K4A4G085WG-BCWE vs K4A4G085WD-BCRC 比較
詳細並排比較 K4A4G085WG-BCWE 由 Samsung Electronics 與 K4A4G085WD-BCRC 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4A4G085WG-BCWE | K4A4G085WD-BCRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM (Volatile) | DDR4 SDRAM (D-die) |
| 記憶體容量 | 4 Gb | — |
| Memory Organization | 512M x 8 | — |
| 資料速率 | 3200 Mbps/pin | 2400 Mb/s (PC2400) |
| Speed Class | DDR4-3200 | — |
| Supply Voltage (VDD) | 1.2 V | — |
| Technology | D-die DDR4 | — |
| 封裝 | FBGA-78 (BCW) | FBGA-78 (TFBGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| 介面 | Parallel (DDR4) | Parallel |
| Burst Length | BL8 | — |
| DLL Mode | DLL Enabled (per datasheet timing) | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | — |
| Refresh | [DATA_NEEDED: refresh rate specification] | [DATA_NEEDED: Refresh specification] |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS Status] |
| Packaging | Tray | — |
| Memory Density | — | 4 Gbit |
| 組織 | — | 512M x 8 |
| 供應電壓 | — | 1.2 V |
| Number of Terminals | — | 78 |
| Access Mode | — | Multi-bank page burst |
| CAS 延遲 | — | [DATA_NEEDED: CAS Latency] |
| 工作溫度範圍 | — | [DATA_NEEDED: Operating Temperature Range] |
| MSL 等級 | — | [DATA_NEEDED: MSL Level] |