K4AAG085WA-BCRC - 16Gb DDR4 SDRAM 2Gx8 FBGA | Samsung
MPN: K4AAG085WA-BCRC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.51 | $8.51 |
| 10 | $7.9 | $79.00 |
| 100 | $7.2 | $720.00 |
| 500 | $6.65 | $3,325.00 |
| 1,000 | $6.1 | $6,100.00 |
Drop-in alternatives for K4AAG085WA-BCRC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4AAG085WA-BCWE
✅ Drop-In✓ In Stock
$7.24 / Unit
View Datasheet →K4AAG085WA-BCTD
✅ Drop-In✓ In Stock
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View Datasheet →K4AAG085WA-BCPB
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6.92 / Unit
View Datasheet →K4AAG085WA-BCRC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 16 Gbit |
| Organization | 2G x 8 |
| Supply Voltage | 1.2 V |
| Interface | Parallel, DDR4 |
| Package | 78FBGA (78-ball Fine-Pitch Ball Grid Array) |
| Operating Temperature | 0C to +85C |
| Mounting Type | Surface Mount |
| Data Width | 8 bit |
| Generation | DDR4 |
| Speed Grade Suffix | BCRC |
| On-Die Termination | Yes (DDR4 ODT) |
| Refresh | Self-refresh and auto-refresh (DDR4 standard) |
| RoHS Status | Compliant |
| Family | K4AAG085WA (16Gb 2Gx8 DDR4 family) |
K4AAG085WA-BCRC 78fbga (78-ball fine-pitch ball grid array) Pin Configuration Guide
Complete pinout information for K4AAG085WA-BCRC (78fbga (78-ball fine-pitch ball grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4AAG085WA-BCRC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4AAG085WA-BCRC is suitable for 6 applications: PC and Server DRAM Modules, Embedded and Industrial Motherboards, Networking Switches and Routers, Set-Top Boxes and Smart TV Platforms, Graphics and Accelerator Cards, Test, Measurement, and Industrial PCs.
PC and Server DRAM Modules
The K4AAG085WA-BCRC is a primary component for UDIMM, RDIMM, and SODIMM memory modules, where eight or more x8 devices form a 64-bit wide rank totaling 16 GB per rank. Its 16 Gbit density halves chip count versus 8 Gbit parts, cutting assembly cost and reducing rank load on the fly-by address/command bus. Operating at 1.2 V it keeps module power within JEDEC DDR4 budgets, and the commercial 0C to +85C rating matches desktop and datacenter ambient conditions. Memory controllers at DDR4-2666 class timing must be verified against the BCRC binning table during module qualification.
Recommended
Embedded and Industrial Motherboards
Industrial controllers, gateways, and embedded x86 or ARM motherboards use soldered-down K4AAG085WA-BCRC devices to provide 2 to 16 GB of DDR4 main memory without SO-DIMM sockets, improving vibration resistance and reducing height. The 78FBGA footprint suits fine-pitch BGA assembly on standard 6 to 8 layer PCBs, and 1.2 V operation simplifies the power tree (one VDD rail plus VPP). Designers should confirm the controller's maximum supported data rate against the BCRC speed bin and follow Samsung's DDR4 layout guidelines for fly-by termination and per-byte length matching.
Recommended
Networking Switches and Routers
Enterprise switches, routers, and telecom appliances rely on high-density x8 DDR4 like the K4AAG085WA-BCRC for packet buffers, routing tables, and control-plane software memory. The 2G x 8 organization lets network processors build 64-bit or 128-bit buses with 8 to 16 devices, and the 16 Gbit density keeps buffer depth high while limiting component count on crowded line cards. Its 1.2 V supply and commercial temperature range fit forced-air-cooled equipment, while the BGA package withstands sustained thermal cycling typical of 24/7 networking hardware.
Recommended
Set-Top Boxes and Smart TV Platforms
Broadcast and OTT set-top boxes, smart TVs, and media players use soldered DDR4 such as the K4AAG085WA-BCRC to feed 4K video decode buffers and application memory. One or two 16 Gbit x8 devices provide 2 to 4 GB, sufficient for Android TV and Linux middleware stacks, while the 1.2 V rail helps meet energy-star style standby and active power targets. The compact 78FBGA supports low-profile enclosure designs, and the commercial 0C to +85C range covers living-room thermal environments with margin.
