Samsung Electronics

K9LUGY8J7D-BCK0 - Samsung V-NAND Flash Memory | Samsung

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[DATA_NEEDED: VCC range] Vdss [DATA_NEEDED: package type and dimensions] Package V-NAND (3D NAND flash) Memory
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Drop-in alternatives for K9LUGY8J7D-BCK0 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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K9KUGY8J7C-BCK0

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Samsung Electronics
📦 [DATA_NEEDED: package]
NAND Flash (TLC V-NAND) · 1 Tb · [DATA_NEEDED: page/block organization] · TLC (3 bits/cell) · [DATA_NEEDED: toggle DDR / ONFI mode] · [DATA_NEEDED: VCC range in V] · [DATA_NEEDED: VCCQ range in V] · [DATA_NEEDED: page size in KB]

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K9KUGY8J7C-CCK0

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Samsung Electronics
📦 [DATA_NEEDED: package]
Samsung Electronics · K9-Series V-NAND · NAND Flash · TLC (Triple-Level Cell) · Samsung V-NAND (3D NAND) · [DATA_NEEDED: total device density] · [DATA_NEEDED: page/block/plane organization] · [DATA_NEEDED: asynchronous/synchronous toggle interface mode]

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K9JUGY8J5C-BCK0

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NAND Flash (V-NAND TLC) · 1 Tb · Triple-Level Cell (TLC) · Samsung V-NAND (3D) · [DATA_NEEDED: page/block organization] · [DATA_NEEDED: page size] · [DATA_NEEDED: block size] · [DATA_NEEDED: async/DDR or Toggle DDR interface and mode]

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K9JUGY8J5C-CCK0

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Samsung Electronics · NAND Flash - V-NAND (TLC) · 1 Tb (128 GB) · TLC (Triple-Level Cell) · V6 (6th-gen V-NAND, 128-layer) · [DATA_NEEDED: page/block organization] · [DATA_NEEDED: toggle/ONFI mode] · [DATA_NEEDED: BGA package code and dimensions]

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K9IUGY8J7B-BCK0

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Samsung Electronics
📦 [DATA_NEEDED: package]
Samsung Electronics · K9IUGY8J7B-BCK0 · V-NAND Flash (raw NAND) · 1 Tbit · TLC (Triple-Level Cell, 3 bits/cell) · Samsung V-NAND (3D vertical NAND) · BCK0 · [DATA_NEEDED: interface type and data rate]

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K9IUGY8J7B-CCK0

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Samsung Electronics
📦 [DATA_NEEDED: package]
1 Tb (Tera bit) · NAND Flash, 3D V-NAND TLC · TLC (3 bits per cell) · V6 (6th generation) · 4448-128L (128-layer) · Samsung Electronics · [DATA_NEEDED: bus interface type] · [DATA_NEEDED: VCC voltage]

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$1 / Unit

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K9LUGY8J7D-BCK0 Maximum Ratings & Electrical Characteristics

Manufacturer Samsung Electronics
Product Type 3D V-NAND Flash Memory
Memory Technology V-NAND (3D NAND flash)
Mounting Type Surface Mount
RoHS Status unknown

K9LUGY8J7D-BCK0 [data_needed: package type and dimensions] Pin Configuration Guide

Complete pinout information for K9LUGY8J7D-BCK0 ([data_needed: package type and dimensions] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

[data_needed: package type and dimensions] package pinout diagram for K9LUGY8J7D-BCK0

No detailed pinout data available for K9LUGY8J7D-BCK0.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for K9LUGY8J7D-BCK0 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

K9LUGY8J7D-BCK0 is suitable for 6 applications: Solid-State Drives, Embedded eMMC / UFS Storage, Industrial Storage Modules, Set-Top Boxes and Smart TVs, Networking and Telecom Equipment, Automotive Infotainment and Telematics.

🖥️

Solid-State Drives

Samsung V-NAND devices of the K9LUGY8J7D class are core storage media in client and consumer SSDs. The vertical 3D cell stacking delivers high bits per package, allowing SSD controllers to aggregate multiple dies on shared channels for parallelism. In this role the NAND connects to an SSD controller over toggle-mode/ONFI interfaces; the controller implements wear leveling, LDPC ECC, and garbage collection to manage TLC cell endurance characteristics. The design benefit is high capacity per BGA footprint with Samsung's mature V-NAND reliability record, while the trade-off is strict dependence on controller firmware quality for endurance and retention.

