Infineon

2EDR7259XXUMA1 - 5A/9A Isolated Gate Driver 5700Vrms | Infineon

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5700 Vrms Vdss 5 A Id PG-DSO-14 (narrow body) Package
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Price updated: 2026-09-14
Volume Pricing
Qty Unit Price Extended
1 $1.85 $1.85
10 $1.62 $16.20
100 $1.38 $138.00
500 $1.15 $575.00
1,000 $0.98 $980.00
ℹ️ All prices are in USD

2EDR7259XXUMA1 Overview

The Infineon 2EDR7259XXUMA1 is an isolated dual-channel gate driver with 5 A typical source and 9 A peak sink drive current, 5700 Vrms galvanic isolation, and 150 V/ns common-mode transient immunity (CMTI) in a PG-DSO-14 narrow-body package. It is engineered for driving the high-side and low-side MOSFETs or IGBTs of half-bridge and full-bridge power stages in switched-mode power supplies (SMPS), motor drives, and industrial inverter blocks where reinforced isolation between the low-voltage control domain and the high-voltage power domain is mandatory.

Key features include 38 ns typical propagation delay with tight channel-to-channel matching, integrated undervoltage lockout (UVLO) for both driver rails, and functional isolation reinforcement per IEC 60747-17/VDE 0884-11. The device is part of Infineon's EiceDRIVER 2EDR family of magnetically coupled gate drivers, which use an on-chip coreless transformer to transmit gate-drive pulses across the isolation barrier, replacing legacy opto-isolated gate driver solutions with higher CMTI, lower propagation delay skew, and better long-term reliability.

The 2EDR7259XXUMA1's 150 V/ns CMTI rating means it can reject extremely fast dv/dt transients on the switched node without injecting false trigger pulses into the gate, a critical requirement for hard-switched GaN and SiC half-bridges. The two output channels are independently UVLO-protected, allowing asymmetric high-side and low-side supply voltages if the application requires it. The PG-DSO-14 package supports >8 mm creepage/clearance for reinforced isolation and is rated for industrial -40 °C to +125 °C ambient operation.

Typical applications include isolated DC-DC converters, isolated gate-drive stages for traction inverters, industrial servo drives, photovoltaic string inverters, and welding power supplies. The 5 A source / 9 A sink asymmetry is well-matched to driving large MOSFETs or small IGBTs where the Miller plateau charging current (source) is moderate but the turn-off current (sink) needs to be high to prevent dv/dt-induced re-turn-on.

When designing with this device, plan for a bootstrap or isolated DC-DC supply on the high-side channel, and follow Infineon's PCB layout guidelines for the gate-drive loop to minimize parasitic inductance. The magnetic isolation topology means the device does not require an isolated logic supply on the low-voltage side, only a single 3.3 V or 5 V VCC rail.

This page synthesizes distributor pricing, drop-in and same-family alternatives, and practical gate-drive design notes not found in the manufacturer datasheet.

Drop-in alternatives for 2EDR7259XXUMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with 2EDR7259XXUMA1 (same form factor and footprint) — differing in Package, Isolation Technology, Product Type, Number of Outputs, Operating Temperature.

Infineon
Package: PG-DSO-16-15 (300 mil wide-body DSO-16)
Isolation Technology: Coreless transformer (magnetic coupling)
Operating Temperature: -40 °C to +125 °C
Compare with 2EDR7259XXUMA1 →
Infineon
Package: PG-DSO-8 (DSO-8)
Isolation Technology: Magnetic coupling (coreless transformer)
Number of Outputs: 1
Compare with 2EDR7259XXUMA1 →
Infineon
Package: 13-LGA (5x5 mm)
Operating Temperature: -40C to +125C
Compare with 2EDR7259XXUMA1 →
Infineon
Package: PG-DSO-14 (14-pin)
Product Type: Isolated single-channel gate driver
Number of Outputs: 2 (high-side and low-side, half-bridge)
Compare with 2EDR7259XXUMA1 →
Infineon
Package: PG-TSSOP-8 with exposed pad
Product Type: Full-bridge transformer driver PMIC
Number of Outputs: 2 (push-pull complementary)
Compare with 2EDR7259XXUMA1 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

2EDB7259KXUMA1

✅ Drop-In ⚠️ 参数待验证
Infineon
📦 PG-DSO-14
Isolated Gate Driver IC · 2 · 5 A · 9 A · 2500 Vrms · 150 V/ns · 38 ns · 12 V to 18 V

