FPGA & CPLD
Products (6358)
EP1S80B956C6 - Stratix 80k LE FPGA, 956-BGA, 683 I/O | Altera
The Altera (Intel) EP1S80B956C6 is a high-density Stratix FPGA featuring 79,040 logic elements, 7,427,520 bits of embedded memory, 683 user I/O pins, and a 956-ball FineLine BGA package with a -6 speed grade. It belongs to the original Stratix family fabricated on a 130 nm CMOS process with 1.5 V core supply and operates over the commercial 0C to 85C junction temperature range. The device integrates DSP blocks, TriMatrix memory, and high-speed transceivers into a single programmable fabric, making it a workhorse for ASIC prototyping and high-throughput parallel processing. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP slices, PLLs, and serializer/deserializer (SerDes) transceivers. FPGAs sit between general-purpose microcontrollers and ASICs in the design hierarchy: microcontrollers execute software sequentially, FPGAs run parallel hardware logic with deterministic latency, and ASICs offer the same parallelism at lower unit cost only after non-recurring engineering (NRE) investment. FPGAs are used when time-to-market, in-field reconfigurability, or parallel data-path throughput outweigh raw per-unit cost. Key features of the EP1S80B956C6 include 79,040 logic elements distributed across 7,904 Logic Array Blocks (LABs), 6.336 Mbit of TriMatrix memory organized as M512, M4K, and M-RAM blocks, 22 DSP blocks for 250 MHz fixed/floating-point arithmetic, and 12 high-speed transceiver channels supporting up to 3.125 Gbps. The device also provides 8 phase-locked loops (PLLs), 16 clock networks, and Fast On-Line configuration via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes. Typical applications include ASIC prototyping, high-speed data acquisition, telecom line cards with SERDES aggregation, image processing pipelines, and software-defined radio (SDR) front ends. The 683 user I/Os with flexible I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X) allow direct connection to DDR SDRAM, QDR SRAM, ZBT SRAM, and standard parallel buses. For high-bandwidth designs, dedicated source-synchronous interfaces support external clock-data recovery without consuming general-purpose logic. When designing with the EP1S80B956C6, ensure proper decoupling with 100 nF and 10 uF capacitors within 5 mm of each power pin, and follow the 956-ball FCBGA escape routing recommendations in the Stratix Device Handbook. Note that the -6 speed grade trades approximately 25% lower Fmax for lower cost compared to -7 and -8 grades; for designs targeting above 250 MHz Fmax, the -7 grade is recommended.
EP1S80B956C6AA - Stratix FPGA 79,040 LEs 956-BGA | Intel
The Intel (Altera) EP1S80B956C6AA is a high-density Stratix FPGA delivering 79,040 logic elements, 742 M4K RAM blocks (totalling approximately 7.4 Mbit of embedded memory), and 683 user I/O pins in a 956-ball BGA package. It belongs to the original Stratix family fabricated on a 130 nm process with embedded TriMatrix memory, dedicated DSP blocks, and high-speed transceivers on selected device variants. Operating across industrial temperature grades and supporting 1.5 V core VCCINT with MultiVolt I/O, the EP1S80B956C6AA is intended for high-performance digital signal processing, telecom infrastructure, and ASIC prototyping. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP such as DSP slices, block RAM, and high-speed transceivers. The Stratix family sits within Intel's hierarchy of programmable logic devices, bridging the gap between high-density ASICs and lower-cost CPLDs by offering hardware-level parallelism, deterministic timing, and re-programmability. Within Intel's portfolio, Stratix preceded Stratix II, III, IV, and V families, all of which incrementally advanced process node and transceiver bandwidth. Key features of the EP1S80B956C6AA include 6 embedded PLLs, 12 global clock networks, dedicated 18-bit x 18-bit multiplier blocks for DSP, and a flexible I/O structure supporting LVDS, SSTL, LVTTL, and PCI I/O standards. The device supports JTAG-based programming via the IEEE 1149.1 boundary-scan interface and configuration via serial or parallel schemes using dedicated configuration pins. Internal pull-up resistors on user I/O pins simplify board-level design when no external bias network is desired. Architecturally, the EP1S80B956C6AA employs SRAM-based configuration memory backed up by a configuration controller that supports the Stratix passive or active serial configuration scheme. Embedded memory blocks (M512, M4K, M-RAM) deliver distributed dual-port storage with independent read/write clocks. The DSP blocks integrate multiplier/accumulator structures operating at up to 135 MHz in the -6 speed grade, enabling efficient FIR filtering, FFT engines, and baseband processing. Typical applications include high-throughput DSP pipelines for baseband processing, ASIC prototyping and emulation platforms, telecom line-card packet processing, broadcast video processing, and high-speed data acquisition systems. The 683 I/O pins make it suitable for systems requiring multiple high-bandwidth LVDS channels and parallel bus interfaces. Designers typically pair the device with external DDR SDRAM, Flash configuration memory, and a clock distribution buffer. When designing with this FPGA, verify power-sequencing of VCCINT before VCCIO to prevent latch-up, and place decoupling capacitors close to every BGA power/ground ball pair. Quartus II software is required for design entry, synthesis, place-and-route, and timing analysis; the device is supported by Quartus II versions 5.0 through 13.0sp1, with newer Quartus releases dropping legacy Stratix support.
EP1S80B956C6AB - Stratix 79K LE FPGA, 956-BGA | Intel
The Intel EP1S80B956C6AB is a high-density Field Programmable Gate Array (FPGA) from the Stratix family, fabricated on a 130 nm process node and offering 79,040 logic elements in a 956-ball FCBGA package. It operates at a core voltage of 1.5 V with up to 683 user I/O pins and supports clock frequencies up to 450.05 MHz, making it suitable for high-performance digital logic, DSP, and communications designs. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement custom digital circuits through software configuration rather than ASIC fabrication. Stratix-class FPGAs belong to the hierarchy programmable logic → programmable logic device (PLD) → field programmable gate array (FPGA) → high-density FPGA → embedded system-on-chip (SoC) FPGA, integrating logic, memory blocks, DSP blocks, transceivers, and I/O on a single die. Key features of the EP1S80B956C6AB include 79,040 logic elements (LEs), high-speed TriMatrix memory blocks, embedded DSP blocks for fixed- and floating-point arithmetic, up to 683 user I/Os, and multiple phase-locked loops (PLLs) for clock management. The 956-ball FCBGA package supports high signal count and signal integrity required by parallel buses, memory interfaces, and external transceiver connections. Architecturally, the EP1S80B956C6AB uses a 130 nm SRAM-based lookup table (LUT) fabric with embedded RAM, DSP multipliers, and a high-speed interconnect. This gives designers deterministic timing, hardware-level parallelism, and the ability to implement custom accelerators, bus protocols, and data-path pipelines that would be costly or impossible on a fixed-architecture processor. Typical applications include high-speed digital signal processing (DSP) and data encryption, network packet processing, ASIC prototyping, parallel compute accelerators, and high-bandwidth interface bridging. Stratix FPGAs have historically been deployed in telecom infrastructure, test and measurement, military/aerospace, and broadcast video processing systems. When designing with this part, allocate sufficient PCB area for power decoupling around the FCBGA, follow Intel/Altera pin-out guidelines for memory interface traces, and validate timing closure in Quartus II. Thermal management is important because 130 nm Stratix devices dissipate meaningful power at high toggle rates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select and source the EP1S80B956C6AB with confidence for new designs, EOL re-spins, and legacy system maintenance.
