FPGA & CPLD
Products (6352)
M7AFS600-2FGG484I - 600K-Gate Fusion FPGA, 172 I/O | Microchip
The Microchip Technology (Microsemi) M7AFS600-2FGG484I is a Fusion mixed-signal FPGA from the Fusion family with 600K system gates, 172 user I/O, and a 1.5V core supply, housed in a 484-ball FBGA (484-BGA) package with 1.0 mm ball pitch. It integrates an ARM CoreMP7 soft-capable processor architecture support, flash-based configuration fabric built on 130nm technology, and an industrial operating temperature range of -40C to +85C, making it suitable for space-constrained embedded control and mixed-signal system integration. A Fusion FPGA is a flash-based field programmable gate array that combines programmable logic fabric with mixed-signal peripherals such as analog-to-digital conversion, voltage/temperature monitoring, and RTC functionality on a single die. Within the system hierarchy, FPGAs sit between fixed-function ASICs and general-purpose microcontrollers, offering hardware parallelism with in-field reconfigurability. The Fusion family was originally developed by Actel, later Microsemi, and is now sold under the Microchip Technology brand. Key differentiating features include nonvolatile flash programming (no external configuration PROM required at power-up, instant-on operation), live probe/debug capability, and integrated analog subsystem blocks that reduce external component count. The -2 speed grade supports system frequencies up to 1470.59 MHz internal equivalent timing as listed by distributors, and the 484-FBGA footprint provides generous routing escape for the 172 I/O. Technically, the device uses 130nm flash-based fabrication with 110592 bits of distributed resource as reported by DigiKey listing data, plus embedded blocks suitable for soft ARM CoreMP7 processor instantiation. The M7 prefix denotes the military/extended temperature screening variant of the AFS600 Fusion device; the I suffix denotes the industrial -40C to +85C range. Typical applications include industrial automation controllers, medical instrumentation, communications line cards, avionics interfaces, and test equipment, where single-chip integration of logic, analog monitoring, and processing lowers BOM cost and board area. When designing with this part, plan power sequencing around the 1.5V core and 3.3V I/O banks, and verify FBGA reflow profiles per the manufacturer packaging data. This page synthesizes distributor pricing, same-brand drop-in alternatives, and design notes not found in a single manufacturer datasheet.
M7AFS600-FG256 - Fusion FPGA 600K Gates, 119 I/O | Microchip
The Microchip (Microsemi/Actel) M7AFS600-FG256 is a Fusion family mixed-signal FPGA with 600K system gates, 119 user I/O, and 110592 D-type flip-flops, housed in a 256-ball LBGA (FBGA, 17x17x1.7 mm) package operating at a 1.5 V core supply. It integrates an ARM CoreMP7 processor, Flash-based fabric, and analog peripherals such as ADC blocks on a 130 nm process. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. Within the programmable-logic hierarchy, the Fusion family sits in the mixed-signal FPGA class: unlike standard FPGAs, it adds analog building blocks (ADCs, voltage/temperature monitoring) and Flash-based configuration storage, making it a system-on-chip-style power management and control platform. Key features include the embedded ARM CoreMP7 32-bit processor core for soft-control functions, 600K system gates of programmable fabric, 119 user I/O pins brought out on the 256-ball substrate, and integrated analog mixed-signal capability that offloads external supervisory components. Flash-based configuration means the device is instant-on, non-volatile, and inherently more secure against bitstream interception than SRAM FPGAs. Technically, the device is fabricated on a 130 nm Flash process with a 1.5 V core operating supply. The commercial-grade M7AFS600-FG256 is rated for 0 C to +70 C operation; the industrial -40 C to +85 C variant carries the -I suffix (e.g., M7AFS600-FG256I). Per Microsemi documentation, all devices within the same package are pin compatible, which simplifies family migration. Typical applications include power-supply management and board-level monitoring, industrial control and motor supervision, portable instrumentation, and embedded systems requiring an instant-on processor plus FPGA fabric in one die. Design consideration: budget the 1.5 V core rail carefully with adequate decoupling, and verify that the 119 available I/O meet your bank voltage requirements before finalizing the 256-ball footprint. This page synthesizes distributor pricing (as of 2026-09-02), drop-in alternatives within the Fusion/ProASIC3 FG256 ecosystem, and practical design notes not found in the manufacturer datasheet.