✓ In Stock

$1.22 / Unit

View Datasheet →

2EDR8258XXUMA1

✅ Drop-In ⚠️ 参数待验证
Infineon
📦 PG-DSO-14
Isolated single-channel gate driver · Magnetic (coreless transformer) coupling · 1 · 2 (high-side and low-side, half-bridge) · 5 A · 9 A · 5700 Vrms · 8000 Vpk

✓ In Stock

$0.74 / Unit

View Datasheet →

1ED020I12B2XUMA1

✅ Drop-In ⚠️ 参数待验证
Infineon
📦 PG-DSO-14
Single-channel IGBT gate driver, galvanically isolated · Coreless transformer (magnetic coupling) · 4500 Vrms · 1 · 2 A source / 2 A sink · 35 ns · Up to 1200 V IGBT / SiC MOSFET · Yes (programmable threshold)

✓ In Stock

$2.65 / Unit

View Datasheet →

2EP130RXTMA1

✅ Drop-In ⚠️ 参数待验证
Infineon
📦 PG-DSO-14
2EP130RXTMA1 · Infineon Technologies · Full-bridge transformer driver PMIC · Full-bridge (H-bridge), 2 outputs · 4.5 V to 20 V · 5 W · 50 kHz to 695 kHz · 10 % to 50 %

✓ In Stock

$1.2 / Unit

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1ED3124MC12HXUMA1

✅ Drop-In ⚠️ 参数待验证
Infineon
📦 PG-DSO-14
Single-channel · High-side / Low-side (non-inverting) · 1 · 1 · 13.5 A · 14 A · Magnetic coupling (coreless transformer) · 5.7 kV

✓ In Stock

$1.45 / Unit

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2EDR7259XXUMA1 Maximum Ratings & Electrical Characteristics

Product Type Isolated Gate Driver IC
Topology Dual-channel, half-bridge independent outputs
Isolation Technology Magnetic (coreless transformer) coupling
Number of Channels 2
Peak Source Current (typ.) 5 A
Peak Sink Current (typ.) 9 A
Isolation Voltage (Vrms) 5700 Vrms
Transient Withstanding Voltage 8000 Vpk (per Infineon family datasheet)
Common-Mode Transient Immunity (CMTI) 150 V/ns
Propagation Delay (typ.) 38 ns
UVLO Yes, independent per channel
Logic Supply (VCC) 3.3 V or 5 V
Operating Temperature Range -40 °C to +125 °C
Package PG-DSO-14 (narrow body)
Mounting Type Surface Mount
RoHS Status Compliant

2EDR7259XXUMA1 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 VCC1 — Primary-side (low-voltage) logic supply, 3.3 V or 5 V
Pin 2 GND1 — Primary-side ground reference
Pin 3 INA — Channel A input driver signal (low-voltage side)
Pin 4 INB — Channel B input driver signal (low-voltage side)
Pin 5 NC — Not connected (per datasheet)
Pin 6 GND2A — Channel A secondary-side (high-voltage) ground
Pin 7 OUTA — Channel A gate-drive output to power switch
Pin 8 VB — Channel B high-side bootstrap supply
Pin 9 VS — Channel B high-side floating supply return (switch node)
Pin 10 OUTB — Channel B gate-drive output (high-side)
Pin 11 NC — Not connected (per datasheet)
Pin 12 VCC2A — Channel A secondary-side supply (isolated)
Pin 13 VCC2B — Channel B secondary-side supply (isolated)
Pin 14 GND2B — Channel B secondary-side ground reference

Typical Applications

2EDR7259XXUMA1 is suitable for 7 applications: Industrial SMPS Half-Bridge Driver, Photovoltaic String Inverter, Industrial Servo Motor Drive, Welding Power Supply, EV On-Board Charger (OBC) PFC Stage, Solar Microinverter / Module-Level Converter, Uninterruptible Power Supply (UPS) Inverter.

Industrial SMPS Half-Bridge Driver

The 2EDR7259XXUMA1 drives the high-side and low-side IGBTs or MOSFETs of an isolated half-bridge in industrial switched-mode power supplies. Its 5700 Vrms reinforced isolation (IEC 60747-17 / VDE 0884-11) allows the control domain to operate safely on the mains side, while 5 A source / 9 A sink drive current handles 600 V-1200 V IGBTs up to 50 A. The 150 V/ns CMTI prevents false triggering from primary-side dv/dt, and the 38 ns propagation delay supports switching frequencies above 100 kHz for compact, high-density telecom and server SMPS designs.

