MT40A512M16LY-062E AAT:E - 8Gbit DDR4 SDRAM 1.6GHz | Micron
MPN: MT40A512M16LY-062E AAT:E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.9 | $12.90 |
| 10 | $11.88 | $118.80 |
| 100 | $10.58 | $1,058.00 |
| 500 | $9.85 | $4,925.00 |
| 1,000 | $9.2 | $9,200.00 |
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View Datasheet →MT40A512M16LY-062E AAT:E Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Size | 8 Gbit (1 GB) |
| Memory Organization | 512M x 16 |
| Interface | Parallel |
| Clock Frequency | 1.6 GHz |
| Access Time | 19 ns |
| Supply Voltage | 1.2 V |
| Speed Grade | 062E |
| Package | 96-FBGA (7.5 x 13.5 mm) |
| Mounting Type | Surface Mount |
| Ordering Code Suffix | AAT:E (temperature/package option per Micron code) |
| RoHS Status | Compliant |
| Data Rate Class | DDR4-3200 (062E speed bin) |
MT40A512M16LY-062E AAT:E [data_needed: package max height] Pin Configuration Guide
Complete pinout information for MT40A512M16LY-062E AAT:E ([data_needed: package max height] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package max height] package pinout diagram for MT40A512M16LY-062E AAT:E](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for MT40A512M16LY-062E AAT:E.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT40A512M16LY-062E AAT:E is suitable for 6 applications: Industrial Embedded Controllers, Networking Equipment Memory, Embedded Compute Modules (SoM), Automotive Infotainment and Telematics (non-Q1 designs), Test and Measurement Instrumentation, Consumer and IoT Gateway Platforms.
Industrial Embedded Controllers
Industrial PLCs, edge controllers, and HMI platforms use the MT40A512M16LY-062E as single-device main memory because its 8Gbit (1 GB) density in one x16 device meets the RAM needs of embedded Linux runtimes without a multi-chip memory subsystem. The 1.2V supply keeps dynamic power within the thermal budget of fanless enclosures, and the 062E speed grade provides headroom for SoCs running DDR4-3200 class controllers. Placement between a DDR PMIC and the processor is standard; with 10-layer stackups the 96-FBGA 7.5 x 13.5 mm body fits typical 40-60 mm compute module boards, leaving area for the FPGA or SoC and industrial I/O isolation circuitry.
Recommended
Networking Equipment Memory
Switches, routers, and network interface cards use the MT40A512M16LY-062E for packet-buffer and control-plane memory. The 1.6 GHz clock and 19 ns access time of the 062E speed bin support the bandwidth demanded by line-rate packet processing, while the x16 organization simplifies a single-device layout for control-plane DDR (1 GB) behind the network processor. The parallel DDR4 interface with on-die termination reduces the external termination component count on dense line cards. Designers typically pair two devices for 2 GB using two independent chip selects, keeping the data bus point-to-point per device for best signal integrity at DDR4-3200 class rates.
Recommended
Embedded Compute Modules (SoM)
System-on-module vendors integrate the MT40A512M16LY-062E to deliver 1 GB of DDR4 memory on compact SoMs built around ARM or RISC-V application processors with x16 DDR4 controllers. Using one 96-FBGA device instead of multiple x8 chips reduces BGA assembly cost and simplifies the memory routing layer of the module PCB. The AAT:E ordering option is selected for its package/temperature code per Micron ordering information. On the module, the DRAM connects through length-matched point-to-point traces to the SoC, and capacity scaling from 1 GB to 2 GB is achieved by swapping to the pin-compatible class MT40A1G16KH-062E without redesigning the module outline.
Recommended
Automotive Infotainment and Telematics (non-Q1 designs)
For non-automotive-grade infotainment, aftermarket head units, and telematics evaluation hardware, the MT40A512M16LY-062E provides 1 GB of DDR4 for application processors running navigation and multimedia stacks. The x16 bus matches the memory width of most mid-range infotainment SoCs, and DDR4's 1.2V operation lowers power versus DDR3-based legacy designs, reducing heat inside dashboard enclosures. Note that for production automotive programs requiring AEC-Q100 qualification, designers should instead select Micron's automotive DDR4 variants; the standard commercial part suits development platforms, aftermarket, and industrial-adjacent vehicle applications where automotive qualification is not mandated.
