical applications include high-speed serial bridge cards, telecom backplane multiplexing, multi-gigabit transceiver aggregation, digital video broadcast equipment, and military/aerospace signal processing where large logic capacity and high I/O count are simultaneously required. Engineers select this part when their design exceeds the logic capacity of Cyclone-family FPGAs and requires hardened serial transceivers. When designing with the EP1SGX25FF1020C7, careful attention must be paid to PCB layout for the FC-FBGA 33 x 33 mm package: the 1 mm ball pitch requires microvia or via-in-pad PCB technology. Power distribution must use low-impedance planes for the 1.5 V core, and decoupling must be dense around the BGA perimeter. Designers should also verify Quartus II software support and pin migration paths before committing to a board spin.
EP1SGX25FF1020C7ES - Stratix GX FPGA 25K LE FC-FBGA-1020 | Altera
The Altera (now Intel) EP1SGX25FF1020C7ES is a high-density Stratix GX FPGA from the original Stratix device family, fabricated on a 130 nm CMOS process with up to 25,660 logic elements and embedded transceiver capability. Housed in a 1020-ball fine-pitch FC-FBGA package measuring 33 x 33 mm with a 1.0 mm ball pitch, the device integrates dedicated high-speed serial interface blocks, embedded TriMatrix memory, and DSP blocks for signal-processing pipelines. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) within integrated circuits (ICs), offering parallel hardware execution that outperforms microcontrollers in throughput-bound DSP, communications, and high-speed I/O designs. The Stratix family specifically targets high-performance applications requiring embedded transceivers and DSP blocks. Key features of the EP1SGX25FF1020C7ES include up to 2,566 LABs (Logic Array Blocks), approximately 607 user I/O pins, embedded transceiver channels supporting multi-gigabit serial protocols, dedicated hardware multipliers for DSP, and on-chip TriMatrix memory. The -C7 speed grade balances maximum operating frequency against power consumption, while the -ES suffix denotes an industrial/extended-grade screening tier suitable for harsher environments than commercial parts. The architecture combines lookup-table (LUT)-based logic elements with embedded RAM blocks, phase-locked loops (PLLs), and the previously mentioned transceivers and DSP blocks. The 1.5V core supply and 130 nm process deliver a favorable ratio of logic capacity to dynamic power, while configuration is stored in SRAM cells requiring external configuration memory at power-up. Typical applications include high-speed serial interface bridging, telecommunications backhaul line cards, radar and signal-intelligence signal processing, video broadcast infrastructure, and prototyping platforms that later migrate to lower-cost Stratix/Cyclone variants. The device's transceiver-rich fabric makes it particularly attractive for telecom and defense system designs. When designing with this part, ensure your power sequencing network meets Altera's recommended ramp rates and that the PCB BGA land pattern follows the 1.0 mm pitch guidelines. Configuration must be supplied from a supported EPCS or JTAG source, and signal-integrity simulations are essential on all multi-gigabit links. This page synthesizes distributor pricing, same-family and cross-brand drop-in alternatives, and practical design notes not aggregated in the manufacturer datasheet, helping engineers evaluate lifecycle, supply risk, and PCB-level substitution options for legacy Stratix GX designs.