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
The Microchip Technology M7AFS600-FG256I is a Fusion mixed-signal FPGA offering 600K system gates, 119 user I/O, and an embedded ARM CoreMP7 processor, housed in a 256-ball FBGA package rated for industrial temperatures of -40C to +85C with a 1.5V core supply. A mixed-signal FPGA is a field-programmable gate array that integrates configurable analog circuitry, flash memory, and programmable digital logic on a single monolithic die. Within the power-management hierarchy of programmable logic devices, Fusion occupies the system-on-chip tier, sitting above pure-digital FPGA families like ProASIC3 by adding analog peripherals and embedded flash. This makes it a predecessor concept to today's mixed-signal programmable SoCs. Key features include flash-based programmable logic that is instant-on and non-volatile (no external configuration PROM required), integrated analog peripherals for monitoring and control, comprehensive on-chip clock generation and management circuitry, and the ARM CoreMP7 soft processor for embedded control. The 130nm flash technology gives the device high design security compared to SRAM FPGAs. Technically, the Fusion family combines large flash memory blocks with the programmable fabric, allowing designers to store firmware and data on-chip. The 119 available I/O support multiple standards, and the industrial-grade M7AFS600-FG256I variant is qualified across the -40C to +85C range, with SMD/SMT mounting in a square LBGA ball-grid-array footprint. Typical applications include industrial control systems, power-supply supervision and telemetry, embedded system integration, and portable instrumentation where analog sensing plus digital control must coexist on one device. A key design consideration is the 1.5V core supply, which requires a clean, regulated power rail and proper decoupling across the 256-ball package. This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
M7AFS600-FG484 - Fusion FPGA 600K Gates, ARM CoreMP7 | Microchip
The Microchip Technology M7AFS600-FG484 is a Fusion mixed-signal field programmable gate array (FPGA) offering 600K system gates, an embedded ARM CoreMP7 processor, 172 user I/Os, and 110592 VersaTiles in a 484-ball FBGA (FG484) package operating from a 1.5V core supply. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks and interconnects that designers configure after manufacturing, sitting within the hierarchy of programmable logic between CPLDs and full ASIC implementations. The Fusion family is unique in being a mixed-signal FPGA platform: it integrates flash-based FPGA fabric with configurable analog blocks, making it an alternative to costly mixed-signal ASIC designs. Key features of the M7AFS600-FG484 include 600K system gates of flash-based fabric, an ARM CoreMP7 soft processor core for embedded control, 172 user I/Os for system interfacing, and 130nm flash technology that retains configuration data in non-volatile memory, eliminating the need for external configuration flash and providing instant-on operation. Technically, the Fusion architecture combines the ProASIC3-style flash fabric with analog peripherals such as the Analog Compute Engine (ACE), RTC, and PLL support, enabling single-chip system management. The 484-ball FBGA measures 23x23x2.44 mm and uses surface-mount assembly. With a maximum operating frequency around 1098.9 MHz per distributor listings, the device targets control-plane and mixed-signal integration tasks. Typical applications include embedded system control, industrial automation, power and fan management, portable instrumentation, and space-constrained mixed-signal designs that benefit from on-chip analog monitoring combined with programmable logic. When designing with this device, note the commercial temperature range of 0C to +70C: for extended-temperature environments, the FG484I variants rated -40C to +100C are the appropriate choice. This page synthesizes distributor pricing, drop-in alternatives within the Fusion family, and practical design notes not found in any single manufacturer datasheet.
M7AFS600-FG484I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip
The Microchip Technology (Microsemi) M7AFS600-FG484I is a Fusion family mixed-signal FPGA offering 600K system gates, up to 172 user I/Os, 110592 bits of embedded Flash configuration memory, and a maximum operating frequency of 1098.9 MHz, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA/FG484) package with industrial temperature rating (I suffix). A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and reconfigurable interconnects that engineers configure in the field, sitting within the broader hierarchy of programmable logic devices: FPGA -> programmable logic IC -> programmable semiconductor. The Fusion family is unusual because it integrates true mixed-signal capability - analog front ends, Flash-based configuration, and digital fabric - on a single 130nm die, reducing board-level component count. Key features include the embedded ARM CoreMP7 soft-capable processor support, Flash-based configuration that is inherently live-at-power-up and resistant to configuration-data theft, 1.5V core supply, and industrial-grade temperature qualification. The 484-ball FBGA exposes the full 172-I/O capability, supporting broad system interconnect in compact footprints. Architecturally, the M7AFS600 is built on 130nm Flash process technology, combining a 600K-gate fabric with embedded analog peripherals. Flash configuration removes the external configuration PROM required by SRAM FPGAs, improving board space, security, and boot behavior. The 1098.9 MHz maximum operating frequency supports high-throughput datapaths and interface bridging. Typical applications include industrial control and automation, instrumentation and test equipment, secure embedded systems, motor drive interfaces, and mixed-signal bridging where analog inputs and FPGA logic must coexist in one device. Design consideration: ball-grid-array packages require controlled-impedance multilayer PCBs; plan power integrity for the 1.5V core rail early, and verify X-ray inspection capability for rework. This page synthesizes distributor pricing, drop-in same-package alternatives, application guidance, and design notes not found in the manufacturer datasheet, with pricing data as of 2026-09-02.
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
The Microchip Technology M7AFS600-FGG256 is a Fusion family mixed-signal field programmable gate array (FPGA) with 600K system gates, 119 user I/Os, and an embedded ARM CoreMP7 processor, housed in a 256-ball fine-pitch Ball Grid Array (FBGA/LBGA) package operating from a 1.5V core supply. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks and programmable interconnects that the designer wires together after manufacturing. The Fusion family extends this concept to mixed-signal system-on-chip integration, combining flash-based programmable logic, configurable analog blocks, large flash memory, and comprehensive clock management circuitry in a single monolithic die, sitting within the broader hierarchy of programmable logic devices alongside CPLDs and ASICs. Key features of the M7AFS600 include 110592 flip-flops of register capacity, 130nm flash-based process technology, and an integrated ARM CoreMP7 hard processor core running at up to 1098.9 MHz per distributor listings, which distinguishes the M7 series from the standard AFS600 that lacks the ARM core. The flash-based fabric is inherently single-chip, secure, and retains configuration at power-up without external boot PROM, reducing bill-of-materials cost and improving tamper resistance. Architecturally, the Fusion family integrates configurable analog modules for system supervision, power management, and smart battery charging alongside the digital fabric, replacing discrete analog components in space-constrained designs. Clock generation and management circuitry is built in, eliminating external PLL chips in many designs. Typical applications include industrial power management and motor control, smart battery charging systems, portable instrumentation, and embedded control systems requiring a soft mix of analog supervision and digital logic. Designers should note the 16-week lead time reported by Mouser as of 2026-09-02, and plan board layout for the 1mm-pitch 256-ball BGA footprint early in the design cycle. This page synthesizes distributor pricing, drop-in alternatives, comparison data, and design guidance not found in a single manufacturer datasheet.