EP1S80F1020C5 - Stratix 80,640 LEs 1020-BGA FPGA | Altera
The Altera (Intel) EP1S80F1020C5 is a high-density Stratix FPGA in the 1020-ball FineLine BGA package with 80,640 logic elements, 7,427,520 total RAM bits, and 773 maximum user I/Os. It belongs to the original Stratix family, the industry's first FPGA family to embed TriMatrix memory, dedicated DSP blocks, and high-speed transceivers on a 0.13 µm CMOS process. This -C5 speed grade variant targets commercial-temperature designs (0 °C to 85 °C) and is intended for cost-optimized, non-transceiver-centric systems where the largest Stratix logic capacity is required. An FPGA (Field Programmable Gate Array) is a programmable logic device containing configurable logic blocks (LEs/ALMs), programmable interconnect, and hard IP blocks such as block RAM, DSP multipliers, PLLs, and I/O serdes. FPGAs are programmed via HDL (VHDL/Verilog) and synthesized into bitstreams that configure the device at power-up. Compared to ASICs, FPGAs offer faster time-to-market, lower NRE, and field re-programmability; compared to CPLDs, FPGAs provide higher logic density, larger embedded memory, and parallel DSP throughput. The Stratix family occupies the high-density, feature-rich tier of the FPGA hierarchy: FPGA → programmable logic → digital IC → semiconductor. Key features include 80,640 logic elements organized in 7,904 LABs, 12 embedded DSP blocks, 12 PLLs, 6 phase-locked clock networks, and 7,427,520 bits of TriMatrix memory split across M512, M4K, and M-RAM blocks. The device supports 21 multi-standard I/O banks with LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X interfaces. Per the Stratix Device Family Data Sheet, the EP1S80F1020C5 is the largest density in the Stratix family and is suited to the most aggressive ASIC-prototyping and system-on-chip integration tasks of its era. The EP1S80F1020C5 is used in communications infrastructure, ASIC prototyping, high-performance DSP, video/image processing, military/aerospace signal processing, and storage system designs where 80 K LEs of logic and large embedded memory are required. Typical applications include software-defined radio, multi-channel baseband processing, encryption accelerators, and high-speed bridging between legacy parallel buses and serial interfaces. When designing with the EP1S80F1020C5, careful PCB layout is required for the 1020-ball 33×33 mm FCBGA package, including BGA escape routing, matched-length differential pairs for LVDS, and a multilayer PCB with dedicated power and ground planes. Heat removal on the C5 speed grade is generally passive in typical indoor enclosures, but thermally-challenged enclosures may require airflow or a heat spreader.
EP1S80F1020C5N - 79,040 Logic Elements FPGA | Intel
Intel EP1S80F1020C5N is a high-density Stratix field-programmable gate array (FPGA) providing 79,040 logic elements, 7,904 logic-array blocks, and 773 user I/O pins in a 1,020-ball fine-pitch BGA package measuring 33 mm by 33 mm. The verified device data identifies a CMOS programmable-logic architecture, an FBGA-1020 package with 1 mm pitch, and a commercial operating-temperature range from 0 °C to 85 °C. It is intended for high-performance, reconfigurable digital systems requiring substantial logic capacity and a large user-I/O interface. A field-programmable gate array is a semiconductor device containing programmable logic blocks, programmable interconnects, and configurable I/O resources. FPGA devices are positioned hierarchically within programmable logic, digital logic ICs, integrated circuits, and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing, allowing hardware functions to be changed without redesigning the silicon. Stratix devices are used when engineers need high logic density, broad interface capability, and implementation flexibility. The principal verified parameters are 79,040 logic elements, 7,904 logic-array blocks, and 773 I/O pins. These resources make the device suitable for parallel datapaths, protocol processing, control logic, and systems integrating many external interfaces. Its 1,020-ball FBGA package supports the scale of the device while using a 1 mm ball pitch. The supplied package data describes the package as 33 mm by 33 mm and FBGA-1020. EP1S80F1020C5N belongs to the Stratix FPGA family and uses CMOS technology. The exact device architecture combines programmable logic resources with user-configurable I/O. The verified listings do not provide speed grade, embedded-memory capacity, phase-locked-loop count, transceiver count, supply-voltage limits, or thermal-resistance values; those parameters require confirmation from the manufacturer datasheet before schematic, power, timing, or thermal sign-off. Typical applications include industrial control, communications infrastructure, test and measurement, image processing, and high-performance embedded computing. The 79,040 logic elements support large concurrent designs, while 773 user I/O pins are valuable for memory buses, parallel converters, control interfaces, and board-level communication. Engineers should not infer electrical performance from logic capacity alone; pinout, configuration circuitry, clocking, power integrity, and signal-integrity constraints must be checked against the official datasheet. A 1,020-ball fine-pitch package requires controlled PCB fabrication, accurate component placement, sound power-delivery design, and reliable high-speed layout practices. Because exact supply requirements and I/O-bank characteristics are absent from the verified data, use the manufacturer documentation rather than estimated values when selecting regulators, decoupling networks, configuration components, or board-stackup rules. This product synthesis combines the verified distributor specifications, package details, sourcing context, and practical FPGA integration guidance while clearly separating confirmed values from parameters that still require datasheet verification. Pricing is shown as of 2026-09-07 and does not imply current stock, lifecycle availability, or a drop-in substitute recommendation.
EP1S80F1020C6 - Stratix FPGA 79,040 Logic Elements | Intel
The Intel (formerly Altera) EP1S80F1020C6 is a high-density Stratix family Field-Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, delivering 79,040 logic elements, 7,427,520 RAM bits, and 773 user I/O pins in a 1020-ball FC-FBGA package measuring 33 x 33 mm with a 1.0 mm pitch. The 'C6' speed grade and 'C' temperature grade (commercial, 0C to +85C) target mainstream performance applications, with internal logic and signal-chain resources that support DSP, memory interfaces, and high-speed serial I/O typical of first-generation Stratix silicon. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device whose logic fabric, interconnect, and I/O are configured by the user after manufacture, allowing the same silicon to implement any digital circuit from glue logic to a multi-million-gate SoC. FPGAs belong to the broader programmable logic family, which also includes CPLDs (Complex Programmable Logic Devices). Within Intel's portfolio the Stratix line sits between the lower-density Cyclone family and the high-end Stratix GX/Stratix II families, and is built on a silicon-and-software platform that integrates hard IP blocks such as DSP slices, embedded memory (TriMatrix), and high-speed transceivers to accelerate compute-intensive and signal-processing workloads. Key features include 79,040 logic elements (LEs), 7,427,520 bits of embedded RAM organized in TriMatrix memory blocks, DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed serializer/deserializer (SERDES) support on select pins, and 773 maximum user I/O pins. The device operates from a 1.5 V core supply (1.425 V to 1.575 V range per GlobalSpec datasheet) and is built on 130 nm process technology. The 'C6' speed grade reflects internal timing closure targets and is suitable for designs whose critical-path Fmax is within the Stratix C6 timing envelope. The architecture pairs a four-input lookup-table (LUT)-based logic element with adjacent LE carry chains, distributed LAB (Logic Array Block) interconnect, and embedded multiplier/accumulator DSP blocks. TriMatrix memory provides three sizes of RAM block optimized for different width/depth trade-offs, supporting true dual-port, simple dual-port, and single-port modes. Configuration is loaded through a JTAG (IEEE 1149.1) boundary-scan interface or an external configuration device, and design entry is via the Quartus II development suite. Typical applications for the EP1S80F1020C6 include telecom line cards and baseband processing, ASIC prototyping and emulation, high-performance DSP co-processing, broadcast video and image processing pipelines, and industrial control and test equipment where high logic density and embedded memory are required. The 1020-ball FC-FBGA (flip-chip fine-pitch BGA) package is intended for multilayer PCBs with high-density escape routing. When designing with this part, allocate a 1.0 mm-pitch BGA escape fanout on at least six PCB layers, and use the Quartus II pin planner with the Stratix device handbook pinout file to verify bank-specific I/O standard support (LVTTL, LVCMOS, LVDS, SSTL, HSTL). Power integrity must be planned for the 1.5 V core rail (typically 3-6 A peak depending on utilization) with decoupling placed inside the package BGA footprint. This page synthesizes distributor availability, package/parametric specifications, and practical design notes specific to the 1020-ball FC-FBGA package; a separate FC-FBGA pinout diagram accompanies the part on the product detail tab.
