EPM5192JM-1/883B - 192-Macrocell EPLD, 55ns, 5V, 883B MIL | Intel / Altera
MPN: EPM5192JM-1/883B β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $142 | $14,200.00 |
| 500 | $122.5 | $61,250.00 |
| 1,000 | $108 | $108,000.00 |
Drop-in alternatives for EPM5192JM-1/883B β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet βEPM5192JM-1/883B Maximum Ratings & Electrical Characteristics
| Device Family | MAX 5000 EPLD |
| Product Type | Erasable Programmable Logic Device (EPLD) |
| Technology | CMOS, UV-erasable |
| Macrocells | 192 |
| User I/O Pins | 64 |
| Total Logic Inputs | 72 (including 7 dedicated inputs) |
| Propagation Delay (tPD) | 55 ns |
| Supply Voltage (VCC) | 4.5 V to 5.5 V (nominal 5 V) |
| Speed Grade | -1 (fastest) |
| Operating Temperature | -55C to +125C (military) |
| Package | 84-pin JLCC (JM) with UV window |
| Mounting Type | Surface Mount |
| Screening | MIL-STD-883B Class B |
| Programming Method | UV erase + standard PLD programmer |
EPM5192JM-1/883B Pin Configuration
| Pin 1 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 2 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 3 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 4 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 5 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 6 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 7 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 8 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 9 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 10 | GND β Ground |
| Pin 11 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 12 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 13 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 14 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 15 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 16 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 17 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 18 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 19 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 20 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 21 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 22 | GND β Ground |
| Pin 23 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 24 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 25 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 26 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 27 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 28 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 29 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 30 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 31 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 32 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 33 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 34 | GND β Ground |
| Pin 35 | INPUT β Dedicated input |
| Pin 36 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 37 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 38 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 39 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 40 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 41 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 42 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 43 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 44 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 45 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 46 | GND β Ground |
| Pin 47 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 48 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 49 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 50 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 51 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 52 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 53 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 54 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 55 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 56 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 57 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 58 | GND β Ground |
| Pin 59 | INPUT β Dedicated input |
| Pin 60 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 61 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 62 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 63 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 64 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 65 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 66 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 67 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 68 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 69 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 70 | GND β Ground |
| Pin 71 | INPUT β Dedicated input |
| Pin 72 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 73 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 74 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 75 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 76 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 77 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 78 | I/O β Bidirectional user I/O (macrocell array) |
| Pin 79 | VCC β +5V supply |
| Pin 80 | INPUT β Dedicated input |
| Pin 81 | INPUT β Dedicated input |
| Pin 82 | INPUT β Dedicated input |
| Pin 83 | INPUT β Dedicated input |
| Pin 84 | I/O β Bidirectional user I/O (macrocell array) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM5192JM-1/883B is suitable for 6 applications: Military Avionics Bus Interface Glue Logic, VME/VXI Backplane Address Decoding and Arbitration, Industrial Control State Machines and Sequencers, Legacy TTL/CMOS Glue Logic Consolidation, Radar and Sensor Signal Routing, Aerospace Flight Control System Redundancy Logic.
Military Avionics Bus Interface Glue Logic
The EPM5192JM-1/883B is widely used to implement glue logic around MIL-STD-1553 and ARINC 429 bus interfaces, where its 192 macrocells and 64 I/Os comfortably consolidate address decoding, interrupt steering, and timing-recovery state machines that previously required multiple discrete TTL/CMOS packages. The -55C to +125C military temperature range and MIL-STD-883B Class B screening directly satisfy avionics environmental requirements without additional up-screening. The deterministic 55 ns tPD - independent of logic placement thanks to the MAX Programmable Logic Array (PLA) interconnect - guarantees worst-case bus turnaround timing for command/response handshakes, a critical requirement for real-time military databuses where timing margins are audited to single-digit nanoseconds.
Recommended
VME/VXI Backplane Address Decoding and Arbitration
In legacy VMEbus and VXI backplane systems, the EPM5192JM-1/883B serves as a single-chip address decoder and bus arbiter, replacing dozens of 74LS/74F-series TTL gates. Its 64 user I/O pins handle the full VME address-data bus (A16/A24/A32 and D8/D16/D32 modes) plus DTACK, BBSY, and grant-chain signals, while the 192 macrocells implement multi-level address matchers and prioritised arbitration logic. The MAX 5000 fabric's instant-on non-volatile configuration means no boot PROM is required - the device is operational within 55 ns of VCC stable, which is essential for VMEbus system-controller responsibilities where slave boards expect immediate bus mastership resolution.
Recommended
Industrial Control State Machines and Sequencers
Engineers deploy the EPM5192JM-1/883B in industrial PLCs, motor controllers, and process-control sequencers where deterministic timing is required for safety interlocks. The 192 macrocells and on-chip flip-flops implement complex Moore/Mealy state machines with up to several dozen states, replacing racks of relays and discrete timers. The wide 5V Β±10% supply tolerance tolerates unregulated industrial 24V rails stepped down to 5V, while the -55C to +125C range covers outdoor cabinet and factory-floor environments. The non-volatile MAX configuration eliminates the inrush chaos of SRAM-based FPGAs and ensures the machine never starts in an undefined logic state, a critical requirement for IEC 61508/61511 functional-safety paths.
