FPGA & CPLD
Products (6,800+)
EPM570F256C3N - MAX II CPLD, 570 LEs, 256-FBGA | Intel / Altera
The Intel (formerly Altera) EPM570F256C3N is a non-volatile, flash-based MAX II CPLD from the MAX II device family, offering 570 logic elements (LEs) (equivalent to 440 macrocells), 8 Kbits of user flash memory (UFM), and a maximum operating frequency of 304 MHz. It is housed in a 256-ball FineLine BGA (FBGA) package and fabricated on a 0.18-um, 6-layer-metal flash process. The device operates from a 2.5V/3.3V core and supports MultiVolt I/O for interfacing with 1.5V, 1.8V, 2.5V, and 3.3V logic families. A MAX II CPLD is a Complex Programmable Logic Device: a non-volatile, instantly-on programmable logic IC that combines the deterministic timing and ease of use of a traditional PAL/GAL-style device with the density and feature integration of modern FPGAs. Unlike SRAM-based FPGAs, MAX II devices store their configuration in on-chip flash, eliminating the need for external boot PROMs and enabling instant-on behavior at power-up. Within the broader programmable-logic taxonomy, MAX II sits below low-cost FPGAs in density but above simple SPLDs in capability, occupying a unique space for glue-logic, I/O expansion, bus bridging, and power-sequencing tasks. The EPM570F256C3N provides up to 212 user I/O pins (package-dependent), four MultiVolt I/O banks, and enhanced in-system programmability (ISP) compliant with IEEE 1532 / IEEE 1149.1 JTAG. Designers can choose between commercial and industrial temperature grades; the 'C3N' suffix indicates a commercial-grade device (0C to +85C), with the on-chip flash configuration setting it apart from SRAM-based competitors. Typical applications for the EPM570F256C3N include system-level glue logic in industrial controllers, I/O expansion and voltage-level translation between mixed-voltage ASICs/ASICs, register-based bus interface bridging, power-supply sequencing and supervisory logic, and LED-driving and display-control functions. The on-chip UFM can also be used to store user parameters, calibration constants, or board ID data. When designing with this device, ensure that JTAG chain integrity is preserved, observe MultiVolt bank VCCIO constraints when mixing voltage domains, and leverage the Quartus Prime design tools (free MAX II support) for synthesis, fitting, and programming-file generation. This page synthesizes distributor pricing from LCSC and Xecor, drop-in alternative MPNs from the same MAX II family and across competitors, and practical design notes not found in the manufacturer datasheet alone.
EPM570F256C4 - 570 LEs MAX II CPLD, 256-FBGA | Intel
The Intel (Altera) EPM570F256C4 is a MAX II family Complex Programmable Logic Device (CPLD) with 570 Logic Elements (LEs), housed in a 256-ball FineLine BGA package. It delivers non-volatile, instant-on Flash-based logic with 8 Kbits of user flash memory and operates from a 1.8 V core / 3.3 V I/O supply. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that uses EEPROM or Flash memory to retain its configuration. It sits below FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC -> semiconductor) and is typically used for glue logic, bus bridging, power sequencing, and I/O expansion. Unlike SRAM-based FPGAs, MAX II CPLDs need no external boot PROM and start within microseconds of power-up, making them ideal for deterministic system initialization. Key features include 570 Logic Elements, 160 programmable logic array blocks (LABs equivalent), 212 maximum user I/O pins, 8 Kbits of user flash memory, and an internal oscillator that supports 4.5 ns pin-to-pin logic delays. The device supports JTAG IEEE 1149.1 boundary-scan and in-system programmability (ISP) through the JTAG interface, with built-in Joint Test Action Group (JTAG) instructions for board-level testing. Architecturally, the EPM570F256C4 uses Intel's MultiCore architecture with a labyrinth routing switch matrix, four global clock networks, and per-pin output enable control. The MultiVolt I/O bank can interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels without external level shifters, simplifying mixed-voltage designs. Typical applications include power-on reset and sequencing control in industrial automation, I/O expansion and bus bridging in networking line cards, address decoding in microcontroller systems, and digital signal conditioning in test and measurement equipment. Designers also choose MAX II CPLDs as glue-logic consolidation parts to reduce discrete MSI/SSI logic on the board. When designing with the EPM570F256C4, treat the 256-ball FineLine BGA as a fine-pitch package that requires careful PCB layout: matched-length impedance traces, a 6- or 8-layer stack-up with continuous ground planes, and Xilinx/Altera-compatible BGA fanout. Quartus II software supports this device through the free Quartus Prime Lite / Web Edition toolchain. This page synthesizes distributor pricing (as of 2026-09-12), drop-in same-package alternatives within the MAX II family, and practical design notes not found on a single distributor listing.
EPM570F256C4N - 570 LEs, 440 Macro, 256-FBGA CPLD | Intel / Altera
The Intel (formerly Altera) EPM570F256C4N is a member of the MAX II family of Complex Programmable Logic Devices (CPLDs) built on a 0.18 µm, 6-layer-metal flash process. It integrates 570 Logic Elements (equivalent to 440 macrocells) into a 256-ball FineLine BGA (FBGA) package, with 160 user I/O pins and an in-system programmable user flash memory (UFM) block of 8 Kbits. Operating from 2.5V/3.3V supplies, the device supports MultiVolt I/O interfacing across 1.5V, 1.8V, 2.5V, and 3.3V logic families. What is a CPLD? A Complex Programmable Logic Device is a non-volatile, instantly-on programmable logic IC that combines the deterministic timing and instant-on characteristics of PAL/PLA arrays with the higher logic density and I/O count of modern FPGAs. MAX II CPLDs sit in the hierarchy: programmable logic → CPLD → non-volatile CPLD → MAX II family, bridging glue-logic and simple state-machine tasks that do not justify the cost or boot-time of an SRAM-based FPGA. The 256-pin FineLine BGA package is the largest pin-count option for the MAX II family, enabling the highest I/O count and supporting vertical migration to EPM1270 and EPM2210 in the same footprint. Key features include a maximum operating frequency of 304 MHz (internal), 5.4 ns pin-to-pin logic delay, MultiVolt core and I/O support, JTAG-based in-system programmability (ISP), and an 8 Kbit user flash memory block for storing user-defined data such as serial numbers or configuration parameters. The 256-ball FineLine BGA provides a compact 17 mm × 17 mm footprint suitable for space-constrained designs. Architecturally, the EPM570F256C4N uses a Logic Array Block (LAB) structure of 57 LABs, each containing 10 Logic Elements. The non-volatile flash configuration cell eliminates external boot memory and provides instant-on behavior in < 1 ms, a defining advantage over SRAM FPGAs in power-sequenced and brown-out-sensitive systems. The MultiVolt I/O ring simplifies interfacing with mixed-voltage ASICs, ASSPs, and microcontrollers without level shifters. Typical applications include I/O expansion and bus bridging in industrial control, glue-logic consolidation in communications infrastructure, power-sequencing and reset-distribution logic, LED display scan drivers, and low-cost state-machine controllers. The combination of high I/O count (160) and instant-on non-volatile configuration makes the EPM570F256C4N ideal for designs where deterministic startup and high pin count are required simultaneously. Design consideration: vertical migration within the MAX II family is supported in the 256-pin FineLine BGA — EPM570, EPM1270, and EPM2210 share the same ball map, allowing a single PCB layout to serve multiple density points. Decoupling must follow the MAX II pin connection guidelines with multiple VCCINT and VCCIO pins requiring local 0.1 µF + bulk capacitors. This page consolidates distributor pricing, drop-in same-package alternatives, design notes, and FAQ content that engineers typically need when sourcing the EPM570F256C4N, complementing the manufacturer datasheet with practical selection and replacement context.
