Microchip Technology

A3PE3000L-FG896M - 3M-Gate Low-Power Flash FPGA | Microchip

MPN: A3PE3000L-FG896M ✓ Nakahanda
1.2 V / 1.5 V Vdss 896-ball FBGA (FG896) Package On-chip flash (nonvolatile, single-chip) Memory
MOQ: 1 |

A3PE3000L-FG896M Ulas

The Microchip (formerly Microsemi/Actel) A3PE3000L-FG896M is a 3-million-gate ProASIC3L low-power flash FPGA with 75,264 logic cells and 620 user I/O, fabricated on a 130nm CMOS flash process and housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.2V/1.5V core supply.

A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are single-chip solutions that do not require an external configuration PROM, power up instantly, and are inherently more secure because the bitstream is not stored externally. Within the power management hierarchy of programmable logic, the ProASIC3L family sits as Microchip's low-power variant of the ProASIC3/ProASIC3E families, adding Flash*Freeze technology.

Key differentiating features include Flash*Freeze technology, which allows the device to enter an ultra-low-power sleep mode while retaining state and waking in microseconds; 1.2V to 1.5V core operation for reduced dynamic and static power; single-chip reprogrammable flash configuration; Schmitt-trigger option on single-ended inputs; and weak pull-up/pull-down support on I/O.

Technically, the device uses a sea-of-gates flash architecture with versatile logic elements, embedded block RAM, and supports IEEE 1149.1 (JTAG) boundary scan testing. The pin-compatible package strategy across the ProASIC3L family (except PQ208) allows design migration between density grades without PCB rework.

Typical applications include military and aerospace systems, industrial automation, portable instrumentation, and low-power embedded control where nonvolatile single-chip configuration and minimal standby power are essential.

Design consideration: the M temperature grade suffix indicates a military-grade screening level; verify supply sequencing and use Microchip Libero SoC design tools for implementation.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

Mga alternatibo na pwedeng ilagay na A3PE3000L-FG896M — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.

Variante sa Seri na ito

Katulad na modelo sa serye na katugma sa pagpasok A3PE3000L-FG896M (parehas na form factor at footprint) — pagkakaiba sa Family, Package, Configuration Memory, Process Technology, RoHS Status.

Microchip Technology
Family: ProASIC3E
Package: 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch)
Configuration Memory: On-chip Flash (non-volatile, single chip)
Ikabit sa A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3E
Package: 896-BGA (FBGA)
Configuration Memory: Flash (non-volatile, reprogrammable)
Ikabit sa A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L (Flash FPGA)
Package: 896-ball FBGA
Process Technology: 130 nm Flash
Ikabit sa A3PE3000L-FG896M →
Microchip Technology
Family: ProASIC3L
Package: 896-ball FBGA
Configuration Memory: Nonvolatile flash (single-chip, Instant On)
Ikabit sa A3PE3000L-FG896M →

Wala ng magagamit na drop-in alternatibo para sa produkto na ito.

Hilingin ang Alternatibo

A3PE3000L-FG896M Mga Pinakamataas na Rating at Electrical Characteristics

Family ProASIC3L (ProASIC3EL)
Equivalent Gates 3,000,000
Logic Cells 75,264
User I/O 620
Process Technology 130 nm CMOS flash
Core Voltage 1.2 V / 1.5 V
Packhaging 896-ball FBGA (FG896)
Uri ng Pagpapasok Surface Mount
Configuration Memory On-chip flash (nonvolatile, single-chip)
Low-Power Technology Flash*Freeze
JTAG Boundary Scan IEEE 1149.1
Input Type Option Schmitt trigger on single-ended inputs
Pull Resistors Weak pull-up / pull-down
Temperature Grade M (military screening per suffix)

Gabay sa Pin Configuration ng A3PE3000L-FG896M 896-ball fbga (fg896)

Pin configuration para sa A3PE3000L-FG896M (896-ball fbga (fg896) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.

Pinout diagram ng 896-ball fbga (fg896) package para sa A3PE3000L-FG896M

Wala ng detalyadong pinout data na magagamit para sa A3PE3000L-FG896M.

Sumangguni sa datasheet para sa buong pin configuration.

Tipikal na mga Gamit

A3PE3000L-FG896M ay nararapat para sa 3 aplikasyons: Mga Embedded System, Mga IoT Device, Industrial na Kontrol.

🧩

Mga Embedded System

Pangunahing pagproseso sa mga embedded application gamit ang A3PE3000L-FG896M.

🌐

Mga IoT Device

Mga smart connected device na pinapagana ng A3PE3000L-FG896M.

🏭

Industrial na Kontrol

Mga automation at control system gamit ang A3PE3000L-FG896M.

Wala ng FAQ na magagamit para sa produkto na ito.

Impormasyon ng Talumpati sa Engineering for A3PE3000L-FG896M — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.

Impormasyon ng Pagsunod sa Kautusan

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Walang Lead
Unknown
Walang Halogen
Unknown
Mga Conflict Mineral
Unknown

Compliance data not present in the provided web data.

Data napatotohanan sa: 2026-09-02 — impormasyon na pinatunayan at pinapatakbo ng pangkat ng engineering ng XAIPART's component engineering team

Mga kaugnay na Mga Komponente at mga Tuntunin

Microchip Technology Actel Corporation Microsemi Corporation A3PE3000L-FG896M ProASIC3L flash FPGA field-programmable gate array Flash*Freeze technology 896-ball FBGA IEEE 1149.1 JTAG 130nm CMOS SRAM FPGA low-power FPGA military FPGA boundary scan
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