RTAX250SL-1LG624E - 250K Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250SL-1LG624E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $2950 | $29,500.00 |
| 100 | $2700 | $270,000.00 |
| 500 | $2500 | $1,250,000.00 |
| 1,000 | $2350 | $2,350,000.00 |
Drop-in alternatives for RTAX250SL-1LG624E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
RTAX250SL-1CG624E
✅ Drop-In✓ In Stock
$1 / Unit
View Datasheet →RTAX250SL-1LG624V
✅ Drop-In✓ In Stock
$950 / Unit
View Datasheet →RTAX250SL-1CG624V
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →RTAX250SL-LG624E
✅ Drop-In✓ In Stock
$1000 / Unit
View Datasheet →RTAX250S-LG624E
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →RTAX250SL-CG624E
✅ Drop-In✓ In Stock
$1375 / Unit
View Datasheet →RTAX250SL-1CG624PROTO
✅ Drop-In📋 Reference alternative (not in catalog)
RTAX250SL-1LG624E Maximum Ratings & Electrical Characteristics
| Family | RTAX-SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 250000 |
| Configurable Logic Blocks (CLBs) | 2816 |
| Logic Cells | 4224 |
| Maximum Frequency | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 (fastest) |
| Package | 624-Pin LGA (LG624), ceramic |
| Operating Temperature | -55C to +125C |
| Configuration Type | One-time programmable, live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide routable reset |
| Packaging Option | Box |
| Mounting Type | Surface Mount |
| Target Market | Space flight systems |
RTAX250SL-1LG624E 624-pin lga (lg624), ceramic Pin Configuration Guide
Complete pinout information for RTAX250SL-1LG624E (624-pin lga (lg624), ceramic package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-1LG624E.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-1LG624E is suitable for 6 applications: Spacecraft On-Board Data Handling, Satellite Payload Data Processing, Telemetry, Tracking and Command (TT&C) Interfaces, New Space LEO Constellation Avionics, Instrument Control and Sensor Front Ends, Launch Vehicle and Avionics Bus Bridging.
Spacecraft On-Board Data Handling
The RTAX250SL-1LG624E fits spacecraft OBDH subsystems because its 250K gates and 4224 logic cells provide enough capacity for CCSDS framing, memory management, and housekeeping aggregation, while its live-at-power-up one-time-programmable configuration eliminates the boot-up vulnerability and external configuration flash of SRAM FPGAs - a common single point of failure in orbit. The 624-pin ceramic LGA offers abundant I/O for interfacing Mil-Std-1553, SpaceWire, and UART peripherals, and the -55C to +125C rating covers extreme thermal cycling. Designers typically wrap the fabric in TMR and EDAC soft cores; the 1.5V low-static-power SL die minimizes battery drain during eclipse operations, a decisive advantage over the standard RTAX-S variant.
Recommended
Satellite Payload Data Processing
In Earth-observation and scientific payloads, the RTAX250SL-1LG624E preprocesses sensor streams - framing CCD or IR detector data, applying gain/offset correction, and packetizing for downlink. Its 649 MHz performance ceiling and hierarchical routing on the 0.15 um CMOS process sustain the sustained throughput demanded by high-rate imagers, while embedded SRAM blocks with built-in FIFO control logic buffer data between clock domains without external FIFO chips, saving board area and power. The segmentable clock structure allows independent timing regions for the sensor interface and the formatter logic. Because payload radiation exposure can be severe, the radiation-tolerant qualification and SEU-mitigatable fabric make it preferable to commercial FPGAs in this role.
Recommended
Telemetry, Tracking and Command (TT&C) Interfaces
TT&C modules demand deterministic, always-on logic from the instant of power application - a requirement the RTAX250SL-1LG624E satisfies inherently through live-at-power-up configuration. Designers implement decoders for uplink command formats, encoders for downlink telemetry frames, and watchdog/health-monitoring counters in its 2816 CLBs. The chip-wide routable reset and segmentable clocks support independent safe-mode logic domains, and the ceramic LG624 package withstands launch vibration and vacuum outgassing constraints. The 1.5V core plus low static power keeps the command receiver alive during long cruise phases when only minimal bus power is budgeted, and the one-time-programmable fabric prevents configuration corruption from single-event upsets.
Recommended
New Space LEO Constellation Avionics
Low-Earth-orbit constellations balance radiation robustness against cost and schedule. The RTAX250SL-1LG624E addresses this middle ground: radiation-tolerant antifuse-style fabric that needs no mitigation-heavy configuration scrubbing, 250K gates sufficient for avionics glue logic, attitude-control interfaces, and mode control, and availability of the E (engineering) and PROTO flows for rapid iteration before flight-lot commitment. For constellation programs standardizing on 624-pin layouts across vendor lots, pin-compatible siblings (RTAX250SL-1CG624E, RTAX250SL-1LG624V) provide second-source resilience without PCB respin. Design teams verify functionality on PROTO units, then freeze the identical programming file for flight units, reducing qualification risk and schedule.
