EPM9480RC208-15 - 480 Macro Cell MAX 9000 CPLD, 15ns | Intel
MPN: EPM9480RC208-15 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $38.5 | $385.00 |
| 100 | $32.75 | $3,275.00 |
| 500 | $28.2 | $14,100.00 |
| 1,000 | $24.95 | $24,950.00 |
Drop-in alternatives for EPM9480RC208-15 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM9560RC208-15
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View Datasheet →EPM9560RC208-20
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EPM9480RC208-20
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View Datasheet →EPM9400RC208-20
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View Datasheet →EPM9320RC208-20
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View Datasheet →EPM9480RC208-15 Maximum Ratings & Electrical Characteristics
| Family | MAX 9000 |
| Logic Cells / Macro Cells | 480 macro cells |
| Usable Gates | 10,000 gates |
| Maximum Operating Frequency | 117.6 MHz |
| Propagation Delay (tPD) | 15 ns |
| User I/O Pins | 153 |
| Supply Voltage | 5.0 V |
| Programmability | In-System (ISP) via JTAG IEEE 1149.1 |
| Configuration Memory | EEPROM (non-volatile) |
| Package | RQFP-208 |
| Operating Temperature | -40C to +85C (commercial) |
| Mounting Type | Surface Mount |
| Architecture | Multiple Array MatriX (MAX) - 3rd generation |
EPM9480RC208-15 rqfp-208 Pin Configuration Guide
Complete pinout information for EPM9480RC208-15 (rqfp-208 package) with 153 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM9480RC208-15.
Refer to the datasheet for full pin configuration.
Estimated pin count: 153 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM9480RC208-15 is suitable for 6 applications: Legacy Industrial Control Glue Logic, Telecommunications Line Card Interface, PCI Bus Interface and Decoder, State Machine and Protocol Conversion, Aerospace Sustainment and Obsolescence Management, Test and Measurement Equipment Backplane.
Legacy Industrial Control Glue Logic
The EPM9480RC208-15 is widely used in legacy industrial control boards to consolidate discrete 74-series glue logic into a single non-volatile programmable device. With 480 macro cells and 153 user I/O pins, the part can replace dozens of TTL packages while providing deterministic 15 ns propagation delay for control-loop timing. Its 5V TTL-compatible I/Os interface directly to legacy sensor drivers and actuator control signals without level translation, simplifying board layout. The JTAG in-system programmability allows field updates to control logic without removing the IC from the board, which is critical for sustainment programs. The -40C to +85C operating range supports factory-floor deployments where ambient temperatures fluctuate widely.
Recommended
Telecommunications Line Card Interface
Telecom line cards historically used MAX 9000 CPLDs for bus arbitration, address decoding, and timing generation between network processors and framer/mapper ASICs. The EPM9480RC208-15 provides 153 I/Os sufficient for parallel backplane interfaces (H.110, PCI, or proprietary buses) at 5V TTL levels. Its 117.6 MHz maximum internal frequency supports common telecom clock rates including 77.76 MHz (STM-1 byte clock) divided down from 155.52 MHz. EEPROM-based configuration means the device powers up in a defined state without external boot PROM, simplifying line-card boot sequencing. Sustainment programs for legacy switches and DSLAMs continue to source this part into the 2026 timeframe.
Recommended
PCI Bus Interface and Decoder
The EPM9480RC208-15 is a classic choice for PCI bus address/data decoding and bus-master arbitration in legacy PCs, servers, and add-in cards. The MAX 9000 family's 5V-tolerant I/Os meet PCI specification requirements for the 5V signaling environment, and the 15 ns tPD comfortably satisfies the 33 MHz PCI clock period timing budget. The 480 macro cells handle full 32-bit address decoding plus chip-select generation for multiple peripherals. The JTAG chain allows post-assembly programming and boundary-scan testing per IEEE 1149.1, which is essential for high-volume card manufacturing. Engineers maintaining PCI-based industrial or test equipment continue to specify this part for field replacements.
Recommended
State Machine and Protocol Conversion
Custom state machines and protocol bridges are a natural fit for the EPM9480RC208-15's deterministic-timing CPLD architecture. With 480 macro cells the device can implement multi-state controllers for protocols such as I2C-to-SPI bridging, UART multiplexing, or legacy parallel-to-serial converters. The 15 ns tPD provides predictable state-transition latency that simplifies timing closure compared to FPGAs. The non-volatile EEPROM configuration ensures the state machine boots into a known valid state without configuration delays, which is critical for fail-safe industrial protocols. Field updates via JTAG ISP allow bug fixes to deployed converters without board rework.
Recommended
Aerospace Sustainment and Obsolescence Management
Aerospace and defense sustainment programs continue to source the EPM9480RC208-15 to maintain legacy avionics, radar front-end controllers, and military communication systems originally designed around the MAX 9000 family. The part's established reliability data, mature manufacturing base, and 5V I/O compatibility with legacy Mil-Std-1553 and ARINC-429 interface circuits make it irreplaceable for these applications. With 153 user I/O pins, a single device can implement complete bus monitor or RT (remote terminal) logic for multiple databuses. Long-term support contracts through QML-rated distributors ensure continued availability despite Intel's migration of the CPLD portfolio to MAX V and MAX 10 devices.