Recommended
Graphics and Accelerator Cards
Entry-level GPUs, AI inference accelerators, and FPGA accelerator cards use arrays of x8 DDR4 like the K4AAG085WA-BCRC as high-capacity workspace memory when GDDR6 bandwidth is unnecessary. Sixteen devices on a 128-bit bus yield 32 GB per card, attractive for model caching and frame buffering. The 78FBGA ball map supports dense double-sided layout, and DDR4 on-die termination eases multi-drop signal integrity at 2666 Mbps-class rates. Thermal design should budget airflow across BGA packages since sustained memory bandwidth keeps junction temperatures elevated.
Recommended
Test, Measurement, and Industrial PCs
Bench instruments, industrial PCs, and data-acquisition platforms deploy the K4AAG085WA-BCRC for main memory where 16 Gbit per chip maximizes capture depth and software workspace in a limited board area. Oscilloscope and logic-analyzer backends in particular value per-chip density to stream and store long record lengths, and the x8 organization allows ECC implementation with standard 72-bit DIMM-style arithmetic. The commercial temperature rating suits laboratory and conditioned industrial enclosures; fanless or wide-temperature systems should qualify an industrial binning suffix instead.
Recommended
Recommended Products Summary
Engineering reference data for K4AAG085WA-BCRC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4AAG085WA-BCWE | K4AAG085WA-BCTD | K4AAG085WA-BCPB |
|---|---|---|---|---|
| Package | 78FBGA | 78FBGA - same | 78FBGA - same | 78FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit |
| Organization | 2G x 8 | 2G x 8 | 2G x 8 | 2G x 8 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Maximum Data Rate | [DATA_NEEDED: BCRC speed grade] | 3200 Mbps | 2400 Mbps | [DATA_NEEDED] |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | [DATA_NEEDED] |
| Reference Price (qty 1) | $8.51 (as of 2026-09-04, family estimate) | $8.5126 (LCSC, as of 2026-09-04) | $10.1839 (LCSC, as of 2026-09-04) | [DATA_NEEDED] |
Key Differentiators
- 16 Gbit density halves chip count per rank (vs K4A8G085WB-BCRC)
- Lower power than DDR3 solutions (vs K4AAG085WA-BCWE)
- Footprint-compatible speed-grade ladder (vs K4AAG085WA-BCTD)
Design Notes
Route the DDR4 interface with fly-by address/command topology and terminate the clock and CA bus at the last device. Length-match each DQS/DQ byte group tightly (per Samsung DDR4 design guide skew targets) and keep all memory traces over an unbroken ground reference. Provide 0.1 uF decoupling at each VDD/VDDQ ball pair plus bulk capacitance near the 1.2 V regulator. Break out the 78FBGA with via-in-pad or dog-bone fanout on at least a 6-layer stackup to preserve impedance control.
Budget power using the 1.2 V VDD/VDDQ rail plus the VPP rail per the datasheet IDD tables at your target data rate. Estimated: dynamic current scales roughly linearly with data rate, so a controller running a slower bin than the BCRC rating reduces IDD accordingly. Verify that the VRM can supply worst-case refresh-plus-burst current simultaneously, and sequence VPP before or with VDD per Samsung power-up requirements to avoid latch-up during initialization.
Do not substitute a slower speed grade (e.g., BCTD at 2400 Mbps) into a controller configured for a faster DDR4 rate, even though the ball maps are identical; timing violations will cause intermittent errors that fail only at temperature. Also verify the exact BCRC binning values (maximum data rate, CAS latency) in the current Samsung datasheet revision rather than assuming binning codes, since Samsung re-bins parts across die revisions. Finally, confirm MSL and baking requirements before reflow to avoid BGA delamination.
Compliance Information
RoHS compliance indicated by distributor listing (JLCPCB marks the K4AAG085WA-BCWE family member as RoHS FBGA-78 DRAM). Formal REACH, halogen-free, and conflict-minerals declarations must be obtained from Samsung's product compliance portal for the exact ordering code.
