K4A8G165WC-BCPB - 8Gb DDR4-2133 SDRAM 96-FBGA | Samsung
부품 번호: K4A8G165WC-BCPB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.74 | $1.74 |
| 10 | $1.66 | $16.60 |
| 100 | $1.55 | $155.00 |
| 500 | $1.42 | $710.00 |
| 1,000 | $1.31 | $1,310.00 |
K4A8G165WC-BCPB 개요
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random Access Memory) is the fourth generation of the DDR DRAM family, sitting within the broader hierarchy of volatile memory -> DRAM -> synchronous DRAM -> DDR SDRAM -> power-management-intensive main-memory ICs. Compared with DDR3, DDR4 lowers the operating voltage from 1.5 V to 1.2 V, doubles bank groups for higher bandwidth, and adds features such as bank group architecture, DLL-on/off modes, and per-DRAM addressability.
Key features of the K4A8G165WC-BCPB include the wide x16 data interface, which simplifies controller routing for embedded designs; auto precharge and asynchronous reset functions; CRC and parity support on critical signals; ZQ calibration for output driver impedance; dynamic on-chip termination (ODT); and a data mask (DM) function for partial writes. The 1.2 V rail reduces system power roughly 25% versus equivalent DDR3 solutions.
Technically, the device uses internal bank groups that allow interleaved accesses for higher effective bandwidth, a programmable DLL for output timing alignment, and programmable CAS latency appropriate to the 2133 Mbps/pin class. The 96-ball FBGA lead-free package measures approximately 7.5 mm x 10 mm x 0.8 mm and suits high-density soldered-down memory subsystems.
Typical applications include embedded industrial controllers, networking equipment line cards, set-top boxes, and FPGA-based processing systems that require soldered 8 Gb DDR4 with a 16-bit data bus, such as Xilinx Zynq UltraScale+ or AMD/Intel embedded platforms.
Design consideration: DDR4 fly-by routing requires proper on-die termination tuning, length-matched address/command groups, and VTT termination supply design; verify the controller supports the x16 organization, since x8 modules use a different 78-ball footprint.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Prices as of 2026-09-04.
드롭인 대체품: K4A8G165WC-BCPB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: K4A8G165WC-BCPB (동일 폼 팩터 및 풋프린트) — 차이점: Package, Data Rate, Operating Temperature, Interface, Memory Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
K4A8G165WB-BCPB
✅ 드롭인✓ 재고 있음
$2.3 / 개
데이터시트 보기 →K4A8G165WC-BCTD
✅ 드롭인✓ 재고 있음
$41.2 / 개
데이터시트 보기 →K4A8G165WC-BCRC
✅ 드롭인✓ 재고 있음
$23 / 개
데이터시트 보기 →K4A8G165WC-BCWE
✅ 드롭인✓ 재고 있음
$38 / 개
데이터시트 보기 →K4A8G165WB-BCTD
✅ 드롭인✓ 재고 있음
$37 / 개
데이터시트 보기 →K4A8G165WB-BCRC
✅ 드롭인✓ 재고 있음
$12.57 / 개
데이터시트 보기 →K4A8G165WB-BCWE
✅ 드롭인✓ 재고 있음
$6.55 / 개
데이터시트 보기 →K4A8G165WC-BCPB 최대 정격 & 전기적 특성
| 메모리 유형 | DDR4 SDRAM (volatile DRAM) |
| 메모리 크기 | 8 Gb |
| Memory Organization | 512M x 16 |
| 데이터 속도 | DDR4-2133 (2133 Mbps/pin) |
| 공급 전압 | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V |
| 인터페이스 | DDR4 (16-bit data bus) |
| 패키지 | 96-ball FBGA (TFBGA) |
| Die Generation | C-die (1Y nm class) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +95C |
| 특징 | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask |
| Termination | On-die termination (ODT), dynamic |
| RoHS 상태 | Compliant |
| Standard | JEDEC DDR4 SDRAM |
K4A8G165WC-BCPB 96-ball fbga (tfbga) 핀 구성 가이드
K4A8G165WC-BCPB(96-ball fbga (tfbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: K4A8G165WC-BCPB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
K4A8G165WC-BCPB 적합 용도: 6 애플리케이션s: Embedded Industrial Controllers, Networking Equipment Line Cards, FPGA-Based Processing Systems, Set-Top Boxes and Smart Home Gateways, Test and Measurement Instrumentation, Automotive-Adjacent Embedded Gateways (Industrial Grade).
Embedded Industrial Controllers
Industrial PLCs and edge controllers need soldered, high-density main memory with long-term availability. The K4A8G165WC-BCPB provides 8 Gb in a single 512M x16 chip at 1.2 V, cutting memory power versus DDR3 by roughly 25%, and its 96-ball FBGA package survives vibration better than SODIMM modules. Placed on a fly-by or matched-length DDR4 bus with dynamic ODT and ZQ calibration enabled, it sustains DDR4-2133 throughput for real-time control data logging. The 0C to +95C operating range covers typical industrial enclosure conditions, and the x16 bus halves component count versus x8, reducing BOM risk.
