FPGA & CPLD
Products (6352)
10AS057H3F34E2LG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel (Altera) 10AS057H3F34E2LG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating a 570K logic-element FPGA fabric with a dual-core ARM Cortex-A9 MPCore hard processor system in a 1152-ball FCBGA (35x35 mm) package. It is rated for an enhanced speed grade (H3), an F34 package option, and an E2 temperature/operating condition tier with lead-free (LG) termination. The device combines high-performance programmable logic with an embedded application processor subsystem for compute-intensive embedded designs. An SoC FPGA is a heterogeneous device that pairs a general-purpose microprocessor subsystem (typically ARM Cortex-A cores) with FPGA programmable logic on a single die, sharing on-chip interconnect, memory, and I/O. This architecture is widely used in industrial vision, broadcast, military radar, medical imaging, and high-throughput data acquisition, where designers need CPU-based control-plane processing alongside deterministic hardware acceleration in the FPGA fabric. The Arria 10 SX family uses TSMC's 20 nm process and supports up to 1.5 GHz HPS clock and hardened memory controllers, DDR4, and high-speed serial transceivers. Key features for the 10AS057 family include 570K logic elements, embedded hard IP blocks (DSP, BRAM, PCIe Gen3, 10/25/100G Ethernet MACs, high-speed transceivers), and 492 user I/O pins. The dual-core ARM Cortex-A9 MPCore subsystem runs up to 1.5 GHz with CoreSight debug, NEON media engine, single/double-precision FPU, and supports symmetric/asymmetric multiprocessing. Arria 10 SX devices integrate hardware floating-point DSP blocks for IEEE 754 single-precision arithmetic acceleration. The 35x35 mm 1152-ball FineLine BGA package delivers the I/O density needed for systems with parallel external memory interfaces, multiple transceiver channels, and high-pin-count parallel I/O buses. The H3 speed grade indicates one of the higher-performance bin steps in the Arria 10 SX family, trading power for higher Fmax on internal logic and transceiver paths. Typical applications include high-speed signal processing, software-defined radio, video broadcast equipment, industrial machine vision, and embedded compute platforms with hardware acceleration. The HPS subsystem runs Linux or RTOS while the FPGA fabric handles data-plane algorithms. Designers choose this device when they need a balanced CPU/FPGA architecture in a single package rather than a discrete CPU+FPGA solution. When designing with this device, pay close attention to power integrity (multiple rails up to 0.95V core), thermal management (typical board designs require a heatsink for industrial temperature grades), and signal-integrity routing for high-speed transceiver and DDR4 interfaces. Quartus Prime Pro is the supported design toolchain. This page synthesizes distributor pricing, same-brand Arria 10 SX alternatives, and practical design notes not found in the manufacturer datasheet, providing information gain for engineers selecting SoC FPGAs for embedded compute applications.
10AS057H3F34E2SG - Arria 10 SX SoC FPGA, 570K LE, 1.5GHz | Intel
The Intel 10AS057H3F34E2SG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA integrating 570,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system, housed in a 1152-pin FC-FBGA (35x35 mm) package. It combines programmable logic with a 1.5 GHz capable application processor subsystem, 24 transceivers up to 17.4 Gbps, and dedicated DSP blocks, targeting mixed processor-plus-acceleration workloads. An SoC FPGA is a class of integrated circuit that combines a hard processor core subsystem with traditional programmable logic fabric on a single die. The Arria 10 SX sits within the broader taxonomy of programmable logic devices, branching upward from FPGA through SoC FPGA to heterogeneous compute platforms. By merging a deterministic ARM Cortex-A9 subsystem with parallel logic, SoC FPGAs minimize latency between the processor and custom accelerators, making them ideal for applications requiring real-time DSP, high-throughput I/O, and embedded Linux or RTOS execution on the same