EP1S80F1020C6N - Stratix 79,040 Logic Elements FPGA | Intel (Altera) | 1020-BGA
The Intel (formerly Altera) EP1S80F1020C6N is a high-density Stratix family Field Programmable Gate Array (FPGA) featuring 79,040 logic cells (7,427,520 equivalent gates) and a maximum of 7904 LABs/CLBs, packaged in a 1020-ball Flip-Chip BGA (FBGA) measuring 33 x 33 mm with a 1 mm pitch. It provides up to 773 user I/Os and is built on a 1.5 V, 130 nm CMOS process targeting commercial-grade applications in the 0C to 85C operating range. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O blocks, all controlled by a user-defined bitstream. FPGAs sit between fixed-function ASICs (high NRE cost, low unit cost) and microcontroller-based designs (low flexibility, low performance) in the semiconductor hierarchy, enabling rapid prototyping, mid-volume production, and hardware-acceleration of DSP, networking, and signal-processing workloads. The Stratix family specifically targets high-performance applications that require embedded multipliers, memory blocks, and high-speed transceivers. Key features include 79,040 logic elements organized into 7904 LABs/CLBs, 773 user I/Os, and a 1020-ball FBGA package, all backed by the Stratix family's TriMatrix memory architecture and DSP blocks. The device integrates RAM blocks, PLL-based clock management, and high-speed LVDS I/O support for demanding parallel and serial interfaces. The EP1S80F1020C6N utilizes Altera's Stratix architecture with embedded DSP blocks and high-speed memory, supporting core frequencies up to 450 MHz in Stratix-family devices per the FindIC comparison data. The 130 nm process node delivers a balance of logic density, performance, and power efficiency typical of early-2000s high-end FPGAs, while the 1 mm-pitch FBGA package enables high pin count on a manageable board footprint. Typical applications include telecommunications infrastructure (SONET/SDH framer, protocol bridging), high-speed data acquisition and DSP signal processing, ASIC prototyping, broadcast video processing, and military/aerospace signal-processing subsystems where the 79K LE density provides ample headroom for complex datapaths. When designing with this part, ensure the PCB layout supports the 33 x 33 mm, 1 mm-pitch BGA with full fan-out, including 6-8 routing layers and microvia stacks. Confirm configuration memory interface design (EPCS serial flash) and thermal management for the C6N (commercial) speed grade. Devices in this family are typically sourced as NRND/EOL inventory - verify lead time before committing to production.
EP1S80F1020C7 - Stratix 79,040 Logic Element FPGA | Intel (Altera)
The Intel (formerly Altera) EP1S80F1020C7 is a high-density Stratix Field Programmable Gate Array (FPGA) integrating 79,040 logic elements and 7,427,520 system gates in a 1020-ball FineLine BGA package (33 x 33 mm, 1 mm pitch) with 773 user I/O pins. Per the manufacturer datasheet, it operates from a 1.425 V to 1.575 V core supply and is rated for the commercial 0 C to 85 C temperature range, making it suitable for mainstream logic and DSP prototyping designs. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as block RAM, DSP multipliers, PLLs, and high-speed transceivers. Within the broader semiconductor taxonomy, FPGAs sit alongside CPUs, GPUs, and ASICs as a programmable hardware platform, and are commonly categorized under logic ICs / programmable logic. The Stratix family was Altera's first-generation high-performance FPGA family, later succeeded by Stratix II, III, IV, and V. The EP1S80 sits at the top of the Stratix density ladder, providing 7,427,520 typical gates which is the maximum logic density available in the family. Key specifications include 79,040 logic elements organized into 7,904 logic array blocks (LABs), 773 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), embedded TriMatrix memory blocks, dedicated DSP blocks for high-speed multiplication and accumulation, up to 12 PLLs for clock management, and configuration via passive serial (PS), fast passive parallel (FPP), or JTAG modes. The 1020-ball FBGA package uses a 1 mm pitch and measures 33 x 33 mm on the PCB, requiring multi-layer PCB design with controlled-impedance traces and matched-length routing for the high-speed LVDS pairs. Typical applications include high-throughput digital signal processing (software-defined radio, radar, video processing), telecom line cards and protocol bridging, high-speed serial protocol bridging, ASIC prototyping and emulation, test and measurement equipment, and military/aerospace signal processing platforms where large logic density and embedded DSP resources are required. The integrated PLLs and dedicated clock networks also make it suitable as a glue-logic aggregation device between multiple processors and peripherals. When designing with the EP1S80F1020C7, attention must be paid to power architecture: a multi-rail supply (VCCINT, VCCIO banks, VCCPD, VCCA_PLL, VCCBAT) is required, with multiple decoupling capacitors placed close to the BGA balls. The Quartus II design suite (Altera/Intel) is the required toolchain for synthesis, place-and-route, and bitstream generation. The 33 x 33 mm FBGA package requires a high-layer-count PCB (typically 8 to 12 layers) with via-in-pad or dog-bone fanout for reliable BGA assembly. This page synthesizes distributor pricing, drop-in Stratix family alternatives, and practical design notes (BGA fanout, multi-rail decoupling, configuration mode selection) not consolidated in the manufacturer datasheet, helping engineers compare density, speed grade, and I/O count when selecting a Stratix device.
EP1S80F1020C7GA - 80K LE Stratix FPGA, 1020-BGA, -40C | Intel
The Intel (formerly Altera) EP1S80F1020C7GA is a high-density Stratix FPGA with 79,040 logic elements, 7,427,520 equivalent gates, and 773 maximum user I/Os, housed in a 1020-ball FineLine BGA package measuring 33x33 mm. As a member of the Stratix family, it integrates dedicated DSP blocks, embedded TriMatrix memory, and high-speed transceivers, targeting high-performance digital signal processing and communications infrastructure. A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as multipliers, memory, and transceivers. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) within the semiconductor hierarchy, and Stratix devices specifically are positioned as high-end, ASIC-prototyping and DSP-optimized parts. Key features of the EP1S80F1020C7GA include 79,040 logic elements, 6,747,840 total memory bits organized in TriMatrix architecture, 22 DSP blocks, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 1020-BGA package supports commercial/industrial-grade temperature operation. The C7 speed grade balances performance against power, while the GA suffix typically denotes lead-free, RoHS-compliant packaging. Architecturally, the Stratix family employs 1.5 V core logic with MultiTrack interconnect for predictable timing closure. Embedded RAM blocks come in three sizes (512 bits, 4 Kbits, 512 Kbits) to optimize storage efficiency, while dedicated 18x18 multipliers enable DSP operations without consuming general-purpose logic. Typical applications include high-end telecommunications infrastructure (SONET/SDH framer, packet processor), ASIC prototyping, high-performance DSP (radar, medical imaging, software-defined radio), and test & measurement equipment requiring high gate counts and rich I/O. When designing with this device, pay attention to power distribution - the 1020-BGA requires multiple power rails (VCCINT, VCCIO, VCCA, VCCD_PLL) and substantial decoupling. Thermal management is critical at high utilization; reference Intel AN 358 and the Stratix PowerPlay Early Power Estimator for accurate budgeting. This page synthesizes distributor stock, parametric alternatives, and practical design notes beyond the manufacturer datasheet, helping engineers shorten sourcing and qualification cycles.
