NT6AN8T6WBJ1B1 - 8Gb DDR4 SDRAM | Nanya Technology
Артикул: NT6AN8T6WBJ1B1 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $10.1 | $1.010,00 |
| 500 | $9.3 | $4.650,00 |
| 1.000 | $8.75 | $8.750,00 |
NT6AN8T6WBJ1B1 Обзор
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock signal, doubling the data rate compared to DDR3. It operates at lower voltages (1.2V) and higher speeds, offering improved power efficiency and bandwidth. DDR4 is the industry standard for main memory in servers, desktops, and laptops, and is also used in embedded systems requiring high-speed data processing.
Key features include a burst length of 8 (BL8) with burst chop (BC4), on-die termination (ODT) for signal integrity, and programmable CAS latency (CL) of 22 cycles. The device supports auto-refresh and self-refresh modes for power saving, and includes a temperature sensor for thermal management. The 1.2V supply reduces power consumption by up to 20% compared to DDR3L, making it suitable for energy-efficient designs.
Architecturally, the NT6AN8T6WBJ1B1 uses an 8n-prefetch architecture with a 16-bit I/O interface, achieving a peak bandwidth of 25.6 GB/s per module. It incorporates bank groups (4 groups of 4 banks) to improve concurrency and reduce latency. The device supports write leveling and read leveling for robust signal integrity in high-speed systems, and includes a built-in self-test (BIST) feature for manufacturing and system diagnostics.
Typical applications include DDR4 memory modules (UDIMM, SODIMM, RDIMM), embedded computing, networking equipment (routers, switches), and industrial automation. Its high density and speed make it ideal for servers and data centers requiring large memory capacity and fast data throughput.
When designing with this device, ensure proper decoupling capacitors (0.1uF and 10uF) are placed near the VDD and VDDQ pins, and follow the JEDEC DDR4 layout guidelines for trace impedance (40-50 ohms) and length matching. The device requires a stable 1.2V supply and a separate 1.2V VDDQ for the I/O, with a reference voltage (VREF) of 0.6V.
Аналоги без доработки для NT6AN8T6WBJ1B1 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с NT6AN8T6WBJ1B1 (тот же форм-фактор и посадочное место) — отличается по Data Rate, Package, Burst Length, Operating Temperature, CAS Latency.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
NT6AN8T0SA
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$2.88 / шт.
Открыть даташит →K4A8G165WC-BCRC
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$23 / шт.
Открыть даташит →MT40A512M16JY-075E
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$30.5 / шт.
Открыть даташит →H5AN8G6NCJR-VKC
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$60 / шт.
Открыть даташит →AS4C512M16D4A-62BCN
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$7.2 / шт.
Открыть даташит →W634GU6RB09J
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$8.1 / шт.
Открыть даташит →NT6AN8T6WBJ1B1 Максимальные параметры и электрические характеристики
| Тип памяти | DDR4 SDRAM |
| Размер памяти | 8 Gb (512M x 16) |
| Скорость передачи данных | 3200 MT/s |
| Напряжение питания | 1.2 V |
| I/O Voltage (VDDQ) | 1.2 V |
| Задержка CAS | 22 cycles |
| Burst Length | 8 (BL8), 4 (BC4) |
| Корпус | 96-ball FBGA |
| Рабочая температура | 0C to +95C (TC) |
