K4A8G165WC-BCRC - 8Gb DDR4 SDRAM 2400Mbps | Samsung
部品番号: K4A8G165WC-BCRC ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $31.67 | $31.67 |
| 10 | $29.5 | $295.00 |
| 100 | $27.2 | $2,720.00 |
| 500 | $25.1 | $12,550.00 |
| 1,000 | $23 | $23,000.00 |
K4A8G165WC-BCRC 概要
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock, doubling the data rate compared to DDR3. It operates at a lower voltage (1.2V) than DDR3 (1.5V), reducing power consumption by about 25%. DDR4 is a key component in the memory hierarchy, sitting between the CPU and storage, providing high-speed temporary data storage for active programs and data. It is essential for servers, desktops, laptops, and embedded systems requiring high bandwidth and capacity.
Key features of the K4A8G165WC-BCRC include a 2400 Mbps data rate, 8Gb density, and a 16-bit I/O interface. The device supports a supply voltage range of 1.14V to 1.26V, ensuring compatibility with standard DDR4 power rails. It also features programmable CAS latency, burst length of 8 (BL8), and on-die termination for improved signal integrity. The 96-ball FBGA package (9mm x 13mm) is optimized for space-constrained designs.
Technically, the K4A8G165WC is based on Samsung's C-die process technology, offering improved performance and power efficiency. It includes a temperature-compensated self-refresh (TCSR) feature to reduce power consumption at high temperatures. The device supports a 1.2V VDD and VDDQ, with a separate VPP of 2.5V for wordline boost. The memory array is organized into 16 banks (4 bank groups), enabling higher concurrency and reduced latency.
Typical applications include high-performance computing, servers, networking equipment, industrial controllers, and embedded systems requiring reliable, high-speed memory. The 512M x 16 organization is ideal for systems needing 16-bit wide memory buses, such as SoCs and FPGAs with DDR4 controllers.
When designing with this device, ensure proper decoupling of the VDD and VDDQ rails with 0.1uF and 1uF capacitors, and follow the PCB layout guidelines for DDR4 routing to maintain signal integrity at 2400 Mbps. The device requires a stable 1.2V supply and a 2.5V VPP supply for wordline boost.
ドロップイン代替品: K4A8G165WC-BCRC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: K4A8G165WC-BCRC （同一形状・フットプリント） — 相違点: Package, Data Rate, Interface, Operating Temperature, Organization.
クイック比較ツール — 並列比較する代替部品を選択:
K4A8G165WB-BCRC
✅ ドロップイン✓ 在庫あり
$12.57 / 個
データシートを見る →K4A8G165WC-BCTD
✅ ドロップイン✓ 在庫あり
$41.2 / 個
データシートを見る →K4A8G165WB-BCTD
✅ ドロップイン✓ 在庫あり
$37 / 個
データシートを見る →MT40A512M16JY-07EAIT:B
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$8.1 / 個
データシートを見る →H5AN8G6NDJR-XNC
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$55.6818 / 個
データシートを見る →NT5AD512M16C4-JR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$73.75 / 個
データシートを見る →K4A8G165WC-BCRC 最大定格＆電気的特性
| メモリタイプ | DDR4 SDRAM |
| Density | 8 Gb |
| メモリ構成 | 512M x 16 |
| データレート | 2400 Mbps |
| Supply Voltage (VDD) | 1.2 V (1.14V to 1.26V) |
| VPP Voltage | 2.5 V |
| 動作温度 | 0°C to +95°C (case) |
| パッケージ | 96-ball FBGA (9mm x 13mm) |
| インターフェース | 16-bit I/O |
| Banks | 16 (4 bank groups) |
| Burst Length | 8 (BL8) |
| CASレイテンシ | Programmable (e.g., 16, 17, 18) |
| Refresh | Temperature-compensated self-refresh (TCSR) |
| RoHS | Compliant |
| 実装タイプ | Surface Mount |
K4A8G165WC-BCRC ピン構成
| ピン A1 | VDD — Power supply (1.2V) |
| ピン A2 | DQ0 — Data input/output 0 |
| ピン A3 | DQ1 — Data input/output 1 |
| ピン A4 | VSS — Ground |
| ピン A5 | DQ2 — Data input/output 2 |
| ピン A6 | DQ3 — Data input/output 3 |
| ピン A7 | VDDQ — I/O power supply (1.2V) |
| ピン A8 | DQ4 — Data input/output 4 |
| ピン A9 | DQ5 — Data input/output 5 |
| ピン A10 | VSS — Ground |
| ピン A11 | DQ6 — Data input/output 6 |
| ピン A12 | DQ7 — Data input/output 7 |
主な用途
K4A8G165WC-BCRC の用途: 6 件s: High-Performance Computing, Networking Equipment, Industrial Controllers, Embedded Systems, Data Storage Systems, Test and Measurement.