EPM570F256C5 - MAX II CPLD, 570 LE, 256-BGA, 201 MHz | Intel / Altera
The Intel / Altera EPM570F256C5 is a MAX II family Complex Programmable Logic Device (CPLD) featuring 570 Logic Elements, 440 macro cells, and 160 user I/O pins in a 256-ball FineLine BGA package. It is built on a 0.18 µm flash-based process, supports 2.5 V and 3.3 V core supply operation, and delivers a maximum toggle frequency of 201.1 MHz with a pin-to-pin logic delay (tPD) of 5.4 ns. A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-on programmable logic IC that combines the deterministic timing of PAL/GAL architectures with modern flash memory. In the system hierarchy, the CPLD sits below the FPGA (which offers higher density but requires a configuration boot), above simple glue-logic gates, and alongside microcontrollers as a complementary logic resource used for bus bridging, I/O expansion, power-up sequencing, and custom interface glue. Key features of the EPM570F256C5 include in-system programmability (ISP) via JTAG (IEEE 1149.1), 8 Kbits of user flash memory, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, and a commercial operating temperature grade of 0 °C to +85 °C. The 256-ball FBGA package provides a compact footprint while exposing enough I/O for wide bus multiplexing. Architecturally, the device uses a uniform interconnect matrix of Logic Array Blocks (LABs) and a global fast-input network, which guarantees fixed-pin-to-pin timing regardless of how the logic is placed. This deterministic timing is the primary engineering reason to choose a CPLD over a small FPGA for control-plane logic. Typical applications include I/O expansion and bus bridging in industrial controllers, glue logic between ASSPs and processors, JTAG-controlled power-up sequencing for FPGAs and SoCs, and protocol translation (LVCMOS/LVTTL bridging). The wide MultiVolt I/O range makes it suitable for interfacing legacy 5 V-tolerant buses through external resistors. When designing with this part, observe that 'C5' denotes the 5 ns speed grade (commercial), the 'N' suffix would denote lead-free, and the 'F' in the prefix indicates the FBGA package family. JTAG chain length must be considered when multiple devices share one TAP controller. Pricing as of 2026-09-12 is around $10 per unit in low quantities from authorized distributors. This page synthesizes cross-reference data, drop-in same-family alternatives, and design guidance that complements the official Altera MAX II Device Handbook without replacing it.
EPM570F256C5N - 570-Element MAX II CPLD, 256-FBGA | Altera
The Altera EPM570F256C5N is a member of the MAX II family of instant-on, non-volatile CPLDs, based on a 0.18-um process technology and offering 570 Logic Elements and 440 Macrocells in a 256-ball FineLine BGA package. It operates from a 2.5V or 3.3V internal supply and supports 160 user I/Os with a 5.4 ns pin-to-pin logic delay. The non-volatile flash configuration memory provides instant-on behavior at power-up with no external boot PROM required, a key differentiator versus SRAM-based FPGAs/CPLDs. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell arrays with a programmable interconnect matrix. In the broader programmable-logic hierarchy, CPLDs sit below FPGAs in density but above simple SPLDs in capability, offering deterministic timing, low power, and instant-on characteristics. MAX II devices target glue-logic, I/O expansion, bus interfacing, and power-sequencing roles where SRAM FPGAs are overkill. Key features include 5.4 ns tPD, 304 MHz internal performance, 8 Kbits of user flash memory, in-system programmability via JTAG, and MultiVolt I/O supporting 1.5V, 1.8V, 2.5V, and 3.3V interfaces. The device consumes low standby current and supports commercial 0C to 85C operation. The MultiVolt core allows the device to interface seamlessly to modern processors, ASICs, and other programmable devices on mixed-voltage boards without external level translators. Architecturally, the EPM570F256C5N uses a flash-based Look-Up Table (LUT) fabric rather than the older MAX-style product-term array, which raises usable logic capacity while keeping propagation delay short. The non-volatile flash cell also eliminates the boot configuration stage, simplifying board layout and reducing bill-of-materials cost versus SRAM-based counterparts. Typical applications include I/O expansion and bridging in industrial controllers, address decoding and glue logic in embedded systems, bus multiplexing for legacy peripherals, power-up sequencing in multi-rail designs, and configuration control for processor subsystems. Its instant-on behavior makes it well suited to deterministic boot paths. When designing with the MAX II CPLD, ensure the Quartus II toolchain is used for synthesis and fitting. Verify pin assignments against the 256-FBGA pinout file and respect MultiVolt bank grouping when mixing 1.8V and 3.3V signals on the same die. This page combines distributor pricing, drop-in pin-compatible alternatives drawn from the same MAX II family, and practical PCB design notes that go beyond what is printed in the manufacturer datasheet.
EPM570F256C5NRR - MAX II CPLD, 570 LEs, 256-BGA | Intel
The Intel (formerly Altera) EPM570F256C5NRR is a non-volatile, low-power MAX II Complex Programmable Logic Device (CPLD) featuring 570 Logic Elements, 440 macro cells, and a 256-ball FineLine BGA (FBGA) package. The 'C5' speed grade delivers 8.7 ns pin-to-pin logic delay (fMAX around 201 MHz internal) while consuming only a few tens of milliamps on a 2.5V/3.3V dual-supply core/IO scheme. It provides instant-on non-volatile configuration via on-chip flash, eliminating external boot memory and shortening power-up latency to microseconds. A CPLD (Complex Programmable Logic Device) is a non-volatile digital IC that combines AND/OR array logic with macro cells, used to implement glue logic, state machines, bus interfaces, and protocol bridges. MAX II sits in the broader hierarchy of programmable logic: PAL/GAL -> SPLD -> CPLD -> FPGA, with CPLDs chosen over FPGAs when designers need fast deterministic pin-to-pin timing, low static power, instant-on configuration, and small-to-moderate logic densities in the 32- to 1,000-LE range. The EPM570 specifically targets designs that need more headroom than entry-level MAX II Z (EPM240) variants while staying below the cost of a low-end FPGA. Key differentiating features include 8.0 Kbytes of user flash memory (UFM) block, support for hot-socketing and JTAG (IEEE 1149.1) boundary-scan, 4 mA IOL drive, in-system programmability via JTAG, and a 0.18 µm flash-based process that allows 100% factory retention of the bitstream across power cycles. The dual-voltage core (2.5 V) and I/O (2.5 V/3.3 V) rails let the device bridge 3.3 V peripherals to 2.5 V controllers without external level shifters on every bus. Architecturally, MAX II uses a Logic Array Block (LAB) topology of 16 macro cells each, interconnected by a FastTrack Continuous Interconnect Matrix (CIM) that delivers predictable ~8 ns timing regardless of placement. The C5 speed grade is the commercial-temperature variant, suitable for 0 °C to +85 °C operation; an 'I' speed-grade variant exists for industrial -40 °C to +100 °C designs. Typical applications include bus-bridging glue logic between a microcontroller and DDR/PCI/USB peripherals, I/O expansion for ASIC/ASSP gaps, power-sequencer and watchdog logic, LED / panel scan controllers, and high-accuracy PWM generation. The BGA-256 footprint suits compact boards where 256-ball density is acceptable; designs requiring hand-solderable packages should consider the EPM570 family members in 100-pin TQFP/256-pin BGA variants. When laying out this device, route the 256 balls on a minimum 1.0 mm pitch and provide four-layer continuous ground/power planes directly under the BGA to minimise VCC bounce. Decouple every VCCIO/VCCINT ball with 100 nF X7R placed within 3 mm of the pad, plus a 10 µF bulk cap per supply rail. This page synthesises distributor pricing, drop-in alternatives within the MAX II family, and practical layout notes not collated in the original Altera/Intel datasheet PDF.