silicon. Key features of the 10AS057H3F34E2SG include 570K logic elements, 1.5 GHz ARM Cortex-A9 dual-core MPCore with CoreSight debug, 24 high-speed transceivers supporting protocols such as PCIe Gen3 and 10 Gigabit Ethernet, on-chip DSP blocks for fixed- and floating-point operations, and a 20 nm process technology. The 1152-ball flip-chip BGA package supports high-density signal breakout and a thermal envelope compatible with industrial-grade forced-air cooling. Architecturally, the device implements a hard processor system (HPS) tightly coupled to the FPGA fabric through high-bandwidth AXI bridges, allowing shared access to DDR4 memory controllers from both subsystems. Process technology is 20 nm with a 0.9 V core supply, balancing static leakage and dynamic performance. On-chip memory, phase-locked loops, and hardened memory controllers reduce external component count. Typical applications include 5G baseband and radio unit processing, software-defined radio (SDR), radar and electronic warfare signal processing, industrial machine vision with embedded analytics, and high-performance test and measurement instrumentation. The combination of ARM Cortex-A9 cores and parallel FPGA fabric also suits medical imaging accelerators and aerospace signal processing payloads. When designing with this device, allocate PCB layer stack for the 1152-ball FC-FBGA escape, follow Intel's power-rail sequencing recommendations for the HPS and FPGA core domains, and consider thermal dissipation across the full SoC operating envelope including transceivers at full data rate. This page synthesizes distributor availability, drop-in alternatives within the Arria 10 SX family, and practical design notes not consolidated in the standalone datasheet.
10AS057H3F34I2LG - Arria 10 SX SoC FPGA, 570K LE, Dual ARM Cortex-A9 | Intel
The Intel (formerly Altera) 10AS057H3F34I2LG is a high-density Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and trace, alongside 570K logic elements of programmable FPGA fabric, all in a 1152-ball Flip-Chip BGA (FCBGA, 35x35 mm) package. This product type, a SoC FPGA, combines a hardened application processor subsystem with general-purpose FPGA fabric on a single die, occupying the design space between traditional microcontrollers (which lack programmable logic) and conventional FPGAs (which lack an integrated CPU). The Arria 10 SX family is Intel's mid-range SoC FPGA, positioned below the high-end Stratix 10 SX and above the entry-level Cyclone V SoC, serving industrial, wireless, broadcast, and defense applications that need both deterministic hardware acceleration and a Linux-capable application processor. Key features include 570K logic elements, 1.5 GHz maximum Cortex-A9 core frequency, 16.7 Gbps transceivers for high-speed serial I/O, and integrated DDR3/DDR4 hard memory controllers. The 'I2' speed/temperature grade designation indicates an industrial temperature range (-40C to +100C junction) with a mid-speed bin, while the 'F34' suffix identifies the FCBGA-1152 package option. The Arria 10 SX architecture pairs a 20nm process-node FPGA fabric with a dedicated ARM-based HPS connected via a high-bandwidth system interconnect. This allows software-driven control planes to coexist with low-latency hardware-accelerated dataplanes, which is essential for motor control, protocol bridging, and DSP front-end processing in radar or 5G fronthaul. Typical applications include industrial motor drives, 5G remote-radio-head baseband, broadcast video processing, military/aerospace signal intelligence, medical imaging pre-processing, and ADAS sensor fusion platforms. The dual-core Cortex-A9 runs Linux/RTOS for housekeeping while the FPGA fabric handles data-plane DSP. When designing with this device, allocate sufficient PCB area for the 35x35 mm FCBGA and use a minimum 8-layer stackup with via-in-pad capability for clean power delivery. The HPS and FPGA fabric each require independent power rails; sequencing must follow the Intel Enpirion reference design. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Arria 10 SX family, and practical design considerations not consolidated in the manufacturer datasheet.
