NT5CB256M16CP-DII - 4Gb DDR3L SDRAM 256Mx16 | Nanya
MPN: NT5CB256M16CP-DII ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $5.9 | $5,900.00 |
Drop-in alternatives for NT5CB256M16CP-DII — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
NT5CB256M16CP-DIA
✅ Drop-In📋 Reference alternative (not in catalog)
NT5CB256M16DP-DI
✅ Drop-In📋 Reference alternative (not in catalog)
NT5CC256M16CP-DII
✅ Drop-In✓ 99,999 In Stock
$2.3 / Unit
View Datasheet →MT41K256M16TW-107
✅ Drop-In✓ 99,999 In Stock
$11.66 / Unit
View Datasheet →IS43TR16512B-125KBLI
✅ Drop-In📋 Reference alternative (not in catalog)
K4B4G1646E-BYMA
✅ Drop-In✓ 99,999 In Stock
$11.5 / Unit
View Datasheet →NT5CB256M16CP-DII Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4Gb |
| Organization | 256M x 16 |
| Supply Voltage (VDD) | 1.35V (1.283V to 1.45V) |
| I/O Voltage (VDDQ) | 1.35V (1.283V to 1.45V) |
| Data Rate | DDR3L-1600 (PC3L-12800) |
| CAS Latency | CL11 |
| tCK (min) | 1.25 ns |
| Number of Banks | 8 |
| Burst Length | 8, 4 (with burst chop) |
| Interface | SSTL-15 |
| Package | 96-ball FBGA (9mm x 13mm) |
| Operating Temperature Range | -40C to +95C (industrial) |
| Refresh Interval | 7.8us at 85C, 3.9us at 95C |
| RoHS | Compliant |
NT5CB256M16CP-DII Pin Configuration
| Pin A0-A15 | Address Inputs — Row/column address inputs |
| Pin BA0-BA2 | Bank Address Inputs — Select bank for read/write |
| Pin DQ0-DQ15 | Data Input/Output — 16-bit bidirectional data bus |
| Pin RAS# | Row Address Strobe — Latches row address |
| Pin CAS# | Column Address Strobe — Latches column address |
| Pin WE# | Write Enable — Enables write operation |
| Pin CS# | Chip Select — Enables the device |
| Pin CKE | Clock Enable — Enables clock and self-refresh |
| Pin ODT | On-Die Termination — Controls internal termination |
| Pin CK, CK# | Differential Clock — System clock inputs |
| Pin VDD | Core Power Supply — 1.35V supply |
| Pin VDDQ | I/O Power Supply — 1.35V supply for I/O |
| Pin VSS | Ground — Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
NT5CB256M16CP-DII is suitable for 6 applications: Embedded Computing, Networking Equipment, Industrial Automation, Automotive Infotainment, Medical Devices, Test & Measurement.
Embedded Computing
The NT5CB256M16CP-DII provides high-density, low-power memory for embedded processors and SoCs. Its 4Gb capacity and 16-bit interface suit applications like industrial PCs, single-board computers, and IoT gateways. The 1.35V operation reduces power consumption, extending battery life in portable devices. With DDR3L-1600 speed, it delivers sufficient bandwidth for multitasking and data-intensive workloads. The industrial temperature range ensures reliable operation in harsh environments, making it ideal for factory automation and outdoor computing.
Recommended
Networking Equipment
In routers, switches, and network appliances, the NT5CB256M16CP-DII offers the capacity and speed needed for packet buffering and routing tables. Its low voltage helps manage thermal budgets in dense chassis. The 16-bit data bus simplifies PCB routing, and the FBGA package saves board space. The device's reliability and industrial temperature rating make it suitable for 24/7 operation in telecom and data center environments. DDR3L-1600 bandwidth supports high-throughput packet processing without bottlenecks.
Recommended
Industrial Automation
The NT5CB256M16CP-DII is well-suited for PLCs, robotics controllers, and HMI panels. Its industrial temperature range (-40C to +95C) ensures operation in factory floors and outdoor installations. The 4Gb density allows storing large control programs and data logs. Low power consumption reduces heat generation, simplifying thermal design in sealed enclosures. The device's robustness and long lifecycle support industrial applications requiring 10+ year availability.
Recommended
Automotive Infotainment
For automotive infotainment systems, the NT5CB256M16CP-DII provides high-bandwidth memory for navigation, multimedia, and connectivity features. Its 1.35V operation reduces power draw from the vehicle's electrical system. The industrial temperature range covers most automotive cabin environments. The device's compact FBGA package fits space-constrained head units. DDR3L-1600 speed supports smooth video playback and responsive UI. For strict automotive grade, consider the -DIA variant.
Recommended
Medical Devices
In medical imaging, patient monitors, and diagnostic equipment, the NT5CB256M16CP-DII offers reliable, low-power memory. Its industrial temperature range ensures stable operation in clinical environments. The 4Gb capacity supports storing high-resolution images and patient data. Low voltage reduces heat, which is critical for portable devices. The device's long-term availability and RoHS compliance meet medical regulatory requirements. DDR3L-1600 bandwidth enables real-time data processing.
Recommended
Test & Measurement
The NT5CB256M16CP-DII is used in oscilloscopes, logic analyzers, and signal generators for data acquisition and waveform storage. Its high density and speed allow capturing long records at high sample rates. The industrial temperature range supports benchtop and field instruments. Low power consumption is beneficial for battery-operated portable testers. The device's reliability ensures consistent performance in demanding measurement applications.
Recommended
Recommended Products Summary
Engineering reference data for NT5CB256M16CP-DII — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | NT5CB256M16CP-DIA | NT5CB256M16DP-DI | MT41K256M16TW-107 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | DDR3L-1600 | DDR3L-1600 | DDR3L-1600 | DDR3L-1600 |
| CAS Latency | CL11 | CL11 | CL11 | CL11 |
| Temperature Range | -40C to +95C | -40C to +105C (automotive) | -40C to +95C | -40C to +95C |
Key Differentiators
- Industrial temperature range (vs NT5CB256M16CP-DIA)
- Low voltage operation (vs MT41K256M16TW-107)
- Pin compatibility (vs IS43TR16512B-125KBLI)
Design Notes
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for address and data lines to reduce signal integrity issues. Follow the layout guidelines in the Nanya datasheet for DDR3L routing.
The industrial temperature range allows operation up to 95C, but ensure adequate airflow or heatsinking in high-ambient environments. The device's power dissipation depends on operating frequency and load; calculate worst-case power and verify junction temperature stays within limits.
Ensure VDD and VDDQ are within 1.283V to 1.45V. Do not exceed the absolute maximum ratings. Properly terminate the clock and data lines with ODT settings. Verify the mode register programming for correct CAS latency and burst length.
Compliance Information
RoHS and REACH compliant per distributor data. Not AEC-Q100 qualified; use -DIA variant for automotive.
