EP1SGX40GF1020I7N - Stratix GX FPGA 41,250 Cells 3.1875Gbps | Intel
MPN: EP1SGX40GF1020I7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $440 | $4,400.00 |
| 100 | $395 | $39,500.00 |
| 500 | $355 | $177,500.00 |
| 1,000 | $320 | $320,000.00 |
Drop-in alternatives for EP1SGX40GF1020I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF1020I7
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP1SGX40GF1020C7N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP1SGX40GF1020I6N
✅ Drop-In✓ In Stock
$1195 / Unit
View Datasheet →EP1SGX40DF1020I7N
✅ Drop-In✓ In Stock
$2290 / Unit
View Datasheet →EP1SGX40CF1020I5
✅ Drop-In✓ In Stock
$370 / Unit
View Datasheet →EP1SGX40GF1020I7N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements / Cells | 41,250 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Transceiver Data Rate | 3.1875 Gbps |
| Minimum Transceiver Data Rate | 500 Mbps |
| Embedded Transceivers | 20 (per datasheet family) |
| Input Reference Frequency Range | 25 MHz to 650 MHz |
| PLL Multiplication Factors | 2, 4, 5, 8, 10, 16, 20 |
| PPM Detector Bandwidth Settings | 125, 250, 500, 1000 ppm |
| Package | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| Operating Temperature | 0 C to 85 C (Industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lifecycle | Not Recommended for New Designs (NRND) |
EP1SGX40GF1020I7N fc-fbga-1020 (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020I7N (fc-fbga-1020 (33 x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020I7N is suitable for 6 applications: Multi-Gigabit Serial Backplane (XAUI / PCIe Gen1), Software Defined Radio (SDR) Baseband Processing, Telecom Line Card Aggregation Switch, High-Speed Data Acquisition Systems, ASIC Prototyping and Emulation, Storage Area Network (SAN) Switching.
Multi-Gigabit Serial Backplane (XAUI / PCIe Gen1)
The EP1SGX40GF1020I7N's 3.1875 Gbps embedded transceivers and 20-channel PMA array make it ideal for XAUI 4x3.125 Gbps aggregation and PCIe Gen1 endpoint/root-complex designs. The 41,250 logic cells provide sufficient fabric for protocol MAC, PCS, and bridge logic. Place the device on a 12-layer PCB with 100-ohm differential stripline routing for the MGT lanes; expect pre-emphasis and receiver equalization settings per Altera application note AN474. Compared with a discrete SERDES plus FPGA approach, the integrated PMA reduces BOM by 30-40% and improves latency determinism.
Recommended
Software Defined Radio (SDR) Baseband Processing
The EP1SGX40GF1020I7N delivers the DSP block density and transceiver throughput required for SDR baseband workloads, with on-chip TriMatrix memory blocks for sample buffering and 20 transceivers for digitizer data ingest at rates up to 3.1875 Gbps. Fabric logic comfortably implements 1024-point FFTs, polyphase filterbanks, and digital downconverters for sub-6 GHz waveforms. Industrial 0-85 C grading supports outdoor military and tactical radio enclosures. Compared with a TI DSP + ASSP combo, the integrated FPGA fabric halves the bill of materials for mid-complexity waveforms while preserving the path to waveform upgrades via bitstream reload.
Recommended
Telecom Line Card Aggregation Switch
Designed into carrier-grade line cards, the EP1SGX40GF1020I7N aggregates 10 or more SFP+ ports at 1 Gbps, 2.5 Gbps CPRI/OBSAI, or lower-rate TDM streams into a backplane-facing 4x3.125 Gbps XAUI link. The industrial 0-85 C range and 130nm process maturity deliver field-proven reliability for central-office deployment. Fabric supports hitless protection switching and Ethernet MAC wrapping at line rate. Compared with merchant silicon switching ASICs, the FPGA approach allows multi-rate protocol flexibility (mix of CPRI, OBSAI, GbE on the same port) without changing the line card hardware.
Recommended
High-Speed Data Acquisition Systems
For 8 to 12-bit ADC front ends sampled above 1 GSPS, the EP1SGX40GF1020I7N serves as the digital downconversion and channelization engine, accepting LVDS or serialized ADC data through its 20 transceivers running at up to 3.1875 Gbps. The TriMatrix memory blocks absorb ADC bursts while fabric implements FIR decimation filters and trigger logic. Industrial temperature grading suits test-and-measurement chassis deployed in factory floors. Compared with a custom ASIC, the FPGA approach lets instrument vendors add new acquisition modes via firmware updates without respinning silicon.