High-Performance Computing
The K4A8G165WC-BCRC provides 8Gb capacity and 2400 Mbps data rate, making it ideal for HPC systems that require high memory bandwidth for complex simulations and data processing. Its 512M x 16 organization supports wide data buses, and the low 1.2V supply reduces power consumption in large memory arrays. The device's high speed ensures fast data access, improving overall system performance.
おすすめ
Networking Equipment
In networking switches and routers, the K4A8G165WC-BCRC offers high bandwidth and reliability for packet buffering and forwarding tables. Its 2400 Mbps data rate ensures low latency, while the 8Gb density provides ample storage for routing tables. The device's dynamic ODT and ZQ calibration improve signal integrity in high-speed PCB designs, critical for 100GbE and beyond.
おすすめ
Industrial Controllers
The K4A8G165WC-BCRC is suitable for industrial controllers that require reliable, high-speed memory for real-time control and data logging. Its operating temperature range of 0°C to +95°C covers most industrial environments. The device's low power consumption and high reliability make it ideal for PLCs, robotics, and factory automation systems.
おすすめ
Embedded Systems
For embedded systems like single-board computers and IoT gateways, the K4A8G165WC-BCRC provides a balance of capacity, speed, and power efficiency. Its 8Gb density supports complex applications, while the 1.2V supply minimizes power draw. The 96-ball FBGA package is compact, fitting space-constrained designs. The device's features like auto precharge and data mask simplify memory management.
おすすめ
Data Storage Systems
In SSDs and storage controllers, the K4A8G165WC-BCRC is used as cache memory to accelerate data access. Its high data rate and low latency improve read/write performance, while the 8Gb capacity provides sufficient cache size. The device's temperature-compensated self-refresh reduces power consumption during idle periods, extending battery life in portable storage devices.
おすすめ
Test and Measurement
The K4A8G165WC-BCRC is used in test and measurement equipment like oscilloscopes and logic analyzers for high-speed data acquisition and buffering. Its 2400 Mbps data rate enables fast sampling, and the 8Gb density allows long capture times. The device's reliable operation over temperature ensures consistent performance in lab environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: K4A8G165WC-BCRC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | K4A8G165WB-BCRC | K4A8G165WC-BCTD | MT40A512M16JY-07EAIT | H5AN8G6NDJR-XNC |
|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | SK Hynix |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | 2400 Mbps | 2400 Mbps | 2400 Mbps | 2400 Mbps | 2400 Mbps |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
主な差別化要因
- C-die process technology （vs K4A8G165WB-BCRC)
- 2400 Mbps data rate （vs K4A8G165WC-BCTD)
- Samsung brand reliability （vs MT40A512M16JY-07EAIT)
設計ノート
For DDR4 routing at 2400 Mbps, maintain controlled impedance of 40-50 ohms for single-ended signals and 80-100 ohms for differential pairs. Keep trace lengths matched within +/- 10 mils for DQ/DQS groups. Use ground planes adjacent to signal layers to minimize crosstalk. Refer to JEDEC DDR4 design guidelines for detailed layout rules.
Decouple VDD and VDDQ with 0.1uF and 1uF capacitors placed as close as possible to the power pins. Use a 2.5V VPP supply for wordline boost, decoupled with 0.1uF. Ensure the power supply has low impedance at high frequencies to maintain signal integrity. Follow the recommended power-up sequence: VDD, VDDQ, then VPP.
The K4A8G165WC-BCRC operates up to +95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. The 96-ball FBGA package has a thermal resistance of approximately 20°C/W (theta_JA) with proper PCB thermal vias. Monitor junction temperature to avoid exceeding the maximum rating.
コンプライアンス情報
RoHS compliant per JLCPCB listing. Other compliance data not specified in provided sources.