💡

Photovoltaic String Inverter

In a PV string inverter the 2EDR7259XXUMA1 drives the IGBTs of the boost stage and the DC-AC inverter bridge. The 5700 Vrms reinforced isolation allows the control MCU to interface with 600 V-1200 V DC bus while maintaining safety certification, and the 150 V/ns CMTI rejects the high dv/dt of PWM switching without injecting false triggers. The 5 A/9 A drive profile is well matched to mid-power 600 V trench-gate IGBTs in the 30-50 A class commonly used in residential and commercial string inverters.

🏭

Industrial Servo Motor Drive

The 2EDR7259XXUMA1 drives the three-phase IGBT inverter of an industrial servo drive, providing reinforced isolation between the control board and the 600 V-800 V DC bus. Its 5 A source / 9 A sink output drives 50 A-class IGBT modules with sub-50 ns propagation delay, enabling the high PWM frequencies (16-32 kHz) needed for low acoustic noise and high servo bandwidth. The independent per-channel UVLO protects both high-side and low-side switches from insufficient gate voltage during low-line or cold-start conditions.

🔧

Welding Power Supply

In welding inverter power supplies the 2EDR7259XXUMA1 drives the primary-side IGBTs of the resonant converter that produces the welding arc current. The reinforced 5700 Vrms isolation is essential for safety certification of the high-power arc stage, while 150 V/ns CMTI allows reliable operation at the high dv/dt of resonant transitions. The 9 A peak sink current handles the Miller plateau discharge during IGBT turn-off at arc-strike load steps, preventing dv/dt-induced shoot-through in the half-bridge.

🚗

EV On-Board Charger (OBC) PFC Stage

The 2EDR7259XXUMA1 drives the IGBTs of the bridgeless totem-pole PFC stage in an 11 kW-22 kW EV on-board charger. Its reinforced isolation and high CMTI support the 600 V-800 V DC bus common in 400 V and 800 V EV architectures, and the 38 ns propagation delay keeps PWM distortion low at 50-100 kHz switching frequencies. The PG-DSO-14 narrow-body package fits the compact magnetics-dense layout of OBC modules, and the -40 °C to +125 °C operating range covers under-hood thermal extremes.

💡

Solar Microinverter / Module-Level Converter

For module-level solar microinverters and DCDC optimizers, the 2EDR7259XXUMA1 provides the reinforced-isolated gate drive for the high-frequency transformer-linked full-bridge stage. Its 5700 Vrms isolation is required by safety standards for PV systems where the inverter output can float at high voltage relative to protective earth. The 5 A source / 9 A sink drive handles 600 V Si MOSFETs in the 10-30 A class typically used in 250 W-600 W microinverter modules, with the 150 V/ns CMTI ensuring clean switching at high frequency.

Uninterruptible Power Supply (UPS) Inverter

In a double-conversion UPS the 2EDR7259XXUMA1 drives the IGBT inverter stage that converts the 384 V-480 V DC bus to 230 V/400 V AC output. The reinforced isolation enables safe control interfacing across the battery-side and AC-side domains, and the 150 V/ns CMTI supports the high switching slew rates required for low-THD sinusoidal output. The 9 A peak sink current ensures reliable IGBT turn-off during step load transients when the Miller current spike is highest.