Recommended
ASIC Prototyping and Emulation
With 41,250 logic cells and abundant TriMatrix memory, the EP1SGX40GF1020I7N hosts mid-complexity ASIC RTL prototypes including PCIe Gen1 endpoints, memory controllers, and custom I/O bridges. The 20 embedded transceivers eliminate the need for external SERDES when emulating chips with multi-gigabit interfaces. Quartus synthesis flow supports industry-standard Verilog and VHDL. Compared with purpose-built prototyping systems, using the same Stratix GX silicon for both prototype validation and low-volume production smooths the path from prototype to product.
Recommended
Storage Area Network (SAN) Switching
The EP1SGX40GF1020I7N fits Fibre Channel 1G/2G and 4G FC switch designs as well as 1 GbE iSCSI aggregation line cards, where its 3.1875 Gbps transceivers handle FC ports with margin. The FC-FBGA-1020 package supports the high ball-count required for 8-12 SERDES channels plus fabric and management I/O. Industrial 0-85 C grading is appropriate for storage controllers deployed in datacenter racks. Compared with ASSP FC switch ICs, the FPGA approach allows blended FC + Ethernet designs on a single line card with full wire-speed forwarding.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020I7 | EP1SGX40GF1020C7N | EP1SGX40GF1020I6N | EP1SGX40DF1020I7N | EP1SGX40CF1020I5 |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) - same | FC-FBGA-1020 (33 x 33 mm, 1 mm pitch) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Max Transceiver Data Rate | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Temperature Grade | Industrial (0 to 85 C) | Industrial (0 to 85 C) | Commercial (0 to 70 C) | Industrial (0 to 85 C) | Industrial (0 to 85 C) | Industrial (0 to 85 C) |
| Speed Grade | I7 (fastest) | I7 (fastest) | C7 (commercial, fast) | I6 (one step slower) | I7 (fastest, DF ordering) | I5 (slowest) |
| Ordering Variant | GF (full feature, 20 transceivers) | GF | GF | GF | DF (different feature set) | CF (reduced feature set) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Approx Unit Price (qty 1, USD, as of 2026-09-07) | $485 | $475 | $445 | $420 | $465 | $390 |
Key Differentiators
- Highest speed grade available in the Stratix GX 40K-cell tier (vs EP1SGX40GF1020I6N)
- Industrial 0-85 C temperature range (vs EP1SGX40GF1020C7N)
- Full-feature 'GF' ordering variant with all 20 transceivers (vs EP1SGX40DF1020I7N)
Design Notes
The FC-FBGA-1020 package at 1 mm ball pitch demands a high-density PCB stack-up with laser-drilled microvias. Use at minimum a 4-6-4 layer count with 0.5 oz copper on outer layers and 1 oz on inner power planes, with via-in-pad for the BGA break-out region. Per Altera's package guidelines, signal escape must traverse a maximum of two microvias from the BGA pad to the inner routing layer to preserve signal integrity on MGT lanes and DDR interfaces.
MGT (multi-gigabit transceiver) channels require 100-ohm differential routing with intra-pair length matching within 5 mils and inter-pair length matching within 25 mils. Use stripline (not microstrip) routing for MGT lanes to suppress EMI and maintain impedance control across the full 3.1875 Gbps Nyquist frequency. Reference Altera application note AN474 for pre-emphasis, equalization, and VOD settings. Estimated: with proper stack-up, eye-opening at the receiver should exceed 60% of the unit interval at 3.125 Gbps.
The EP1SGX40GF1020I7N requires multiple supply rails: VCCINT (1.5 V core), VCCPD (3.3 V or 2.5 V I/O pre-drive), VCCA (1.5 V PLL analog), and per-bank VCCIO. Decouple each rail with a 100 nF ceramic cap per power pin plus bulk tantalum or polymer caps per Altera's power distribution network guidelines. Estimated: worst-case core current at full MGT utilization reaches 3-4 A, requiring at least 4 power-input vias per rail to the inner planes.
The FC-FBGA-1020 package relies on the PCB for heat dissipation. Without a heatsink, theta_JA typically falls between 12-18 C/W depending on copper-pour coverage and airflow. Estimated: at full transceiver and fabric utilization with 100% toggle rate, junction-to-ambient temperature rise of 30-40 C is typical, requiring either 200 LFM airflow or a heatsink with thermal interface material for industrial 0-85 C compliance in enclosed chassis.
Configuration mode selection (PS, FPP, JTAG) must match the design's bitstream loading strategy; miswiring MSEL pins will prevent the FPGA from configuring. Ensure the nCONFIG, nSTATUS, and CONF_DONE signals have proper pull-ups and that JTAG chain integrity is verified before power-up. Also, do not mix LVTTL and LVCMOS I/O standards on the same bank without checking VCCIO compatibility, as the I/O banks on this device are grouped by voltage tolerance.
Compliance Information
RoHS and lead-free compliance per Intel/Altera product page. AEC-Q100 not applicable (this is a programmable logic device, not an automotive-grade IC). Halogen-free status not explicitly stated in verified data - set to unknown.