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
The Microchip Technology M7AFS600-FGG256I is a Fusion mixed-signal FPGA integrating 600K system gates, 119 user I/Os, and an embedded 32-bit ARM CoreMP7 processor in a 256-ball LBGA (FBGA) package. Built on 130nm flash-based process technology, it operates at a 1.5V core voltage and supports system speeds up to approximately 1098.9 MHz as listed by distributor parametric data, in an industrial temperature-grade (I suffix) device. A mixed-signal FPGA is a field-programmable gate array that combines digital programmable logic fabric with analog peripherals on a single monolithic die. Within the power-management and programmable-logic hierarchy, the Fusion family sits as a system-on-chip (SoC) class device: flash-based programmable logic, large flash memory blocks, comprehensive clock generation and management circuitry, and configurable analog modules such as ADCs, voltage/temperature monitors, and current monitors, all integrated without external configuration devices. Key differentiating features include the flash-based fabric, which is inherently non-volatile and instant-on at power-up, unlike SRAM FPGAs that require external configuration flash. The integrated ARM CoreMP7 soft/hard processor core enables single-chip embedded control, while the Fusion analog subsystem (analog-to-digital conversion, on-chip monitoring) reduces board-level component count in power-supply and system-health applications. Architecturally, the device pairs the 130nm flash fabric with flash memory blocks that can serve as on-chip non-volatile storage, and a clock conditioning system with integrated PLLs that generates and manages multiple clock domains. According to the Microchip (formerly Microsemi/Actel) Fusion product page, the family monolithically integrates configurable analog, large flash memory blocks, clock management, and high-performance flash-based programmable logic. Typical applications include industrial system monitoring and control, embedded processing nodes combining an ARM processor with custom logic, smart power-supply supervision with on-die analog sensing, and secure, configuration-immune programmable logic for applications where SRAM reconfiguration attacks are a concern. When designing with this device, plan I/O budgets carefully: the FGG256 package exposes 119 user I/Os versus 172 on the FGG484 variant, so pin planning in Libero SoC software should precede board layout. This page synthesizes distributor data from DigiKey, Mouser, and Octopart, drop-in same-family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
M7AFS600-FGG484 - 600K Gate Fusion FPGA, 484-BGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) M7AFS600-FGG484 is a 600K-system-gate mixed-signal Fusion FPGA with an embedded ARM CoreMP7 processor, fabricated in 130nm flash-based technology, operating at a 1.5V core voltage, and housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) measuring 23 x 23 x 2.44 mm. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that an engineer configures after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices - above CPLDs in capacity and below ASICs in volume economics - and the Fusion family adds a unique mixed-signal analog layer (analog I/O, flash memory, and an ARM hard core) that turns the FPGA into a single-chip system controller. Key features of the M7AFS600-FGG484 include 600,000 system gates of flash-based programmable logic, 172 user I/O pins, an ARM CoreMP7 hard processor core running up to 1098.9 MHz as listed by distributors, and flash fabric that is inherently non-volatile, secure, and immune to configuration-readback - eliminating the need for an external boot flash. Technically, the Fusion family integrates programmable analog circuitry, configurable flash blocks, and the Actel flash-switch fabric process. Because the configuration cell is flash rather than SRAM, the device powers up instantly, draws no configuration current from external memory, and resists cloning - a significant advantage in industrial and defense designs. Typical applications include industrial automation and smart motor control, power management and intelligent system monitoring, portable instrumentation, and embedded single-chip controllers consolidating FPGA logic plus microcontroller functions. Design consideration: the FGG suffix denotes lead-free (Pb-free) solder balls; the drop-in FG variant uses standard balls, so always match the ball metallurgy to your assembly process (RoHS vs leaded reflow). This page synthesizes distributor pricing, pin-compatible same-family drop-in alternatives, design notes, and application guidance not consolidated in the manufacturer datasheet.
M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip
The Microchip Technology M7AFS600-FGG484I is a Fusion family mixed-signal FPGA with 600K system gates, 172 user I/Os, and an embedded ARM CoreMP7 processor, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) with 1.0 mm ball pitch and industrial temperature grade (-40C to +100C, denoted by the I suffix). A mixed-signal FPGA is a field-programmable gate array that integrates analog and digital building blocks on a single die. In the system hierarchy, the AFS600 sits at the FPGA level of programmable logic devices (PLDs), above CPLDs in gate count, and uniquely combines FPGA fabric with microcontroller subsystem (MSS) functions, making it a programmable system-on-chip (SoC) rather than a pure logic device. Key features of the M7AFS600-FGG484I include the ARM7TDMI-compatible CoreMP7 soft processor for embedded control, Flash-based configuration that retains programming through power cycles without external boot memory, and integrated analog peripherals characteristic of the Fusion family. The device operates from a 1.5V core supply with 3.3V-capable I/O banking. DigiKey lists the device as a Fusion FPGA IC with 172 I/O and 484-BGA packaging. Architecturally, the Fusion family fabric is built on Microsemi (formerly Actel) Flash-based architecture, offering high design security because the bitstream is stored on-chip rather than loaded from external Flash at power-up. This also reduces bill-of-materials cost and improves resistance to design cloning compared with SRAM FPGAs. Typical applications include industrial control, instrumentation with mixed analog/digital signal chains, motor and power supervision, medical device control boards, and aerospace/defense prototyping where single-chip programmable integration reduces board area and debug complexity. A key design consideration is BGA soldering and rework: the 484-ball FGG package requires a controlled-impedance multilayer PCB with via-in-pad or doghouse fanout, and X-ray inspection is recommended for assembly qualification. This page synthesizes distributor pricing, drop-in family alternatives, design notes, and procurement guidance not found in the manufacturer datasheet. Pricing is as of 2026-09-02.