Recommended
Test and Measurement Equipment Backplane
Test instruments and ATE (Automated Test Equipment) systems use the EPM9480RC208-15 for backplane arbitration, fixture identification, and per-pin DUT (Device Under Test) control logic. The 153 I/O pins allow direct connection to high-density test fixtures without external muxing, while the deterministic 15 ns timing enables precise test-window generation. The 5V I/O compatibility supports legacy mixed-signal test interfaces. JTAG boundary-scan capability aids board-level fault diagnosis in production test environments. The CPLD's non-volatile configuration eliminates boot-time variability that would otherwise complicate test sequencing in high-throughput manufacturing.
Recommended
Recommended Products Summary
Engineering reference data for EPM9480RC208-15 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM9560RC208-15 | EPM9560RC208-20 | EPM9480RC208-20 | EPM9400RC208-20 | EPM9320RC208-20 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | RQFP-208 | RQFP-208 - same | RQFP-208 - same | RQFP-208 - same | RQFP-208 - same | RQFP-208 - same |
| Macro Cells | 480 | 560 (+17%) | 560 (+17%) | 480 (identical) | 400 (-17%) | 320 (-33%) |
| Propagation Delay (tPD) | 15 ns | 15 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| Maximum Frequency (fMAX) | 117.6 MHz | 117.6 MHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O Pins | 153 | 153 | 153 | 153 | 153 | 153 |
| Supply Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Programmability | JTAG IEEE 1149.1 ISP | JTAG IEEE 1149.1 ISP | JTAG IEEE 1149.1 ISP | JTAG IEEE 1149.1 ISP | JTAG IEEE 1149.1 ISP | JTAG IEEE 1149.1 ISP |
| Family | MAX 9000 | MAX 9000 | MAX 9000 | MAX 9000 | MAX 9000 | MAX 9000 |
Key Differentiators
- Highest logic density in the 5V MAX 9000 family (vs EPM9400RC208-20)
- Fastest speed grade available in the 208-pin MAX 9000 family (vs EPM9480RC208-20)
- Mature EEPROM technology with field-proven reliability (vs MAX II EPM1270)
- Native 5V TTL-compatible I/O without level translation (vs Modern 3.3V CPLDs)
Design Notes
The EPM9480RC208-15 requires a clean 5.0V supply with adequate decoupling on every VCC pin. Place one 0.1 uF ceramic decoupling capacitor within 0.25 inches of each VCC pin and one 10 uF tantalum bulk capacitor near the package. During in-system programming, transient current spikes can reach 200 mA; ensure the regulator has sufficient headroom and a 100 uF bulk reservoir at the board entry point to prevent voltage droops that would abort programming.
Route JTAG signals (TCK, TMS, TDO, TDI) with characteristic impedance of 50 ohms and keep them away from high-speed clock or data signals. Place a 10 kohm pull-up on TCK and TDI as recommended by IEEE 1149.1, and a 10 kohm pull-up on TMS. The TDO pin is a totem-pole output that can be wired-ORed with other devices in the JTAG chain. For long JTAG chains or backplane programming, add a JTAG buffer such as the SN74ACT8990 to maintain signal integrity.
The RQFP-208 package has a thermal resistance of approximately 35 C/W (theta_JA) on a standard JEDEC 4-layer test board. At 5V supply with all 153 I/O pins switching at 50 MHz, the device dissipates roughly 1.5 W, resulting in a 53C temperature rise above ambient. For closed-enclosure industrial applications (ambient up to 70C), ensure the junction temperature stays below 125C by providing at least 200 LFM airflow or a copper heatsink pad. Avoid placing the part directly adjacent to high-power regulators.
Do not confuse the EPM9480RC208-15 with the EPM9560ARI208-10—the latter uses a BFQFP package with a different pinout and is not pin-compatible. The trailing -15 in EPM9480RC208-15 refers to the 15 ns speed grade; parts ending in -20 are 33% slower but otherwise identical. Do not mix speed grades within the same JTAG chain when chain-timing-sensitive applications require matched tCO values. Always verify the JTAG IDCODE before programming to avoid bricking the device with an incompatible bitstream.
Route all 153 user I/O signals on inner layers to escape the dense RQFP-208 footprint; the 0.5 mm pitch requires micro-via fan-out or HDI PCB technology on dense boards. Place a ground plane on layer 2 directly beneath the package to provide a low-impedance return path. The package's exposed thermal pad (if present on the specific RQFP variant) should be soldered to a copper pour with at least 8 thermal vias to inner ground layers. Maintain 5-mil clearance between JTAG traces and adjacent user I/O to minimize crosstalk during in-system programming.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status could not be confirmed from the verified web data; the part was originally designed before many of these standards were in force. AEC-Q100 is not applicable (this is not an automotive-qualified part). Engineers should request the latest material declaration directly from Intel for compliance documentation.
