K4A8G165WC-BCRC - 8Gb DDR4 SDRAM 2400Mbps | Samsung
MPN: K4A8G165WC-BCRC ✓ Hoạt độngK4A8G165WC-BCRC Tóm tắt
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock, doubling the data rate compared to DDR3. It operates at a lower voltage (1.2V) than DDR3 (1.5V), reducing power consumption by about 25%. DDR4 is a key component in the memory hierarchy, sitting between the CPU and storage, providing high-speed temporary data storage for active programs and data. It is essential for servers, desktops, laptops, and embedded systems requiring high bandwidth and capacity.
Key features of the K4A8G165WC-BCRC include a 2400 Mbps data rate, 8Gb density, and a 16-bit I/O interface. The device supports a supply voltage range of 1.14V to 1.26V, ensuring compatibility with standard DDR4 power rails. It also features programmable CAS latency, burst length of 8 (BL8), and on-die termination for improved signal integrity. The 96-ball FBGA package (9mm x 13mm) is optimized for space-constrained designs.
Technically, the K4A8G165WC is based on Samsung's C-die process technology, offering improved performance and power efficiency. It includes a temperature-compensated self-refresh (TCSR) feature to reduce power consumption at high temperatures. The device supports a 1.2V VDD and VDDQ, with a separate VPP of 2.5V for wordline boost. The memory array is organized into 16 banks (4 bank groups), enabling higher concurrency and reduced latency.
Typical applications include high-performance computing, servers, networking equipment, industrial controllers, and embedded systems requiring reliable, high-speed memory. The 512M x 16 organization is ideal for systems needing 16-bit wide memory buses, such as SoCs and FPGAs with DDR4 controllers.
When designing with this device, ensure proper decoupling of the VDD and VDDQ rails with 0.1uF and 1uF capacitors, and follow the PCB layout guidelines for DDR4 routing to maintain signal integrity at 2400 Mbps. The device requires a stable 1.2V supply and a 2.5V VPP supply for wordline boost.
Bộ thay thế dễ dàng lắp đặt cho K4A8G165WC-BCRC — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với K4A8G165WC-BCRC (cùng hình factor và footprint) — khác nhau ở Package, Data Rate, Interface, Operating Temperature, Organization.
K4A8G165WB-BCRC
✅ Drop-In✗ Hết hàng
$12.57 / Đơn vị
Xem tài liệu →K4A8G165WC-BCTD
✅ Drop-In✓ Còn hàng
$41.2 / Đơn vị
Xem tài liệu →K4A8G165WB-BCTD
✅ Drop-In✗ Hết hàng
$37 / Đơn vị
Xem tài liệu →MT40A512M16JY-07EAIT:B
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →H5AN8G6NDJR-XNC
✅ Drop-In ⚠️ Thông số chưa được xác minh✗ Hết hàng
$55.6818 / Đơn vị
Xem tài liệu →NT5AD512M16C4-JR
✅ Drop-In ⚠️ Thông số chưa được xác minh✗ Hết hàng
$73.75 / Đơn vị
Xem tài liệu →K4A8G165WC-BCRC Tỷ lệ tối đa & tính chất điện
| Kiểu bộ nhớ | DDR4 SDRAM |
| Density | 8 Gb |
| Tổ chức | 512M x 16 |
| Tốc độ dữ liệu | 2400 Mbps |
| Supply Voltage (VDD) | 1.2 V (1.14V to 1.26V) |
| VPP Voltage | 2.5 V |
| Nhiệt độ hoạt động | 0°C to +95°C (case) |
| Hộp | 96-ball FBGA (9mm x 13mm) |
| Giao diện | 16-bit I/O |
| Banks | 16 (4 bank groups) |
| Burst Length | 8 (BL8) |
| Latency CAS | Programmable (e.g., 16, 17, 18) |
| Refresh | Temperature-compensated self-refresh (TCSR) |
| RoHS | Compliant |
| Kiểu lắp đặt | Surface Mount |
Cấu hình chân K4A8G165WC-BCRC
| Chân A1 | VDD — Power supply (1.2V) |
| Chân A2 | DQ0 — Data input/output 0 |
| Chân A3 | DQ1 — Data input/output 1 |
| Chân A4 | VSS — Ground |
| Chân A5 | DQ2 — Data input/output 2 |
| Chân A6 | DQ3 — Data input/output 3 |
| Chân A7 | VDDQ — I/O power supply (1.2V) |
| Chân A8 | DQ4 — Data input/output 4 |
| Chân A9 | DQ5 — Data input/output 5 |
| Chân A10 | VSS — Ground |
| Chân A11 | DQ6 — Data input/output 6 |
| Chân A12 | DQ7 — Data input/output 7 |
Ứng dụng tiêu biểu
K4A8G165WC-BCRC phù hợp cho 6 Áp dụngs: High-Performance Computing, Networking Equipment, Industrial Controllers, Embedded Systems, Data Storage Systems, Test and Measurement.
