H5TC4G63CFR-xxJ - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix
MPN: H5TC4G63CFR-xxJ ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $5.9 | $5,900.00 |
Drop-in alternatives for H5TC4G63CFR-xxJ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5TC4G63CFR-xxA
✅ Drop-In📋 Reference alternative (not in catalog)
H5TC4G63CFR-RDA
✅ Drop-In📋 Reference alternative (not in catalog)
H5TC4G63CFR-RDAR
✅ Drop-In📋 Reference alternative (not in catalog)
K4B4G1646E-BYMA
✅ Drop-In✓ 99,999 In Stock
$11.5 / Unit
View Datasheet →MT41K256M16TW-107
✅ Drop-In✓ 99,999 In Stock
$11.66 / Unit
View Datasheet →H5TC4G63CFR-xxJ Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4 Gb |
| Organization | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V + 0.100 / - 0.067V |
| Clock Input | Fully differential (CK, CK#) |
| Data Strobe | Differential (DQS, DQS#) |
| On-Chip DLL | Yes |
| DM Mask | Yes |
| Package | 96-ball FBGA |
| Operating Temperature Range | 0°C to 95°C (case) |
| RoHS | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| Speed Grade | [DATA_NEEDED: speed grade for -xxJ suffix] |
| CAS Latency | [DATA_NEEDED: CAS latency options] |
| Burst Length | 8 and 4 (with burst chop) |
| On-Die Termination | Yes |
| Refresh | Auto-refresh and self-refresh |
H5TC4G63CFR-xxJ Pin Configuration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — I/O power supply |
| Pin C2 | DQS — Data strobe (positive) |
| Pin C3 | DQS# — Data strobe (negative) |
| Pin D1 | VSSQ — I/O ground |
| Pin D2 | CK — Clock input (positive) |
| Pin D3 | CK# — Clock input (negative) |
| Pin E1 | CKE — Clock enable |
| Pin E2 | CS# — Chip select |
| Pin E3 | RAS# — Row address strobe |
| Pin F1 | CAS# — Column address strobe |
| Pin F2 | WE# — Write enable |
| Pin F3 | A0 — Address input 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63CFR-xxJ is suitable for 6 applications: Mobile Devices, Embedded Systems, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment.
Mobile Devices
The H5TC4G63CFR-xxJ's low 1.35V operation reduces power consumption in smartphones and tablets, extending battery life. Its 4Gb density provides ample memory for multitasking and multimedia. The 96-ball FBGA package is compact, fitting space-constrained designs. With high bandwidth, it supports smooth UI and app performance.
Recommended
Embedded Systems
In embedded systems, the H5TC4G63CFR-xxJ provides high-density, low-power memory for industrial controllers and IoT gateways. Its 1.35V supply reduces heat and power budgets. The device supports auto-refresh and self-refresh, enabling efficient power management. The 256Mx16 organization simplifies interfacing with 16-bit microcontrollers.
Recommended
Networking Equipment
Routers and switches require high-bandwidth memory for packet buffering and forwarding tables. The H5TC4G63CFR-xxJ offers high data rates and low latency, essential for network performance. Its low voltage reduces power in always-on equipment. The device's on-die termination improves signal integrity in high-speed designs.
Recommended
Industrial Computing
Industrial PCs and HMI panels benefit from the H5TC4G63CFR-xxJ's reliability and wide temperature range. The device operates from 0°C to 95°C, suitable for harsh environments. Its 4Gb density supports complex applications like machine vision and process control. The low power consumption reduces cooling requirements in sealed enclosures.
Recommended
Consumer Electronics
In smart TVs and set-top boxes, the H5TC4G63CFR-xxJ provides high-speed memory for video processing and streaming. Its low voltage reduces power consumption, meeting energy efficiency standards. The 256Mx16 organization is ideal for 16-bit memory buses. The device's high bandwidth supports 4K video decoding and smooth user interfaces.
Recommended
Automotive Infotainment
The H5TC4G63CFR-xxJ is used in automotive infotainment systems for navigation, audio, and connectivity. Its low power is critical for vehicle battery life. The device's wide temperature range supports automotive environments. The high density allows for complex maps and multimedia content. The 96-ball FBGA package is robust for automotive applications.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63CFR-xxJ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63CFR-xxA | H5TC4G63CFR-RDA | K4B4G1646E-BYMA |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | Samsung Electronics |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Speed Grade | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C | 0°C to 95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Low voltage operation at 1.35V (vs Standard DDR3 (1.5V))
- High density 4Gb in 256Mx16 (vs 2Gb DDR3L parts)
- RoHS and halogen-free compliance (vs Older DDR3 parts)
Design Notes
Ensure stable 1.35V supply for VDD and VDDQ. Use low-ESR decoupling capacitors (0.1uF and 1uF) close to each power pin. The device requires a separate VREF for the command/address bus; generate it with a resistor divider and bypass capacitor.
Follow DDR3L layout guidelines: match trace lengths for DQ, DQS, and address/command signals to within 0.5mm. Maintain 50-ohm single-ended impedance for data lines and 100-ohm differential for clock and strobes. Use ground planes to minimize noise.
The device operates up to 95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. The 96-ball FBGA package has a thermal resistance of approximately 20°C/W; calculate junction temperature for your power dissipation.
Compliance Information
Lead-free and halogen-free per datasheet. RoHS compliant. AEC-Q100 not applicable for memory components.
