H5AN4G6NBJR-PBC - 4Gb DDR4 SDRAM 256Mx16 FBGA-96 | SK hynix
MPN: H5AN4G6NBJR-PBC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.1 | $8.10 |
| 10 | $7.8 | $78.00 |
| 100 | $7.4 | $740.00 |
| 500 | $7 | $3,500.00 |
| 1,000 | $6.6 | $6,600.00 |
Drop-in alternatives for H5AN4G6NBJR-PBC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5AN4G6NBJR-UHC
✅ Drop-In✓ In Stock
$8.09 / Unit
View Datasheet →H5AN4G6NBJR-VKC
✅ Drop-In✓ In Stock
$12.96 / Unit
View Datasheet →H5AN4G6NBJR-UHI
✅ Drop-In📋 Reference alternative (not in catalog)
K4A4G165WD-BCRC
✅ Drop-In✓ In Stock
$5.1 / Unit
View Datasheet →MT40A256M16GE-083E
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →H5AN4G6NBJR-PBC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Density | 4 Gbit |
| Organization | 256M x 16 (268435456 words x 16 bits) |
| Supply Voltage (VDD) | 1.2 V |
| Interface | DDR4 (double data rate, synchronous) |
| Package Code | TFBGA |
| Package | FBGA-96 (PBGA96), rectangular |
| Number of Terminals | 96 |
| Mounting Type | Surface Mount |
| Features | Auto self-refresh, data mask, asynchronous reset, dynamic ODT, ZQ calibration, write leveling, CRC |
| Process | CMOS |
| Lead-Free / Halogen-Free | Yes (per family datasheet, Lead-Free & Halogen-Free) |
| Temperature Grade | OTHER (per distributor listing) |
H5AN4G6NBJR-PBC fbga-96 (pbga96), rectangular Pin Configuration Guide
Complete pinout information for H5AN4G6NBJR-PBC (fbga-96 (pbga96), rectangular package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5AN4G6NBJR-PBC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5AN4G6NBJR-PBC is suitable for 6 applications: Embedded System Main Memory, Industrial Controllers and PLCs, Networking and Communication Equipment, Computing Modules and SODIMM-style Boards, Data Logging and Embedded Storage Systems, Automotive-adjacent and Rugged Embedded Systems.
Embedded System Main Memory
The H5AN4G6NBJR-PBC serves as main system memory in embedded processors and SoCs with DDR4 controllers. Its 4Gb density in a single 256M x 16 chip allows a single-device 512MB-class memory subsystem, and two devices back-to-back yield a 32-bit / 1GB bus without a multi-chip module. The 1.2V DDR4 interface cuts memory power roughly 20% versus DDR3, which matters in fanless embedded boxes. Dynamic ODT and ZQ calibration simplify termination networks on point-to-point or lightly loaded buses. Place the DRAM within matched-length range of the controller, use a 2-layer reference plane stackup for the data bus, and follow the controller's DDR4 layout guide for fly-by vs. point-to-point routing to meet eye masks at the target data rate.
Recommended
Industrial Controllers and PLCs
Industrial controllers require large, high-bandwidth working memory for motion planning, protocol stacks, and HMI buffering. The H5AN4G6NBJR-PBC's 4Gb x16 DDR4 organization provides 512MB per device with JEDEC-standard interface compatibility across vendors, easing second-sourcing on long-lifetime industrial BOMs. Auto self-refresh and the asynchronous reset function support clean recovery after brownout events common on factory floors. The FBGA-96 package withstands reflow and vibration better than edge-connector DIMM solutions when soldered directly to the control board. Design for wide operating temperature margins by verifying junction temperature under worst-case self-refresh and active current, and add copper pour under the ball array to spread heat into the PCB.
Recommended
Networking and Communication Equipment
Routers, switches, and industrial gateways buffer packets in DDR4 working memory. The H5AN4G6NBJR-PBC's DDR4 bank-group architecture enables multiple open banks for sustained random-access throughput suited to packet buffering and table lookups. The data mask function simplifies partial writes common in buffer management, and CRC features aid link reliability in systems with ECC-capable controllers. A single x16 device serves cost-sensitive edge equipment; multiple devices scale bandwidth for aggregation hardware. Use fly-by clock routing with per-byte dynamic termination when multiple devices share a bus, and follow the SK hynix datasheet termination scheme for VTT generation with a sink-source LDO sized for transient currents at the target data rate.
Recommended
Computing Modules and SODIMM-style Boards
Computer-on-modules and single-board computers populate the H5AN4G6NBJR-PBC directly on the module PCB to implement soldered-down (non-removable) memory, improving vibration reliability and reducing height versus socketed DIMMs. The 256M x 16 organization allows two or four devices to build 32-bit or 64-bit buses with 1GB to 2GB capacity, typical for ARM-based and x86 embedded modules. JEDEC-standard DDR4 ball mapping preserves interchangeability with Samsung and Micron 4Gb x16 parts, important for module makers managing supply risk. Power design should budget the DRAM core and termination current separately, using a dedicated VTT rail; spread thermal loading with internal copper planes because the BGA dissipates heat into the board.