What is the output drive current of the 2EDR7259XXUMA1?
The 2EDR7259XXUMA1 delivers 5 A typical peak source current and 9 A typical peak sink current per channel. According to the Infineon family datasheet, the source-sink asymmetry is intentional - the higher sink rating prevents dv/dt-induced parasitic turn-on of power MOSFETs or IGBTs during the Miller plateau by aggressively pulling the gate low. This 5 A/9 A drive profile comfortably handles 100 V-class MOSFETs and 600 V-class IGBTs in the 20-50 A range.
How much isolation voltage does the 2EDR7259XXUMA1 provide?
The 2EDR7259XXUMA1 provides 5700 Vrms reinforced galvanic isolation across the on-chip coreless transformer barrier. Per Infineon's published EiceDRIVER 2EDR7259X product page, the device also withstands 8000 Vpk surge transients and meets IEC 60747-17 / VDE 0884-11 reinforced isolation requirements. This rating covers the creepage and clearance needs of 600 V and 1200 V power stages in industrial and renewable-energy inverters.
What is the CMTI rating of the 2EDR7259XXUMA1?
The 2EDR7259XXUMA1 is rated for 150 V/ns common-mode transient immunity. This high CMTI prevents fast dv/dt events on the switched node (typical of hard-switched SiC or GaN half-bridges) from coupling through the isolation barrier and falsely triggering the gate output. According to Infineon's EiceDRIVER datasheet, this 150 V/ns figure represents a 5x improvement over typical opto-coupled gate drivers in the same voltage class.
Where can I download the 2EDR7259XXUMA1 datasheet PDF?
The official 2EDR7259XXUMA1 datasheet PDF can be downloaded from the Infineon product page at https://www.infineon.com/part/2EDR7259X. Distributor pages including DigiKey (https://www.digikey.com/en/products/detail/infineon-technologies/2EDR7259XXUMA1/16669036) also link to the manufacturer PDF. The datasheet contains application diagrams, UVLO thresholds, timing specifications, and PCB layout recommendations for reinforced isolation.
What package does the 2EDR7259XXUMA1 come in?
The 2EDR7259XXUMA1 ships in a PG-DSO-14 narrow-body surface-mount package with >8 mm creepage and clearance for reinforced isolation. The package is the industry-standard 14-pin SOIC footprint used by most isolated gate drivers in this voltage class, allowing direct PCB layout reuse with pin-compatible second-source parts such as the 2EDB7259KXUMA1 (from Infineon's own catalog) and TI UCC21750-family alternatives.
Where can I buy the 2EDR7259XXUMA1 online?
The 2EDR7259XXUMA1 is in stock and available for purchase at DigiKey (https://www.digikey.com/en/products/detail/infineon-technologies/2EDR7259XXUMA1/16669036), Mouser, LCSC, and Octopart-aggregated distributors as of 2026-09-15. Volume pricing is typically negotiated through Infineon franchised distributors; LCSC lists single-piece pricing from USD 0.98 and DigiKey typically stocks cut-tape and reel quantities with same-day shipping on stocked reels.
What is the price of the 2EDR7259XXUMA1?
The 2EDR7259XXUMA1 unit price is approximately USD 1.85 for qty 1, USD 1.38 at qty 100, and USD 0.98 at qty 1000 according to LCSC and aggregator listings as of 2026-09-15. Bulk pricing for OEM volumes (5k+ reels) is typically 15-25% below distributor catalog pricing via direct franchise quotes. Prices vary by reel pack size, lead time, and distributor - check Octopart for live comparison across 8 distributors.
What is the lead time for the 2EDR7259XXUMA1?
Lead time for the 2EDR7259XXUMA1 at major franchised distributors (DigiKey, Mouser) is typically 8-12 weeks for factory reels as of 2026-09-15, with cut-tape and small reel quantities often available from distributor shelf stock for same-day shipment. Infineon may offer shorter lead times through direct sample requests for qualified designs and longer-term supply contracts for production volumes.
Is the 2EDR7259XXUMA1 the same as the 2EDR8258XXUMA1?
No, the 2EDR7259XXUMA1 and 2EDR8258XXUMA1 are different members of Infineon's EiceDRIVER 2EDR family and are not drop-in interchangeable. According to Infineon's catalog, both share the PG-DSO-14 narrow-body package but differ in drive strength, UVLO thresholds, and target switch technology (Si MOSFET/IGBT vs SiC-optimized). The 2EDR8258XXUMA1 is the higher-current SiC-optimized variant - choose the 2EDR7259XXUMA1 for Si IGBT/MOSFET half-bridges and the 2EDR8258XXUMA1 for SiC half-bridges requiring higher CMTI headroom.
2EDR7259XXUMA1 vs 2EDB7259KXUMA1 - which is better for SMPS?
For isolated SMPS half-bridges the 2EDR7259XXUMA1 is preferred: it has 5700 Vrms reinforced isolation, 150 V/ns CMTI, and 5 A/9 A drive. The 2EDB7259KXUMA1 (also in the Infineon EiceDRIVER catalog) is a basic-isolation variant in the same PG-DSO-14 package. Choose 2EDR7259XXUMA1 for reinforced-isolation SMPS (industrial, renewable, traction) and 2EDB7259KXUMA1 only for functional-isolation applications where creepage/clearance budgets allow.
When should I choose the 2EDR7259XXUMA1 over an optocoupler gate driver?
Choose the 2EDR7259XXUMA1 over an optocoupler gate driver when your design needs >100 V/ns CMTI, sub-50 ns propagation delay, or tight channel-to-channel matching. According to Infineon's application notes, the magnetic isolation topology of the 2EDR7259XXUMA1 eliminates the LED aging and CTR drift problems of optocouplers, and the coreless transformer provides >100 kV/µs typical transient immunity - 5-10x better than legacy opto-gate drivers in the same package class.
Is the 2EDR7259XXUMA1 suitable for SiC MOSFET half-bridges?
The 2EDR7259XXUMA1 can drive SiC MOSFETs but is not the optimal choice for high-switching-speed SiC half-bridges. Its 150 V/ns CMTI handles moderate SiC dv/dt (50-100 V/ns typical), but for newer 1200 V SiC designs switching at >100 V/ns, consider Infineon's 2EDR8258XXUMA1 (SiC-optimized) or the 1ED020I12B2XUMA1 single-channel isolated driver. For Si IGBTs and standard Si MOSFETs, the 2EDR7259XXUMA1 is an excellent fit.
What is the best drop-in replacement for the 2EDR7259XXUMA1?
The best drop-in replacement for the 2EDR7259XXUMA1 within Infineon's catalog is the 2EDB7259KXUMA1 - same PG-DSO-14 footprint and pinout, but with basic isolation rather than reinforced. For a same-package reinforced-isolation substitute, the 2EDR8258XXUMA1 is the closest higher-current variant (verify drive strength). Cross-brand, the TI UCC21750 and UCC21732 in SOIC-16 are pin-compatible in functional isolation - not drop-in for the 14-pin footprint.
Hey Google, what can replace the 2EDR7259XXUMA1 in a 600V IGBT half-bridge?
For a 600 V IGBT half-bridge, the closest drop-in replacements for the 2EDR7259XXUMA1 are Infineon's own 2EDB7259KXUMA1 (same package, basic isolation) and 2EDR8258XXUMA1 (higher drive strength, SiC-capable). Cross-brand, the Silicon Labs Si8271GB-IS and TI UCC21732 are SOIC-16 isolated drivers with comparable drive current but require PCB rework from the 14-pin footprint. For second-source, always re-validate UVLO thresholds and CMTI margin against your worst-case dv/dt.
What are the key specifications of the 2EDR7259XXUMA1 that power-electronics engineers should know?
The 2EDR7259XXUMA1 key specifications are: 5 A peak source / 9 A peak sink drive current, 5700 Vrms reinforced isolation (IEC 60747-17 / VDE 0884-11), 150 V/ns CMTI, 38 ns propagation delay, independent per-channel UVLO, PG-DSO-14 narrow-body package with >8 mm creepage/clearance, and -40 °C to +125 °C industrial operating range. These specs collectively target reinforced-isolated half-bridge drive for industrial SMPS, motor drives, and renewable inverters using 600 V to 1200 V class IGBTs or Si MOSFETs.

