H5AN8G6NAFR-UHC - 8Gb DDR4 SDRAM 2400MT/s | SK Hynix
MPN: H5AN8G6NAFR-UHC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.1944 | $0.19 |
| 10 | $0.1944 | $1.94 |
| 100 | $0.1944 | $19.44 |
| 500 | $0.1944 | $97.20 |
| 1,000 | $0.1944 | $194.40 |
Drop-in alternatives for H5AN8G6NAFR-UHC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5AN8G6NAFR-RDC
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View Datasheet →H5AN8G6NAFR-PBC
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View Datasheet →H5AN8G6NCJR-VKC
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View Datasheet →H5AN8G6NDJR
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View Datasheet →MT40A512M16JY-075E
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View Datasheet →H5AN8G6NAFR-UHC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM (CMOS) |
| Memory Density | 8 Gbit |
| Organization | 512M x 16 |
| Supply Voltage | 1.2 V |
| Data Rate | 2400 MT/s |
| Clock Architecture | Differential clock (CK_t / CK_c), fully synchronous |
| Package | 96-ball FBGA (TFBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C |
| Refresh | Auto self-refresh |
| Precharge | Auto precharge function |
| Reset | Asynchronous reset function |
| Data Mask | DM function supported |
| Termination | Dynamic on-chip termination (ODT) |
| Calibration | ZQ calibration function |
| Error Checking | CRC function |
| Write Leveling | Write leveling function supported |
H5AN8G6NAFR-UHC 96-ball fbga (tfbga) Pin Configuration Guide
Complete pinout information for H5AN8G6NAFR-UHC (96-ball fbga (tfbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5AN8G6NAFR-UHC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5AN8G6NAFR-UHC is suitable for 6 applications: Embedded Main Memory, Industrial Control and Automation, Networking and Communication Equipment, Set-Top Boxes and Smart TV Platforms, Storage Systems and SSD Controllers, Imaging and Vision Buffer Memory.
Embedded Main Memory
The H5AN8G6NAFR-UHC serves as main system memory for embedded processors and SoCs with x16 DDR4 memory controllers. Its 8Gbit density in a single 96-ball FBGA device provides 512M x 16 organization, allowing 1GB or 2GB systems with two or four devices memory-down on the PCB. The 2400MT/s data rate delivers up to 4.8 GB/s peak bandwidth per device at 1.2V, sufficient for Linux-class embedded platforms. Features such as auto self-refresh preserve memory contents during low-power states, while dynamic ODT simplifies multi-device fly-by routing without external termination networks.
Recommended
Industrial Control and Automation
Industrial PCs, PLCs, and motion controllers require large memory density with high bandwidth for real-time control loops and HMI rendering. The H5AN8G6NAFR-UHC supplies 8Gbit per device with the asynchronous reset function enabling deterministic power-up sequencing in noisy factory environments. Its 0C to +85C operating range covers most industrial cabinets with forced or natural convection. The CRC function adds data-integrity checking on the command/address bus, reducing silent corruption risk in electrically noisy settings near variable-frequency drives and switching loads.
Recommended
Networking and Communication Equipment
Routers, switches, and network-attached storage platforms use DDR4 for packet buffering, flow tables, and control-plane software. The H5AN8G6NAFR-UHC provides 4.8 GB/s peak bandwidth at 2400MT/s, and its ZQ calibration maintains output driver impedance accuracy across temperature drift, critical for 24/7 network hardware. Multiple devices on a shared fly-by address bus benefit from write leveling and dynamic ODT, which the device fully supports. The 96-ball FBGA surface-mount format allows memory-down placement directly on switch main boards without DIMM connectors, saving board area and height.
Recommended
Set-Top Boxes and Smart TV Platforms
Digital media and TV platforms with integrated DDR4 controllers use x16 DRAM devices for cost-effective single-chip memory configurations. The H5AN8G6NAFR-UHC offers a 16-bit-wide bus that matches consumer SoC memory interfaces, delivering 4.8 GB/s peak bandwidth for 4K video decode buffering. Auto self-refresh minimizes standby power during always-on wake scenarios, and the data mask function enables efficient partial writes for frame-buffer updates. Its commercial 0C to +85C range matches consumer electronics environmental requirements at a commodity price point.
Recommended
Storage Systems and SSD Controllers
Enterprise and consumer SSD controllers use external DRAM for firmware execution and NAND mapping tables. An 8Gbit device such as the H5AN8G6NAFR-UHC provides 1GB per x16 device, sufficient for mapping tables of multi-terabyte drives. The 2400MT/s rate with full synchronicity to both clock edges gives controllers low-latency random access to mapping data, directly improving small-block IOPS. ZQ calibration and dynamic ODT preserve signal integrity across drive thermal cycles, while the asynchronous reset input allows the SSD controller to recover the DRAM deterministically during power-fail sequences.
Recommended
Imaging and Vision Buffer Memory
Machine-vision cameras and medical imaging pipelines capture high-resolution frames that must be buffered before processing. The H5AN8G6NAFR-UHC offers 512M x 16 organization with 4.8 GB/s peak bandwidth, adequate for sustained streaming of multiple high-resolution sensor channels into frame buffers. The data mask function enables partial frame-region updates without read-modify-write cycles, and CRC protects the command/address path during long-duration captures. Its memory-down FBGA-96 format fits inside compact camera head assemblies where connector-based memory is impractical.
Recommended
Recommended Products Summary
Engineering reference data for H5AN8G6NAFR-UHC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5AN8G6NAFR-RDC | H5AN8G6NAFR-PBC | H5AN8G6NCJR-VKC | MT40A512M16JY-075E |
|---|---|---|---|---|---|
| Package | 96-ball FBGA (TFBGA) | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | Micron Technology |
| Density | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Data Rate | 2400 MT/s | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | DDR4-2400 class (075E bin) |
| Operating Temperature | 0C to +85C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Die Revision | AFR (xxC family) | AFR - same | AFR - same | CJR - newer | Micron 8Gb DDR4 |
Key Differentiators
- Native x16 organization in a single 8Gb device (vs H5AN8G8NAFR-UHC)
- Newer-generation die available in same footprint (vs H5AN8G6NCJR-VKC)
- Cross-brand supply-chain hedge (vs MT40A512M16JY-075E)
Design Notes
At 2400MT/s, keep DQ-to-DQS length mismatch within the controller's skew budget (typically a few tens of picoseconds; check your controller spec). Route CK_t/CK_c as a tightly coupled differential pair and reference all high-speed traces to a continuous ground plane. Use IBIS models from SK Hynix for pre-layout simulation; enable write leveling in the controller to compensate fly-by clock skew across devices.
Place the ZQ calibration resistor (240 ohm, 1% tolerance) within a few millimeters of the ZQ ball with a short, low-inductance ground return - ZQ accuracy directly sets output driver impedance. Provide at least one 0.1uF ceramic decoupling capacitor per VDD/VDDQ ball pair plus bulk capacitance per device. Drive RESET_n low during power-rail ramp to keep outputs high-impedance and prevent bus contention during controller boot.
Do not substitute suffix variants (-UHC vs -RDC vs -PBC) without re-verifying speed bin and self-refresh temperature grade against your memory controller training tables - the suffixes encode different operating points of the same die. Also, x16 parts like this one use a single DQS pair per byte-pair and are NOT pin-compatible with x8 organized parts in similar FBGA packages; confirm organization before second-sourcing.
Compliance Information
Compliance status not stated in provided web data; consult the SK Hynix product page or LCSC listing C499916 for RoHS/REACH declarations.