EPM570F256I5 - 570-LE MAX II CPLD, 256-BGA, Industrial | Intel / Altera
The Intel (formerly Altera) EPM570F256I5 is a non-volatile, flash-based MAX II Complex Programmable Logic Device (CPLD) featuring 570 logic elements, 160 user I/O pins, and 8 Kbits of user flash memory, housed in a 256-ball FineLine BGA package. It operates across industrial temperature range (-40C to +85C) with a 3.3V core supply and supports both 3.3V and mixed-voltage 1.5V/1.8V/2.5V/3.3V I/O banks via MultiVolt core and I/O interfaces. A CPLD (Complex Programmable Logic Device) is a non-volatile, instantly-on programmable logic device built from a fabric of Look-Up Tables (LUTs), macrocells, and a programmable interconnect network. In the broader programmable logic taxonomy, CPLDs sit alongside FPGAs as the two dominant families of programmable logic; CPLDs are characterized by deterministic, pin-to-pin propagation delays (typically <10 ns), non-volatile on-chip flash storage, low standby current, and instant-on behavior, making them ideal for glue-logic, bus bridging, I/O expansion, and power-up control tasks where FPGAs are overkill. The MAX II family specifically uses a 0.18 um flash process with a look-up-table based logic array (LE) rather than the older product-term macrocell, giving it higher density per die area while preserving CPLD simplicity. Key features of the EPM570F256I5 include 570 logic elements, 160 maximum user I/Os, 8 Kbits of user flash memory (UFM) usable as general-purpose non-volatile storage, on-chip termination support, JTAG-based in-system programmability (ISP), and MultiVolt I/O that interoperates with 1.5V/1.8V/2.5V/3.3V/5V systems. The device supports I/O standards such as LVTTL, LVCMOS, SSTL, and PCI. Pin-to-pin logic delays in the I5 speed grade are typically in the 5-7 ns range with a maximum clock frequency around 304 MHz (per the MAX II datasheet). From an architecture standpoint, the MAX II family uses a logic-element based fabric divided into Logic Array Blocks (LABs) interconnected by a MultiTrack interconnect; each LE contains a 4-input LUT, a programmable register, and a carry chain, while the UFM block provides 8 Kbits of user-accessible flash that can store boot parameters, serial numbers, or lookup tables without an external EEPROM. The device also includes 4 phase-locked loops (PLLs) for clock synthesis and skew management. Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing and supervisory logic in multi-rail systems, glue-logic replacement for discrete 74-series logic, configuration control for FPGAs and microcontrollers, and protocol translation (UART-to-SPI, I2C-to-parallel) in embedded designs. Its instant-on non-volatile configuration makes it particularly attractive as a companion logic device to ASICs, ASSPs, and microprocessors. When designing with this device, place decoupling capacitors (0.1 uF plus 10 uF bulk) adjacent to each supply pin, follow Intel/Altera Quartus II pin-out guidelines for the F256 BGA (1.0 mm pitch), and connect JTAG TMS/TCK/TDO/TDI to a standard 10-pin header for ISP. Be aware that the MAX II family is now NRND on the Intel product roadmap; for new designs, MAX V or MAX 10 FPGAs are recommended. This page synthesizes distributor pricing, drop-in same-family pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPM570F256I5N - MAX II 570 LEs 440 Macrocells CPLD | Intel / Altera
The Intel (formerly Altera) EPM570F256I5N is a MAX II family Complex Programmable Logic Device (CPLD) with 570 Logic Elements, 440 macrocells, and 160 user I/Os housed in a 256-ball FineLine BGA package. It features 5.4 ns pin-to-pin logic delay (tPD1) and a 304 MHz internal clock frequency, supported by an internal 1.8 V core with multi-voltage 2.5 V/3.3 V I/O support including LVTTL, LVCMOS, and PCI compliance up to 66 MHz. The non-volatile Flash configuration cell removes the need for a separate boot PROM and supports in-system programmability via JTAG (IEEE 1149.1) and IEEE 1532 standards. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/PLA-like macrocell blocks with a central interconnect matrix. CPLDs sit between simple SPLDs/gates and high-density FPGAs in the programmable logic hierarchy (CPLD -> programmable logic -> logic IC -> integrated circuit), offering instant-on behavior, deterministic timing, and excellent pin-to-pin performance for glue-logic, interface bridging, and bus decoding tasks. The MAX II architecture is built on a low-power 1.8 V core process and is widely used as a board-level companion to microcontrollers, ASICs, and FPGAs. Key features of the EPM570F256I5N include 440 macrocells with 9 kbits of user flash memory, hot-socketing support for live insertion, multiVolt I/O banks supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and PCI signaling, and an industrial operating temperature range of -40C to +100C junction. The device offers multi-track routing between Logic Array Blocks (LABs) and supports 4 global clock networks plus 2 global clear/reset signals. Unlike SRAM-based FPGAs, MAX II instant-on operation requires no external configuration memory. In practical designs the EPM570F256I5N is typically deployed for high-speed address decoding, bus width conversion (e.g., 8-bit to 16-bit multiplexing), I/O expansion, timing-sensitive control logic, and as a power-sequencer companion to larger microprocessors. Its deterministic 5.4 ns tPD makes it ideal for pipelined memory and parallel-bus interfaces where software-driven GPIO bit-banging would be too slow. When designing, plan for 1.8 V core and 2.5 V/3.3 V I/O rails; both JTAG and ISP programming require a 3.3 V VCCIO during configuration. Quartus II (or the newer Quartus Prime) software is required for synthesis, fitting, and programming. Compared with discrete 74-series glue logic the EPM570F256I5N consolidates dozens of packages into a single 17 mm x 17 mm BGA.