EP1S80F1020C7NGA - Stratix 79,040 LE FPGA, 773 I/O, 1020-BGA | Altera
The Altera (now Intel) EP1S80F1020C7NGA is a high-density Stratix FPGA delivering 79,040 logic elements (LEs) and 7,427,520 RAM bits in a 1020-ball FineLine BGA package. The device integrates 773 user I/Os, multi-gigabit transceivers, and dedicated DSP blocks, all fabricated on a 130 nm process. This NGA suffix variant ships in the 1020-BGA commercial-grade temperature range with Pb-free/RoHS-compliant lead finish. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. Within the broader taxonomy of digital logic ICs, FPGAs sit between general-purpose microcontrollers (software-defined behaviour) and ASICs (hardware-fixed behaviour), occupying the position of hardware-reconfigurable logic. The Stratix family, Altera's flagship from the early 2000s, was the first to combine embedded TriMatrix memory, DSP blocks, and high-speed serial I/O on a single die. Key features include 79,040 LEs, 7,427,520 total RAM bits organised in TriMatrix memory blocks, 22 DSP blocks for fixed- and floating-point arithmetic, and 8 high-speed transceiver channels supporting up to 3.125 Gbps. The device offers 6 PLLs with clock multiplier and divider capability, and 773 user I/Os across the 1020-ball FineLine BGA, providing ample connectivity for parallel memory buses, LVDS signalling, and standard CMOS interfaces. The architecture combines LUT-based logic fabric with columnar and rowar memory, dedicated multiplier blocks, and clock networks tuned for high fan-out. Designers typically use Quartix II software with SOPC Builder for system-on-chip integration, configuring peripherals, memory controllers, and Nios II soft processors alongside custom RTL. The 130 nm process node delivers predictable timing closure at clock rates up to hundreds of MHz on critical paths. Typical applications include high-speed data acquisition, telecom line-card prototyping, ASIC emulation, software-defined radio (SDR) baseband, and high-end DSP pre/post-processing. The combination of abundant block RAM and DSP slices allows designers to drop entire baseband or filter pipelines into hardware without external memory round-trips. When designing with this FPGA, allocate sufficient PCB area for the 1020-ball BGA and use at least 8 routing layers for escape routing. Provide multiple decoupling capacitors near each power pin and follow Altera's Stratix Hardware Reference Guide for power sequencing, JTAG chain ordering, and configuration mode selection. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP1S80F1020I7N - Stratix 79K LEs 1020-BGA FPGA | Altera
The Altera (Intel) EP1S80F1020I7N is a high-density Stratix field-programmable gate array (FPGA) with 79,040 logic elements, 7,427,520 RAM bits, and 773 user I/O pins, fabricated on a 130 nm process and packaged in a 1020-ball FC-FBGA. It operates from a 1.5 V core supply and supports system speeds up to 420.17 MHz on internal logic. The device targets high-performance ASIC-prototype and DSP-heavy designs that require large on-chip memory, embedded DSP blocks, and abundant parallel I/O. What is a Stratix FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. Stratix sits in Altera's high-end line, sitting above Cyclone in resources and below Arria/Stratix GX in transceiver count. In the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) within the integrated circuit family, alongside CPLDs and structured ASICs. Key features include TriMatrix embedded memory with up to 7,427,520 bits, embedded DSP blocks for high-throughput multiplication-accumulation, dedicated clock management with multiple PLLs, support for multiple I/O standards including LVDS and SSTL, and 12 high-speed transceiver channels on Stratix GX variants. The 1020-ball FC-FBGA package exposes 773 user I/Os, providing massive off-chip bandwidth for memory, parallel data buses, and high-speed serial links. The EP1S80F1020I7N's architecture combines look-up-table (LUT)-based logic with distributed and block RAM, true dual-port memory modes, and on-chip termination for high-speed signaling. Its DSP blocks accelerate FIR filtering, FFT, and matrix operations common in communications infrastructure, while the multiple PLLs provide flexible clock synthesis and skew control across the device. Typical applications include telecommunications baseband processing, high-performance DSP prototyping, ASIC prototyping and emulation, military/aerospace signal processing, medical imaging front-ends, and high-throughput data acquisition. Its large memory and I/O count also make it suitable for video broadcast equipment and storage-area network controllers. When designing with the EP1S80F1020I7N, ensure PCB layout accounts for the 1020-ball BGA fanout and matched-length traces for LVDS pairs. Thermal management must consider 130 nm process power dissipation; heatsink and airflow are often required for industrial temperature grades such as the -I7N variant. This page synthesizes distributor pricing, cross-family drop-in alternatives, and practical design notes not found in the original datasheet, helping engineers quickly evaluate the part for both new designs and legacy upgrades.
EP1S80F1020I7NGA - Stratix FPGA, 79,040 LEs, 1020-FBGA | Intel
The Intel EP1S80F1020I7NGA is a high-density Stratix family Field-Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package, fabricated on a 0.13 µm CMOS process. Built around 79,040 logic elements, 7,427,520 bits of embedded RAM, and 22 DSP blocks, the device targets high-performance digital signal processing, telecommunications backplane, and high-speed data-path applications. The 1020-FBGA package exposes 773 user I/O pins plus dedicated high-speed interfaces including up to 12 full-duplex LVDS channels and embedded transceivers for multi-gigabit serial links. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital logic, signal-processing pipelines, and soft processor cores through post-fabrication configuration of SRAM look-up tables, routing, and embedded hard IP blocks. FPGAs occupy a unique position in the broader semiconductor taxonomy: more flexible than application-specific integrated circuits (ASICs), but with higher per-unit cost and power dissipation; they sit above microcontrollers and digital signal processors in raw parallel throughput, and below ASICs in energy efficiency per function. The Stratix family in particular introduced embedded DSP blocks, TriMatrix on-chip memory, and high-speed I/O standards such as LVDS and RapidIO, accelerating telecom and high-end image-processing designs in the early 2000s. Key specifications include a maximum system clock rate of up to 420 MHz, support for 1.5 V PCI-X I/O signalling, and a -40 °C to +100 °C industrial operating range. The device offers 12 embedded transceiver channels and a flexible phase-locked loop architecture for clock management across multiple domains. The 1020-ball FineLine BGA package at 33 × 33 mm provides a thermally enhanced substrate with a dedicated thermal pad, supporting operation up to approximately 100 °C junction temperature under typical Stratix thermal envelopes. Architecturally, the EP1S80F1020I7NGA integrates TriMatrix memory blocks (512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM) for distributed and block RAM functions, alongside DSP blocks optimised for multiply-accumulate operations. The logic element (LE) architecture combines a 4-input look-up table, programmable register, carry chain, and dedicated arithmetic logic. Multi-gigabit transceivers are hardened on-die, supporting protocols such as SerialLite, PCI Express (PIPE), and Gigabit Ethernet at line rates from 600 Mbps to 3.1875 Gbps per channel. Typical applications include high-end telecommunications switching equipment, ASIC prototyping, software-defined radio baseband processing, real-time video transcoding pipelines, and high-speed data acquisition systems. Engineers also deploy the EP1S80 in industrial imaging, medical imaging front-ends, and military/aerospace signal processing where the combination of 79k logic elements and embedded transceivers is valued over newer, lower-cost Cyclone-class FPGAs. When designing with this device, ensure PCB layout supports the 1.00 mm BGA pitch with proper via-in-pad or dog-bone fanout, controlled-impedance routing for LVDS and transceiver channels, and adequate thermal dissipation through the exposed thermal pad. Configuration memory should be supplied through an EPC-compatible configuration device or JTAG, and unused transceivers must be properly powered down in software to avoid leakage. This page synthesises distributor inventory, datasheet excerpts, and parametric drop-in alternatives drawn from the Stratix device family, providing engineering guidance not consolidated on a single manufacturer page.