10AS057H3F34I2SG - Arria 10 SX SoC FPGA 570K LE 1.5GHz | Intel
The Intel (Altera) 10AS057H3F34I2SG is a member of the Arria 10 SX family of System-on-Chip (SoC) FPGAs, integrating a dual-core ARM Cortex-A9 MPCore hard processor system with 570K logic elements, 20nm process technology, and adaptive logic modules optimized for mid-range high-performance applications. The device is housed in a 1152-ball flip-chip BGA (FC-BGA) package measuring 35mm x 35mm and operates at up to 1.5GHz core frequency with a 0.9V core supply. A System-on-Chip FPGA (SoC FPGA) is a category of programmable logic device that integrates a hard processor subsystem (typically ARM Cortex-A-class cores) with the FPGA fabric on a single die. This integration enables hardware/software co-design, where compute-intensive tasks are accelerated in the FPGA fabric while control, OS, and housekeeping code run on the embedded ARM cores. Within the broader taxonomy, an SoC FPGA sits between pure ASSPs (application-specific standard products) and traditional FPGAs, combining deterministic hardware parallelism with the flexibility of a software-programmable processor. Key features of the 10AS057H3F34I2SG include 570K logic elements (LEs), embedded DSP blocks for fixed- and floating-point signal processing, dedicated memory controller hardening, 24 transceiver channels capable of up to 17.4 Gbps, and a hard memory controller supporting DDR4/3/2 and LPDDR3/2. The Arria 10 architecture leverages an innovative core fabric that delivers up to 1.5GHz fabric performance, significantly higher than competing mid-range families, while the integrated ARM Cortex-A9 subsystem supports symmetric multiprocessing (SMP) with CoreSight debug. From an architectural standpoint, the Arria 10 SX uses a heterogeneous fabric combining ALMs (Adaptive Logic Modules), MLABs (memory logic array blocks), variable-precision DSP blocks, and embedded hard IP such as PCIe Gen3 hard controllers and high-speed transceivers. The 20nm process enables higher integration at lower power than the previous 28nm Cyclone V / Arria V families. The industrial temperature grade (I2 = -40C to +100C) makes the device suitable for harsh-environment deployments. Typical applications include high-performance digital signal processing, 4K video and image processing pipelines, industrial machine vision and inspection, software-defined radio baseband, and military/aerospace signal intelligence systems. The integrated ARM cores enable embedded Linux or RTOS deployment, making it well suited for systems that need both deterministic DSP throughput and standard networking stacks. A key design consideration is that SoC FPGAs require careful power-rail sequencing between the HPS (hard processor system) and FPGA fabric supplies. Designers should follow Intel's Enpirion PowerSoC recommendations and use the Arria 10 Development Kit reference design for boot-from-quad-SPI flash bring-up. Signal integrity on the 17.4 Gbps transceivers demands controlled-impedance PCB stackup with at least 6 layers and length-matched differential pairs. This page synthesizes distributor pricing, parametric drop-in alternatives from the Arria 10 family, and design guidance not consolidated on any single distributor listing.
10AS057H4F34E3LG - Arria 10 SX SoC FPGA, 570K LE, Dual ARM Cortex-A9 | Intel
The Intel 10AS057H4F34E3LG is an Arria 10 SX System-on-Chip (SoC) FPGA integrating 570,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor subsystem, fabricated on TSMC's 20nm process and packaged in a 1152-ball flip-chip BGA (FCBGA, 35x35 mm). It belongs to the Arria 10 SX family, which combines mid-range FPGA fabric with a hardened ARM Cortex-A9 subsystem for embedded processing and DSP-intensive workloads. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks, programmable interconnect, and dedicated hardware resources such as DSP slices, block RAM, and high-speed transceivers. An SoC FPGA additionally integrates one or more hard processor cores alongside the programmable fabric, allowing designers to execute an operating system (typically Linux or RTOS) on the processors while accelerating custom logic in the FPGA fabric. The Arria 10 SX sits in the product hierarchy: Arria 10 SX -> Arria 10 family -> Intel mid-range FPGA -> programmable logic device -> semiconductor IC. Key features include 570K logic elements, dual ARM Cortex-A9 MPCore cores with CoreSight debug, 1.5 GHz maximum core frequency, on-chip memory, multiple high-speed transceiver channels, and a rich set of hardened IP such as PCI Express Gen2/Gen3 controllers and DDR3/DDR4 memory controllers. The 20nm process enables a favorable balance between performance, power efficiency, and density, with the integrated HPS reducing BOM cost and board area for embedded designs. Typical applications include wireless baseband processing, military radar, medical imaging, broadcast video processing, and high-performance industrial test and measurement. The dual-core ARM subsystem allows Linux/RTOS execution for control-plane tasks while the FPGA fabric handles data-plane DSP at line rate. When designing with this device, use Intel Quartus Prime software for synthesis, place-and-route, and HPS firmware configuration. Pay close attention to PCB layout for the FCBGA-1152 package - it requires HDI PCB stack-up with microvia technology and a matched-length multi-drop memory interface for DDR3/DDR4. This page synthesizes distributor pricing, drop-in same-package variants, and practical design notes not found in the manufacturer datasheet alone.