RTAX1000S-1LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip
The Microchip Technology RTAX1000S-1LG624V is a radiation-tolerant antifuse FPGA delivering 1,000,000 equivalent system gates with 12096 CLBs, 18144 logic cells, and up to 418 user I/Os, housed in a 624-ball ceramic column grid array (LG624) package. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation and single-event effects encountered in orbital and deep-space environments. Unlike reprogrammable SRAM FPGAs, the RTAX-S family uses nonvolatile antifuse technology, in which permanent interconnects are formed at one-time programming. This eliminates configuration-storage vulnerabilities, gives true live-at-power-up operation, and makes the device a single-chip solution in the power management hierarchy of spacecraft avionics systems. Key features include one-time-programmable antifuse interconnect with no external configuration PROM, up to 540 kbits of embedded SRAM with optional EDAC protection, segmentable clock resources, chip-wide highway routing, and carry logic inherited from the commercial Axcelerator architecture. Total ionizing dose tolerance is 300 krad (functional) and 200 krad (parametric), with SEU rates below 1E-10 errors per bit-day. The CMOS architecture achieves a maximum combinatorial delay of 0.93 ns on the -1 speed grade. Embedded FIFO control logic and dual-port SRAM blocks support on-board data processing, telemetry formatting, and payload signal chains without external memory in many designs. Typical applications include satellite payload processing, spacecraft telemetry and command interfaces, radiation-hardened bus controllers, and Earth-observation instrument data acquisition where live-at-power-up behavior is mandated. Design consideration: because the device is one-time programmable, complete functional simulation and a prototyping pass on the pin-mapped commercial Axcelerator device via Microchip Extender boards or Aldec CG624 adaptor boards are strongly recommended before committing flight parts. This page synthesizes distributor availability data, same-footprint drop-in alternatives, and space-flight design guidance not consolidated on the manufacturer product page.
RTAX1000SL-1CQ352V - 1M-Gate Rad-Tolerant Antifuse FPGA | Microchip
The Microchip Technology (Actel/Microsemi) RTAX1000SL-1CQ352V is a radiation-tolerant, antifuse-based FPGA delivering 1,000,000 equivalent system gates with 12,096 CLBs and 18,144 logic cells, housed in a 352-pin ceramic quad flat pack (CQ352) package with military/space screening per the -V ordering suffix. A radiation-tolerant FPGA is a field-programmable gate array qualified to survive the total ionizing dose (TID) and single-event effect (SEE) environments encountered in space flight. Within the power-management hierarchy of spacecraft avionics, the RTAX-S/SL family sits at the top of Microchip's rad-hard logic portfolio: FPGA -> radiation-tolerant programmable logic -> space-grade IC. Unlike flash- or SRAM-based FPGAs, the RTAX-S/SL family uses antifuse programmable interconnect that is one-time programmed, providing live-at-power-up operation with no external configuration storage required. Key features include 1,000,000 system gates of capacity, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic chains. Because the configuration is locked into the antifuse fabric, the device is immune to configuration upsets that plague SRAM FPGAs, dramatically reducing SEU-driven system-level mitigation overhead. The RTAX1000SL is based on the commercial Axcelerator architecture, so designers can prototype on cost-effective Axcelerator devices and migrate using Microchip's footprint-compatible adaptor board methodology and EDIF netlist/pinout conversion flow described in the RTAX-S/SL datasheet. Typical applications include spacecraft avionics buses, satellite payload data processing, telemetry/command interfaces, and instrument control in low-Earth-orbit and deep-space missions where low power and single-chip form factor matter. A key design consideration: antifuse devices are one-time programmable, so functional verification (simulation and hardware prototyping on Axcelerator equivalents) must be completed before programming flight units. This page synthesizes distributor sourcing data, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
RTAX1000SL-1LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip
The Microchip Technology RTAX1000SL-1LG624V is a radiation-tolerant Field Programmable Gate Array (FPGA) from the RTAX-SL family delivering 1,000,000 equivalent system gates, 18,144 logic cells, and 12,096 CLBs in a 624-pin LG (LGA) package. Built on 0.15 um CMOS process technology at a 1.5V core voltage, it offers a maximum CLB combinatorial delay of 0.93 ns. A radiation-tolerant FPGA is a programmable logic device qualified for space-flight environments, where cosmic rays and trapped-particle radiation would corrupt or destroy commercial FPGAs. The RTAX-SL family sits within the broader hierarchy: FPGA -> radiation-tolerant FPGA -> space-grade programmable logic, and is based on the commercial Actel Axcelerator architecture with anti-fuse one-time-programmable interconnect that is inherently immune to configuration upsets. Key differentiating features include true single-chip operation (no external configuration PROM required), live-at-power-up functionality, low static power consumption, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, and chip-wide highway routing. The one-time-programmable anti-fuse fabric eliminates the need for SEU-sensitive configuration memory, a major system-level advantage in orbit. Architecturally, the device combines combinatorial and sequential logic modules (CLBs) with dedicated embedded SRAM and high-speed interconnect derived from Axcelerator, supporting system performance up to hundreds of MHz while remaining latch-up immune and tolerant to total ionizing dose. Typical applications include satellite payload processing, spacecraft telemetry and command interfaces, orbital instrument control, and spaceflight avionics bus bridges where single-chip, low-power, radiation-tolerant logic is mandatory. Designers should note that anti-fuse programming is irreversible: finalize the design using the footprint-compatible prototyping flow before committing flight units. This page synthesizes verified distributor data, drop-in family alternatives, and design guidance not consolidated in the manufacturer datasheet.