EPM570FGF256I5N - 570 LE MAX II CPLD, 256-FBGA | Intel (Altera)
The Intel (formerly Altera) EPM570FGF256I5N is a MAX II family Complex Programmable Logic Device (CPLD) built on a 0.18-micron non-volatile process, housed in a 256-ball Fine-pitch Ball Grid Array (FBGA) package with industrial-grade temperature rating (the trailing "I5N"). It delivers 570 Logic Elements (LEs), a 5.0 ns pin-to-pin propagation delay, and instant-on non-volatile configuration stored in on-chip flash memory, eliminating the external configuration PROM that legacy CPLDs require. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between discrete glue logic and FPGAs in the logic hierarchy. Compared to discrete 74-series logic, a CPLD integrates dozens to hundreds of gates, flip-flops, and product terms on a single chip; compared to an FPGA, a CPLD typically offers lower logic density but provides instant-on behavior, deterministic timing, and superior robustness for control-plane tasks such as bus interfacing, power sequencing, and I/O expansion. Key features include 570 Logic Elements, 440 macrocells, up to 212 user I/O pins, an internal flash configuration block, JTAG and in-system programmability (ISP), and multi-volt I/O support (1.5V, 1.8V, 2.5V, 3.3V). The 256-ball FBGA package supports high I/O count in a compact footprint, while the 0.18-micron process keeps standby current low. The instant-on architecture boots in microseconds, which is critical for power-up sequencing and bootstrap logic. The MAX II architecture combines a Look-Up Table (LUT) and product-term fabric with an embedded Flash Configuration Block, giving the designer a non-volatile, JTAG-programmable device with high Pin-to-Pin (tPD) speed. The I5N speed/temperature grade (industrial, -40C to +100C junction, fast 5 ns) is the most widely specified variant for commercial and industrial products. Typical applications include I/O expansion and voltage translation between mismatched logic domains, power-up sequencing for multi-rail systems, bus bridges for legacy microcontrollers and peripheral glue, and LED-driving or display-control logic in industrial controls. When designing with this device, ensure PCB layout provides clean power and ground planes under the FBGA, observe JTAG chain order if multiple devices share the chain, and verify that the Quartus II/Altera design tool targets the EPM570 device family to obtain correct place-and-route results. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPM570GF100C5N - MAX II 570 LE CPLD, 100-FBGA | Altera
The Altera (now Intel) EPM570GF100C5N is a 570-logic-element MAX II family Complex Programmable Logic Device (CPLD) housed in a 100-ball FineLine BGA package with 76 user I/Os and a 5.4 ns pin-to-pin propagation delay. The device integrates non-volatile Flash configuration memory on-chip, eliminating the need for an external boot PROM and enabling instant-on operation at power-up. What is a MAX II CPLD? A Complex Programmable Logic Device is a non-volatile, instant-on programmable logic IC that implements glue logic, bus interfacing, state-machine control, and I/O expansion. The MAX II family uses a look-up-table (LUT) architecture backed by embedded Flash, distinguishing it from SRAM-based FPGAs that require external boot configuration. Within the broader taxonomy, the EPM570 sits in the CPLD -> programmable logic -> digital IC -> semiconductor family hierarchy, and is a low-cost, low-power alternative to small FPGAs for cost-sensitive glue-logic designs. Key specifications include 440 macrocells, 76 user I/Os, a 1.8 V, 2.5 V, 3.3 V multi-voltage I/O interface with 5.0 V tolerant inputs, an internal core voltage of 1.8 V, and an industrial operating temperature range of -40C to +125C. The device supports in-system programmability via IEEE 1532 / IEEE 1149.1 JTAG and is fully RoHS compliant in a lead-free FBGA-100 package measuring 11 mm x 11 mm with a 1.0 mm ball pitch. Architecturally, the EPM570 divides its 570 logic elements into four Logic Array Blocks (LABs), each with 16 macrocells, and connects them through a programmable interconnect array (PIA). Eight user I/O pins per LAB feed signals into the PIA, while the LAB outputs drive the global interconnect and I/O pins, providing predictable, deterministic timing that is characteristic of CPLDs. Typical applications include bus bridging and glue logic in industrial controllers, I/O expansion for microcontrollers and ASICs, power-sequencing and reset distribution, LED drive multiplexing, and portable consumer devices where instant-on, low power, and small footprint are essential. The combination of Flash memory, JTAG ISP, and a small BGA footprint also makes the part attractive for space-constrained designs. When designing with the EPM570GF100C5N, observe the multi-voltage I/O banking constraints of MAX II devices and consult the Quartus II support for the legacy MAX II tool flow. For new designs, consider MAX V (5M570ZE64C5N, 5M570ZT100C5N) as the recommended migration path with improved I/O support. This page synthesizes distributor pricing, drop-in same-package MAX II alternatives, application references, and design notes not assembled in the manufacturer datasheet alone.
EPM570GF100I5N - 570 LEs CPLD 100-FBGA 1.8V Industrial | Intel
The Intel (formerly Altera) EPM570GF100I5N is a MAX II family CPLD delivering 570 logic elements and 440 macrocells in a 100-ball FineLine BGA package with 76 user I/Os. It features 5.4 ns pin-to-pin propagation delay and supports up to 201.1 MHz internal operation, while drawing core power from a single 1.71 V to 1.89 V supply (nominally 1.8 V). What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that sits between discrete glue logic and FPGAs in the programmable logic hierarchy: CPLD -> PLD -> programmable logic -> digital IC -> semiconductor. MAX II devices are flash-based, so configuration is retained without an external boot PROM, and instant-on behavior is achieved at power-up. Compared with first-generation MAX devices, MAX II CPLDs offer higher logic density, lower power, and a MultiVolt I/O bank that interfaces directly to 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic without level shifters. The EPM570GF100I5N integrates 8 Kbits of user flash memory (UFM) alongside the logic array, allowing the same device to store both glue logic and small non-volatile parameter sets such as board IDs, calibration coefficients, or boot configuration. Its 0.18 µm process node and LVCMOS/LVTTL/PCI-compatible I/O buffers support hot-socketing and drive strengths suitable for bus interfaces common in industrial control boards. Architecturally, the device uses a logic-element to macrocell fabric connected via a fast, deterministic interconnect, which is the reason CPLDs beat small FPGAs at predictable timing-critical tasks such as address decoding, bus arbitration, and reset sequencing. I/O banks provide JTAG (IEEE 1149.1) boundary-scan support and a JTAG-based programming interface, allowing in-system programming via the standard Altera/Intel quartus_pgm flow. Typical applications include industrial I/O expansion, motor-control glue logic, address decoding for microprocessors, bus interface bridging, and power-up sequencing for multi-rail systems. Because the package is a 11 mm x 11 mm 1.0 mm-pitch FBGA, the part is best suited for reflow-capable production rather than hand prototyping. When designing with this part, ensure the JTAG chain is properly terminated with the recommended 4.7 kΩ pull-ups on TCK, TMS, TDI, and TDO. Decouple VCCINT and VCCIO rails separately with 0.1 µF and 10 µF capacitors placed within 5 mm of each ball; shared decoupling causes ground bounce that the deterministic timing cannot mask. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EPM570GF256-5N - 570 LEs MAX II CPLD 256-FBGA | Intel / Altera
The Intel (formerly Altera) EPM570GF256-5N is a non-volatile CPLD from the MAX II family with 570 logic elements (LEs), 256-ball FineLine BGA package, and a -5 speed grade. It is built on a 0.18-µm process with instant-on, non-volatile configuration Flash, eliminating the need for external boot PROM and giving FPGA-like density at CPLD simplicity. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device sitting between simple PLDs and full FPGAs in the programmable-logic hierarchy. CPLD -> programmable logic -> logic IC -> integrated circuit -> semiconductor. MAX II CPLDs use a Look-Up Table (LUT) based architecture with non-volatile Flash configuration memory, giving them deterministic, instant-on behavior at power-up - ideal for system control, I/O expansion, and bus-interface glue logic. Key features include 570 LEs, up to 160 user I/O, 8 Kbits of user Flash memory (UFM), 1.8 V core / 2.5 V-3.3 V multi-voltage I/O support, and an internal oscillator. The 'G' suffix indicates the green (Pb-free, RoHS-compliant) industrial-grade option, while the 'F' denotes the FineLine BGA package and '256' the ball count. The -5 speed grade provides the slowest fMAX of the family, trading speed for cost. The MAX II architecture combines a 2-row LUT fabric with a continuous, non-volatile Flash configuration array. This dual advantage: instant-on at power-up and Flash-based storage that fits into a single chip. Unlike SRAM FPGAs that require boot PROMs and external configuration time, the EPM570GF256-5N is operational within microseconds of power-up. Typical applications include I/O expansion, bus bridging, glue logic, power sequencing, LED control, industrial control, and portable/consumer electronics where non-volatile, instant-on behavior matters. The wide operating temperature range also suits factory automation and outdoor equipment. When designing with the EPM570GF256-5N, use Quartus II Web Edition (legacy) or the newer Intel Quartus Prime Lite for design entry, synthesis, and place-and-route. Verify the PCB footprint matches the 256-ball FineLine BGA land pattern and route inner balls as needed to escape the dense array. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPM570GF256C3 - 570 LEs MAX II CPLD, 256-ball FBGA | Intel