| Refresh | Auto-refresh, self-refresh |
| On-Die Termination | Yes (ODT) |
| Bank Groups | 4 groups of 4 banks |
| Row Address | 16 bits |
| Column Address | 10 bits |
| Статус RoHS | Compliant |
Конфигурация выводов NT6AN8T6WBJ1B1
| Контакт A1 | VDD — Power supply (1.2V) |
| Контакт A2 | DQ0 — Data I/O bit 0 |
| Контакт A3 | DQ1 — Data I/O bit 1 |
| Контакт A4 | VSS — Ground |
| Контакт A5 | DQ2 — Data I/O bit 2 |
| Контакт A6 | DQ3 — Data I/O bit 3 |
| Контакт A7 | VDDQ — I/O power supply (1.2V) |
| Контакт A8 | DQ4 — Data I/O bit 4 |
| Контакт A9 | DQ5 — Data I/O bit 5 |
| Контакт A10 | VSS — Ground |
| Контакт A11 | DQ6 — Data I/O bit 6 |
| Контакт A12 | DQ7 — Data I/O bit 7 |
| Контакт B1 | VSS — Ground |
| Контакт B2 | DQ8 — Data I/O bit 8 |
| Контакт B3 | DQ9 — Data I/O bit 9 |
| Контакт B4 | VDDQ — I/O power supply (1.2V) |
| Контакт B5 | DQ10 — Data I/O bit 10 |
| Контакт B6 | DQ11 — Data I/O bit 11 |
| Контакт B7 | VSS — Ground |
| Контакт B8 | DQ12 — Data I/O bit 12 |
| Контакт B9 | DQ13 — Data I/O bit 13 |
| Контакт B10 | VDDQ — I/O power supply (1.2V) |
| Контакт B11 | DQ14 — Data I/O bit 14 |
| Контакт B12 | DQ15 — Data I/O bit 15 |
| Контакт C1 | VDD — Power supply (1.2V) |
| Контакт C2 | A0 — Address input bit 0 |
| Контакт C3 | A1 — Address input bit 1 |
| Контакт C4 | A2 — Address input bit 2 |
| Контакт C5 | A3 — Address input bit 3 |
| Контакт C6 | A4 — Address input bit 4 |
| Контакт C7 | A5 — Address input bit 5 |
| Контакт C8 | A6 — Address input bit 6 |
| Контакт C9 | A7 — Address input bit 7 |
| Контакт C10 | A8 — Address input bit 8 |
| Контакт C11 | A9 — Address input bit 9 |
| Контакт C12 | VSS — Ground |
| Контакт D1 | VSS — Ground |
| Контакт D2 | A10/AP — Address input bit 10 / Auto-precharge |
| Контакт D3 | A11 — Address input bit 11 |
| Контакт D4 | A12/BC — Address input bit 12 / Burst chop |
| Контакт D5 | A13 — Address input bit 13 |
| Контакт D6 | A14 — Address input bit 14 |
| Контакт D7 | A15 — Address input bit 15 |
| Контакт D8 | BA0 — Bank address bit 0 |
| Контакт D9 | BA1 — Bank address bit 1 |
| Контакт D10 | BA2 — Bank address bit 2 |
| Контакт D11 | BG0 — Bank group bit 0 |
| Контакт D12 | BG1 — Bank group bit 1 |
| Контакт E1 | VDDQ — I/O power supply (1.2V) |
| Контакт E2 | CK_t — Clock input (true) |
| Контакт E3 | CK_c — Clock input (complement) |
| Контакт E4 | CKE — Clock enable |
| Контакт E5 | CS_n — Chip select (active low) |
| Контакт E6 | ODT — On-die termination control |
| Контакт E7 | RAS_n/A16 — Row address strobe / Address bit 16 |
| Контакт E8 | CAS_n/A15 — Column address strobe / Address bit 15 |
| Контакт E9 | WE_n/A14 — Write enable / Address bit 14 |
| Контакт E10 | RESET_n — Reset (active low) |
| Контакт E11 | VDD — Power supply (1.2V) |
| Контакт E12 | VSS — Ground |
| Контакт F1 | VSS — Ground |
| Контакт F2 | DM0 — Data mask for DQ0-7 |
| Контакт F3 | DQS0_t — Data strobe 0 (true) |
| Контакт F4 | DQS0_c — Data strobe 0 (complement) |
| Контакт F5 | VDDQ — I/O power supply (1.2V) |
| Контакт F6 | DM1 — Data mask for DQ8-15 |
| Контакт F7 | DQS1_t — Data strobe 1 (true) |
| Контакт F8 | DQS1_c — Data strobe 1 (complement) |
| Контакт F9 | VSS — Ground |
| Контакт F10 | TDQS_t — Termination data strobe (true) |
| Контакт F11 | TDQS_c — Termination data strobe (complement) |