RTAX1000SL-LG624V - Rad-Tolerant FPGA, 1M Gates | Microchip
The Microchip Technology (Microsemi/Actel) RTAX1000SL-LG624V is a radiation-tolerant, antifuse-based field-programmable gate array (FPGA) delivering 1,000,000 equivalent system gates with 12,096 configurable logic blocks (CLBs) in a 624-terminal ceramic column grid array (CGA) package qualified for space-flight environments. A radiation-tolerant FPGA is a semiconductor device designed to operate reliably in the presence of cosmic radiation and solar particle events found in space orbits. Within the semiconductor hierarchy, it belongs to the programmable logic family: FPGA -> programmable logic IC -> digital integrated circuit. Unlike SRAM FPGAs, the RTAX-S/SL family uses antifuse technology, meaning configuration is permanent and non-volatile - the device is live-at-power-up with no external configuration memory required. Key features include single-chip form factor, low-power CMOS operation, built-in FIFO control logic within embedded SRAM blocks, segmentable clock structures, chip-wide highway routing, and dedicated carry logic for arithmetic functions. The related RTAX1000SL-1LG624V speed-grade variant specifies a maximum CLB combinatorial delay of 0.93 ns, indicating the family's high-speed capability. The RTAX-S architecture is based on the commercial Axcelerator device family, providing designers with proven system-level features while adding radiation tolerance through process and design hardening. Designers program the device once, and the antifuse connections retain the design through power cycles and radiation exposure - a critical property for launcher electronics, satellites, and planetary probes. Typical applications include satellite payload processing, spacecraft command and data handling, telemetry and telecommand interfaces, bus controllers, and radiation-exposed instrumentation for low-Earth-orbit and deep-space missions. When designing with this device, plan the power budget around the CMOS static current plus dynamic switching, and use Microchip's Libero SoC design suite with the provided footprint-compatible prototyping flow. This page synthesizes distributor stock listings, family datasheet parameters, drop-in alternative analysis, and practical design notes not consolidated in the manufacturer datasheet alone.
RTAX2000D-1CQ352E - 2M-Gate Rad-Tolerant FPGA CQFP352 | Microchip
The Microchip Technology RTAX2000D-1CQ352E is a 2,000,000-equivalent-gate radiation-tolerant antifuse FPGA organized as 19,712 Configurable Logic Blocks (CLBs), housed in a 352-terminal ceramic quad flat pack (CQFP352) and specified for operation from -55C to +125C. It belongs to the RTAX-S/SL and RTAX-DSP family of high-reliability, nonvolatile antifuse FPGAs designed for space-based applications. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of orbital and deep-space missions, where commercial devices would suffer total ionizing dose (TID) degradation and single-event effects. Within the power-management and processing hierarchy of a spacecraft avionics system, an FPGA such as the RTAX2000D sits between the onboard computer and sensor/interface electronics, implementing glue logic, bus interfaces, and high-throughput datapath functions. Key features include highly reliable nonvolatile antifuse technology, which retains its programmed configuration permanently and eliminates configuration-memory upset, and a DSP-rich architecture with up to 120 DSP mathblocks supporting 125 MHz 18-bit x 18-bit multiply-accumulate operations. Embedded memory extends to 540 kbits with optional EDAC protection, mitigating single-event upsets in on-chip SRAM. The RTAX2000D is a digital CMOS device based on the commercial Axcelerator architecture, with the radiation-tolerant RT variant distinguished by screening of ICCA current limits at 125C final electrical test. TID performance is 300 krad (functional) and 200 krad (per the RTAX-DSP family characterization), enabling multi-year missions in medium Earth orbit and beyond. Typical applications include spacecraft command and data handling, payload processing and sensor-data formatting, and telecommunications payload beam-forming, where the DSP mathblocks accelerate filtering and FFT workloads. Design consideration: antifuse FPGAs are one-time-programmable; prototypes should be validated on commercial Axcelerator Extender boards before flight-unit programming. This page synthesizes distributor sourcing data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
RTAX2000D-CQ352B - 2M-Gate Rad-Tolerant FPGA, CQFP-352 | Microchip
The Microchip (Actel/Microsemi) RTAX2000D-CQ352B is a radiation-tolerant, antifuse-based FPGA with 2,000,000 equivalent system gates, 29,568 logic cells organized as 19,712 CLBs, and a 1.5V core supply, housed in a 352-pin ceramic quad flat pack (CQFP-352) with burn-in screening (B suffix). A radiation-tolerant FPGA is a programmable logic device qualified for space-flight environments where total ionizing dose (TID) and single-event effects threaten conventional SRAM FPGAs. Within the power-management hierarchy of space avionics, the RTAX family sits in the on-board data processing tier, providing single-chip glueless logic that is live at power-up because its antifuse configuration is permanently programmed. Key features include antifuse one-time-programmable interconnect immune to configuration upsets, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic chains. The D-suffix die is screened with tighter ICCA current limits at 125C final electrical test compared to the standard RTAX2000S, supporting high-reliability programs. Architecturally, the RTAX2000D derives from the commercial Axcelerator family, using a 0.15-micron CMOS process with metal-to-metal antifuse elements. This yields low static power, no configuration PROM requirement, and no SEE-sensitive configuration memory, a decisive advantage over SRAM-based FPGAs in orbit. Typical applications include satellite payload data processing, spacecraft bus command and telemetry controllers, sensor interface and formatting logic, and radiation-hardened reconfigurable computing modules. Design-wise, plan the migration path: prototype against Axcelerator commercial parts using the footprint-compatible adaptor board and EDIF netlist/pinout conversion methodology described in the manufacturer datasheet before committing to the one-time-programmable RTAX device. This page synthesizes distributor availability, drop-in family alternatives, and design guidance not consolidated in the manufacturer datasheet.
RTAX2000D-CQ352V - 2M-Gate Rad-Tolerant FPGA CQFP352 | Microchip
The Microchip Technology RTAX2000D-CQ352V is a radiation-tolerant, antifuse-based FPGA offering 2,000,000 equivalent system gates, 29,568 logic cells, and 19,712 configurable logic blocks (CLBs), housed in a 352-pin ceramic quad flat pack (CQFP352) with 0.500 mm terminal pitch. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space, where total ionizing dose (TID) and single-event effects would degrade or destroy commercial silicon. Within the semiconductor hierarchy, the RTAX2000D-CQ352V belongs to the RTAX-S/SL and RTAX-DSP family of rad-tolerant FPGAs, derived from the commercial Axcelerator architecture, and sits in the broader category of programmable logic devices (PLDs) alongside CPLDs and structured ASICs. Key features include one-time-programmable antifuse configuration, which is inherently immune to configuration memory upsets caused by single-event effects; a nominal 1.5V core supply (1.425V to 1.575V range); and embedded SRAM blocks with built-in FIFO control logic for on-chip data buffering. The 'D' designation denotes the die lot, and the 'V' suffix indicates the qualification screening flow applied at final test. Architecturally, the device uses segmentable clock resources and chip-wide highway routing to distribute high-speed clocks and wide buses with low skew, supporting system-level integration typical of space-flight payload and platform electronics. Typical applications include satellite payload data processing, spacecraft bus control electronics, telemetry and telecommand interfaces, and radiation-hardened signal processing chains where reprogrammable SRAM FPGAs are unacceptable due to upset sensitivity. A key design consideration is that antifuse FPGAs cannot be reprogrammed after programming; design flows therefore rely on the footprint-compatible prototyping methodology using adaptor boards (such as the Aldec ACT-H3Ki-CQ352) before committing flight hardware. This page synthesizes distributor listings, family cross-references, and drop-in alternative data not consolidated in the manufacturer datasheet.