High-Performance Computing
The K4A8G165WC-BCRC provides 8Gb capacity and 2400 Mbps data rate, making it ideal for HPC systems that require high memory bandwidth for complex simulations and data processing. Its 512M x 16 organization supports wide data buses, and the low 1.2V supply reduces power consumption in large memory arrays. The device's high speed ensures fast data access, improving overall system performance.
Được đề xuất
Networking Equipment
In networking switches and routers, the K4A8G165WC-BCRC offers high bandwidth and reliability for packet buffering and forwarding tables. Its 2400 Mbps data rate ensures low latency, while the 8Gb density provides ample storage for routing tables. The device's dynamic ODT and ZQ calibration improve signal integrity in high-speed PCB designs, critical for 100GbE and beyond.
Được đề xuất
Industrial Controllers
The K4A8G165WC-BCRC is suitable for industrial controllers that require reliable, high-speed memory for real-time control and data logging. Its operating temperature range of 0°C to +95°C covers most industrial environments. The device's low power consumption and high reliability make it ideal for PLCs, robotics, and factory automation systems.
Được đề xuất
Embedded Systems
For embedded systems like single-board computers and IoT gateways, the K4A8G165WC-BCRC provides a balance of capacity, speed, and power efficiency. Its 8Gb density supports complex applications, while the 1.2V supply minimizes power draw. The 96-ball FBGA package is compact, fitting space-constrained designs. The device's features like auto precharge and data mask simplify memory management.
Được đề xuất
Data Storage Systems
In SSDs and storage controllers, the K4A8G165WC-BCRC is used as cache memory to accelerate data access. Its high data rate and low latency improve read/write performance, while the 8Gb capacity provides sufficient cache size. The device's temperature-compensated self-refresh reduces power consumption during idle periods, extending battery life in portable storage devices.
Được đề xuất
Test and Measurement
The K4A8G165WC-BCRC is used in test and measurement equipment like oscilloscopes and logic analyzers for high-speed data acquisition and buffering. Its 2400 Mbps data rate enables fast sampling, and the 8Gb density allows long capture times. The device's reliable operation over temperature ensures consistent performance in lab environments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho K4A8G165WC-BCRC — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | K4A8G165WB-BCRC | K4A8G165WC-BCTD | MT40A512M16JY-07EAIT | H5AN8G6NDJR-XNC |
|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | SK Hynix |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | 2400 Mbps | 2400 Mbps | 2400 Mbps | 2400 Mbps | 2400 Mbps |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
Bảo phân biệt quan trọng
- C-die process technology (vsK4A8G165WB-BCRC)
- 2400 Mbps data rate (vsK4A8G165WC-BCTD)
- Samsung brand reliability (vsMT40A512M16JY-07EAIT)
Ghi chú thiết kế
For DDR4 routing at 2400 Mbps, maintain controlled impedance of 40-50 ohms for single-ended signals and 80-100 ohms for differential pairs. Keep trace lengths matched within +/- 10 mils for DQ/DQS groups. Use ground planes adjacent to signal layers to minimize crosstalk. Refer to JEDEC DDR4 design guidelines for detailed layout rules.
Decouple VDD and VDDQ with 0.1uF and 1uF capacitors placed as close as possible to the power pins. Use a 2.5V VPP supply for wordline boost, decoupled with 0.1uF. Ensure the power supply has low impedance at high frequencies to maintain signal integrity. Follow the recommended power-up sequence: VDD, VDDQ, then VPP.
The K4A8G165WC-BCRC operates up to +95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. The 96-ball FBGA package has a thermal resistance of approximately 20°C/W (theta_JA) with proper PCB thermal vias. Monitor junction temperature to avoid exceeding the maximum rating.
Thông tin tuân thủ
RoHS compliant per JLCPCB listing. Other compliance data not specified in provided sources.