Recommended
Legacy TTL/CMOS Glue Logic Consolidation
The EPM5192JM-1/883B is a classic 'one-chip replaces a board' solution for defense electronics sustainment programs. A 6U VME card populated with 30-50 74LS245, 74LS138, 74LS244, and 74LS374 buffers and latches can typically be replaced by a single EPM5192 plus a few bus transceivers. The 192 macrocells provide ample capacity, while the 64 user I/Os handle the multi-bus glue required between legacy microprocessors (8086, 68000, 80386EX), memory, and peripheral devices. MIL-STD-883B screening plus the proven MAX architecture make this part preferred over modern SRAM FPGAs for legacy programs where re-qualification cost dominates any silicon-savings argument.
Recommended
Radar and Sensor Signal Routing
In ground-based radar and electro-optical sensor front-ends, the EPM5192JM-1/883B routes and conditions timing-critical control signals between the RF up/down-conversion chain, ADCs/DACs, and the signal-processing back-end. Its 55 ns propagation delay, combined with the deterministic MAX interconnect, ensures that beam-steering commands, range-gate pulses, and trigger signals arrive within picosecond-level matched-path delays - critical for phased-array calibration. The wide military temperature range and MIL-STD-883B screening support outdoor sensor installations, while the 192-macrocell capacity accommodates the wide mux/demux trees and timing generators typical of modern radar signal paths.
Recommended
Aerospace Flight Control System Redundancy Logic
Flight-control actuator drive electronics and sensor-signal conditioning units use the EPM5192JM-1/883B as a secondary/tertiary vote-comparator and channel-health monitor. The 192 macrocells can implement dual or triple-redundant signal voting with disagreement detection, while the deterministic 55 ns tPD allows tight synchronisation with the primary flight-control processor. The instant-on non-volatile MAX 5000 configuration means the device is fully operational at power-up with no boot sequence - essential for flight safety where any undefined logic state during startup is unacceptable. The MIL-STD-883B Class B screening directly addresses DO-254/DO-178C design-assurance expectations for Level A/B flight-critical hardware.
Recommended
Recommended Products Summary
Engineering reference data for EPM5192JM-1/883B β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5192GM-1/883B | EPM5192GM/883B | EPM5192GM883B-2 | EPM5192GM883B | EPM5192GM-2/883B | EPM5192GM/883 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 84-pin JLCC (JM, UV window) | 84-pin JLCC (GM, no UV window) | 84-pin JLCC (GM, no UV window) | 84-pin JLCC (GM, no UV window) | 84-pin JLCC (GM, no UV window) | 84-pin JLCC (GM, no UV window) | 84-pin JLCC (GM, no UV window) |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| User I/O Pins | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Speed Grade | -1 | -1 | standard | -2 (slower) | standard | -2 (slower) | standard |
| tPD (propagation delay) | 55 ns | 55 ns | [DATA_NEEDED] | [DATA_NEEDED: typical -2 tPD value] | [DATA_NEEDED] | [DATA_NEEDED: typical -2 tPD value] | [DATA_NEEDED] |
| MIL-STD-883B Screening | Yes (Class B) | Yes (Class B) | Yes (Class B) | Yes (Class B) | Yes (Class B) | Yes (Class B) | Yes (Rev /883) |
| UV Erase Window | Yes (ceramic lid) | No (GM = no window) | No (GM = no window) | No (GM = no window) | No (GM = no window) | No (GM = no window) | No (GM = no window) |
Key Differentiators
- UV-erasable window allows in-house reprogramming during development (vs EPM5192GM-1/883B)
- MIL-STD-883B Class B screening directly satisfies military programs (vs EPM5192JC-1)
- Largest macrocell density in MAX 5000 family (vs EPM5130GM883B)
Design Notes
Once the EPM5192JM-1/883B is programmed for a production design, place an opaque label (black electrical tape or UV-blocking sticker) over the quartz window. Sunlight or fluorescent lighting contains enough UV-A (315-400 nm) to gradually erase the EPROM-based configuration over weeks-months, causing field failures. The non-windowed GM package variants in this family eliminate this risk entirely for production builds.
Use a minimum 4-layer PCB with a continuous ground plane beneath the JLCC-84 footprint. Decouple each VCC pin with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, plus a single 10 uF tantalum bulk capacitor near the device. The 84-pin JLCC lead pitch is 1.27 mm (50 mil) - standard J-lead soldering profile with peak temperature 220 C Β±5 C, 60 sec above 183 C, is recommended for the ceramic package.
Estimated: With 192 macrocells toggling at 10 MHz, typical ICC for the EPM5192JM-1/883B at 5V is approximately 150-200 mA; standby current is <10 mA. Use a regulator with at least 250 mA headroom and 5% tolerance. Add bulk decoupling on VCC planes since the device draws current in sharp transitions during macrocell state changes, which can couple into analog rails if not isolated.
The ceramic JLCC-84 package has excellent thermal conductivity (theta_JA approx 30 C/W in still air, lower with airflow). At full military temperature (-55C to +125C), no heatsink is required for typical 192-macrocell designs drawing under 250 mA. However, for fully-populated designs with all I/Os switching at maximum frequency, derate by 20% or provide forced-air cooling for high-altitude applications where air density is reduced.
Route all dedicated input pins (typically pins 35, 59, 71, 80, 81, 82, 83) directly to connectors or nearby drivers without stubs - these are pure input paths that bypass the macrocell output buffers and benefit from shortest electrical path. Similarly, group ground pins (10, 22, 34, 46, 58, 70) around the package perimeter and stitch them to the ground plane with multiple vias each to minimise ground bounce on simultaneous-switching outputs (SSOs).
Compliance Information
MIL-STD-883B Class B screened per MIL-STD-883 Test Methods. RoHS/REACH/lead-free status marked unknown - the hermetic ceramic JLCC package and military-screened supply chain typically fall outside RoHS scope (military/aerospace exemptions), but no manufacturer datasheet statement is available in the verified web data.