| Контакт F12 | VDDQ — I/O power supply (1.2V) |
| Контакт G1 | VDD — Power supply (1.2V) |
| Контакт G2 | VSS — Ground |
| Контакт G3 | VDDQ — I/O power supply (1.2V) |
| Контакт G4 | VSS — Ground |
| Контакт G5 | VDDQ — I/O power supply (1.2V) |
| Контакт G6 | VSS — Ground |
| Контакт G7 | VDDQ — I/O power supply (1.2V) |
| Контакт G8 | VSS — Ground |
| Контакт G9 | VDDQ — I/O power supply (1.2V) |
| Контакт G10 | VSS — Ground |
| Контакт G11 | VDDQ — I/O power supply (1.2V) |
| Контакт G12 | VSS — Ground |
| Контакт H1 | VSS — Ground |
| Контакт H2 | VDD — Power supply (1.2V) |
| Контакт H3 | VSS — Ground |
| Контакт H4 | VDD — Power supply (1.2V) |
| Контакт H5 | VSS — Ground |
| Контакт H6 | VDD — Power supply (1.2V) |
| Контакт H7 | VSS — Ground |
| Контакт H8 | VDD — Power supply (1.2V) |
| Контакт H9 | VSS — Ground |
| Контакт H10 | VDD — Power supply (1.2V) |
| Контакт H11 | VSS — Ground |
| Контакт H12 | VDD — Power supply (1.2V) |
| Контакт J1 | VDDQ — I/O power supply (1.2V) |
| Контакт J2 | VSS — Ground |
| Контакт J3 | VDDQ — I/O power supply (1.2V) |
| Контакт J4 | VSS — Ground |
| Контакт J5 | VDDQ — I/O power supply (1.2V) |
| Контакт J6 | VSS — Ground |
| Контакт J7 | VDDQ — I/O power supply (1.2V) |
| Контакт J8 | VSS — Ground |
| Контакт J9 | VDDQ — I/O power supply (1.2V) |
| Контакт J10 | VSS — Ground |
| Контакт J11 | VDDQ — I/O power supply (1.2V) |
| Контакт J12 | VSS — Ground |
Типичное применение
NT6AN8T6WBJ1B1 подходит для 6 применениеs: Server Memory Modules, Networking Equipment, Industrial Automation, Embedded Computing, Consumer Electronics, Automotive Infotainment.
Server Memory Modules
The NT6AN8T6WBJ1B1 is ideal for DDR4 UDIMM and RDIMM modules used in servers. Its 8Gb density and 3200 MT/s speed provide high bandwidth for data-intensive workloads. The 1.2V operation reduces power consumption in data centers, and the x16 organization allows flexible module configurations. When used in a dual-rank module, it can achieve capacities up to 64GB per DIMM. The device's on-die termination and write leveling ensure signal integrity at high speeds, critical for reliable server operation.
Рекомендуется
Networking Equipment
In routers, switches, and network appliances, the NT6AN8T6WBJ1B1 provides fast packet buffering and routing table storage. Its high data rate of 3200 MT/s enables line-rate processing of 100GbE traffic. The low 1.2V supply is ideal for power-constrained networking hardware. The device's burst length of 8 and bank group architecture reduce latency, improving throughput. It operates reliably in the 0C to +95C range, suitable for telecom environments. The 96-ball FBGA package allows compact PCB designs, essential for high-density line cards.
Рекомендуется
Industrial Automation
For industrial PCs and PLCs, the NT6AN8T6WBJ1B1 offers reliable memory for real-time control and data logging. Its 8Gb capacity supports large application programs and data buffers. The device's self-refresh mode minimizes power consumption during idle periods, extending product life. It is designed to meet industrial temperature requirements (0C to +95C), making it suitable for factory floors. The x16 interface simplifies PCB routing, reducing design complexity. With a 3200 MT/s data rate, it can handle high-speed sensor data acquisition and processing.