📱

Embedded eMMC / UFS Storage

Raw V-NAND of this family is packaged by Samsung into eMMC and UFS embedded storage modules used in smartphones, tablets, and IoT devices. The K9LUGY8J7D-class NAND provides the non-volatile layer behind the eMMC/UFS controller, which abstracts NAND management from the host. Benefits include proven V-NAND endurance, high sequential throughput over the UFS interface, and industrial temperature options. Designers of custom embedded boards who choose raw NAND instead of finished eMMC gain cost control but must implement full flash translation layers, bad-block management, and refresh algorithms in their host controller firmware.

🏭

Industrial Storage Modules

Industrial PCs, data loggers, and factory automation systems use V-NAND like the K9LUGY8J7D-BCK0 in CFast, mSATA, and board-level storage modules. V-NAND's charge-trap cells tolerate program-disturb stress better than planar NAND, supporting the high write duty cycles of logging applications. Industrial builds benefit from fixed-BOM supply agreements on Samsung NAND and predictable endurance data for maintenance scheduling. The design consideration is that industrial controllers must implement power-fail protection circuits (bulk capacitors plus firmware checkpointing) because unexpected power loss during a program operation can corrupt the affected page.

📺

Set-Top Boxes and Smart TVs

Broadcast and streaming set-top boxes use K9LUGY8J7D-class V-NAND for firmware storage and DVR content buffering. The BGA NAND provides gigabit-class capacity in a compact footprint, and toggle-mode interfaces keep controller pin counts low. Low standby power of V-NAND suits always-on consumer electronics, and the TLC density point keeps bill-of-material cost competitive for high-volume CE manufacturing. Designers should verify the NAND's timing modes against the SoC's NAND controller, as many CE SoCs support only a subset of toggle-mode speeds, requiring conservative timing configuration at boot.

🌐

Networking and Telecom Equipment

Routers, switches, and 5G small-cell equipment store firmware, configuration, and log data on V-NAND devices of this class. The K9LUGY8J7D-BCK0's high density enables redundant firmware banks and extended log retention on a single package. Samsung V-NAND's stable read-disturb behavior suits equipment with 24/7 read-mostly duty cycles, and the BGA package withstands vibration better than card-based storage. Telecom designers typically pair the NAND with industrial-temperature controllers and must derate endurance estimates for continuous ambient temperatures above the consumer baseline specified in the Samsung datasheet.

🚗

Automotive Infotainment and Telematics

Automotive head units, digital clusters, and telematics control units require multi-gigabyte non-volatile storage for navigation maps and media, using V-NAND like the K9LUGY8J7D-BCK0 within automotive-qualified eMMC/UFS or raw-NAND subsystems. V-NAND tolerance of wide temperature swings and high vibration environments makes it well matched to vehicle electronics, and its density supports OTA update partitioning with A/B fallback banks. Automotive designers must verify the specific ordering code's qualification level (AEC-Q100 grade or Samsung automotive qualification), since suffix variants differ, and should implement power-interruption-safe FTL firmware for cranking and load-dump scenarios.

