EPM9560ARC208-10 - MAX 9000 CPLD 560 Macro 208-RQFP | Intel
MPN: EPM9560ARC208-10 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for EPM9560ARC208-10 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM9560ARC208-10N
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View Datasheet →EPM9560ARC208-10 Maximum Ratings & Electrical Characteristics
| Device Family | MAX 9000A (Multiple Array MatriX) |
| Programmable Logic Type | CPLD (Complex Programmable Logic Device) |
| Usable Gates | 12,000 gates |
| Macrocells | 560 macrocells |
| Logic Array Blocks | 35 LABs |
| User I/O Pins | 153 I/O |
| Propagation Delay (tPD) | 10 ns (speed grade -10) |
| Internal Frequency | 144.9 MHz |
| Supply Voltage | 5.0 V |
| Logic Family | CMOS |
| Configuration Technology | EEPROM (non-volatile, in-system programmable) |
| JTAG Interface | IEEE 1149.1 boundary-scan (ISP) |
| Operating Temperature | 0 C to +70 C (commercial) |
| Package | 208-pin RQFP (PowerQuad Flat Pack) with exposed pad |
| Mounting Type | Surface Mount |
| Pin Count | 208 pins |
EPM9560ARC208-10 208-pin rqfp (powerquad flat pack) with exposed pad Pin Configuration Guide
Complete pinout information for EPM9560ARC208-10 (208-pin rqfp (powerquad flat pack) with exposed pad package) with 208 pins pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM9560ARC208-10.
Refer to the datasheet for full pin configuration.
Estimated pin count: 208 pins pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM9560ARC208-10 is suitable for 6 applications: Industrial Control Backplane Glue Logic, Telecommunications Line Card Logic, Test and Measurement Instrument Control, Legacy System Maintenance and Repair, Bus Bridging and Protocol Translation, Military and Aerospace Legacy Upgrades.
Industrial Control Backplane Glue Logic
The EPM9560ARC208-10 fits industrial control backplanes because its 560 macrocells and 153 user I/O pins can absorb the address decoding, chip-select generation, and bus arbitration logic that would otherwise require dozens of discrete 74-series devices. Its 10 ns pin-to-pin delay and uniform MAX 9000 interconnect array give deterministic timing, which matters when backplane strobes must meet fixed setup and hold windows. The device is EEPROM-based, so it configures instantly at power-up with no boot PROM, unlike an SRAM FPGA. A typical implementation places the CPLD between the host processor bus and peripheral slots, translating 5.0 V signals and generating wait states. The trade-off is power: the 5.0 V CMOS core draws more than a modern 1.8 V CPLD, so thermal relief on the 208-RQFP exposed pad should be verified.
Recommended
Telecommunications Line Card Logic
In telecommunications line cards the EPM9560ARC208-10 handles protocol glue, timeslot interchange control, and status register logic where 560 macrocells provide ample headroom. The 144.9 MHz internal frequency supports clocked state machines running well above typical T1/E1 or SONET tributary rates, and the 153 I/O pins can interface multiple framers and backplane transceivers. Because MAX 9000 routing is through a fixed interconnect array, timing is repeatable across production lots, simplifying static timing sign-off. The 5.0 V supply matches legacy line-card rails, avoiding level shifters. Designers should note that the commercial 0 C to +70 C rating may require forced-air cooling in dense racks, and that the part is obsolete, so new line-card designs should migrate to MAX V while existing designs use remaining stock.
Recommended
Test and Measurement Instrument Control
Test and measurement instruments use the EPM9560ARC208-10 for trigger sequencing, front-panel interface logic, and acquisition memory address generation. The 10 ns propagation delay keeps trigger-to-sample latency low and predictable, which is critical when correlating multiple acquisition channels. With 560 macrocells the device can implement several independent state machines plus a register file, reducing board area versus discrete logic. EEPROM configuration means the instrument boots into a known logic state without a configuration PROM, improving reliability in field service. The 208-pin RQFP exposed pad provides a thermal path for the 5.0 V core. A practical caution: because the MAX 9000 family is obsolete, instrument makers maintaining legacy platforms should stock the EPM9560ARC208-10N lead-free variant for long-term repair.