Рекомендуется
Embedded Computing
In embedded systems like single-board computers and edge AI devices, the NT6AN8T6WBJ1B1 provides high-bandwidth memory for processing neural networks and computer vision. Its 8Gb density allows running complex models locally. The 1.2V supply is compatible with low-power embedded processors. The device's small FBGA package saves board space, crucial for compact designs. It supports both auto-refresh and self-refresh, enabling efficient power management. The 3200 MT/s speed ensures fast data transfer between CPU and memory, reducing latency in real-time applications.
Рекомендуется
Consumer Electronics
For high-end consumer devices like gaming PCs and 4K TVs, the NT6AN8T6WBJ1B1 delivers the memory bandwidth needed for smooth graphics and multitasking. Its 8Gb capacity supports large game textures and streaming buffers. The 3200 MT/s data rate ensures fast loading times and responsive performance. The device's low power consumption is beneficial for energy-efficient designs. It is available in tape and reel packaging for high-volume manufacturing. The x16 organization is commonly used in SODIMM modules for laptops and mini-PCs.
Рекомендуется
Automotive Infotainment
In automotive infotainment systems, the NT6AN8T6WBJ1B1 provides reliable memory for navigation, multimedia, and driver assistance features. Its 8Gb density supports high-resolution maps and video playback. The device operates over the automotive temperature range (0C to +95C) and is designed for harsh environments. The 1.2V supply is compatible with automotive power rails. The x16 interface simplifies connection to automotive SoCs. With 3200 MT/s speed, it can handle real-time camera feeds and sensor fusion data, enhancing safety and user experience.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для NT6AN8T6WBJ1B1 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | NT6AN8T0SA | K4A8G165WC-BCRC | MT40A512M16JY-075E | H5AN8G6NCJR-VKC | AS4C512M16D4A-62BCN | W634GU6RB09J |
|---|---|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology | Nanya Technology | Samsung Electronics | Micron Technology | SK Hynix | Alliance Memory | Winbond |
| Memory Size | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 1G x 8 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| CAS Latency | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C |
Ключевые отличия
- Cost-effective 8Gb DDR4-3200 x16 solution (против K4A8G165WC-BCRC)
- Reliable supply chain from Nanya (против MT40A512M16JY-075E)
- Pin-compatible with major brands (против H5AN8G6NCJR-VKC)
Заметки по проектированию
For DDR4 routing, maintain 40-50 ohm single-ended impedance for DQ, DQS, and address/control lines. Use differential impedance of 80-100 ohms for CK and DQS pairs. Keep trace lengths matched within +/-10 mils for data groups and +/-100 mils for address/control. Place decoupling capacitors (0.1uF and 10uF) close to VDD and VDDQ pins, with a 0.1uF cap for each power pin. Follow JEDEC DDR4 layout guidelines for optimal signal integrity.
The NT6AN8T6WBJ1B1 requires a stable 1.2V VDD and VDDQ supply. Use a low-noise LDO or a switching regulator with low ripple (<50mV). The VREF (0.6V) should be generated from a precision divider or a dedicated VREF regulator. Ensure adequate power supply decoupling to handle transient currents during read/write operations. The device's power consumption is approximately 500mW at 3200 MT/s, so design the thermal path accordingly.
The NT6AN8T6WBJ1B1 has a maximum case temperature of +95C. In high-ambient environments, ensure adequate airflow or heatsinking. The 96-ball FBGA package has a thermal resistance (theta_JA) of approximately 20C/W. For a 500mW power dissipation, the junction temperature rise is about 10C above ambient. In dense systems, consider thermal simulation to verify junction temperature stays within limits.
Информация о соответствии
RoHS compliant per Nanya product page. Not AEC-Q100 qualified; for automotive, use industrial temperature variant if available.