Recommended
Test and Measurement Instrumentation
Bench instruments, data acquisition units, and logic analyzers use the MT40A512M16LY-062E as acquisition memory and as the main memory of embedded Linux-based instrument controllers. The 8Gbit capacity supports deep capture buffers, and the 19 ns access time with DDR4-3200 class bandwidth sustains streaming from front-end ADCs into memory. Because the x16 device is a single package, layout on instrument mainboards can dedicate a clean power island fed by a DDR PMIC with VTT termination, keeping switching noise from analog front ends isolated. Long-term availability matters here; Micron DDR4 is an active product line, supporting multi-year instrument service commitments.
Recommended
Consumer and IoT Gateway Platforms
Smart gateways, set-top platforms, and AIoT edge boxes pair the MT40A512M16LY-062E with cost-optimized application processors to provide 1 GB of DDR4 running full Linux distributions. The LCSC pricing from about $10.58 at quantity 100 (as of 2026-09-02) keeps the memory BOM line competitive for consumer cost targets, and the single-device x16 design minimizes assembly cost on 4-6 layer consumer PCBs. The 1.2V rail integrates easily with mainstream PMICs bundled with consumer SoCs. Firmware teams typically configure the controller's ODT and drive-strength settings during bring-up calibration to meet signal integrity margins across process and temperature corners.
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Recommended Products Summary
Engineering reference data for MT40A512M16LY-062E AAT:E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT40A512M16AD-062E | MT40A1G16KH-062E | NT5AD512M16C4-JRU | K4A8G165WG-BCWE |
|---|---|---|---|---|---|
| Package | 96-FBGA (7.5 x 13.5 mm) | 96-FBGA - same class | 96-FBGA - same class | 96-FBGA - verify ball map | FBGA (78-ball class DDR4) - verify ball map |
| Brand | Micron Technology | Micron Technology | Micron Technology | Nanya Technology | Samsung Electronics |
| Density | 8 Gbit | 8 Gbit | 16 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 1G x 16 | 512M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | 062E (DDR4-3200 class, 1.6 GHz) | 062E (DDR4-3200 class) | 062E (DDR4-3200 class) | [DATA_NEEDED] | [DATA_NEEDED] |
| Access Time | 19 ns | 19 ns (same speed bin) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Indicative Price (qty 1, as of 2026-09-02) | $12.90 | [DATA_NEEDED] | $20.87 (LCSC) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Full 8Gbit density at DDR4-3200 class speed (vs MT40A256M16LY-062E)
- Lower cost per gigabit than the 16Gbit option (vs MT40A1G16KH-062E)
- Single-source Micron die vs multi-source x16 DDR4 (vs NT5AD512M16C4-JRU)
Design Notes
Route the DDR4 x16 data group (DQ0-DQ15, DQS pair, DM) as matched-length nets with controlled impedance, typically 40-50 ohm single-ended. For a single-device point-to-point topology, per-byte length matching of DQS to its DQ byte is the dominant constraint; keep address/command nets matched to the clock. Refer to Micron's DDR4 layout application notes and your SoC vendor's memory design guide for the exact skew and length rules before releasing the PCB.
Provide VDD and VDDQ at 1.2V from a DDR4-capable PMIC, a VTT termination rail at 0.6V capable of bidirectional current (source and sink), and a VTTREF tracking reference at 0.6V for the controller. Decouple each power ball of the 96-FBGA with at least one 0.1 uF ceramic plus bulk capacitance near the device. Omitting the VTT rail or undersizing its regulator is a common cause of DDR4 marginal timing failures at DDR4-3200 class rates.
Verify the AAT:E ordering-code meaning (temperature/package option) directly in the Micron ordering information table before production, and confirm the exact speed bin timing tables apply to your controller calibration settings. DRAM is a frequent counterfeit target: source only from authorized distributors such as DigiKey, Mouser, Newark, or LCSC. When substituting cross-brand parts (Nanya, Samsung), re-run memory controller calibration at bring-up rather than assuming identical timing parameters.
Compliance Information
RoHS compliance per distributor listings for Micron DDR4 SDRAM. AEC-Q100 qualification not applicable to this standard commercial grade part; Micron offers separate automotive DDR4 variants. Exact REACH/halogen status should be confirmed on the Micron compliance portal.