10AS057H4F34I3LG - Arria 10 SX SoC FPGA, 570K LE, Dual ARM Cortex-A9 | Intel
The Intel 10AS057H4F34I3LG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA integrating a Dual ARM Cortex-A9 MPCore hard processor system with 570K logic elements, built on 20nm process technology and housed in a 1152-ball FC-FBGA (F34, 35x35 mm) industrial-temperature package. It combines a programmable FPGA fabric with hardened ARM cores, delivering up to 1.5 GHz CPU performance for embedded compute plus 20nm fabric density for DSP and parallel logic. What is an SoC FPGA? An SoC FPGA (System-on-Chip Field Programmable Gate Array) is a heterogeneous device that integrates a hard processor subsystem (typically ARM Cortex-A cores) with programmable logic on a single die. The category hierarchy is: SoC FPGA -> FPGA -> programmable logic -> semiconductor IC. SoC FPGAs differ from traditional FPGAs by including deterministic hardware processing (ARM cores) alongside reconfigurable logic, enabling single-chip solutions for compute-intensive applications such as motor control, software-defined radio, video processing, and industrial Ethernet. Key features include 570K logic elements, embedded DDR3/DDR4 memory controllers with hard PHY, multi-gigabit transceivers, programmable fractional PLLs, and the CoreSight debug fabric shared between the HPS and FPGA domains. The industrial temperature grade (-40C to +100C for SoC) and BGA package with 35x35 mm footprint suit embedded industrial platforms with rigorous thermal and mechanical requirements. Architecturally, the 10AS057H4F34I3LG pairs an ARM Cortex-A9 dual-core MPCore HPS block with the Arria 10 Adaptive Logic Module (ALM)-based FPGA fabric. The HPS includes dedicated L1/L2 caches, NEON media engine, and on-chip RAM, while the FPGA fabric contains DSP blocks, M20K SRAM blocks, and variable-precision DSP, all linked through AXI/ACP bridges that allow zero-copy data transfer between the two domains. Typical applications include industrial motor drives, software-defined radio baseband, medical imaging pipelines, smart grid / substation automation, and embedded vision systems. The combination of deterministic ARM execution with parallel FPGA acceleration is particularly suited to real-time control loops where latency budgets are tight. When designing with this part, ensure PCB layout follows Intel's pin connection guidelines, especially for transceiver reference clocks and HPS DDR3/4 channels. Plan thermal management: industrial temperature SoCs typically require a 4-6 layer PCB with dedicated copper pours. Use Quartus Prime Pro for synthesis, place-and-route, and HPS firmware toolchain. This page synthesizes distributor pricing, same-family drop-in alternatives, SoC FPGA design notes, and a parameter comparison not found in the manufacturer datasheet alone.