RTAX2000DL-CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip
The Microchip Technology RTAX2000DL-CQ352B is a radiation-tolerant antifuse FPGA from the RTAX-DSP family delivering 2,000,000 equivalent system gates organized as 19,712 CLBs, with up to 120 DSP mathblocks performing 18-bit x 18-bit multiply-accumulate at 125 MHz, housed in a 352-terminal ceramic quad flat pack (CQFP) with a 0.500 mm terminal pitch. A radiation-tolerant FPGA is a programmable logic device qualified for spaceflight environments, where total ionizing dose (TID), single-event effects, and reliability dominate the design hierarchy. The RTAX family sits within the broader taxonomy of FPGAs -> radiation-tolerant programmable logic -> space-grade semiconductors, and derives its architecture from the commercial Microsemi (Actel) Axcelerator family. Key features include nonvolatile antifuse programming technology, which is live-at-power-up and requires no configuration PROM, single-chip form factor, embedded SRAM blocks totaling up to 540 kbits with optional EDAC protection, segmentable clocks, and chip-wide highway routing. The DL variant integrates dedicated DSP mathblocks, offloading multiply-accumulate operations from general-purpose logic and dramatically improving FFT and FIR filter throughput per watt. Technically, the device is fabricated in CMOS and operates from a nominal 1.5V core supply (1.425V to 1.575V range per Microchip data). Radiation performance includes functional operation to 300 krad (Si) total ionizing dose and 200 krad (Si) for related parameters, per the RTAX-S/SL and RTAX-DSP datasheet. The hermetic ceramic metal-sealed CQFP package supports the outgassing and reliability requirements of spaceflight assembly. Typical applications include satellite payload processing, onboard image and signal processing, spacecraft bus controllers, and telemetry/telecommand systems - anywhere high DSP throughput must coexist with radiation tolerance and single-chip simplicity. A critical design consideration is that antifuse FPGAs are one-time programmable: any logic change requires a physical board replacement, so extensive pre-flight simulation and in-orbit flexibility trade-offs must be evaluated against SRAM-based alternatives. This page synthesizes verified distributor data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
RTAX2000DL-CQ352E - 2M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip
The Microchip Technology (Actel/Microsemi) RTAX2000DL-CQ352E is a 2,000,000-system-gate radiation-tolerant antifuse FPGA from the RTAX-DSP/RTAX-SL family, organized as 19,712 Configurable Logic Blocks (CLBs) and packaged in a 352-terminal ceramic quad flat pack (CQFP-352) with a square, metal-sealed cofired ceramic body measuring 48 mm x 48 mm on a 0.50 mm terminal pitch. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the heavy-ion and proton environments of orbital and deep-space missions. Within the space-electronics hierarchy (semiconductor -> programmable logic -> FPGA -> radiation-tolerant FPGA), the RTAX family sits in the one-time-programmable antifuse class, distinct from SRAM-based FPGAs: configuration data is stored physically in antifuse elements, so the device is live-at-power-up with no external configuration ROM required and no configuration upset mechanism. Key features include the 2M-gate fabric with embedded SRAM blocks featuring built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and 166 input and 166 output user terminals in the CQ352 package. The D-speed grade ordering option balances logic performance against total ionizing dose and single-event-effect performance for typical LEO and MEO missions. Architecturally, RTAX-DSP devices derive from the commercial Microsemi Axcelerator family, retaining its cluster-based logic structure while qualifying the fabric for space-flight doses. The antifuse OneTime programmability also reduces SEU-sensitive configuration overhead compared to SRAM FPGAs, and simplifies board design with a true single-chip form factor. Typical applications include satellite payload data processing, spacecraft avionics and command/data-handling units, telemetry encoders, and sensor-interface digital signal processing on orbital platforms where low power, radiation tolerance, and instant-on operation are mandatory. A key design consideration: antifuse FPGAs are one-time programmable, so the design must be fully verified in simulation and via the footprint-compatible Axcelerator prototyping flow (adaptor-board methodology) before committing hardware; pinout changes after fabrication are impossible. This page synthesizes distributor listings, drop-in alternatives within the CQ352 footprint, and practical space-design notes not found in the manufacturer datasheet.