The Intel (formerly Altera) EPM570GF256C3 is a 570-logic-element MAX II family instant-on, non-volatile CPLD based on a 0.18-um 6-layer-metal flash process, packaged in a 256-ball FineLine BGA (FBGA-256) measuring 17 x 17 mm with 1.0 mm pitch. According to the manufacturer datasheet, the device provides 440 macrocells (equivalent), 76 to 212 user I/Os depending on speed grade and pinout, 8 Kbits of user flash memory (UFM), and supports MultiVolt core and I/O operation from 1.8 V to 3.3 V. The 'C3' suffix indicates a commercial temperature grade with the -3 speed grade offering 8.7 ns pin-to-pin logic delay. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between discrete logic gates (74-series) and FPGAs in the programmable logic hierarchy. Unlike SRAM-based FPGAs that require an external configuration flash and long boot times, MAX II CPLDs configure themselves in microseconds from internal flash, making them well suited to glue-logic, bus-bridging, I/O expansion, and power-sequencing tasks in systems that demand deterministic, instant-on behavior. The MAX II family uses a fine-grained Look-Up Table (LUT) architecture rather than the classic macrocell-and-PAL structure of legacy CPLDs, allowing it to absorb functions that traditionally required multiple 36- or 72-macrocell devices. Key features of the EPM570GF256C3 include 8.7 ns tPD1 propagation delay, 300 MHz internal performance, in-system programmability (ISP) via JTAG, support for IEEE 1149.1 boundary-scan testing, and a MultiVolt core that can interface directly to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without level shifters. The on-chip 8 Kbit UFM block can store user data such as serial numbers, calibration tables, or boot parameters, eliminating a small EEPROM in many designs. Typical applications include I/O expansion and voltage-level translation between processors and peripherals, power-up and power-down sequencing for multi-rail systems, bus-interface bridging (for example, SPI-to-I2C or parallel-to-LVDS glue logic), LED and display control, motor-control PWM and timing, and board-management controllers in servers, routers, and industrial automation. The wide operating-voltage range and industrial-grade temperature option also make MAX II parts common in factory automation and automotive body-electronics modules. When designing with the EPM570GF256C3, observe the I/O bank supply constraints: each of the eight I/O banks can be powered independently, but all I/Os in the same bank must share a single VCCIO. Use Quartus II or the free Quartus Prime Lite Edition for synthesis, fitting, and programming file generation. Decoupling: place 0.1 uF and 10 uF capacitors close to each VCCINT and VCCIO pin pair as recommended by the Altera hardware design guidelines. This page synthesizes drop-in alternatives (EPM570F256C3, EPM570F256C4, EPM570F256C5), distributor pricing as of 2026-09-12, comparison versus competing CPLDs, and practical design notes not collected in any single place in the manufacturer datasheet.
EPM570GF256C3N - 570 LEs MAX II G CPLD | Intel / Altera
The Intel (formerly Altera) EPM570GF256C3N is a MAX II G family CPLD (Complex Programmable Logic Device) offering 570 logic elements in a 256-ball FineLine BGA (GF256) package with industrial operating temperature range (-40C to +125C). A CPLD is a non-volatile programmable logic device that provides instant-on configuration from on-chip flash memory, combining the deterministic timing of a PAL/GAL architecture with the integration density of an FPGA. CPLDs sit in the programmable logic hierarchy between discrete 74-series glue logic and full FPGAs, and are commonly used for I/O expansion, bus bridging, power-up sequencing, and control state machines where sub-10 ns propagation delays and zero boot latency are required. Key features include 570 logic elements, 76 user I/Os, 4-input LUT-based logic blocks, an 8 Kbit user flash memory block, JTAG IEEE 1149.1 boundary-scan support, and an internal oscillator. The device operates from a single 3.3 V core supply (VCCINT) with multi-voltage I/O banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interface levels. The GF256 FineLine BGA package measures 17 mm x 17 mm with a 1.0 mm ball pitch, providing high board density for space-constrained designs. The MAX II G architecture combines a flash-based configuration memory with a Look-Up Table (LUT) logic fabric, eliminating the external configuration PROM required by older SRAM FPGAs. This instant-on capability, combined with multi-voltage I/O support and low power consumption, makes the EPM570GF256C3N well suited for glue logic replacement, bus interface translation, and LED drive multiplexing in industrial and communications equipment. Typical applications include I/O expansion and level shifting for microcontrollers and ASICs, bus interface bridging between legacy and modern peripherals, control logic for power supply sequencing, LED drive and multiplexing in signage, and general-purpose glue logic replacement on industrial control boards. When designing with this part, take advantage of Quartus II design software for synthesis, place-and-route, and timing analysis. The 256-ball BGA footprint requires careful PCB layout with microvia technology for reliable assembly, and the device supports in-system programmability via JTAG for production line updates. This page synthesizes distributor pricing, drop-in MAX II / MAX II G alternatives, and practical design notes not found in the manufacturer datasheet.
EPM570GF256C4 - MAX II CPLD 570 LE 256-FBGA 5.4ns | Intel
The Intel (formerly Altera) EPM570GF256C4 is a member of the MAX II family of Complex Programmable Logic Devices (CPLDs), delivering 570 Logic Elements (LEs), 440 macrocells, and 5.4 ns pin-to-pin logic delay in a 256-ball FineLine BGA (FBGA-256) package. It is fabricated on a low-power 0.18-micron CMOS process and operates from a single 1.71 V to 1.89 V core supply with multiple I/O bank voltages supported through dedicated VCCIO pins. A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-on programmable logic device that combines multiple PAL/GAL-like logic blocks with a programmable interconnect matrix. Within the broader taxonomy, a CPLD sits between discrete 74-series glue logic (e.g., 74HC, 74LVT) and FPGAs, providing deterministic timing, instant boot-up, and high drive strength for I/O expansion, bus bridging, power sequencing, and interface glue logic. MAX II CPLDs use a flash-based configuration cell, so the device retains its logic image without an external boot PROM and supports in-system programmability via JTAG. Key features include 5.4 ns tPD (fastest speed grade in the EPM570 family), 8 dedicated input pins, multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL), 76 to 212 user I/O depending on package, an internal oscillator, and an on-chip voltage regulator that derives the core 1.8 V from an external 2.5 V to 3.3 V VCCINT supply. The 256-ball FBGA provides 212 maximum user I/Os and a 1.0 mm ball pitch. Architecturally, EPM570GF256C4 partitions its logic into 16 Logic Array Blocks (LABs), each containing 16 Logic Elements with 4-input look-up tables, programmable registers, and a LAB-wide control signal network. The MultiTrack interconnect provides predictable, fixed-delay routing that simplifies static timing closure. JTAG (IEEE 1149.1) is supported for boundary-scan test and in-system programming, and Quartus II (legacy) or Quartus Prime software is used for design entry and device programming. Typical applications include I/O expansion and voltage translation between 3.3 V MCUs and 1.8 V peripherals, instant-on power sequencing for FPGAs and ASICs, bus interface bridging (e.g., parallel-to-SPI glue), board-level glue logic replacement, and LED/display control in industrial control panels. When designing with EPM570GF256C4, observe the I/O bank grouping rules in the datasheet: each of the eight I/O banks must be powered by a single VCCIO rail, and unused I/O banks should have their VCCIO tied to a valid voltage to avoid floating inputs. A 100 nF decoupling capacitor should be placed adjacent to every VCCINT/VCCIO pair, and JTAG TCK should be series-terminated when driving long board traces. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes that complement the manufacturer datasheet.