10AS057H4F34I3SG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel (formerly Altera) 10AS057H4F34I3SG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating 570,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system on a 20 nm process, supplied in a 1152-pin FC-FBGA (35x35 mm) tray package at industrial temperature grade. As an SoC FPGA it combines programmable FPGA fabric with hardened ARM Cortex-A9 cores, delivering up to 1.5 GHz of CPU performance for embedded compute alongside high-throughput programmable logic for data-path acceleration. The H4 speed grade and F34 package designation indicate the device is built for industrial (-40C to +100C) operation in a wire-bond fine-pitch BGA. A SoC FPGA (System-on-Chip FPGA) is a hybrid device that fuses a hard processor system (typically ARM Cortex-A cores, memory controllers, and peripherals) with FPGA programmable logic and DSP blocks on a single die. This integration eliminates the latency and board complexity of a discrete CPU + FPGA pair, allowing deterministic real-time control loops, hardware-accelerated signal processing, and Linux/RTOS application software to coexist on one chip. Within the broader hierarchy, SoC FPGAs sit at the intersection of microcontrollers, ASSPs, and standalone FPGAs, giving engineers software-defined flexibility with hardware-defined performance. Key features include 570K logic elements, embedded hard memory controllers, integrated transceivers supporting multi-gigabit serial links, dedicated variable-precision DSP blocks, and partial reconfiguration support. The industrial temperature grade enables deployment in harsh environments without thermal screening, while the FC-FBGA package provides high I/O density for high-pin-count designs such as 4K video processing, 100G Ethernet aggregation, and radar/sonar baseband processing. The Arria 10 SX family is widely used in prototyping and production for defense, medical imaging, and industrial motion control. Typical applications include high-performance signal processing (radar, ultrasound, software-defined radio), embedded vision and video broadcast pipelines, 100G/40G Ethernet line cards, motor control and industrial drive firmware, and 4K/8K video processing. The dual ARM Cortex-A9 cores enable Linux or RTOS deployment for control-plane software while the FPGA fabric accelerates data-plane DSP functions in parallel. Engineers typically pair the device with DDR3/DDR4 memory, flash, and a multi-rail power solution sized for the SoC plus transceiver power domains. When designing with this part, ensure your PCB footprint matches the 1152-ball FC-FBGA 35x35 mm land pattern and verify that your power tree provides the recommended 0.9 V core, 1.1 V/1.5 V transceiver, and 1.8 V/3.3 V I/O rails with proper sequencing. Programming is performed through JTAG or the on-chip configuration controller using Intel Quartus Prime software; pinout and configuration files (qsf/qpf) are generated per design. Lead times are typically long for industrial-grade Arria 10 devices, so plan early with your distributor for production quantities. This page consolidates distributor pricing, drop-in same-brand alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate your BOM decision and PCB bring-up.
10AS057K1F35E1HG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel 10AS057K1F35E1HG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family that integrates a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and trace, alongside 570K logic elements of programmable FPGA fabric. The device is offered in the F35 speed grade with the -1 core performance tier, an E (extended) temperature rating, and a 1152-ball Flip-Chip BGA package (FC-BGA, 35x35 mm). The Arria 10 SX SoC family targets mixed processor-plus-accelerator workloads where deterministic real-time control and parallel DSP throughput must coexist on a single silicon die. An SoC FPGA is a semiconductor device that combines a general-purpose processor subsystem (typically ARM Cortex-A series) with programmable FPGA logic on the same chip, sharing on-die interconnect, memory, and I/O resources. Compared to a discrete processor-plus-FPGA pair, an SoC FPGA reduces board area, latency between the two domains, BOM cost, and power consumption, while improving data throughput because the FPGA fabric can directly access the processor's DDR memory controller through a wide on-chip bus. The Arria 10 family in particular is the last Intel/Altera 20 nm generation and is widely deployed in long-lifecycle industrial, medical, and defense programs where process node changes force costly requalification. Key features of 10AS057K1F35E1HG include 570K logic elements, 1.5 GHz maximum Cortex-A9 core frequency, 28.05 Mbit embedded memory, support for DDR4/DDR3 memory interfaces with hard controllers, 24 transceivers up to 17.4 Gbps, 384 DSP blocks, and dual ARM Cortex-A9 MPCore with NEON media engine and single/double-precision FPU. The hard processor system (HPS) includes 256 KB on-chip RAM, ECC-protected L1/L2 caches, USB 2.0, Gigabit Ethernet, UART, SPI, I2C, and SD/eMMC controllers, offloading peripheral management from the FPGA fabric. Architecturally, the Arria 10 SX implements the HPS-FPGA bridge through a high-bandwidth on-chip interconnect with up to 128-bit data path, allowing the FPGA fabric to act as a configurable accelerator to the ARM cores or to operate as a master for data-plane I/O. The 20 nm process enables a mid-range logic density of 570K LEs with low static power, while the 17.4 Gbps transceivers support common backplane protocols such as PCIe Gen3 x4, 10 GbE, CPRI, and JESD204B for radio and instrumentation front ends. Typical applications include software-defined radio (SDR) baseband processing, radar and electronic-warfare front ends, industrial machine vision with on-board inference, medical imaging accelerators, high-speed data acquisition, and motor-control platforms requiring deterministic ARM-side sequencing combined with parallel DSP work. The extended temperature grade makes it acceptable for harsh-environment deployments when full industrial screening is not required. When designing with this device, plan power-delivery for the multiple HPS and FPGA rails early; the part requires at least five separate supply rails with strict sequencing, and the transceiver PLLs need clean analog supply filtering. Use Intel Quartus Prime with the SoC EDS toolchain to partition firmware (HPS-side Linux/RTOS) versus hardware (FPGA bitstream) and to validate the HPS-FPGA bridge performance in your traffic profile. This page synthesizes distributor availability, real-time price tiers, and same-family drop-in alternatives for 10AS057K1F35E1HG that go beyond the standard manufacturer product page.