What is the K9LUGY8J7D-BCK0?
The K9LUGY8J7D-BCK0 is a Samsung Electronics 3D V-NAND flash memory device in a BGA package, part of Samsung's K9LUGY8J7D family used in high-density mass-storage designs such as SSDs and embedded storage modules. The -BCK0 suffix identifies the speed grade and packing variant. Exact density, cell type, and interface specifications should be confirmed against the official Samsung datasheet for this ordering code before design-in.
What are the key specifications of K9LUGY8J7D-BCK0 that engineers should know?
The K9LUGY8J7D-BCK0 is a Samsung 3D V-NAND flash memory in a surface-mount BGA package. Key engineering parameters include device density, cell type (TLC/MLC), page and block sizes, tR/tPROG/tBERS timings, interface mode, VCC supply voltage, and program/erase endurance. According to Samsung product family documentation, all of these must be verified from the specific -BCK0 ordering-code datasheet; current verified web data did not expose these values, so consult the official Samsung datasheet PDF before design-in.
Where can I download the K9LUGY8J7D-BCK0 datasheet PDF?
The K9LUGY8J7D-BCK0 datasheet PDF is available from datasheet aggregation sites such as Alldatasheet.com and Datasheet4U.com, and nominally from Samsung Semiconductor's official product page at semiconductor.samsung.com. Samsung typically distributes V-NAND datasheets under NDA to qualified OEM customers, so the public full datasheet may be restricted; the aggregated sources listed above host distributor-level summaries and pinout diagrams.
What is the price of K9LUGY8J7D-BCK0?
Pricing for the K9LUGY8J7D-BCK0 was not published in distributor search results as of 2026-09-04. Samsung V-NAND components of this class are usually quoted directly by authorized distributors such as Samsung's OEM channel, Avnet or Arrow, and pricing varies significantly with NAND spot-market conditions. Contact XAIPART or an authorized Samsung distributor with your volume requirement for a current quotation.
Is K9LUGY8J7D-BCK0 in stock?
Stock status for the K9LUGY8J7D-BCK0 could not be confirmed from the retrieved distributor data as of 2026-09-04. High-density Samsung V-NAND components are frequently allocated to long-term OEM agreements, so open-market stock is limited. Use the XAIPART quote request or check Octopart and authorized distributors for live inventory; expect factory lead times when sourcing outside existing Samsung supply agreements.
What is the difference between K9LUGY8J7D-BCK0 and K9KUGY8J7C-CCK0?
Both are Samsung V-NAND flash devices in the same K9*UGY8J7* family with very similar package and interface characteristics. The K9LUGY8J7D-BCK0 is the newer generation with a D revision suffix, while K9KUGY8J7C-CCK0 belongs to the prior C revision of the same family. Differences typically include density, process node, and timing specifications. Samsung does not generally guarantee pin-to-pin substitution between generations without a controller firmware review, so verify the datasheets before swapping.
What is the best drop-in replacement for K9LUGY8J7D-BCK0?
The closest same-family drop-in candidates are other Samsung K9*UGY8J7* family members such as K9KUGY8J7C-BCK0 and K9KUGY8J7C-CCK0, which share the Samsung V-NAND BGA footprint and command set heritage. However, Samsung NAND parts are rarely cross-brand pin-compatible, and generation changes require controller and firmware validation. Always compare the pin map and parameter table of the candidate against the K9LUGY8J7D-BCK0 datasheet before qualifying a replacement.
What is the best Samsung equivalent for K9LUGY8J7D-BCK0?
Within Samsung's portfolio, the best equivalents are same-family ordering codes: K9KUGY8J7C-BCK0, K9KUGY8J7C-CCK0, and K9JUGY8J5C-BCK0/CCK0 from the immediately preceding generation. These share Samsung's V-NAND BGA packaging approach and NAND command interface. Note that cross-brand NAND equivalents (Micron, SK Hynix, Kioxia) use different ball maps and are not drop-in; a controller requalification is mandatory for any cross-brand NAND change.
Can K9KUGY8J7C-BCK0 replace K9LUGY8J7D-BCK0?
Possibly, but not automatically. The K9KUGY8J7C-BCK0 is the previous C-revision member of the same Samsung K9*UGY8J7* V-NAND family, sharing a similar BGA footprint and NAND interface. Differences in density, timing (tR, tPROG, tBERS), and ONFI/toggle-mode timing modes may require controller firmware updates and revalidation of ECC settings. Samsung recommends confirming both datasheets' parametric tables before qualifying the substitution in production.
When should I choose K9LUGY8J7D-BCK0 over the older K9KUGY8J7C?
Choose the K9LUGY8J7D-BCK0 (D revision) when a new design starts and you want the latest V-NAND generation, typically offering better density, lower power per bit, and improved endurance from process-node improvements. Choose the K9KUGY8J7C-BCK0/CCK0 when maintaining an existing board designed around the C revision, where requalification of a new device would cost more than the component savings. Always weigh controller firmware compatibility against supply longevity in the decision.
Is K9LUGY8J7D-BCK0 suitable for SSD applications?
Yes, Samsung K9LUGY8J7D-class V-NAND devices are primary components in consumer and client SSD designs. The high per-package density allows multi-die SSD configurations, and V-NAND's vertical stacking reduces cell interference at high densities. However, raw NAND requires a dedicated SSD controller implementing wear leveling, LDPC ECC, and garbage collection. For embedded designs, consider Samsung's pre-qualified eMMC or UFS modules instead of raw NAND to eliminate firmware development effort.
Does K9LUGY8J7D-BCK0 require ECC?
Yes, like all modern high-density NAND flash, the K9LUGY8J7D-BCK0 requires the host controller to implement error correcting code. V-NAND TLC-class devices generally need strong ECC such as LDPC rather than simple BCH, with correction strength requirements increasing as the device wears. The exact ECC requirement per page is specified in the Samsung datasheet. Omitting or under-provisioning ECC is the most common cause of data retention failures in raw-NAND designs.
Is K9LUGY8J7D-BCK0 RoHS compliant?
Samsung's current-generation V-NAND components, including the K9LUGY8J7D-BCK0 family, are manufactured to be RoHS-compliant and lead-free as standard for global markets. However, the retrieved web data did not include an explicit RoHS declaration for this exact ordering code, so this status is marked unknown in the compliance table. The authoritative declaration can be obtained from Samsung Semiconductor's product compliance documentation or your Samsung distributor.
What design considerations apply to K9LUGY8J7D-BCK0 PCB layout?
Design the PCB following Samsung's NAND BGA layout guidance: keep the data bus lines length-matched, maintain solid ground returns under the device, and decouple VCC and VCCQ rails with low-ESR ceramic capacitors placed close to the balls. Because NAND VCCQ can toggle in DDR/toggle modes at hundreds of MT/s, signal integrity on DQ/RE/WE lines is critical. Include test points for firmware bring-up and verify power sequencing between VCC and VCCQ per the datasheet.
Is K9LUGY8J7D-BCK0 the same as K9KUGY8J7C?
No, they are different devices, though closely related. K9LUGY8J7D-BCK0 is the D-revision device and K9KUGY8J7C-CCK0/BCK0 is the prior C-revision in the same Samsung V-NAND family. The letter changes indicate process generation, density, or die revision differences. They may share a similar BGA footprint, but Samsung does not guarantee identical ball maps or timings between revisions, so both datasheets must be compared before any substitution is attempted.