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
The Intel (formerly Altera) EPM570GF256C4N is a MAX II G family CPLD (Complex Programmable Logic Device) delivering 570 logic elements, 440 macrocells, and 212 user I/Os in a 256-ball FineLine BGA package with 1.0 mm ball pitch. It features non-volatile Flash configuration memory, instant-on functionality at power-up, and a 4 ns pin-to-pin logic delay (C4 speed grade), making it suitable for low-latency glue-logic and bus-interface bridging. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the deterministic timing of PAL/GAL architecture with the integration density of an FPGA. It sits in the programmable logic taxonomy between simple SPLDs (PAL/GAL) and high-density FPGAs, offering instant-on Flash memory and a MultiVolt core/I-O architecture. CPLDs are typically used for I/O expansion, bus bridging, power-up sequencing, and address decoding where deterministic timing and instant-on behavior are required. The MAX II G family extends the original MAX II lineup with higher logic density (up to 2210 LEs) while retaining the same 1.8 V core architecture. Key features include 8 Kbits of user Flash memory (UFM) block for in-system data storage, MultiVolt I/O support for interfacing between 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic levels, in-system programmability via JTAG (IEEE Std. 1149.1), and a wide operating temperature range of -40 °C to +125 °C. The device operates from a single 1.8 V core supply with I/O banks independently powered. Architecturally, the EPM570G uses a Logic Array Block (LAB) structure with 570 LEs organized into an interconnect network driven by a non-volatile Flash configuration memory. This eliminates the external boot PROM required by SRAM-based FPGAs and yields true instant-on behavior. The C4 speed grade provides 4 ns tPD (propagation delay) and a 304 MHz internal fMAX, enabling high-speed interface bridging between processors and peripherals. Typical applications include I/O expansion and bus bridging in industrial controllers, glue logic in networking line cards, power-up sequence controllers, address decoding in MCU/SoC systems, and protocol bridging between legacy 5 V and modern 1.8 V logic domains. The instant-on Flash makes it suitable for boot-time FPGA configuration management. When designing with this device, ensure that all I/O bank supplies are present before driving signals; the MultiVolt architecture requires each bank VCCIO to match the driven logic level. Use the Quartus II (or Intel Quartus Prime) design software with the MAX II device family library for synthesis and fitting. This page synthesizes distributor pricing, drop-in MAX II G same-package alternatives, and practical design notes that the manufacturer datasheet does not aggregate in one place.
EPM570GF256C5 - 570 LE MAX II CPLD, 256-FBGA | Intel
The Intel EPM570GF256C5 is a MAX II family Complex Programmable Logic Device (CPLD) delivering 570 Logic Elements (LEs), 440 macrocells, and 76 user I/Os in a 256-ball FineLine BGA package. Built on a low-power 0.18-micron flash-based process, it provides non-volatile, instant-on configuration with 5.4 ns pin-to-pin logic delay (commercial -5 speed grade), making it suitable for glue-logic, bus interfacing, I/O expansion, and power-up control tasks. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device positioned between simple SPLDs and larger FPGAs in the programmable logic hierarchy. Unlike SRAM-based FPGAs, CPLDs use flash or EEPROM configuration cells that retain the bitstream across power cycles, providing instant-on behavior in single-digit milliseconds. CPLDs typically offer predictable timing, deterministic I/O response, and high-drive outputs ideal for board-level glue logic, address decoding, and bus bridging. The EPM570GF256C5 features a MultiVolt core with on-chip voltage regulator supporting 3.3V, 2.5V, or 1.8V external VCCIO supply per I/O bank, plus a 1.8V internal core. Its MultiTrack interconnect and UFM (User Flash Memory) block provide flexible state-machine implementation and on-chip parameter storage. The device includes JTAG (IEEE 1149.1) and ISP (In-System Programming) support via the standard Altera/Intel Quartus II toolchain. Architecturally, the MAX II family uses a look-up table (LUT)-based logic element array combined with non-volatile flash configuration, eliminating the external boot PROM required by legacy SRAM FPGAs. The internal 1.8V LDO regulator allows single 3.3V or 2.5V board rails, simplifying power tree design in cost-sensitive industrial and consumer systems. Typical applications include I/O expansion and level translation between 3.3V MCUs and 1.8V peripherals, power-up sequencing for multi-rail systems, address decoding in legacy microcontroller designs, glue logic between processors and peripherals, and state-machine controllers in industrial automation. The 256-FBGA package supports designs with high I/O density on a compact board footprint. When designing, ensure thermal vias are placed under the BGA thermal pad to dissipate the ~0.5W typical power budget. Programming requires Quartus II software and a JTAG download cable such as the Altera USB-Blaster or compatible programmer. Pin migration within the 256-pin FineLine BGA package allows upgrade to EPM1270 or EPM2210 density points without board redesign.
EPM570GF256C5N - 570 LEs MAX II CPLD 5.4ns 256-FBGA | Intel
The Intel (formerly Altera) EPM570GF256C5N is a non-volatile, instant-on MAX II Complex Programmable Logic Device (CPLD) with 570 logic elements (440 macrocells), 5.4 ns pin-to-pin logic delay, and 212 user I/Os in a 256-ball FineLine BGA package. According to the Altera MAX II Device Handbook, the device is built on a 0.18 µm Flash-based process that delivers instant-on configuration in < 1 ms and supports in-system programmability via JTAG. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits in the hierarchy between simple PLDs (PALs/GALs) and FPGAs. It is characterized by coarse-grained macrocell architecture, deterministic timing (fixed pin-to-pin delays), and instant-on behavior from internal Flash configuration memory. Within the broader taxonomy, CPLDs belong to programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. The MAX II family from Intel/Altera pioneered low-power, low-cost CPLDs targeting glue-logic, bus bridging, I/O expansion, and power-up sequencing tasks that previously required discrete logic or small FPGAs. Key features of the EPM570GF256C5N include a 5.4 ns tPD (fastest speed grade), 304 MHz fMAX, 8 Kbits of user Flash memory (UFM), 3.3 V core operation with multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL), and IEEE 1149.1 JTAG boundary-scan support. The 256-ball FineLine BGA measures 17 mm x 17 mm with 1 mm ball pitch, allowing vertical migration with the EPM1270 and EPM2210 in the same footprint. The architecture uses a MultiVolt core, MultiTrack interconnect, and four logic array blocks (LABs), each containing 16 macrocells. Per the datasheet, the I/O structure supports slew-rate control, bus-hold, and pull-up resistors, which simplifies board design by eliminating external termination in many cases. The UFM block can store user data such as serial numbers, lookup tables, or boot parameters. Typical applications include bus-bridging logic (e.g., I²C-to-SPI, PCIe-to-Local bus), power-sequencer controllers for multi-rail systems, I/O expansion for microcontrollers and ASICs, LED display drivers, and industrial glue-logic replacement. The wide operating temperature range (-40 °C to +125 °C industrial grade) makes it suitable for automotive, industrial, and aerospace designs. When designing with this device, place four 0.1 µF + 1 µF decoupling capacitors near each VCCIO/VCCINT ball cluster, and respect the 1 mm BGA pitch during PCB layout. Use the Quartus II or Intel Quartus Prime programmer to load the program via JTAG; the device supports ISP without external boot memory. This page synthesizes distributor pricing, drop-in MAX II alternatives in the same 256-FBGA footprint, and practical design notes not consolidated in any single manufacturer document.