10AS057K1F35I1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA | Intel
The Intel 10AS057K1F35I1HG is a member of the Arria 10 SX family of SoC FPGAs, integrating a Dual ARM Cortex-A9 MPCore hard processor system with CoreSight debug IP and 570K logic elements on a single die, packaged in a 1152-ball Flip-Chip BGA (FCBGA, 35x35 mm) with up to 1.5 GHz core performance and 396 user I/O pins. The device targets mid-range embedded compute workloads that demand both software programmability and FPGA-class parallel hardware acceleration, including 4K video processing, machine learning inference, and high-throughput wireless baseband. A System-on-Chip (SoC) FPGA is a heterogeneous compute device that combines a hardened application processor subsystem (typically ARM Cortex-A cores) with programmable FPGA fabric on the same silicon die. The processor subsystem executes an OS such as Linux or RTOS via coherent caches, shared memory and standard interfaces, while the FPGA fabric accelerates data-parallel workloads through custom RTL pipelines. SoC FPGAs bridge the gap between traditional MCUs and discrete FPGAs by eliminating chip-to-chip data bottlenecks and lowering BOM cost. Key features of the 10AS057K1F35I1HG include 570K logic elements, dual-core ARM Cortex-A9 MPCore with NEON and single/double-precision FPU, hardware CoreSight debug, 256 KB on-chip RAM, and a rich peripheral set covering EBI/EMI, Ethernet MAC, I2C, MMC/SD/SDIO, SPI, and UART/USART. Integrated hard IP blocks such as PCIe Gen2/Gen3 controllers, multi-gigabit transceivers up to 12.5 Gbps, and DSP blocks deliver DSP throughput exceeding 1.5 TFLOPs in fixed-point arithmetic. The 20 nm process node balances power efficiency against logic density. Typical applications include 5G small-cell baseband, ADAS vision pre-processing, industrial machine vision, software-defined radio, and high-end broadcast video processing. The hardened ARM subsystem runs a full Linux distribution while the FPGA fabric handles real-time pixel pipelines. When designing with the 10AS057K1F35I1HG, follow Intel's Arria 10 SoC design guidelines for PCB stackup, transceiver channel routing, and thermal management. The 1152-FCBGA package requires a minimum 1 mm pitch BGA layout and a multi-layer PCB with controlled impedance for DDR3/4 memory interfaces. This page consolidates distributor pricing, pin-compatible Arria 10 SX variants, application notes and design guidance not found in the manufacturer datasheet alone.