Engineering reference data for K9LUGY8J7D-BCK0 — comparison, design guidance, and compliance information.

Selection Guide

Choose the K9LUGY8J7D-BCK0 when starting a new high-density storage design (SSD, embedded module, industrial logger) where the latest Samsung V-NAND generation, best cost-per-bit, and longest supply outlook matter. Choose the K9KUGY8J7C-BCK0/CCK0 when maintaining or extending an existing board already qualified on the C revision, avoiding requalification cost. Choose the K9JUGY8J5C when a lower density point at lower cost suffices, and the K9IUGY8J7B only for legacy continuity. If your team lacks flash translation layer firmware capability, prefer Samsung's finished eMMC/UFS modules over raw NAND regardless of generation. Since verified parametric data for the -BCK0 ordering code was unavailable, obtain the official Samsung datasheet and confirm density, timings, and package before committing any substitution decision.

Comparison with Alternatives

Parameter This Product K9KUGY8J7C-BCK0 K9JUGY8J5C-BCK0 K9IUGY8J7B-BCK0
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics
Package [DATA_NEEDED: package] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Density [DATA_NEEDED: density] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Cell Type [DATA_NEEDED: cell type] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Interface [DATA_NEEDED: interface] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Supply Voltage [DATA_NEEDED: VCC] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Generation / Revision D revision (newest in family) C revision (prior) C revision, J5 family B revision, I generation
Price (qty 1) [DATA_NEEDED: pricing] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Newest D-revision V-NAND process generation (vs K9KUGY8J7C-BCK0)
  • Longer supply longevity than older generations (vs K9IUGY8J7B-BCK0)
  • Higher capacity option within the same family (vs K9JUGY8J5C-BCK0)

Design Notes

Samsung V-NAND devices use separate VCC (core) and VCCQ (I/O) supply rails. Decouple each rail with low-ESR ceramic capacitors (typically 0.1uF per ball group plus bulk capacitance) placed as close to the BGA as possible. Verify power sequencing between VCC and VCCQ in the device datasheet before power-tree design; incorrect sequencing can stress I/O structures. Estimated rail currents depend on operating mode (read, program, erase) and should be taken from the official Samsung datasheet ICC tables, which were not available in the current verified data.

In toggle-mode/DDR operation, DQ, RE#, and WE# lines toggle at high rates. Length-match the DQ bus within the tolerance specified by Samsung's layout guide, maintain a continuous ground reference plane beneath the bus, and avoid routing data lines across plane splits. Add series termination resistors near the driver as recommended for the applicable speed grade. Simulation of the full channel (controller, PCB trace, NAND input) is recommended for first-pass success on new boards using this V-NAND generation.

The most frequent raw-NAND design errors are under-provisioned ECC (modern TLC V-NAND needs LDPC, not simple BCH), missing bad-block management in the flash translation layer, and ignoring power-fail integrity - a lost power event during program/erase can corrupt the operating page or block. Budget firmware effort accordingly, and reserve spare blocks for wear leveling. Also confirm the exact -BCK0 suffix meaning (speed grade/packing) from Samsung before ordering, since suffix variants are not interchangeable on the same PCB in all cases.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

No explicit compliance declarations for this exact ordering code were present in the retrieved web data. Samsung current-generation V-NAND is generally RoHS/lead-free compliant as standard; obtain the official declaration from Samsung Semiconductor product compliance documentation.

Data verified on: 2026-09-04 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Samsung Electronics K9LUGY8J7D-BCK0 K9KUGY8J7C-BCK0 K9KUGY8J7C-CCK0 K9JUGY8J5C-BCK0 K9IUGY8J7B-BCK0 V-NAND NAND flash flash memory non-volatile memory memory IC solid-state drive eMMC UFS toggle-mode DDR interface ONFI LDPC ECC BGA package surface mount wear leveling TLC RoHS
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