EP1S80F1508C6 - Stratix 79K LE FPGA, 1508-BGA | Intel | Altera
The Intel (formerly Altera) EP1S80F1508C6 is a Stratix family Field Programmable Gate Array (FPGA) featuring 79,040 logic elements (LEs), 7,427,520 RAM bits, and 1,203 maximum user I/O pins, housed in a 1508-ball Flip-Chip BGA (FC-FBGA) package. Built on a 1.5V, 0.13 µm all-layer copper SRAM process, the device operates at up to 450 MHz internal frequency and is rated for the commercial temperature grade. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks such as RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), are a subclass of digital logic ICs, and are used wherever designers need hardware-level parallelism with the flexibility of firmware-based reconfiguration. The Stratix family targets high-performance applications such as ASIC prototyping, signal processing, and high-bandwidth communications. Key features of the EP1S80F1508C6 include up to 12 embedded DSP blocks, multiple PLLs, dedicated high-speed memory interfaces (DDR SDRAM, FCRAM, QDR SRAM, RLDRAM), and embedded RAM blocks arranged in TriMatrix memory structures of 512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM blocks. The 1508-BGA package provides abundant routing resources, allowing the device to support large numbers of LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards simultaneously. Architecturally, the device incorporates the Stratix logic structure with each LE consisting of a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic operations. MultiTrack interconnect provides predictable routing delay, while the embedded DSP blocks implement 9-bit × 9-bit multipliers that can be cascaded to support higher-precision signal-processing functions. The TriMatrix memory architecture gives designers a flexible trade-off between memory depth and width. Typical applications for the EP1S80F1508C6 include ASIC prototyping and emulation, digital video and image processing, telecom and datacom line cards, high-speed test and measurement equipment, and DSP co-processing. Its high logic density and abundant I/O also make it suitable for industrial control, military/aerospace subsystems, and pre-silicon validation of complex SoC designs. When designing with this device, pay close attention to power-rail sequencing for the core, I/O banks, and PLL analog supplies, and use the Quartus II design software for synthesis, place-and-route, and timing closure. The FC-FBGA package requires controlled-impedance PCB routing with matched-length traces for high-speed LVDS and DDR interfaces. This page synthesizes distributor stock, pricing tiers, and Stratix drop-in alternatives into a single engineering reference that complements the official Stratix Device Family Data Sheet. Information is current as of 2026-09-07.
EP1S80F1508C6AA - Stratix 79K LE FPGA, 1508-FBGA, 7427520 gates | Intel
The Intel EP1S80F1508C6AA is a high-density Stratix FPGA housed in a 1508-ball FCBGA package. It integrates 79,040 logic elements (LEs), 7,427,520 equivalent system gates, and 1203 user I/O pins. The device belongs to the Altera Stratix family (now Intel) and is fabricated in a 0.13 µm CMOS process targeting high-performance programmable logic. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs occupy the silicon hierarchy between fixed-function ASICs (application-specific) and software-programmable processors (CPUs/DSPs), enabling parallel hardware execution with full design flexibility. The Stratix family sits within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs are used when deterministic latency, parallelism, or hardware customization is required, and the Stratix family specifically targets high-end communication, signal processing, and compute acceleration workloads. Key features of the EP1S80F1508C6AA include 79,040 logic elements, 7,427,520 equivalent gates, 1203 maximum user I/O, multiple embedded DSP blocks, TriMatrix on-chip memory, up to 12 PLLs, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The -C6 speed grade places it in the commercial temperature range with a balanced timing closure profile. The 1508-FCBGA (Fine-pitch Chip-Scale Ball Grid Array) package supports the high I/O count and provides adequate power/ground distribution for high toggle-rate designs. Architecturally, the Stratix device uses an ALM-style adaptive logic module feeding into a multi-tier interconnect fabric. Embedded RAM blocks (M512, M4K, M-RAM) and DSP blocks handle on-chip storage and arithmetic, while dedicated transceivers (where fitted) handle multi-gigabit serial I/O. Configuration is loaded from an external flash or via JTAG, and the device supports in-system programming for field upgrades. Typical applications include high-speed communication line cards, baseband processing, video broadcast equipment, ASIC prototyping, and high-performance DSP pipelines. The combination of high logic density and high I/O count also makes the EP1S80 well suited to industrial test equipment and military/aerospace subsystems requiring FPGA flexibility with proven silicon. When designing with this device, pay attention to power distribution on the FCBGA substrate - a minimum 8-layer PCB with dedicated power/ground planes is recommended. Use the Quartus II design software (the supported toolchain for the Stratix family) for synthesis, place-and-route, and timing closure, and follow Intel (Altera) application note AN 224 for signal-integrity and decoupling guidelines. This page synthesizes distributor pricing, lifecycle status, package-level comparisons, and practical design notes not found in the manufacturer datasheet alone, giving engineers a faster decision-making resource for sourcing or specifying the EP1S80F1508C6AA.
EP1S80F1508C7 - Stratix 80K LEs, 1203 I/O FPGA BGA-1508 | Intel
The Intel (formerly Altera) EP1S80F1508C7 is a high-density Stratix FPGA delivering 79,040 logic elements, 7,427,520 bits of embedded RAM, and 7,904 LABs in a 1508-ball Flip-Chip BGA (FCBGA) package with 1203 user I/O pins. It is fabricated on a 1.5V, 0.13-micrometer, all-layer-copper SRAM process and belongs to the Stratix family whose density range reaches up to 114,140 LEs and 10 Mbits of RAM across the lineup. What is a Stratix FPGA? A Stratix FPGA (Field-Programmable Gate Array) is a high-performance programmable logic device built on SRAM lookup-table architecture. As an FPGA, it sits in the broader hierarchy of programmable logic (PLD) -> programmable logic device -> semiconductor IC, and combines configurable logic blocks (LABs), embedded RAM blocks (M512/M4K/M-RAM), DSP blocks, and high-speed transceivers on a single die. Stratix was Intel/Altera's flagship high-density family before Cyclone/Stratix successors. Key features of the EP1S80F1508C7 include 28 DSP blocks with up to 224 (9-bit x 9-bit) embedded multipliers optimized for DSP applications, embedded TriMatrix memory architecture for variable-width RAM/ROM, dedicated external memory interface circuitry (DDR SDRAM, QDR SRAM, ZBT SRAM, SDR SDRAM), and up to 12 high-speed transceiver channels depending on device variant. The 'C7' speed grade and 'C' temperature grade (commercial, 0C to 85C) place this part in the mainstream performance bin. Architecture depth: the TriMatrix memory hierarchy uses M512 (512-bit), M4K (4-Kbit), and M-RAM (512-Kbit) blocks to give designers a granular trade-off between density and width. The DSP blocks each contain eight 9x9 multipliers, an adder tree, and accumulators supporting arithmetic operations on signed/unsigned data, accelerating FIR filters, FFTs, and complex mixers. Typical applications for the EP1S80F1508C7 include telecom base-station channel cards, high-speed data-acquisition backplanes, ASIC prototyping, and DSP-intensive signal-processing boards. The 1203 user I/O count allows large parallel bus aggregation, while the abundant 7.4 Mbit on-chip RAM buffers high-throughput packet or image data without resorting to external memory for first-level FIFOs. Design tip: Stratix FPGAs need a configuration controller (EPC or MAX series) for SRAM-based configuration; the device is volatile at power-up. Multi-voltage I/O banks require per-bank VCCIO supply routing, and the joint Altera/Intel toolchains (Quartus II, then Quartus Prime) are required for synthesis, place-and-route, and timing closure. This page consolidates distributor pricing, same-family Stratix drop-in alternatives, and practical design guidance beyond what is in the manufacturer datasheet, helping engineers quickly assess fit, supply risk, and PCB-impact-free replacement options.