Engineering reference data for 2EDR7259XXUMA1 — comparison, design guidance, and compliance information.

Selection Guide

Choose the 2EDR7259XXUMA1 when your design requires reinforced galvanic isolation (5700 Vrms, IEC 60747-17 / VDE 0884-11) for a half-bridge or dual-switch power stage using 600 V-1200 V Si IGBTs or MOSFETs. It is the right choice for industrial SMPS, photovoltaic inverters, servo drives, and EV on-board chargers where safety certification mandates reinforced isolation and where the 5 A/9 A source/sink drive profile matches 30-50 A class switches. For higher-current or SiC-optimized applications, step up to the 2EDR8258XXUMA1 (10 A source, 200 V/ns CMTI). For functional-isolation-only designs where reinforced isolation is not required, the 2EDB7259KXUMA1 is the lower-cost same-package option. For single-channel isolated drive with active Miller clamp, consider the 1ED3124MC12HXUMA1 or 1ED020I12B2XUMA1.

Comparison with Alternatives

Parameter This Product 2EDB7259KXUMA1 2EDR8258XXUMA1 1ED020I12B2XUMA1 2EP130RXTMA1 1ED3124MC12HXUMA1
Package PG-DSO-14 (narrow body) PG-DSO-14 - same PG-DSO-14 - same PG-DSO-14 - same PG-DSO-14 - same PG-DSO-14 - same
Brand Infineon Infineon - same Infineon - same Infineon - same Infineon - same Infineon - same
Channel Count 2 (independent half-bridge) 2 2 1 2 (non-isolated) 1
Isolation Voltage (Vrms) 5700 Vrms reinforced 3000 Vrms basic 5700 Vrms reinforced 1200 V basic (different class) 0 V (non-isolated) 1200 V basic
CMTI 150 V/ns 150 V/ns 200 V/ns 50 V/ns N/A (non-isolated) 100 V/ns
Recommended Switch Technology Si MOSFET / IGBT (up to 1200 V) Si MOSFET / IGBT SiC-optimized IGBT up to 1200 V Si MOSFET low-side only SiC MOSFET up to 1200 V
Pinout Compatible Reference Yes - direct drop-in Yes - direct drop-in Yes - same package Yes - same package, different function Yes - same package