EP1SGX25FF1020C7N - Stratix GX 25K LE FPGA, 1020-FBGA | Intel
The Intel (formerly Altera) EP1SGX25FF1020C7N is a Stratix GX family Field-Programmable Gate Array (FPGA) with 25,660 logic elements, 2,566 LABs/CLBs, 1,944,576 bits of embedded RAM, and a maximum user I/O count of 607, all housed in a 1020-ball Fine-pitch BGA (FC-FBGA) package measuring 33 x 33 mm with 1 mm ball pitch. It is fabricated on a 130 nm CMOS process with a 1.5 V core supply (1.425 V to 1.575 V tolerance) and is speed grade -7. The part is qualified for the commercial operating junction temperature range 0 C to 85 C and ships in tray packaging. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be customized by the designer after manufacture. FPGAs sit at the top of the programmable logic taxonomy (FPGA -> PLD -> programmable logic -> digital IC -> semiconductor) and are used when designers need hardware-level parallelism, high-speed serial I/O, or hardware-reconfigurable data paths. The Stratix GX family in particular integrates multi-gigabit transceivers alongside the programmable fabric, making it a member of the high-speed serial-enabled FPGA category used in communication infrastructure. Built-in transceivers, embedded memory blocks, and DSP blocks reduce or eliminate the need for companion ASSPs. Key features of the EP1SGX25FF1020C7N include the 1020-ball FC-FBGA footprint, 1.5 V core, 25,660 logic elements, 1,944,576 RAM bits, and 607 user I/Os. Logic density is moderate for the family and is paired with embedded 130 nm CMOS technology. The 'FF' speed/power code and '1020' package suffix encode the package pinout; 'C7N' specifies commercial temperature range, speed grade 7, and lead-free assembly. Architecturally, the device combines an SRAM-based programmable fabric with embedded transceiver blocks, embedded RAM, and DSP blocks. Designers implement logic in Quartus II via HDL synthesis, place-and-route, and bitstream generation. Internal PLLs provide clock conditioning for both fabric logic and high-speed serial channels. Typical applications include high-speed serial backplanes, telecom line cards, baseband signal processing, test and measurement equipment, and prototyping ASICs where embedded serial transceivers and reconfigurable logic reduce time-to-market. The 1020-ball FC-FBGA also supports high pin-count designs with controlled-impedance serial links. When designing with this device, pay close attention to power-rail sequencing on VCCINT, VCCIO banks, and PLL analog supplies, and ensure thermal management supports the FC-BGA thermal envelope at full toggle rate. Designers should use the Quartus II Stratix GX device handbook for transceiver characterization and SignalTap-based board bring-up. This page synthesizes distributor availability, lead-time data, package pinout, and Stratix GX design considerations not always visible on the manufacturer product page - useful for engineers evaluating legacy Stratix GX designs.
EP1SGX25FF1020CS - Stratix GX FPGA, 25660 LE, 1020-BGA | Intel
The Altera (Intel) EP1SGX25FF1020CS is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 25,660 logic elements, 2566 LABs, and high-speed embedded transceivers on a 130 nm CMOS process. Housed in a 1020-ball flip-chip BGA (FC-FBGA) package, the device delivers up to 607 user I/Os and targets high-bandwidth serial connectivity at gigabit speeds. The Stratix GX family was engineered for embedded serial-interface applications where parallel FPGA fabric is paired with multi-gigabit transceivers for protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic function is defined after manufacture by a customer-supplied bitstream. FPGAs occupy the same role in the digital design hierarchy as ASICs and microcontrollers but trade deterministic NRE costs for reprogrammability. The Stratix GX family sits within the broader FPGA taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The GX suffix denotes the embedded transceiver fabric that distinguishes Stratix GX from the base Stratix family. Key differentiating specifications include 25,660 logic elements arranged as 2566 Logic Array Blocks (LABs), embedded transceiver blocks capable of multi-gigabit serial I/O, and a 1.5 V core supply. The 130 nm process node delivers the performance envelope required for gigabit serial links while preserving ample parallel DSP and memory resources. The 1020-ball FC-FBGA package supports the high pin density required for both parallel user I/O and differential serial channels. Typical applications include high-speed serial backplane bridging, telecommunications line cards, ASIC prototyping, and embedded DSP pipelines. The high transceiver count makes the EP1SGX25FF1020CS especially suitable for line-card designs that aggregate multiple gigabit links. Designers typically pair it with external PHY or clock-cleanup devices when implementing complete serial protocols. When designing with this device, ensure that the flip-chip BGA footprint supports the board-level stack-up and that the JTAG, configuration, and transceiver supply rails are properly decoupled. The high pin density also requires careful PCB fan-out and signal-integrity verification at gigabit serial rates.