EPF8820ATC144-4 - FLEX 8000 FPGA, 672 Cells, 144-TQFP | Intel
MPN: EPF8820ATC144-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14.05 | $1,405.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $11.1 | $11,100.00 |
Drop-in alternatives for EPF8820ATC144-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF8820ATC144-3N
✅ Drop-In✓ In Stock
$10.4 / Unit
View Datasheet →EPF8820ATC144-2N
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EPF8820ATC144-1
✅ Drop-In✓ In Stock
$15.95 / Unit
View Datasheet →EPF8636ATC144-4
✅ Drop-In📋 Reference alternative (not in catalog)
EPF8452ATC100-4N
✅ Drop-In✓ In Stock
$7.1 / Unit
View Datasheet →EPF8820ATC144-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements / Cells | 672 |
| Logic Array Blocks (LABs) | 84 |
| Equivalent Gates | 8000 |
| Number of I/Os | 112 |
| Number of Gates | 8000 |
| Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Core Supply Voltage (VCCINT) | 5 V |
| I/O Voltage (VCCIO) | 3.3 V or 5.0 V (MultiVolt) |
| Package | 144-pin TQFP (LFQFP, gull-wing) |
| Speed Grade | -4 |
| Configuration Method | SRAM, serial/parallel PROM (EPC1/EPC1064/EPC1213/EPC1441) |
| Operating Temperature | Commercial (0°C to +70°C) |
| Mounting Type | Surface Mount |
EPF8820ATC144-4 144-pin tqfp (lfqfp, gull-wing) Pin Configuration Guide
Complete pinout information for EPF8820ATC144-4 (144-pin tqfp (lfqfp, gull-wing) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ATC144-4.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8820ATC144-4 is suitable for 6 applications: Legacy Industrial Control Glue Logic, Telecommunications Interface Bridging, Test and Measurement Instrumentation, Educational and Prototyping Platforms, Legacy Avionics and Defense Subsystems, Automotive Body Electronics (Legacy Systems).
Legacy Industrial Control Glue Logic
The EPF8820ATC144-4 fits legacy industrial control glue logic because its 672 logic elements provide sufficient capacity for state-machine and bus-bridging functions commonly required in PLC backplanes and motor-control I/O modules. Its 5 V VCCINT and 5 V tolerant I/O allow direct connection to legacy 5 V sensor and actuator buses (e.g., TTL, HCT logic) without level translation, and the 144-pin TQFP footprint integrates cleanly with surface-mount control boards. MultiVolt I/O also enables 3.3 V communication with newer microcontrollers. Engineers should consider the obsolete lifecycle status and source from distributor stock only.
Recommended
Telecommunications Interface Bridging
The EPF8820ATC144-4 is suited for telecommunications interface bridging because its 84 LABs deliver enough logic density to implement multi-protocol bridges (e.g., UART-to-HDLC, TDM-to-parallel) in legacy telecom shelves. The 112 user I/O pins allow direct attachment of parallel bus interfaces, and the 5 V core supply matches older telecom backplanes. Configuration via EPC1 or EPC1441 serial PROM enables field-upgradable firmware in central-office equipment, and the IEEE 1149.1 JTAG interface simplifies board-level boundary-scan testing during manufacturing.
Recommended
Test and Measurement Instrumentation
The EPF8820ATC144-4 fits test and measurement instrumentation because its SRAM-based re-programmability allows on-the-fly logic updates during instrument calibration and test-pattern generation. The 672 logic elements support parallel pattern generators and counter/timer functions commonly used in benchtop instruments, while the 112 user I/O pins accommodate multi-channel data acquisition. The 5 V VCCINT simplifies power tree design in legacy instruments, and the JTAG boundary-scan port enables in-system programming and fault diagnosis during production test.
Recommended
Educational and Prototyping Platforms
The EPF8820ATC144-4 is well-suited for educational and prototyping platforms because its FLEX 8000 architecture is well-documented in academic textbooks and Altera legacy training materials, making it ideal for FPGA fundamentals coursework. The 672 logic elements provide enough capacity to implement representative designs such as UARTs, FIFOs, and small CPUs, and the 5 V supply allows direct connection to breadboard-friendly 5 V peripherals. The MAX+PLUS II and Quartus legacy design tools support the FLEX 8000 family, enabling student projects without licensing cost for non-commercial use.
