EP1SGX40GF800C7N - Stratix GX FPGA, 41.25K LE, 800-BGA | Intel / Altera
MPN: EP1SGX40GF800C7N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $162.5 | $1,625.00 |
| 100 | $142 | $14,200.00 |
| 500 | $125 | $62,500.00 |
| 1,000 | $110 | $110,000.00 |
Drop-in alternatives for EP1SGX40GF800C7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet βEP1SGX40GF800C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Embedded Memory Bits | 3,423,744 bits |
| DSP Blocks | 624 |
| Multi-Gigabit Transceivers | 20 channels, up to 3.1875 Gbps |
| PLLs | 4 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| I/O Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVTTL/LVCMOS/LVDS) |
| Package | 800-ball FineLine BGA (FBGA-800) |
| Speed Grade | 7 (commercial, fastest) |
| Operating Junction Temperature | 0C to +85C |
| Configuration Mode | Passive Serial / Fast Passive Parallel / Passive Parallel Asynchronous / JTAG |
| Memory Interfaces Supported | DDR, DDR2, QDR, RLDRAM |
| Mounting Type | Surface Mount (BGA) |
EP1SGX40GF800C7N Pin Configuration
| Pin B1 | VCCINT β Core supply voltage (1.5 V) |
| Pin B2 | GXB_RXP0 β Transceiver channel 0 positive input (pin assignment is ball-coordinate based; consult datasheet pin table) |
| Pin B3 | GXB_RXN0 β Transceiver channel 0 negative input |
| Pin B4 | VCCL_GXB β Transceiver analog supply |
| Pin C1 | IO_BANK1 β User I/O, bank 1 (3.3 V tolerant LVCMOS/LVTTL) |
| Pin C2 | GND β Ground |
| Pin C3 | REFCLK0p β Reference clock input 0 positive |
| Pin C4 | REFCLK0n β Reference clock input 0 negative |
| Pin D1 | MSEL0 β Configuration mode select 0 |
| Pin D2 | MSEL1 β Configuration mode select 1 |
| Pin D3 | MSEL2 β Configuration mode select 2 |
| Pin D4 | nCONFIG β Configuration start (active low) |
| Pin E1 | nSTATUS β Configuration status (active low) |
| Pin E2 | CONF_DONE β Configuration complete |
| Pin E3 | TCK β JTAG test clock |
| Pin E4 | TMS β JTAG test mode select |
| Pin F1 | TDI β JTAG test data in |
| Pin F2 | TDO β JTAG test data out |
| Pin F3 | VCCPD β I/O pre-driver supply (3.3 V) |
| Pin F4 | VCCA_PLL β PLL analog supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF800C7N is suitable for 6 applications: Multi-Gigabit Serial Backplane Bridge, Telecom Line-Card Data Path Processing, ASIC Prototyping Platform, Serial RapidIO Switch, Industrial Imaging and Video Processing, Aerospace and Defense Signal Processing.
Multi-Gigabit Serial Backplane Bridge
The EP1SGX40GF800C7N excels in backplane bridging applications where multiple serial lanes aggregate low-speed fabric into a high-speed uplink. Its 20 multi-gigabit transceiver channels at 3.1875 Gbps can implement eight independent XAUI (4-lane) ports, four 10G Serial RapidIO links, or aggregated PCI Express x8 lanes. The 41,250 logic elements and 624 DSP blocks provide ample fabric to implement link-layer retimers, MAC/PCS logic, and switch fabrics. Engineers pair this part with on-board TI HotSwap controllers and Micrel KSZ9031 PHYs to complete a multi-protocol line card.
Recommended
Telecom Line-Card Data Path Processing
In SONET/SDH and OTN line-card designs, the EP1SGX40GF800C7N integrates the framer, mapper, and forward-error-correction (FEC) functions alongside the multi-gigabit transceivers, eliminating external PHY and framer ASICs. The 624 DSP blocks accelerate Reed-Solomon and BCH FEC algorithms at line rate, while the 3,423,744 bits of TriMatrix memory provide elastic stores and pointer-processing FIFOs. The -7 speed grade is preferred here because OTU-1 (2.67 Gbps) and OTU-2 with stubs operate at aggressive timing margins.
Recommended
ASIC Prototyping Platform
The EP1SGX40GF800C7N is widely used as an ASIC prototyping platform because the Stratix GX family provides high logic density, abundant DSP blocks, and a generous TriMatrix memory structure that maps well to ASIC gate counts between 500K and 2M gates. The 800-ball FBGA package exposes enough user I/O to wire up to 600+ signal pins for boundary-scan emulation. Quartus II's incremental compilation and the LogicLock feature let engineers partition a design across multiple FPGAs. Engineers should target the -7 speed grade to model ASIC timing margins realistically.
Recommended
Serial RapidIO Switch
Serial RapidIO (SRIO) switches for embedded DSP clusters, baseband cards, and radar processing benefit from the EP1SGX40GF800C7N's combination of 20 serial lanes and high logic density. Each RapidIO 1x port uses one transceiver lane, allowing up to 20 SRIO endpoints with 4x aggregation possible using logic. The DSP blocks accelerate CRC, packet classification, and routing-table lookup operations. The 800-ball FBGA provides sufficient user I/O for status LEDs, JTAG chaining, and reference clock distribution.
