K4A8G165WB-BIRC vs H5TC4G63AFR-PBA Perbandingan
Perbandingan bersamaan detil K4A8G165WB-BIRC dari Samsung Electronics dan H5TC4G63AFR-PBA dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4A8G165WB-BIRC | H5TC4G63AFR-PBA |
|---|---|---|
| Merek | Samsung Electronics | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Status Stok | In Stock | — |
| Harga Unit (USD) | $32,50 | $3,98 |
| Tipe Memori | DDR4 SDRAM | DDR3L SDRAM |
| Density | 8 Gb | 4Gb |
| Organisasi | 512M x 16 | 256M x 16 |
| Laju Data | 2400 Mbps | 1866 Mbps (PC3L-14900) |
| Tegangan Pemuat | 1.2 V | — |
| Suhu Kerja | -40°C to +95°C | — |
| Paket | 96-FBGA | 96-ball FBGA |
| Latensi CAS | 15, 16, 17 | — |
| Burst Length | 8 (BL8) and 4 (BC4) | 8 and 4 (with burst chop) |
| Antarmuka | Pseudo-open-drain | 16-bit I/O |
| On-Die Termination | Yes | — |
| Refresh | Auto-refresh and self-refresh | — |
| Row Address | 16K | — |
| Column Address | 1K | — |
| RoHS | Compliant | Compliant |
| Supply Voltage (VDD/VDDQ) | — | 1.35V |
| Ball Pitch | — | 0.8mm |
| Number of Banks | — | 8 |
| CAS Latency (CL) | — | 11, 12, 13 |
| Rentang Suhu Kerja | — | 0°C to +95°C (Tcase) |
| On-Die Termination (ODT) | — | Yes |
| ZQ Calibration | — | Yes |
| Write Leveling | — | Yes |
| Auto Self-Refresh | — | Yes |
| Partial Array Self-Refresh | — | Yes |