Recommended
Instrument Control and Sensor Front Ends
Scientific instruments - spectrometers, particle detectors, star trackers - need deterministic sequencing, precise trigger generation, and high-speed serial-free parallel data capture. The RTAX250SL-1LG624E implements these controller functions with cycle-accurate determinism impossible in software, leveraging 649 MHz-capable fabric and embedded SRAM FIFOs for buffering detector bursts. The wide -55C to +125C operating range accommodates instruments with passively controlled thermal environments, and the hermetic ceramic LGA suppresses moisture-related failure mechanisms seen in plastic packages. Because instrument firmware is fixed at launch, the one-time-programmable nature is a feature rather than a limitation, guaranteeing the tested configuration is exactly what flies.
Recommended
Launch Vehicle and Avionics Bus Bridging
Launch avionics and spacecraft bus bridges require logic that is immune to configuration upset and operates through severe vibration and radiation exposure. The RTAX250SL-1LG624E bridges legacy interfaces (1553, ARINC-style parallel buses, discrete discretes) to modern digital sections within its 4224 logic cells, with deterministic timing supported by the -1 speed grade's shortest propagation delays in the family. Segmentable clocks allow the bridge to run separate timing domains for each interface without external PLL devices, improving reliability. The 624-pin LGA gives enough I/O for full parallel bus widths, and low static power suits battery-backed emergency modes during ascent aborts or safe-hold entry.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-1LG624E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-1CG624E | RTAX250SL-1LG624V | RTAX250S-LG624E | RTAX250SL-1CG624PROTO |
|---|---|---|---|---|---|
| Package | 624-pin LGA (LG624) | 624-pin ceramic LGA (CG624) | 624-pin LGA (LG624) - same | 624-pin LGA (LG624) - same | 624-pin non-hermetic ceramic (CG624) |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells / CLBs | 4224 cells / 2816 CLBs | 4224 / 2816 | 4224 / 2816 | 4224 / 2816 | 4224 / 2816 |
| Speed Grade | -1 (fastest) | -1 (fastest) | -1 (fastest) | -1 (fastest) | PROTO (same timing attributes per datasheet) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Maximum Frequency | 649 MHz | 649 MHz | 649 MHz | 649 MHz | 649 MHz (proto equivalent) |
| Qualification Flow | E (engineering/flight-grade per suffix) | E flow | V (flight) flow | E flow | PROTO (non-flight, non-hermetic) |
| Static Power Optimization | SL (low static power) | SL (low static power) | SL (low static power) | S (standard, higher static power) | SL (low static power) |
Key Differentiators
- Low static power SL die (vs RTAX250S-LG624E)
- Fastest speed grade in family (vs RTAX250SL-LG624E)
- Flight V-flow availability in identical footprint (vs RTAX250SL-1LG624V)
- Live-at-power-up configuration (vs SRAM-based commercial FPGAs)
Design Notes
RTAX-SL devices are one-time programmable: there is no in-orbit or post-production reconfiguration. Complete all timing closure, functional verification, and radiation-mitigation (TMR, EDAC) in Microchip Libero SoC before releasing programming files, and validate on RTAX250SL-1CG624PROTO prototype units or the commercial AX250 equivalent. Never commit flight units to an unproven bitstream - a single masking error consumes a flight part permanently.
Estimated: the SL die draws lower static core current than the standard RTAX-S variant, which matters during eclipse or cruise phases when solar input is absent. Budget I/O power separately using Libero SmartPower with your actual toggle rates - I/O switching on a 624-pin device at high fanout can dominate total power. Provide 1.5V core and I/O rails with sequencing per the datasheet power-up requirements to avoid latchup risk during hot switching.
The 624-pin LGA requires precise land-pattern alignment; use the package drawing in the Microchip RTAX-S/SL datasheet (DS2169) for pad geometry, and design thermal relief through the ceramic package's rated conditions rather than relying on the LGA for heat spreading. Decouple each VCC bank with low-ESR ceramics placed within a few millimeters of the pins, and keep configuration/JTAG nets short and guarded, since they remain the only external programming access for the life of the flight unit.
Compliance Information
Hermetic ceramic space-grade packages typically fall under specific RoHS exemptions, but compliance status was not stated in the provided data. Request certificates of conformance from Microchip for the purchased date code.