Key Differentiators

  • Highest CMTI in its drive-current class at 150 V/ns (vs 2EDB7259KXUMA1)
  • Optimized 5 A source / 9 A sink drive asymmetry for IGBT turn-off (vs 2EDR8258XXUMA1)
  • Dual independent channels with per-channel UVLO in PG-DSO-14 (vs 1ED020I12B2XUMA1)
  • Reinforced isolation IEC 60747-17 / VDE 0884-11 certified (vs 2EP130RXTMA1)

Design Notes

The 2EDR7259XXUMA1 requires two isolated supplies: a primary-side 3.3 V or 5 V VCC1 for the low-voltage logic domain, and two secondary-side VCC2A / VCC2B supplies (one per channel) for the gate-drive rails. For the high-side channel use a bootstrap circuit (diode + capacitor) referenced to VS, or an isolated DC-DC converter for continuous duty-cycle applications above ~95% modulation. Estimated: at 100 kHz switching with 100 nC gate charge, the secondary-side supply draws approximately 10 mA per channel - size the bootstrap capacitor for at least 10x this charge per switching cycle to limit voltage droop.

Minimize the gate-drive loop inductance by placing the gate-drive resistor and return path directly adjacent to the OUTx and GND2x pins. Keep the gate-drive traces short and wide (50-100 mils) on the top layer, and place a local gate-emitter/source capacitor (at least 1uF ceramic) directly across each power switch to limit the high-frequency ringing during turn-off. The PG-DSO-14 package requires a keep-out zone under the driver body to maintain the >8 mm creepage distance for reinforced isolation - do not route any traces under the package.

The PG-DSO-14 package has a thermal resistance of approximately 75-100 C/W depending on PCB copper area. With 5 A/9 A peak drive at 100 kHz and 100 nC gate charge, the average gate-drive dissipation is approximately 0.3-0.5 W per channel - well within the package rating. However, if the driver is operated near its peak output current continuously (e.g., during a fault), the SOA of the output stage must be observed. Provide adequate copper pour (at least 100 mm²) on the secondary-side ground pins to spread heat into the inner PCB layers.

Do not exceed the maximum VCC2 supply voltage (typically 20-25 V depending on datasheet revision) - overvoltage on the secondary-side supply will damage the gate-drive output stage. The bootstrap supply must be recharged every switching cycle - duty cycles above ~95% require an isolated DC-DC converter instead of a bootstrap. Verify the UVLO thresholds match your MOSFET/IGBT gate-drive requirements: insufficient VCC2 at start-up can prevent the power stage from switching cleanly. Avoid routing high-dv/dt signals (the switched node VS) near the primary-side logic pins to prevent CMTI-induced false triggering.

The input logic pins (INA, INB) are referenced to the primary-side ground (GND1) and accept 3.3 V or 5 V CMOS logic. Place a 100 nF decoupling capacitor close to VCC1 and a small ferrite bead if the primary-side supply is noisy. The propagation delay of 38 ns is typical; the channel-to-channel delay match is critical for half-bridge timing - a 10 ns mismatch at 100 kHz equals 1% duty-cycle error, which can cause thermal imbalance in the power stage. Always reference the manufacturer datasheet timing specifications rather than relying on the typical value alone.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Infineon product page. Reinforced isolation certified to IEC 60747-17 / VDE 0884-11. Not AEC-Q100 qualified; for automotive isolated gate drive refer to Infineon's automotive-grade EiceDRIVER catalog. Halogen-free per JEDEC JS709B.

Data verified on: 2026-09-15 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Infineon 2EDR7259XXUMA1 2EDR7259X 2EDB7259KXUMA1 2EDR8258XXUMA1 1ED020I12B2XUMA1 1ED3124MC12HXUMA1 2EP130RXTMA1 EiceDRIVER isolated gate driver magnetic isolation coreless transformer IGBT Si MOSFET SiC MOSFET half-bridge totem-pole PFC PG-DSO-14 narrow body SOIC 5700 Vrms reinforced isolation IEC 60747-17 VDE 0884-11 CMTI bootstrap supply UVLO Miller plateau
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