Recommended
Data Logging and Embedded Storage Systems
High-speed data acquisition and logging systems use the H5AN4G6NBJR-PBC as a write buffer between sensors and non-volatile storage. The 4Gb density provides hundreds of megabytes of circular buffering, absorbing burst data rates from ADC arrays or camera interfaces while slower flash writes proceed in the background. DDR4's double-data-rate transfers at the controller clock sustain the streaming throughput, and the data mask function enables efficient buffer management. Use self-refresh during idle periods to cut power in battery-powered loggers. Buffer sizing should account for worst-case flash program latency; size the DDR4 write budget so a full erase-block stall never overruns available memory, and add CRC if the controller supports it.
Recommended
Automotive-adjacent and Rugged Embedded Systems
Rugged embedded platforms - telematics, test instrumentation, and vehicle-mounted gateways - use soldered DDR4 such as the H5AN4G6NBJR-PBC because BGA attachment resists shock and vibration far better than socketed memory. The -I industrial temperature suffix within the same family (H5AN4G6NBJR-xxI) is the drop-in choice when -40C cold-crank or extended ambient requirements apply; the -C grade suits cabin and protected environments. Confirm derating of refresh rate at high temperature per the datasheet (1x to 2x refresh) and budget the associated bandwidth loss. Layout should prioritize impedance control and reference-plane continuity over flexibility routing, and underfill may be specified for severe vibration profiles.
Recommended
Recommended Products Summary
Engineering reference data for H5AN4G6NBJR-PBC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5AN4G6NBJR-UHC | H5AN4G6NBJR-VKC | K4A4G165WD-BCRC | MT40A256M16GE-083E |
|---|---|---|---|---|---|
| Package | FBGA-96 (TFBGA) | FBGA-96 - same | FBGA-96 (PBGA96) - same | FBGA-96 - same (JEDEC map) | FBGA-96 - same (JEDEC map) |
| Brand | SK hynix | SK hynix | SK hynix | Samsung | Micron Technology |
| Density / Organization | 4Gb / 256M x 16 | 4Gb / 256M x 16 | 4Gb / 256M x 16 | 4Gb / 256M x 16 | 4Gb / 256M x 16 |
| Interface / VDD | DDR4 / 1.2 V | DDR4 / 1.2 V | DDR4 / 1.2 V | DDR4 / 1.2 V | DDR4 / 1.2 V |
| Speed Grade | [DATA_NEEDED] | UH speed bin | VK speed bin (faster) | 2133 MHz bin (PC4-17000) | 2133 MHz bin |
| Key Features | Auto self-refresh, DQM, async reset, dynamic ODT, ZQ cal, write leveling, CRC | Same family feature set; -40C to +95C self-refresh support | Same family feature set, higher speed bin | Standard DDR4 feature set | Standard DDR4 feature set |
| Reference Price (qty 1) | [DATA_NEEDED] | ~$8.09 - $9.74 (LCSC, as of 2026-09-04) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Primary Use Case Fit | Embedded/industrial main memory at PBC speed bin | Same, when UH bin timing suffices | Higher-bandwidth designs | Second-source for Samsung-approved BOMs | Second-source for Micron-approved BOMs |
Key Differentiators
- Higher-bandwidth speed bin option available in same footprint (vs H5AN4G6NBJR-VKC)
- Wider temperature self-refresh support in sibling part (vs H5AN4G6NBJR-UHC)
- Vendor-locked JEDEC compatibility enables cross-brand second sourcing (vs K4A4G165WD-BCRC)
Design Notes
DDR4 at speed requires controlled-impedance routing (40 ohm single-ended typical) and length matching: keep data-byte skew within the controller spec (commonly +/-10 ps class) and address/command fly-by routing with per-DIMM-style termination for multi-device buses. For a point-to-point single-chip design, dynamic ODT and ZQ calibration (external 240-ohm 1% RZQ resistor) handle most termination, but still maintain a continuous reference plane under all data traces. Run IBIS-simulation of the eye diagram before committing the PCB stackup.
Budget three rails per JEDEC DDR4: VDD 1.2V (core), VPP 2.5V (wordline pump), and VTT 0.6V termination rail. Estimated: for a single x16 device with 8 data DQ signals terminating at 40 ohm effective, VTT transient currents can reach several hundred milliamps; use a dedicated sink-source VTT LDO with bulk capacitance near the DRAM. Do not share VTT with other analog loads - termination noise coupling corrupts setup/hold margins.
Verify speed-grade matching before substitution: -PBC, -UHC, and -VKC bins differ in supported data rate and CAS latency, and the controller's memory-training tables are vendor- and bin-specific. Also confirm refresh requirements at elevated temperature (2x refresh above 85C per JEDEC practice) when using -C grade parts near the top of range. Finally, when swapping to Samsung or Micron equivalents, re-run controller read/write training because DRAM vendor timing tables and ODT settings are not bit-identical.
Compliance Information
Family datasheet title identifies H5AN4G6NBJR-xxC parts as Lead-Free & Halogen-Free. REACH and conflict-minerals statements not found in provided data.