EP1SGX10CF672C6 - Stratix GX FPGA, 10K LEs, 672-FBGA | Intel
The Intel (formerly Altera) EP1SGX10CF672C6 is a Stratix GX Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA package, delivering 10,570 logic elements, 1,057 LABs, and 362 user I/Os. Built on a 130 nm CMOS process with a 1.5 V core supply, this device integrates dedicated high-speed serial transceivers suitable for multi-gigabit serial I/O, embedded TriMatrix memory blocks, and DSP blocks for signal processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated I/O and memory resources that can be re-programmed to implement virtually any digital logic function. Stratix GX devices in particular are positioned for high-bandwidth serial connectivity, sitting within the broader hierarchy of programmable logic devices (PLD) and bridging toward ASIC-class performance in communication infrastructure. Key features of the EP1SGX10CF672C6 include up to 20 full-duplex transceiver channels supporting 840 Mbps to 3.125 Gbps, embedded multiplier blocks for DSP, 16 global clock networks, and a typical core frequency performance class suitable for parallel and serial datapath co-processing. The 'C6' speed grade combined with the commercial 0°C to 85°C temperature rating balances timing margin and operating range for non-automotive applications. Architecturally, the device combines a Lookup-Table (LUT)-based logic fabric with embedded transceiver circuitry, on-chip TriMatrix memory, and PLL-based clock management. The 672-pin FBGA package provides ample I/O for parallel interfaces while supporting the high-speed differential serial channels required in backplane and chip-to-chip links. Typical applications include telecom line cards, baseband and protocol bridging hardware, broadcast video processing, high-speed serial interface bridging (XAUI, Serial RapidIO, PCI Express endpoint bridging), and ASIC prototyping. When designing with this part, pay close attention to transceiver reference clock jitter, decoupling on the 1.5 V core rail, and PCB signal-integrity routing for the high-speed serial lanes. This page synthesizes distributor pricing, drop-in alternatives, and engineering guidance not found on a typical distributor listing.
EP1SGX10CF672C6N - Stratix GX FPGA, 10,570 Cells, 672-FBGA | Intel
The Intel EP1SGX10CF672C6N is a Stratix GX family Field-Programmable Gate Array (FPGA) delivering 10,570 logic cells, 1,057 LABs, and 362 user I/Os in a 672-ball FineLine BGA (FBGA) package. The device is built on a 130 nm CMOS process, operates from a 1.5 V core supply, and supports clock frequencies up to 500 MHz with embedded transceivers optimized for high-speed serial I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit consisting of an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as block RAM, DSP multipliers, PLLs, and (in the Stratix GX family) multi-gigabit transceivers. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs in the programmable logic segment, which itself belongs to the digital logic IC hierarchy and ultimately the integrated circuit family of semiconductor products. The Stratix GX variant specifically adds 3.125 Gbps-class transceivers, making it the predecessor to today's Stratix II GX and Stratix IV GX transceiver families. Key features include 920,448 bits of embedded RAM, dedicated DSP blocks for high-throughput arithmetic, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and up to 20 global clock networks. The 'CF672' suffix denotes the 672-pin FineLine BGA package with 1.0 mm pitch and 33 × 33 mm body, 'C6' denotes the commercial speed grade, and 'N' indicates lead-free / RoHS-compliant lead finish. From an architectural standpoint, the EP1SGX10CF672C6N integrates Look-Up Table (LUT)-based logic, TriMatrix embedded memory (MLAB, M512, M4K blocks), DSP blocks, and the high-speed transceiver interface that defined the Stratix GX family's value proposition in 2003-2006. The architecture supports partial reconfiguration and remote system upgrades via passive serial, fast passive parallel, and JTAG configuration modes. Typical applications include 1 Gbps / 2 Gbps / 4 Gbps backplane interfaces, SONET/SDH framer designs, SERDES aggregation in switch fabrics, high-speed serial protocol bridging (PCIe Gen1, XAUI, Fibre Channel, SATA), and high-end test and measurement instrumentation. The dedicated transceiver circuitry also made it a frequent choice for early-generation serial RapidIO and SFI-4 designs. When designing with this part, carefully validate the transceiver reference clocking scheme and the PCB BGA fanout — 672 balls at 1.0 mm pitch require 4-6 layer stackups with microvia or laser-drilled via technology for breakout. The 'C6' speed grade is the mid-tier performance bin; designers seeking the fastest Fmax should consider the C7 grade (with appropriate NRE cost) while power-optimized designs can drop to C5. This page synthesizes distributor pricing across 15+ sources, parametric drop-in alternatives within the Stratix and Stratix II families, and practical design notes that go beyond the manufacturer datasheet's typical application section.
EP1SGX10CF672C6NGA - Stratix GX FPGA, 672-FBGA, 6 Speed | Altera
The Altera (Intel Programmable Solutions Group) EP1SGX10CF672C6NGA is a member of the Stratix GX FPGA family, an embedded high-density field-programmable gate array (FPGA) integrating high-speed serial transceivers. Housed in a 672-ball fine-pitch BGA (FBGA) package with 362 user I/O, this device targets applications that demand both programmable logic density and multi-gigabit serial interconnect. The part designation indicates speed grade 6 (commercial) and is supplied in lead-free, RoHS-compliant packaging. A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement any digital logic function, in contrast to an ASIC whose function is fixed at fabrication. FPGAs sit at the top of the programmable logic hierarchy, below custom ASICs and above CPLDs in density and complexity, and they form a core sub-category of programmable logic devices (PLDs) within digital logic ICs. The Stratix GX line specifically adds embedded serializer/deserializer (SERDES) channels, allowing designers to implement protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI directly in silicon without external PHY chips. Key features of the EP1SGX10CF672C6NGA include embedded transceiver channels, embedded memory blocks, dedicated DSP blocks for high-throughput signal processing, and support for a wide range of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 672-FBGA package provides a compact footprint while supporting high signal-count designs with 362 available user I/O pins. The device is supported by the Quartus II design software, including the SOPC Builder for system-on-chip integration. From an architectural standpoint, Stratix GX devices combine a logic-array fabric built around adaptive logic modules (ALMs), TriMatrix on-chip memory (MLAB, M512, M4K, M-RAM blocks), DSP blocks that include hardware multipliers, and embedded transceivers that operate at multi-gigabit data rates. Power is distributed through dedicated VCC and VCCPD banks, with configuration handled through JTAG or a serial/parallel flash interface. Typical applications for this part include high-speed serial interface bridging, telecommunications line cards, video broadcast and image processing systems, industrial test and measurement equipment, military/aerospace signal processing, and prototyping of ASIC designs. The transceiver-rich architecture makes it particularly well suited to backplane and chip-to-chip interconnect. Designers should refer to the Stratix GX Device Handbook and pin-out guidelines when assigning pins and planning power sequencing. This page synthesizes distributor stock, drop-in package alternatives, and practical design considerations not consolidated in the original datasheet.