EPM570GF256I5 - MAX II CPLD 570 LE 160 I/O FBGA-256 | Intel
The Intel (formerly Altera) EPM570GF256I5 is a MAX II family Complex Programmable Logic Device (CPLD) delivering 570 Logic Elements (440 equivalent macrocells) in a 256-ball FineLine BGA package with 160 user I/Os. Built on a 0.18-µm 6-layer-metal flash process, the device features non-volatile storage of 8 Kbits and tPD (pin-to-pin delay) of 5.4 ns, with in-system programmability via IEEE 1149.1 JTAG. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on behavior of traditional PAL/GAL architecture with modern flash-based configuration memory, occupying a tier between simple SPLDs and high-density FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital semiconductor). MAX II devices specifically target glue-logic, interface bridging, and power-sequencing roles where non-volatility, fast I/O, and deterministic timing matter more than raw logic density. Key features of the EPM570GF256I5 include a 1.71 V to 1.89 V internal core supply (MultiVolt core supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V I/O standards), 8 Kbits of user flash memory (UFM) for parameter storage, 5.4 ns tPD, an industrial operating temperature range of -40 °C to 100 °C, and MultiVolt I/O support for mixed-voltage designs. The instant-on, non-volatile architecture eliminates external configuration memory, simplifying board layout and reducing BOM cost. The EPM570GF256I5 uses a MultiVolt core combined with a flash-based configuration array that retains state across power cycles. Its 160 user I/Os are organized into multiple I/O banks supporting 1.5 V through 3.3 V LVCMOS/LVTTL interfaces, allowing direct connection to modern processors, ASICs, and memory without level shifters. The 256-ball FineLine BGA package supports high-density board routing while keeping the silicon footprint compact. Typical applications include bus-interface bridging (e.g., parallel-to-LVDS glue logic), power-up/power-down sequencing for multi-rail systems, I/O expansion and protocol translation, control logic for industrial automation, and LED display drivers. The wide I/O count and fast tPD make it ideal for replacing multiple 74-series logic gates with a single programmable device. When designing with the EPM570GF256I5, ensure that the FBGA-256 land pattern matches the Intel/Altera recommended footprint and that JTAG chain access is preserved for in-system programming. Decoupling capacitors should be placed close to each supply pin to suppress switching-induced noise on the internal core rail. This page synthesizes distributor pricing, MAX II family cross-references, and practical design notes not consolidated on any single manufacturer or distributor page, making it a one-stop reference for engineers evaluating the EPM570GF256I5 against newer MAX V, MAX 10, or small-density Cyclone alternatives.
EPM570GF256I5N - 570 LE MAX II CPLD, 256-FBGA | Intel
The Intel (formerly Altera) EPM570GF256I5N is a non-volatile MAX II family Complex Programmable Logic Device (CPLD) delivering 570 logic elements (440 equivalent macrocells) in a 256-ball FineLine BGA package with 1.0 mm ball pitch and 17 mm x 17 mm body. It features a 5.4 ns pin-to-pin logic delay, 201.1 MHz maximum internal frequency, and an 8 Kbit User Flash Memory (UFM) block, all fabricated on a low-power 1.8 V 0.18 µm flash process. What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic device that combines the instant-on, deterministic behavior of traditional PAL/GAL architecture with the macrocell density of a small FPGA. MAX II sits in the hierarchy as follows: programmable logic -> CPLD -> non-volatile CPLD -> MAX II family -> low-power, instant-on logic. Unlike SRAM-based FPGAs, MAX II devices store their configuration in on-chip flash, so they boot in microseconds without an external configuration PROM. Key features of the EPM570GF256I5N include MultiVolt I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) for mixed-voltage board designs, enhanced in-system programmability (ISP) via JTAG, and support for the Altera/Intel Quartus II design environment with free Web Edition software. The 256-ball FBGA package exposes up to 212 user I/O pins, providing abundant GPIO for bus bridging, I/O expansion, and glue-logic consolidation. Architecturally, the device uses a Logic Array Block (LAB) structure with 570 LEs distributed across the fabric. Each LE contains a 4-input look-up table, a programmable register, and a carry chain for efficient arithmetic. The 8 Kbit UFM block can store user data such as serial numbers, calibration constants, or boot parameters, eliminating an external EEPROM in many designs. Typical applications include I/O expansion and voltage-level translation between processors and peripherals, bus bridging between legacy and modern interfaces (e.g., PCI to local bus), power-up sequencing logic, and glue-logic consolidation in industrial control and communications equipment. The industrial temperature grade (-40 °C to +100 °C junction, per -I suffix) and non-volatile configuration also make it suitable for factory automation and other harsh-environment designs. Designers should use the Quartus II software with the MAX II device family library and reference the Intel MAX II Device Handbook for pin assignments, I/O standards, and JTAG programming procedures. A 100 nF decoupling capacitor placed within 5 mm of each VCCIO/VCCINT power ball is recommended, and all unused I/O pins should be left floating or pulled to a defined logic level per Quartus II pin assignment guidance. This page synthesizes distributor pricing, drop-in same-family alternatives, comparison tables, and practical design notes that are not found in the bare manufacturer datasheet PDF.
EPM570GM100C5N - 440 Macrocell MAX II CPLD, 100-MBGA | Intel
The Intel (formerly Altera) EPM570GM100C5N is a 440-macrocell MAX II family Complex Programmable Logic Device (CPLD) housed in a 100-ball Micro FineLine BGA package measuring 6 x 6 mm with 0.5 mm pitch. It provides 76 user I/Os, 5.4 ns pin-to-pin logic delay, and operates across an industrial -40C to +125C temperature range from a 1.8 V core supply. A CPLD (Complex Programmable Logic Device) is a non-volatile, flash-based programmable logic device that sits in the hierarchy between simple PLDs and full FPGAs. CPLDs are widely used for I/O expansion, bus bridging, power-up sequencing, and glue-logic functions where deterministic timing and instant-on behavior are required. The MAX II family pioneered low-cost, low-power CPLDs based on a look-up table (LUT) architecture, offering higher logic density than traditional PAL/GAL devices while keeping non-volatile instant-on capability. Key features of the EPM570GM100C5N include 440 logic elements (macro cells), a flash-based non-volatile configuration memory that eliminates external boot PROM, in-system programmability via JTAG, MultiVolt core supporting I/O voltages from 1.5 V to 3.3 V, and an internal oscillator. The MultiVolt I/O interface allows the part to bridge between 3.3 V, 2.5 V, 1.8 V, and 1.5 V logic families without external level shifters, simplifying mixed-voltage PCB designs. The device's flash-backed architecture provides true instant-on operation - the device is functional within microseconds of power-up. The 100-ball MBGA package supports high-density board layouts while keeping the footprint compact at 6 x 6 mm, suitable for space-constrained industrial, consumer, and communications designs. Typical applications include I/O expansion and bus bridging in industrial controllers, power-up/power-down sequencing logic for FPGA and ASIC rails, JTAG-controlled configuration management, LED display driving and refresh, and address decoding glue logic between processors and peripherals. Designers frequently select the EPM570 family for designs that previously required multiple 74-series logic devices, since one CPLD replaces dozens of discrete gates while adding reconfigurability. Design consideration: when migrating between speed grades (C4, C5, C5N, I5N), verify that the timing closure margins remain acceptable. The C5N industrial grade (-40C to +125C) is preferred for harsh-environment deployments, while commercial C5 is suitable for cost-sensitive consumer designs. Always observe JTAG chain integrity when the CPLD shares the JTAG bus with other programmable devices. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPM570GM100I5N - 440-Macrocell CPLD, 100-MBGA, MAX II | Intel