Recommended
Legacy System Maintenance and Repair
The EPM9560ARC208-10 is widely used in legacy system maintenance because many 1990s and 2000s designs standardized on MAX 9000 CPLDs for glue logic. When a board fails, replacing the CPLD requires an exact pin-compatible part with the same 208-pin RQFP footprint and 10 ns speed grade, which the EPM9560ARC208-10 and its lead-free -10N variant provide. Because the device is EEPROM-based, a replacement can be programmed in-system via JTAG after soldering, avoiding the need for a pre-programmed part. The main risk is counterfeit or re-marked stock, so buyers should source from authorized distributors and verify date codes. Keeping the EPM9560ARC208-10N on hand as a drop-in reduces downtime when the non-RoHS version is unavailable.
Recommended
Bus Bridging and Protocol Translation
The EPM9560ARC208-10 is well suited to bus bridging because its 153 user I/O pins can connect two dissimilar buses while 560 macrocells implement the translation state machine and FIFO control. Typical uses include bridging an ISA or VME backplane to a peripheral bus, or converting between multiplexed and non-multiplexed address/data formats. The MAX 9000 interconnect array gives uniform delays, so bridge latency is deterministic and easy to budget. Operating from 5.0 V, the device interfaces directly with legacy TTL-level buses without level shifters. The main design consideration is that the 10 ns delay grade must be selected when the bridge sits in a critical path; the slower EPM9560RC208-15 at 15 ns may violate timing. For new designs, a MAX V CPLD offers the same function at lower power.
Recommended
Military and Aerospace Legacy Upgrades
Military and aerospace platforms often retain MAX 9000 CPLDs because requalification of a new logic device is expensive. The EPM9560ARC208-10 provides 560 macrocells and 153 I/O in a 208-pin RQFP package, allowing obsolescence-driven redesigns to preserve the existing board layout. Its EEPROM configuration is immune to the single-event upsets that affect SRAM-based FPGAs, an advantage in radiation-sensitive environments, though the commercial temperature grade limits use to benign compartments. When upgrading, engineers should confirm that the replacement carries the same speed grade and that the exposed pad is soldered for thermal and mechanical integrity. Because the family is obsolete, long-term support depends on remaining stock and the lead-free EPM9560ARC208-10N variant.
Recommended
Recommended Products Summary
Engineering reference data for EPM9560ARC208-10 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM9560ARC208-10N | EPM9560RC208-15 | EPM9480RC208-15 | EPM9320RC208-20 |
|---|---|---|---|---|---|
| Package | 208-pin RQFP | 208-pin RQFP - same | 208-pin RQFP - same | 208-pin RQFP - same | 208-pin RQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 560 | 560 | 560 | 480 | 320 |
| Usable Gates | 12,000 | 12,000 | 12,000 | 10,000 | 6,000 |
| Propagation Delay | 10 ns | 10 ns | 15 ns | 15 ns | 20 ns |
| User I/O Pins | 153 | 153 | 153 | [DATA_NEEDED] | [DATA_NEEDED] |
| Supply Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Lead-Free (RoHS) | [DATA_NEEDED: RoHS status] | Yes (N suffix) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Fastest 208-RQFP MAX 9000 speed grade (vs EPM9560RC208-15)
- Highest macrocell count in the 208-RQFP MAX 9000 family (vs EPM9480RC208-15)
- Lead-free drop-in available (vs EPM9560ARC208-10N)
Design Notes
Decouple every VCC pin of the EPM9560ARC208-10 with a 0.1 uF ceramic capacitor placed within 5 mm of the pin, and add at least one 10 uF bulk capacitor per power plane. The 5.0 V CMOS core draws transient current during macrocell switching; inadequate decoupling causes ground bounce that can corrupt EEPROM configuration during in-system programming. Keep the 5.0 V rail within 5% tolerance across the full 0 C to +70 C range.
The 208-pin RQFP package has an exposed thermal pad that must be soldered to a matching copper land with thermal vias to the ground plane. Solder voiding under the pad degrades both thermal performance and mechanical reliability. Use a stencil aperture of approximately 50-80% of the pad area to control paste volume, and verify voiding with X-ray after reflow. Route the 153 user I/O traces away from the pad region to avoid solder bridging.
Do not assume the EPM9560ARC208-10 is still in production: the MAX 9000A family is obsolete, so designs must either qualify remaining stock or migrate to MAX V/MAX 10. When substituting the EPM9560RC208-15, re-run static timing analysis because the 15 ns delay is 50% slower than the 10 ns grade and may violate setup/hold on critical paths. Always verify date codes and request a Certificate of Conformance when buying obsolete CPLDs.
Compliance Information
Compliance data for the EPM9560ARC208-10 was not present in the verified web data. The lead-free variant EPM9560ARC208-10N carries the N suffix indicating RoHS-compliant construction, but the base part's RoHS/REACH status must be confirmed with the manufacturer or distributor.