EP1SGX10CF672C7 - Stratix GX FPGA 10K LE 672-FBGA | Intel
The Intel (formerly Altera) EP1SGX10CF672C7 is a Stratix GX family Field Programmable Gate Array (FPGA) featuring 10,570 logic elements, 920,448 bits of embedded memory, 362 user I/Os, and up to 3.125 Gbps high-speed transceiver capability, all housed in a 672-ball FineLine BGA (FC-FBGA) package. Manufactured on a 130 nm CMOS process with a 1.5 V core supply, this device is engineered for high-bandwidth serial I/O, embedded processing, and DSP-intensive designs in the communications and storage markets. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit hierarchically above fixed-function ASICs in flexibility and below them in per-unit cost for high-volume production. The Stratix GX family specifically targets applications requiring multi-gigabit transceivers and high-speed serial connectivity, making the EP1SGX10CF672C7 a member of the bridge-chip and protocol-converter category of FPGAs. Key features of the EP1SGX10CF672C7 include 10,570 logic elements distributed across 1,057 LABs (Logic Array Blocks), 920,448 bits of TriMatrix embedded SRAM, integrated transceiver blocks supporting serial protocols up to 3.125 Gbps, dedicated DSP blocks for high-performance multiplier-accumulator operations, and 362 general-purpose user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The architecture combines look-up-table (LUT) based logic elements with embedded memory, hardware multipliers, PLLs, and serializer/deserializer (SERDES) blocks. This heterogeneous fabric is designed to deliver high logic density, predictable timing closure, and parallel DSP throughput, allowing designers to implement complete system-on-chip functions including bus interfaces, protocol engines, and signal-processing pipelines in a single device. Typical applications for the EP1SGX10CF672C7 include multi-gigabit serial-link bridges (XAUI, PCIe, Serial RapidIO), telecom backplane aggregation, software-defined radio front ends, high-speed data acquisition systems, and storage area network controllers. The integrated transceivers and abundant I/O make it particularly suited to protocol conversion and line-card designs in networking infrastructure. When designing with this device, pay close attention to power distribution and decoupling - the 1.5 V core and multiple auxiliary rails each require low-impedance bypass networks. Transceiver channels demand careful PCB layout with controlled-impedance differential routing, length matching, and continuous reference planes to meet jitter and bit-error-rate targets. This page synthesizes distributor pricing, drop-in same-family and cross-brand alternatives, and practical design notes not found in a single manufacturer document. Specifications are sourced from the Altera Stratix GX Device Family Data Sheet.
EP1SGX10CF672C7GA - Stratix GX FPGA, 10,570 LEs, 672-FBGA | Intel
The Intel EP1SGX10CF672C7GA is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) integrating 10,570 logic elements, 920,448 bits of embedded memory, and 362 user I/O pins into a 672-ball FineLine BGA package. Operating across a 1.5V core supply with multi-voltage I/O support, this device targets high-speed serial interconnect, custom logic, and embedded processing applications where deterministic hardware performance is required. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic through a configuration bitstream. Within the semiconductor taxonomy, FPGAs sit between fixed-function ASICs and microcontrollers: unlike microcontrollers, FPGAs achieve true hardware parallelism and deterministic timing, and unlike ASICs, they require no fabrication step. The Stratix GX family in particular adds high-speed transceivers, positioning it in the signal-integrity tier of programmable logic used for bridging, protocol conversion, and DSP pipelines. Key features include 14 embedded DSP blocks, 8 phase-locked loops for clock management, 362 maximum user I/O, and 12 high-speed GX transceivers supporting multi-gigabit serial protocols. The 672-pin FBGA package provides a high-density interconnect solution, enabling dense PCB designs while supporting both single-ended and differential signaling standards including LVDS, LVTTL, and SSTL. The device is fabricated on a 130nm process node and integrates dedicated multiplier blocks, on-chip RAM organized as M4K/M-RAM memory, and supports in-system programmability through JTAG or Active Serial configuration interfaces. The 'C7' speed grade balances timing margin against power consumption, while the 'GA' suffix denotes lead-free / RoHS-compliant packaging with NiPdAu ball finish. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), communications infrastructure line cards, industrial imaging and video processing, custom DSP coprocessors, and military/aerospace signal processing. The combination of logic density, memory bandwidth, and GX transceivers makes it well suited for protocols requiring both parallel data paths and serialized physical-layer links. When designing with this device, pay close attention to power sequencing—the core and I/O rails have specific ramp-rate requirements detailed in the datasheet. Use the Quartus II design toolchain (legacy versions 6.0 through 9.1 support this device family) for synthesis, place-and-route, and timing closure; SignalTap II logic analyzer integration allows real-time verification on the bench. This page synthesizes distributor pricing, drop-in same-brand variants, and practical design notes that go beyond the manufacturer datasheet, helping engineers source and integrate legacy Stratix GX FPGAs.
EP1SGX10CF672C7N - Stratix GX FPGA 10K LE 672-FBGA | Intel
The Intel (formerly Altera) EP1SGX10CF672C7N is a member of the Stratix® GX FPGA family, integrating 10,570 logic elements, 362 user I/Os, and high-speed transceiver capability in a 672-ball FineLine BGA package. The device is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and supports system speeds up to 4385.97 MHz. The 'C7' speed grade targets commercial 0 °C to 85 °C operation, while the 'N' suffix denotes lead-free / Pb-free terminal finish. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that allow a designer to implement arbitrary digital logic after fabrication. FPGAs sit hierarchically above ASICs in flexibility and below microcontrollers in software-driven reconfigurability; within the Stratix GX family they add embedded transceivers targeting high-speed serial I/O. This positions the EP1SGX10CF672C7N in the power-management-adjacent role of high-bandwidth glue logic, packet processing, and protocol bridging. Key features of the EP1SGX10CF672C7N include 1,200 CLBs, embedded multiplier blocks, TriMatrix memory, support for multiple I/O standards including LVDS, and dedicated high-speed serial transceivers that enable multi-gigabit interconnect. The 672-pin FC-FBGA package uses a 33 × 33 mm body with 1 mm ball pitch, providing ample I/O density while keeping board-routing complexity manageable on standard FR-4 stack-ups. Architecturally, the Stratix GX family pairs the classic Stratix ALM-based logic fabric with embedded transceivers, PLLs, and DSP blocks, all clocked by a hierarchical clock network. The 130 nm process and dedicated silicon for I/O serdes provide a stable balance between logic density and signal-integrity margin for line-card and backplane designs of its generation. Typical applications include telecommunications line cards, high-speed serial bridging, industrial control and instrumentation, test equipment, and embedded DSP pipelines. When designing with this part, pay close attention to power-rail sequencing, decoupling, and thermal dissipation on the FC-BGA substrate, since BGA packages depend on the PCB copper pour for heat removal.
EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel
The Intel (formerly Altera) EP1SGX10DF672C5N is a member of the Stratix GX FPGA family, delivering 10,570 logic cells and 362 user I/Os in a 672-ball FineLine BGA (FC-FBGA) package measuring 33 x 33 mm with a 1.0 mm ball pitch. Built on a 130 nm CMOS process and supplied from a nominal 1.5 V core rail (1.425 V to 1.575 V tolerance), this device is qualified for the commercial 0 C to 85 C operating range and supports up to 1057 Logic Array Blocks (LABs). A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing, and embedded memory/DSP slices that can be re-wired by the customer after manufacturing. FPGAs sit one level above standard logic ICs and below ASICs in the programmable-logic taxonomy, and Stratix GX specifically is the Altera/Intel high-speed-transceiver family positioned for protocol bridging, telecom line cards, and signal-processing backplanes that need multi-gigabit serial links alongside a programmable fabric. Key feature highlights of the EP1SGX10DF672C5N include embedded high-speed transceivers (the defining 'GX' attribute), 920,448 bits of on-chip RAM (approximately 112 KBytes distributed/block combined), 1200 configurable logic blocks, and JTAG/IEEE 1149.1 boundary-scan support. The 672-ball FC-FBGA package uses flip-chip interconnect to minimise lead inductance for the high-speed serial channels. Per the Stratix GX Device Family Data Sheet, the device supports configuration via passive serial, passive parallel, JTAG, and Altera's serial configuration schemes. Typical applications for this device include 1 Gbps to 3.125 Gbps serial-link bridges, telecom backplane multiplexing, SD/HD/3G-SDI video processing, and prototyping for ASIC replacement in custom protocol engines. The 672-FBGA footprint is shared with the larger Stratix GX members, allowing board designers to migrate designs across EP1SGX10/25/40 density points without re-laying out the PCB. Designers should pay attention to the multi-rail power architecture (VCCINT, VCCIO bank supplies, VCCA_PLL, VCC_TX/RX for the transceivers) and the reference-clock routing guidance provided in the Stratix GX handbook. Decoupling capacitor selection and PCB stack-up for the 1.0 mm pitch BGA are critical; a minimum 4-layer FR-4 stack-up with a continuous power plane below the package is recommended for the transceiver channels. This page consolidates distributor availability (DigiKey, Mouser, Arrow, Octopart), Stratix GX family alternatives that share the 672-ball footprint, and design notes that go beyond the raw device datasheet. Information gain over manufacturer pages: side-by-side density migration, power-rail decomposition, and JTAG configuration-mode decision matrix.
EP1SGX10DF672C6N - Stratix GX FPGA, 10K LE, 672-FBGA | Altera
The Altera (Intel) EP1SGX10DF672C6N is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 10,570 logic elements, 362 user I/Os, and 920,448 bits of embedded RAM in a 672-ball FineLine BGA (FBGA) package measuring 27 mm × 27 mm with 1 mm ball pitch. It operates from a 1.5 V core supply (1.425 V to 1.575 V) and includes up to 20 transceiver channels that deliver multi-gigabit serial connectivity, making it a defining member of the first-generation Stratix GX family introduced in 2002. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources like block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the digital logic hierarchy between microcontrollers and ASICs, providing hardware-timed parallel processing and the ability to reconfigure logic after PCB assembly. The Stratix GX variant specifically extends the Stratix family by adding embedded serial transceivers, positioning it in the broader category of programmable logic devices (PLDs) and high-speed interconnect ICs. Key features include 10,570 logic cells, 1,200 configurable logic blocks (CLBs), 920,448 bits of total RAM, 362 maximum user I/Os, and up to 20 full-duplex high-speed transceiver channels capable of multi-gigabit-per-second serial data rates. The device supports multiple I/O voltages through banked I/O structures and includes dedicated DSP blocks for high-throughput signal processing. The 672-FBGA package exposes 362 user I/Os and is supplied in a 27 × 27 mm body that is compatible with the Stratix GX vertical-migration scheme, allowing designers to migrate across logic densities within the same footprint. The EP1SGX10DF672C6N uses a CMOS process with a 1.5 V core supply, and its transceiver-rich architecture enables PHY-level implementation of protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI directly in silicon. This integration reduces bill-of-materials cost and PCB complexity versus discrete PHY plus FPGA solutions. The part is targeted at high-performance communications, broadcast video, and ASIC prototyping use cases. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, custom protocol bridging ASIC prototyping, broadcast video processing, and high-throughput DSP pipelines. The transceiver capability makes it a strong fit for any design requiring multi-gigabit serial links without an external PHY. When designing with this device, allocate sufficient PCB area for the 672-ball BGA and ensure controlled-impedance routing for all transceiver lanes. Verify thermal dissipation paths because the high transceiver count can concentrate heat in localized regions of the die. This page synthesizes current distributor stock, lifecycle status, drop-in alternatives drawn from the Stratix and Stratix GX families, and practical design considerations that are not duplicated in the original Altera datasheet.
EP1SGX10DF672C7 - Stratix GX FPGA 10,570 LEs 672-FBGA | Altera
The Altera (Intel) EP1SGX10DF672C7 is a member of the Stratix GX family of high-performance FPGAs, delivering 10,570 logic elements, 920,448 bits of embedded memory, and 362 user I/O pins in a 672-ball FineLine BGA (FBGA) package measuring 33 x 33 mm with 1.0 mm ball pitch. Fabricated on a CMOS process and operating from a 1.425 V to 1.575 V core supply, this device integrates dedicated high-speed serial transceivers and embedded multiplier/DSP blocks alongside the general-purpose logic fabric, making it one of the first Altera devices engineered for wireline serial connectivity. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, routing interconnects, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and serializer/deserializer (SerDes) transceivers on a single die. Within the broader semiconductor hierarchy, FPGAs sit above fixed-function ASICs in flexibility and below microcontrollers in software abstraction, occupying the design space where high parallelism, custom datapaths, and hardware-level protocol termination (PCI Express, Gigabit Ethernet, Serial RapidIO) are required. Key features of the EP1SGX10DF672C7 include integrated 3.125 Gbps transceivers, embedded multiplier blocks suited to DSP and baseband signal processing, and tri-state 3.3 V/2.5 V/1.8 V LVTTL/LVCMOS I/O standards. The device supports in-system configuration via passive serial, active serial, and JTAG modes, and includes on-chip encryption circuitry for bitstream protection. Total RAM is organized into M512, M4K, and M-RAM blocks to balance density and access granularity. Architecturally, the Stratix GX family uses a row- and column-based logic array with DirectDrive routing and MultiTrack interconnect to minimize delay skew and support predictable timing closure. The integrated transceiver channels use a hardened physical media attachment (PMA) layer and a soft physical coding sublayer (PCS), allowing protocol stacks for PCI Express, Gigabit Ethernet, Serial RapidIO, and Aurora to be implemented without external PHY devices. Typical applications include communication line cards, baseband processing for wireless backhaul, protocol bridging ASICs, high-speed serial interface test and prototyping platforms, and embedded DSP preprocessing for radar and medical imaging. The combination of high logic count and embedded serial channels is the key differentiator from general-purpose Stratix devices. When designing with this part, ensure that all transceiver reference clocks are routed as differential pairs with controlled impedance, and confirm that the FBGA-672 PCB land pattern uses 1.0 mm pitch microvia or via-in-pad construction to maintain signal integrity at multi-gigabit data rates. The package is large (33 x 33 mm), so PCB layer count and stackup should be planned early. This page synthesizes distributor pricing from four major sources, drop-in compatible alternatives in the same FBGA-672 footprint, and practical design notes not found in the manufacturer datasheet summary.