Recommended
Industrial Imaging and Video Processing
Industrial frame grabbers and machine vision systems leverage the EP1SGX40GF800C7N for real-time image processing at line rates exceeding 1 Gbps. The transceiver channels carry Camera Link, CoaXPress, or proprietary serial sensor data into the FPGA, where DSP blocks perform Bayer demosaic, color correction, and edge detection at pixel rate. The TriMatrix memory buffers up to 3.4 Mbits of image data between pipeline stages, enough for several full HD lines. Industrial -40C to +85C variants in the same family (designated by 'I' speed grade) are used for factory floor deployments.
Recommended
Aerospace and Defense Signal Processing
Defense signal-processing systems use the EP1SGX40GF800C7N for radar beamforming, electronic countermeasures, and secure communications. The 3.1875 Gbps transceivers accept direct RF downconverter outputs, while the 624 DSP blocks implement pulse compression, FFT, and direction-finding algorithms. Although the standard -7 speed grade is commercial temperature, the industrial variants in the same family (such as EP1SGX40GF1020I7N) extend operation to -40C to +100C for avionics bays. Aerospace users commonly screen parts to higher grades.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF800C7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF800C5N | EP1SGX25FF800C5N | EP1SGX25DF800C6N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 800-ball FineLine BGA | 800-ball FineLine BGA - same | 800-ball FineLine BGA - same | 800-ball FineLine BGA - same |
| Logic Elements | 41,250 | 41,250 (same) | 25,660 (-38%) | 25,660 (-38%) |
| Embedded Memory | 3,423,744 bits | 3,423,744 bits (same) | 1,944,576 bits (-43%) | 1,944,576 bits (-43%) |
| Multi-Gigabit Transceivers | 20 channels up to 3.1875 Gbps | 20 channels up to 3.1875 Gbps (same) | 8 channels up to 3.1875 Gbps (-60%) | 8 channels up to 3.1875 Gbps (-60%) |
| DSP Blocks | 624 | 624 (same) | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | -7 (fastest) | -5 (slower, cheaper) | -5 (slower) | -6 (middle) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest transceiver channel count in the EP1SGX family at 800-ball BGA (vs EP1SGX25FF800C5N)
- Highest logic density in the EP1SGX family at 800-ball BGA (vs EP1SGX25FF800C5N)
- Fastest speed grade available in the EP1SGX40 part family (vs EP1SGX40GF800C5N)
Design Notes
Estimated: Power sequencing for the EP1SGX40GF800C7N must follow Sequence A (3.3 V VCCPD before 1.5 V VCCINT, with VCCA_PLL tied to 1.5 V) or Sequence B (1.5 V VCCINT before 3.3 V VCCPD). The Stratix GX datasheet specifies that VCCINT rise time must be between 100 us and 100 ms to prevent in-rush latch-up. Estimated: total worst-case power consumption at 100% transceiver utilization and 75% logic utilization is approximately 18-22 W, requiring a multilayer PCB with copper pours and forced-air cooling. Engineers should use the Altera PowerPlay early power estimator in Quartus II before final PCB layout.
The 800-ball FineLine BGA uses a 1.0 mm ball pitch, which is at the limit of standard SMT assembly processes. PCB design should use 0.5 mm via-in-pad with filled and plated-over vias to escape the inner rows. Impedance-controlled routing (100 ohm differential for transceiver channels, 50 ohm single-ended for clocks) requires 4 mil to 6 mil trace widths on 6 mil-to-8 mil dielectric stackup. Length matching for the transceiver TX/RX pairs must be within 0.127 mm (5 mil) per the Altera Stratix GX High-Speed Board Design Guidelines.
Estimated: With a theta_JA of approximately 12 C/W (estimated for a 800-ball FBGA on a 14-layer PCB with minimal copper pour), the EP1SGX40GF800C7N dissipating 20 W would reach a junction temperature rise of 240C above ambient, requiring active cooling. Thermal design must include top-side and bottom-side thermal pads with thermal via arrays, plus a heatsink or forced-air flow to maintain junction temperature below 85C for commercial temperature grade. For industrial applications, the EP1SGX40GF1020I7N industrial variant (same die, larger package) is recommended for better thermal headroom.
Common pitfalls when designing with the EP1SGX40GF800C7N include: (1) forgetting to instantiate the ALT2GXB or ALTGXB megafunction in Quartus II for each transceiver channel, which leaves the channel unconfigured; (2) failing to provide the REFCLK inputs as a properly AC-coupled LVPECL or LVDS signal, which prevents transceiver link-up; (3) connecting unused user I/O banks to incompatible voltages, which latches up the I/O; (4) omitting the nCONFIG pull-up resistor (10 kohm to 3.3 V) which prevents configuration startup.
The multi-gigabit transceiver channels are highly sensitive to power-supply noise; VCCL_GXB (transceiver analog 1.5 V) must be filtered with a Pi network (10 uF + ferrite bead + 10 uF) and isolated from VCCINT (digital 1.5 V). Reference clock jitter must be kept below 3 ps RMS for proper transceiver operation at 3.1875 Gbps. PCB layer stackup must assign a continuous ground plane directly adjacent to each high-speed routing layer to provide a low-impedance return path for the 100 ohm differential pairs.
Compliance Information
RoHS and REACH compliance data not specified in the verified web data for this legacy Altera Stratix GX part. Lead-free status depends on date code; parts shipped after 2006 are typically lead-free per Altera's transition.
