H5TC4G63CFR-xxL - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix
MPN: H5TC4G63CFR-xxL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.2 | $720.00 |
| 500 | $6.8 | $3,400.00 |
| 1,000 | $6.5 | $6,500.00 |
Drop-in alternatives for H5TC4G63CFR-xxL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5TC4G63CFR-xxA
✅ Drop-In📋 Reference alternative (not in catalog)
H5TC4G63CFR-PBA
✅ Drop-In✓ 99,999 In Stock
$6.5 / Unit
View Datasheet →H5TC4G63CFR-RDA
✅ Drop-In📋 Reference alternative (not in catalog)
H5TC4G63CFR-RDAR
✅ Drop-In📋 Reference alternative (not in catalog)
K4B4G1646E-BYMA
✅ Drop-In✓ 99,999 In Stock
$11.5 / Unit
View Datasheet →MT41K256M16TW-107
✅ Drop-In✓ 99,999 In Stock
$11.66 / Unit
View Datasheet →H5TC4G63CFR-xxL Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4Gb |
| Organization | 256M x 16 |
| Supply Voltage | 1.35V |
| Package | 96-pin FBGA |
| Data Rate | [DATA_NEEDED: data rate] |
| CAS Latency | [DATA_NEEDED: CAS latency] |
| Burst Length | 8 (with burst chop) |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] |
| RoHS | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| Mounting Type | Surface Mount |
| Number of Pins | 96 |
| Interface | DDR3L |
H5TC4G63CFR-xxL Pin Configuration
| Pin A0-A14 | Address Inputs — Row/column address inputs |
| Pin BA0-BA2 | Bank Address Inputs — Bank select |
| Pin DQ0-DQ15 | Data I/O — Bidirectional data bus |
| Pin DQS0-DQS1 | Data Strobe — Data strobe for read/write |
| Pin CK, CK# | Clock — Differential clock input |
| Pin CKE | Clock Enable — Enables clock |
| Pin CS# | Chip Select — Selects the device |
| Pin RAS# | Row Address Strobe — Row address latch |
| Pin CAS# | Column Address Strobe — Column address latch |
| Pin WE# | Write Enable — Write enable |
| Pin ODT | On-Die Termination — Termination control |
| Pin VDD | Power Supply — Core power supply (1.35V) |
| Pin VDDQ | I/O Power Supply — I/O power supply (1.35V) |
| Pin VSS | Ground — Ground |
| Pin VSSQ | I/O Ground — I/O ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63CFR-xxL is suitable for 6 applications: Laptop Main Memory, Embedded Systems, Networking Equipment, Industrial Computing, Memory Modules, Consumer Electronics.
Laptop Main Memory
The H5TC4G63CFR-xxL is ideal for laptop main memory due to its 4Gb density and 1.35V low power operation. It provides high bandwidth for multitasking and power efficiency for extended battery life. The 256M x 16 organization supports standard DDR3L memory modules, and the low voltage reduces heat generation, making it suitable for compact laptop designs.
Recommended
Embedded Systems
In embedded systems, the H5TC4G63CFR-xxL provides high-density memory with low power consumption, essential for applications like industrial controllers and IoT gateways. The 1.35V operation reduces power dissipation, and the 96-pin FBGA package is compact for space-constrained designs. The device supports high bandwidth for real-time data processing, and its RoHS compliance meets environmental standards.
Recommended
Networking Equipment
The H5TC4G63CFR-xxL is suitable for networking equipment such as routers and switches, where high bandwidth and low power are critical. The 4Gb density supports large routing tables and packet buffers, while the 1.35V operation reduces power consumption in always-on devices. The device's high-speed interface ensures low latency for data forwarding, and the FBGA package provides good thermal performance.
Recommended
Industrial Computing
For industrial computing, the H5TC4G63CFR-xxL offers reliable memory with low power consumption, suitable for rugged environments. The device operates over a wide temperature range (if specified) and is lead-free, meeting industrial standards. The high bandwidth supports demanding applications like machine vision and process control, and the 96-pin FBGA package ensures robust soldering.
Recommended
Memory Modules
The H5TC4G63CFR-xxL is commonly used in DDR3L memory modules (SO-DIMM, UDIMM) for desktops and servers. Its 4Gb density and x16 organization allow for module capacities of 4GB and higher. The low voltage operation is compatible with DDR3L module specifications, and the device's high bandwidth supports dual-channel configurations for improved performance.
Recommended
Consumer Electronics
In consumer electronics like smart TVs and set-top boxes, the H5TC4G63CFR-xxL provides high-density memory for multimedia processing. The 1.35V operation reduces power consumption, and the high bandwidth supports HD video streaming and gaming. The device's small FBGA package is ideal for slim designs, and its RoHS compliance meets consumer product regulations.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63CFR-xxL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63CFR-xxA | H5TC4G63CFR-PBA | K4B4G1646E-BYMA |
|---|---|---|---|---|
| Package | 96-pin FBGA | 96-pin FBGA | 96-pin FBGA | 96-ball FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | Samsung |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 2133 Mbps |
| CAS Latency | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 15 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Low voltage operation at 1.35V (vs K4B4G1646E-BYMA)
- Lead-free and halogen-free (vs MT41K256M16TW-107)
- Same-brand drop-in availability (vs K4B4G1646E-BYMA)
Design Notes
For DDR3L memory, maintain controlled impedance of 40-50 ohms for data lines and 50-60 ohms for address/control lines. Keep trace lengths matched within 100 mils to ensure signal integrity. Use a solid ground plane and place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin.
The H5TC4G63CFR-xxL operates at 1.35V, which is lower than standard DDR3. Ensure the power supply provides stable 1.35V with low ripple. Use a dedicated voltage regulator for the memory rail and place bulk capacitors (10uF) near the device to handle transient currents.
Although DDR3L consumes less power than DDR3, thermal management is still important. Ensure adequate airflow or a heatsink if the device is used in high-temperature environments. The FBGA package has a thermal resistance of [DATA_NEEDED: theta_JA], so calculate junction temperature to avoid exceeding the maximum rating.
Compliance Information
Lead-free and halogen-free per datasheet. RoHS compliant. No AEC-Q100 qualification for memory components.