RTAX2000S-1CGS624EV - 2M-Gate Rad-Tolerant FPGA | Microchip
The Microchip Technology (Actel/Microsemi) RTAX2000S-1CGS624EV is a radiation-tolerant FPGA from the RTAX-S/SL and RTAX-DSP family offering 2,000,000 equivalent system gates and 21,504 logic cells (CLBs) in a 624-pin ceramic column grid array (CGA/CCGA-624) package. It operates from a nominal 1.5V core supply (1.425V to 1.575V) across a military/space temperature range of -55C to +125C, fabricated on a 0.15um CMOS process with performance up to 649 MHz. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the single-event effects and total ionizing dose found in space-flight radiation environments. Within the power hierarchy, it belongs to the programmable logic device (PLD) family: FPGA -> radiation-tolerant FPGA -> space-grade programmable logic. Unlike SRAM FPGAs that require external configuration, RTAX-S devices are one-time programmable anti-fuse based, providing true single-chip, live-at-power-up operation that eliminates the need for a configuration PROM and reduces boot-time vulnerability. Key features include SEU-hardened registers that eliminate the need for Triple-Module Redundancy (TMR), immunity to single-event upsets to a specified LET threshold, and a quoted SEU rate of less than 10-10 errors per bit-day, plus embedded SRAM with built-in FIFO control logic, segmentable clock resources, and chip-wide highway routing inherited from the commercial Axcelerator family architecture. Technically, the RTAX2000S derives from the Axcelerator fabric with radiation hardening by design. The anti-fuse interconnect is inherently immune to configuration upsets, so only user registers require SEU hardening. Embedded SRAM blocks support FIFO and dual-port operation for on-board data processing and payload buffering. Roughly 250,000 equivalent ASIC gates of embedded resources supplement the programmable fabric in the RTAX-DSP oriented members. Typical applications include satellite payload data processing, spacecraft command and data handling (C&DH), telemetry encoder/decoder logic, and instrument control in low-Earth-orbit and deep-space missions where reprogrammability is not required and radiation robustness is paramount. A key design consideration is that the CGA-624 ceramic package requires a compatible land pattern and column-grid socket strategy; verify thermal resistance per the JEDEC JESD51 simulation conditions cited in the manufacturer datasheet. This page synthesizes distributor listings, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
RTAX2000S-1CQ352PROTO - Rad-Tolerant FPGA 2M Gates | Microchip
The Microchip Technology RTAX2000S-1CQ352PROTO is a radiation-tolerant FPGA from the RTAX2000S family, providing 21,504 configurable logic blocks (CLBs), approximately 2 million equivalent system gates, and a CQFP352 ceramic quad flat pack package in a PROTO (prototyping/engineering) device designation with commercial temperature grade and -1 speed grade. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive and operate reliably in space-flight radiation environments, where total ionizing dose (TID) and single-event effects would degrade or destroy standard commercial silicon. Within the power-management hierarchy of avionics electronics, these devices occupy the top reliability tier above standard and military-grade FPGAs, sitting in the broader taxonomy of programmable logic: FPGA -> radiation-tolerant FPGA -> space-grade programmable logic IC. Key differentiating features of the RTAX-S family include low-power operation, a true single-chip form factor (no configuration PROM required at startup), and live-at-power-up behavior enabled by antifuse programmability. Unlike SRAM-based FPGAs, the antifuse architecture is one-time programmable, so configuration data is inherently immune to configuration upsets and the device is functional immediately when power is applied - a critical property for spacecraft that cannot tolerate a configuration reload cycle. Architecturally, the RTAX2000S is fabricated in a CMOS process and organizes its ~2 million gates across logic modules, embedded SRAM blocks, and I/O clusters. Designers implement radiation-hardening-by-design techniques at the system level, typically combining the RTAX-S fabric with external triple-module-redundancy (TMR) schemes supported by Microchip's Libero design suite and Hi-Rel mitigation flows. Typical applications include satellite payload processing, spacecraft bus control, telemetry and telecommand interfaces, and launch-vehicle avionics - anywhere complex logic must operate for years in orbit. The PROTO suffix denotes engineering/prototype hardware intended for design development and system validation rather than flight lots. A key design consideration: PROTO devices must not be substituted for qualified flight units in final flight hardware; flight programs should transition to the corresponding V (flight) suffix part. This page consolidates verified specifications, drop-in family alternatives, and procurement guidance beyond what distributor listings typically show.
RTAX2000S-CG624PROTO - 2M-Gate Rad-Tolerant FPGA CCGA-624 | Microchip
The Microchip Technology (Actel/Microsemi) RTAX2000S-CG624PROTO is a prototyping variant of the RTAX-S radiation-tolerant FPGA family, offering 2,000,000 equivalent system gates, 21,504 logic cells (R-cells) and 32,256 flip-flops in a 624-ball ceramic column grid array (CCGA-624) package. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the single-event upset (SEU) and total ionizing dose (TID) environment of space flight. Within the power-management hierarchy of a spacecraft avionics stack, the FPGA sits as the central programmable logic element between the on-board computer and mission payloads, and the RTAX-S family is a radiation-tolerant antifuse (one-time programmable, OTP) member of the broader FPGA/programmable logic taxonomy. Key features include SEU-hardened registers that eliminate the need for triple-module redundancy (TMR) on flip-flops, live-at-power-up operation due to the non-volatile antifuse fabric, true single-chip form factor without external configuration memory, and low static power consumption. The PROTO suffix denotes a prototyping device intended for design validation before flight-unit programming. Architecturally, the RTAX2000S uses CMOS antifuse technology with an R-cell/C-cell logic fabric and supports clock speeds up to approximately 350 MHz. I/O standards include single-ended and differential pairs via dedicated P/N pin pairs, and embedded SRAM blocks support FIFO and dual-port memory functions. Typical applications include satellite payload data processing, spacecraft telemetry and command interfaces, attitude control electronics, and radiation-tolerant glue logic replacing multiple ASIC functions. Design consideration: per Microchip application note AC170, prototyping must be done with the RTAX-S design flow in Libero SoC converted to an Axcelerator device; reverse flow is not permitted, so final timing closure must always be verified on the RTAX-S target. This page adds value beyond the datasheet with drop-in alternatives, cross-reference data, and distributor sourcing information synthesized from live web data.