추천
Networking Equipment Line Cards
Switch and router line cards use soldered DDR4 for packet buffers, routing tables, and control-plane memory. The K4A8G165WC-BCPB's 2133 Mbps/pin data rate delivers the bandwidth needed for queue management, while CRC support improves data integrity on high-availability links and the asynchronous reset function simplifies system-level fault recovery. Its 96-ball FBGA footprint allows multiple chips to be stacked on a matched-length bus for larger buffers. Dynamic ODT termination reduces signal-integrity tuning effort on multi-drop topologies common in networking backplane-adjacent designs.
추천
FPGA-Based Processing Systems
FPGA image-processing and data-acquisition systems require large on-board frame buffers. The K4A8G165WC-BCPB's x16 organization lets a single chip provide a 16-bit DDR4 interface, simplifying FPGA bank placement versus two x8 devices. At DDR4-2133, one chip delivers roughly 4.2 GB/s of peak bandwidth, sufficient for multi-stream video line buffering. Enable the memory controller's ZQ calibration and train at board bring-up; use the data mask function for partial frame writes to avoid read-modify-write overhead on video payloads.
추천
Set-Top Boxes and Smart Home Gateways
IPTV set-top boxes and home gateways run rich UI stacks and video pipelines that need gigabyte-class soldered memory. The K4A8G165WC-BCPB's 8 Gb density in one FBGA saves board area versus multiple lower-density chips, and its 1.2 V rail aligns with energy-efficiency targets for always-on consumer equipment. DDR4-2133 bandwidth supports simultaneous 4K decode buffering and network traffic. The device's auto precharge function improves page-hit efficiency for streaming access patterns, and RoHS compliance keeps consumer certification straightforward.
추천
Test and Measurement Instrumentation
Oscilloscope, logic analyzer, and data-recorder front ends capture long acquisition records that overflow on-chip SRAM, so soldered DDR4 is used for deep capture memory. The K4A8G165WC-BCPB offers 8 Gb per chip at DDR4-2133, enabling multi-gigasample streaming architectures with sequential burst writes. ZQ calibration keeps output impedance accurate over temperature, protecting eye margins on long PCB traces typical of instrument backplanes. The asynchronous reset input allows the host to recover the memory subsystem without a full power cycle between captures.
추천
Automotive-Adjacent Embedded Gateways (Industrial Grade)
Telematics gateways, fleet recorders, and off-highway equipment controllers use industrial-grade soldered DDR4 rather than AEC-Q100 memory. The K4A8G165WC-BCPB suits these designs where 0C to +95C operation is acceptable, providing 8 Gb for map, log, and communication buffering at DDR4-2133. The 96-ball FBGA's soldered attachment resists shock and vibration better than connectors, and the low 1.2 V rail reduces total power draw in battery-backed or energy-harvesting nodes. Verify the wider automotive temperature requirement before using it inside the passenger compartment ECU domain.
추천
추천 제품 요약
엔지니어링 참조 데이터: K4A8G165WC-BCPB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | K4A8G165WB-BCPB | K4A8G165WC-BCTD | K4A8G165WC-BCRC | K4A8G165WB-BCWE |
|---|---|---|---|---|---|
| Package | 96-ball FBGA (TFBGA) | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Size | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) |
| Die Generation | C-die | B-die | C-die | C-die | B-die |
| Speed Grade (suffix) | PB (DDR4-2133 class) | PB (DDR4-2133 class) | TD (higher grade) | RC (lower grade) | WE (higher grade) |
주요 차별점
- Newer C-die silicon generation (vs K4A8G165WB-BCPB)
- Lowest quoted price among verified family members (vs K4A8G165WC-BCTD)
- x16 organization halves component count (vs K4A8G085WC-BCPB)
설계 노트
Route DDR4 address/command/control as a fly-by topology with length-matched traces and tune write leveling and read training in the controller. The K4A8G165WC-BCPB's dynamic ODT and ZQ calibration help maintain eye margins at DDR4-2133, but you must still control trace impedance (40-50 ohm single-ended) and keep data-group skew within controller specifications. Run full DRAM training at board bring-up for every PCB stackup revision, since impedance changes shift the trained delays.
The device operates at 1.2 V nominal (1.14 V to 1.26 V) with separate VDD, VDDQ, and VPP rails per JEDEC DDR4 practice. Estimated: at DDR4-2133 with moderate utilization, a single 8 Gb x16 chip draws on the order of a few hundred milliwatts; use a dedicated buck regulator such as the TPS54218 for VDD/VDDQ and a proper VTT termination supply with bulk capacitance at the package. Keep rail ripple below the JEDEC DDR4 tolerance band to avoid refresh errors.
The most common substitution error is mixing organizations: the K4A8G085WC series (x8) uses a 78-ball FBGA that is physically incompatible with the 96-ball footprint of this x16 part. Also verify the speed-grade suffix (PB/RC/TD/WE) against your controller's validated timing table before BOM swaps, and do not assume B-die (WB family) timing settings carry over unchanged to C-die (WC family) silicon even when the footprint is identical.
Place the 96-ball FBGA within 50 mm of the controller where possible, keep the DRAM on a solid reference plane, and reserve space for series termination resistors on address/command nets. For multi-chip topologies, use fly-by routing of address/command with daisy-chained ODT, and length-match data groups per byte lane. Provide thermal relief via the PCB since FBGA packages dissipate heat through the ball field.
규정 준수 정보
RoHS compliance and lead-free FBGA package per distributor listings (LCSC, JLCPCB). REACH, halogen-free, and conflict-minerals declarations should be confirmed via Samsung's official environmental documentation.