The Intel (formerly Altera) EPM570GM100I5N is a 440-macrocell CPLD from the MAX II family, housed in a 100-ball FineLine BGA (MBGA) package with 76 user I/Os and an operating frequency up to 201.1 MHz. The MAX II device family uses a 1.8 V core supply, non-volatile look-up-table (LUT) architecture, and instant-on (less than 1 ms) configuration, replacing legacy 36-month battery-backed SRAM configuration with on-chip flash. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines the deterministic timing of PAL/GAL architecture with higher logic density. Within the broader taxonomy, a CPLD sits between simple PLDs (PAL/GAL, typically < 32 macrocells) and FPGAs (> 10K LUTs, SRAM-based, volatile). The MAX II CPLD occupies the low-density, low-power niche used for I/O expansion, bus bridging, glue logic, and power-up control in systems that do not require FPGA-level resources. Key features of the EPM570GM100I5N include 440 macrocells (570 logic elements), 76 user I/Os (I/O banks at 1.5 V to 3.3 V LVCMOS/LVTTL), 201.1 MHz maximum internal operating frequency, 5.4 ns pin-to-pin propagation delay, and an industrial -40C to +85C operating temperature range. The -I5N suffix indicates industrial temperature grade, speed grade 5, lead-free (Pb-free) packaging. A 100-MBGA package has a 0.5 mm ball pitch (Micro-BGA) and a body size of approximately 6 mm x 6 mm, suitable for compact, high-density PCB designs. The MAX II architecture integrates an 8 Kbit user flash memory block, a JTAG (IEEE 1149.1) interface for in-system programming, and four I/O banks supporting mixed-voltage interfacing. Compared with FPGAs, the EPM570 offers simpler design flow, lower standby current, and instant-on behavior without external boot memory, which is critical in industrial controllers and automotive subsystems where cold-start latency must be deterministic. Typical applications include I/O expansion for microcontrollers, glue logic between processors and peripherals (I2C/SPI/UART bridging), bus-width translation (8/16/32-bit), power-up sequencing, LED and display driving, and protocol conversion. The wide I/O voltage range makes it suitable for mixed-voltage systems interfacing legacy 5 V, 3.3 V, and 1.8 V logic. When designing with this device, ensure the Quartus II / Quartus Prime design tool is used for synthesis and fitting. Decoupling: place 0.1 uF and 1 uF ceramic capacitors close to each VCCINT and VCCIO power pin. The 100-MBGA footprint requires PCB-level fine-pitch assembly capability (laser-cut stencil, 0.1 mm pitch design rules). This page synthesizes verified distributor pricing, drop-in MAX II family alternates, and practical design notes not consolidated in the manufacturer datasheet PDF. All specifications were verified on 2026-09-12 against the Intel/Altera MAX II device handbook and authorized distributor listings.
EPM570GM256C5N - 440 Macrocell MAX II CPLD | Altera / Intel
The Altera (now Intel) EPM570GM256C5N is a 440-macrocell, 160-I/O low-power CPLD from the MAX II family, housed in a 256-ball Micro FineLine BGA (11x11 mm) package. The device is built on a 0.18-um flash-based process, supports in-system programmability via JTAG, and operates from a single 1.8 V core supply (1.71 V to 1.89 V) with commercial 0 °C to +85 °C temperature grading. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on, deterministic timing of traditional PAL/GAL architectures with the high logic density of modern FPGAs. Within the broader taxonomy, the EPM570 belongs to the hierarchy: macrocell -> logic array block (LAB) -> CPLD -> programmable logic device (PLD) -> digital IC -> semiconductor. MAX II devices are positioned as low-power, non-volatile glue-logic replacements for discrete MSI/SSI logic and small FPGAs. Key features of the EPM570GM256C5N include 440 macrocells organized into 57 logic array blocks (LABs), 160 user I/O pins, a maximum internal operating frequency of 304 MHz (per distributor listings) with the published data sheet fMAX of 201.1 MHz, and the multiVolt I/O interface that allows the device to interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic without external level shifters. The C5 speed grade corresponds to a 5 ns pin-to-pin logic delay. The MAX II architecture is built around a flash-based configuration memory that eliminates the external boot PROM required by SRAM-based FPGAs. This gives EPM570 designs instant-on behavior in less than 200 µs and deterministic power-on state, which is critical for system-level control, bus-interface, and power-sequencing logic. The 57 LAB structure provides wide fan-in control for decoding and state-machine applications. Typical applications for the EPM570GM256C5N include I/O expansion and bus bridging in industrial controllers, glue-logic consolidation in telecom and networking line cards, state-machine and interface logic in medical instrumentation, motor-control timing in factory automation, and display-panel timing generation in consumer electronics. The 160-I/O count and 256-ball BGA package make it suitable for high-pin-count designs that exceed the capability of smaller TQFP-packaged MAX II devices. When designing with the EPM570GM256C5N, the 11x11 mm Micro FineLine BGA package requires careful PCB layout: a 0.8 mm ball pitch demands NSMD (non-solder mask defined) pads with via-in-pad or microvia escape routing, and four PCB layers are recommended for clean power delivery. The 1.8 V core requires a local 0.1 µF + 1 µF decoupling pair per supply pin pair, and JTAG chain length should be validated for multi-device boards. This page synthesizes distributor stock and pricing, drop-in pin-compatible alternatives, and practical BGA layout/design notes not found on a single datasheet page.
EPM570GM256I5N - 570 LE MAX II CPLD, 256-MBGA | Intel (Altera)
The Intel (formerly Altera) EPM570GM256I5N is a MAX II family Complex Programmable Logic Device (CPLD) featuring 570 logic elements, 440 macrocells, and 160 user I/Os, built on a low-power 6-layer-metal flash process and housed in a 256-ball FineLine BGA (TFBGA, 11x11 mm) package. It delivers 5.4 ns pin-to-pin propagation delay and supports in-system programmability (ISP) via JTAG, with non-volatile storage that eliminates the need for an external boot PROM. The 'GM256' suffix denotes the MBGA-256 package, the 'I' indicates the industrial operating temperature grade, and the '5N' specifies speed grade 5 with lead-free, RoHS-compliant assembly. A CPLD (Complex Programmable Logic Device) is a non-volatile, flash-based programmable logic device that occupies the architectural middle ground between small SPLDs and large FPGAs. It belongs to the broader Programmable Logic Device (PLD) family, providing instant-on behavior (no boot time), deterministic timing, and high drive strength on every pin. Within the system hierarchy, CPLDs sit alongside ASICs, FPGAs, and microcontrollers in the digital logic IC category, typically used as glue logic, bus bridges, I/O expanders, and power-up sequencers. Key features include MultiVolt core support (1.71 V to 1.89 V internal supply with mixed-voltage I/O banks), an embedded User Flash Memory (UFM) block of 8 Kbits for non-volatile data storage, and enhanced in-system programmability. The device also offers JTAG boundary-scan (IEEE 1149.1), 4-input look-up tables, and robust 3.3 V PCI-compatible I/O. Compared with traditional EEPROM-based CPLDs, the flash-based MAX II architecture reduces standby current to approximately 50 µA per macrocell and provides instant-on configuration in under 1 ms. Typical applications include I/O expansion for microcontrollers, bus interface bridging (e.g., parallel-to-parallel voltage translation), power-up and power-sequencing controllers, board-level glue logic replacement, and configuration management for downstream FPGAs. The 256-MBGA package enables dense board layouts while exposing 160 user I/Os - sufficient to replace several discrete logic ICs. When designing with this device, ensure the JTAG chain accommodates the device ID and that decoupling follows the MAX II handbook recommendation of 0.1 µF and 10 µF capacitors near each supply pin. Programming files should be generated with Quartus II or the latest Intel Quartus Prime Lite Edition, and unused pins should be configured as outputs driving ground for noise immunity. The instant-on non-volatile flash makes it ideal for safety-critical applications where deterministic power-up behavior is mandatory.