Recommended
Legacy Avionics and Defense Subsystems
The EPF8820ATC144-4 fits legacy avionics and defense subsystems because the FLEX 8000 family is on long-term military and aerospace approved-vendor lists (AVL) where redesign qualification is prohibitively expensive. Its 5 V tolerance, 144-pin TQFP packaging, and proven in-service reliability over decades make it suitable for sustainment programs where form-fit-function replacement is mandatory. Re-programmability via SRAM supports mission-specific configuration loads, while the ruggedized TQFP-144 package withstands standard MIL-STD-810 vibration and thermal cycling profiles when properly mounted.
Recommended
Automotive Body Electronics (Legacy Systems)
The EPF8820ATC144-4 fits legacy automotive body electronics because its 5 V I/O capability interfaces directly with 12 V automotive buses through conventional level shifters, and its 672 logic elements support typical body-control functions (lighting controllers, wiper logic, seat controllers). The 144-pin TQFP package is automotive-assembly compatible with standard SMT lines. Engineers should note that this part is not AEC-Q100 qualified; new designs targeting automotive applications should consider modern MAX V or Cyclone devices with proper AEC-Q100 compliance.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ATC144-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ATC144-3N | EPF8820ATC144-2N | EPF8820ATC144-1 | EPF8636ATC144-4 | EPF8452ATC100-4N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 100-pin TQFP (different) |
| Logic Elements | 672 | 672 | 672 | 672 | 576 | 452 |
| LABs | 84 | 84 | 84 | 84 | 72 | 56 |
| User I/O | 112 | 112 | 112 | 112 | 112 | 68 |
| Speed Grade | -4 | -3 | -2 | -1 | -4 | -4 |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM |
Key Differentiators
- Fastest speed grade (-4) in the EPF8820ATC144 family (vs EPF8820ATC144-3N)
- Highest logic density within the FLEX 8000 family (vs EPF8636ATC144-4)
- 5 V core supply compatibility with legacy 5 V systems (vs EPF8452ATC100-4N)
Design Notes
The EPF8820ATC144-4 requires a stable 5 V VCCINT supply with adequate decoupling: place a 100 µF bulk capacitor near the device plus 0.1 µF ceramic capacitors on every VCC pin pair. VCCIO can be independently set to 3.3 V or 5.0 V to support MultiVolt I/O interfacing; both rails must be present at power-up before configuration begins. The SRAM configuration cells are volatile, so all configuration data must be reloaded after each power cycle.
Do not attempt to use the EPF8820ATC144-4 with the latest Quartus Prime Pro Edition; the FLEX 8000 family is only supported by MAX+PLUS II (legacy) and Quartus II versions up to 13.0. Modern design flows cannot target this part. Additionally, be aware that the JTAG instruction register length and BSDL file must match the specific 84 LAB / 672 LE density, not generic FLEX 8000 templates.
The 144-pin TQFP package has 0.5 mm lead pitch requiring careful PCB layout: keep signal traces within the pad, use solder mask defined (SMD) pads for improved joint reliability, and ensure a uniform thermal copper pour beneath the package to dissipate the 5 V core power dissipation. Lead-free reflow profiles are available, but verify specific solder composition since some FLEX 8000 lots used SnPb finish. The package body is 20 mm × 20 mm with a 1.6 mm maximum height.
Estimated: At 125 MHz worst-case toggle activity across all 672 logic elements, internal power dissipation may reach 1.5 W-2.0 W; ensure the PCB thermal design provides adequate heat spreading. The 144-pin TQFP has no exposed thermal pad, so all cooling must be via the gull-wing leads and PCB copper. Input values used: 5 V VCCINT × estimated ICC (~400 mA worst-case) = ~2.0 W. Verify with actual ICC measurement in your specific design.
Compliance Information
FLEX 8000 family predates broad RoHS adoption; specific lot compliance varies. Not AEC-Q100 qualified. Lifecycle status obsolete per FLEX 8000 family EOL announcements.