RTAX2000S-CQ256PROTO - 2M-Gate Rad-Tolerant FPGA Prototype | Microchip
The Microchip Technology (formerly Microsemi/Actel) RTAX2000S-CQ256PROTO is a radiation-tolerant FPGA prototype device delivering 2,000,000 system gates with 21,504 Configurable Logic Blocks (CLBs) in a 256-pin ceramic quad flat package (CQFP-256). Built on CMOS anti-fuse architecture, it supports system frequencies up to 350 MHz and provides 136 user input/output pins, with functional characteristics matching the flight-unit RTAX2000S in a non-hermetic package. A radiation-tolerant FPGA (Field Programmable Gate Array) is a programmable logic device engineered to survive the ionizing radiation environments of space flight, including total ionizing dose (TID), single-event upset (SEU), and single-event latchup (SEL). Within the power hierarchy of spacecraft electronics, the RTAX-S family sits alongside rad-hard processors and memory as core onboard data-processing silicon, using anti-fuse programmable interconnect that is programmed once and remains stable under radiation. Key features of the RTAX2000S-CQ256PROTO include low-power consumption, true single-chip form factor, and live-at-power-up (LAPU) operation, which eliminates the need for an external configuration device. The PROTO variant shares the same functional characteristics as the space flight unit but ships in a non-hermetic package at a fraction of the cost, specifically for functional verification before committing to flight parts. Architecturally, the RTAX-S/SL family uses Microchip's Axcelerator-derived logic fabric with a sea-of-modules architecture combining C-cells, R-cells, and embedded SRAM/dedicated FIFO blocks, enabling high performance at densities up to four million equivalent system gates for space-based applications. Typical applications include satellite on-board data handling, spacecraft payload processing, telemetry and telecommand interfaces, and reprogrammable prototyping of RTAX-S flight designs. Designers often pair the PROTO device with Aldec prototyping adaptors that map ProASIC3E flash technology onto the CQ256 footprint for iterative functional verification. A key design consideration is that PROTO devices are non-hermetic and not radiation-screened, so they must never be flown; they exist solely for de-risking the flight design. Timing closure performed on PROTO silicon should be re-verified against flight-grade specifications. This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
RTAX2000S-CQ256V - 2M-Gate Rad-Tolerant FPGA, CQFP-256 | Microchip
The Microchip Technology (Actel/Microsemi) RTAX2000S-CQ256V is a 2,000,000-gate RTAX-S radiation-tolerant FPGA built on CMOS antifuse technology, offering 32,256 logic cells and 21,504 configurable logic blocks (CLBs) in a 256-pin ceramic quad flat package (CQFP-256, JESD-30 code S-CQFP-F256). A radiation-tolerant FPGA is a field-programmable gate array engineered to survive and operate reliably in the space radiation environment, where total ionizing dose (TID) and single-event effects (SEE) would impair standard commercial devices. The RTAX-S family sits within Microchip's space-grade programmable logic hierarchy, designed specifically for space-flight systems where low power, single-chip integration, and live-at-power-up operation are mandatory. The defining feature of the RTAX2000S is its antifuse programming technology. Unlike SRAM-based FPGAs, the antifuse configuration is non-volatile and inherently radiation-immune: the device is live at power-up with no configuration time, no external configuration PROM, and no configuration-bit upset risk. This gives the RTAX2000S a true single-chip form factor, reducing board area, mass, and system complexity in orbit. The device targets high-reliability space designs with low static power consumption, an important consideration for solar- and battery-powered spacecraft. Logic density of 2 million system gates accommodates payload processing, bus interfaces, telemetry formatting, and glueless integration of boards that previously required multiple ASICs or discrete devices. The 'V' speed-grade ordering suffix and ceramic CQFP-256 hermetic package support qualification flows for flight hardware, and the part is used in the Microchip (formerly Actel) RTAX-S ecosystem supported by Libero SoC design software. Typical applications include satellite payload data processing, spacecraft avionics and command/data-handling units, telemetry and telecommand interfaces, sensor front-end acquisition in orbital platforms, and radiation-hardened control logic for scientific instruments. A key design consideration is that RTAX-S devices are one-time programmable: there is no reprogramming after flight, so designers rely on Aldec flash-based ProASIC3E prototyping adaptors for RTAX design validation before committing to hardware. This page synthesizes verified distributor and manufacturer data, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
RTAX2000S-LG1152V - 2M-Gate Rad-Tolerant FPGA | Actel/Microchip
The Actel (Microsemi/Microchip Technology) RTAX2000S-LG1152V is a 2,000,000-gate radiation-tolerant antifuse FPGA with 32,256 logic cells and 21,504 CLBs, housed in a 1152-pin ceramic column grid array (LG1152 / CG1152) package with V space qualification screening. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation and heavy-ion environments of spaceflight, where commercial devices would suffer latch-up, gate rupture, or configuration loss. Within the semiconductor hierarchy, the RTAX2000S belongs to the RTAX-S/SL and RTAX-DSP family of rad-tolerant FPGAs, which sits under programmable logic ICs and ultimately under space-grade digital integrated circuits. Unlike SRAM FPGAs, the RTAX-S family uses antifuse one-time-programmable technology, which is inherently immune to configuration upsets. Key features include approximately two million equivalent system gates, embedded SRAM blocks with built-in FIFO control logic, segmentable clock circuitry, chip-wide highway routing, and dedicated carry logic for arithmetic chains. Live-at-power-up operation eliminates the need for external configuration storage, and true single-chip form factor reduces board area, mass, and failure points, all critical attributes for spacecraft avionics. Architecturally, the device is based on the Microsemi commercial Axcelerator family, inheriting its high-performance CMOS fabric while adding radiation-tolerant process and qualification. Densities across the family reach four million equivalent system gates, allowing design porting between package-compatible siblings. Typical applications include satellite on-board data processing, payload signal processing, spacecraft bus control, telemetry/telecommand interfaces, and radiation-exposed instrumentation. Design consideration: prototype your RTAX2000S design on the footprint-compatible Axcelerator commercial device using Microchip's adaptor-board methodology and EDIF netlist/pinout conversion flow before committing to the flight unit, since antifuse parts are one-time programmable. This page synthesizes distributor listings, cross-reference data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.