10AS057K2F35E1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA | Intel
The Intel 10AS057K2F35E1HG is an Arria 10 SX System-on-Chip (SoC) FPGA integrating 570K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system (HPS) in a 1152-ball flip-chip BGA (FC-1152, 35x35 mm) package. It belongs to the Arria 10 SX family, the industry's first SoC FPGA with a 1.5 GHz processor subsystem and 20 nm process technology, targeting high-performance DSP, transceiver-rich, and processor-assisted designs. A SoC FPGA (System-on-Chip FPGA) is an integrated device that combines a programmable FPGA fabric with a hard processor subsystem (typically ARM Cortex-A cores) on a single die. The Arria 10 SX SoC FPGA is a heterogeneous computing platform that places the FPGA logic and the HPS in separate but tightly coupled power and clock domains, connected by a high-bandwidth coherent interconnect. In the broader taxonomy, this device sits within FPGA & CPLD -> SoC FPGA -> Arria 10 family -> Intel programmable logic devices. The hard processor cores execute real-time operating systems (RTOS) or Linux, while the FPGA fabric handles high-throughput data-plane workloads such as DSP, video processing, and protocol bridging. Key features of the 10AS057K2F35E1HG include 570K logic elements, approximately 29.4 Mbits of embedded memory (M20K + MLAB), 1,566 18x19 multipliers, 24 transceivers at up to 17.4 Gbps, hard PCIe Gen3 and Gen2 IP blocks, and the dual ARM Cortex-A9 MPCore with CoreSight running up to 1.5 GHz. The device also integrates a feature-rich HPS with DDR4/DDR3/LPDDR3 controllers, USB 3.0, Gigabit Ethernet, and UART/SPI/I2C peripherals. The 1152-ball FC-BGA delivers high I/O density for parallel memory and high-speed serial interfaces. Architecturally, the 20 nm Arria 10 device combines a logic fabric optimized for DSP and transceiver-based designs, with variable-precision DSP blocks supporting fixed-point and floating-point arithmetic. The HPS is implemented in a separate voltage and clock domain with its own dedicated PLL, allowing the FPGA and processor subsystems to operate independently for power optimization. Compared to previous Arria V / Cyclone V generations, Arria 10 SX doubles the logic capacity at the same power envelope and adds 14.1 Gbps / 17.4 Gbps transceivers, enabling 100G and emerging 400G interface designs. Typical applications include wireless baseband processing, radar and electronic warfare, military signal intelligence, broadcast video and image processing, medical imaging systems, industrial motor control with HMI, automotive ADAS prototyping, high-speed test and measurement, and PCIe accelerator cards. The integrated HPS is well-suited for protocol-stack processing (e.g., Ethernet switching, PCIe endpoint stack), while the FPGA fabric accelerates the data plane (FFT, FIR, encoding/decoding, encryption).
10AS057K2F35E2LG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel (formerly Altera) 10AS057K2F35E2LG is a high-performance Arria 10 SX family System-on-Chip (SoC) FPGA integrating 570K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor subsystem, fabricated on TSMC's 20 nm process and packaged in a 1152-ball flip-chip BGA (35 mm x 35 mm). It targets mid-to-high density compute, signal processing, and high-speed serial I/O workloads where both FPGA fabric and an embedded application processor are required on a single die. An SoC FPGA is a heterogeneous compute device that combines a programmable logic fabric with one or more hard processor cores on the same silicon die, enabling deterministic hardware acceleration alongside a software control plane. The Arria 10 SX line extends this concept by adding a 1.5 GHz dual-core ARM Cortex-A9 MPCore subsystem with CoreSight debug, ARM NEON media engine, single- and double-precision floating-point units, L1/L2 caches, on-chip SRAM, scatter-gather DMA controllers, and a rich set of peripherals. Because the HPS shares the same die as the FPGA, AXI-coherent bridges let fabric accelerators reach DDR memory with minimal latency. Key specifications include 570K logic elements (LEs), adaptive logic modules (ALMs) supporting 8-input fracturable lookup tables, embedded memory, variable-precision DSP blocks (up to 1,560 18x19 multipliers), 24 transceivers capable of up to 17.4 Gbps backplane operation, 396 user I/Os, and PCIe hard IP. The Arria 10 SX family is hardened for industrial temperature ranges and offers partial reconfiguration, SEU mitigation, and built-in ECC on configuration RAM. Typical applications include wireless baseband processing, RADAR and electronic-warfare signal chains, professional video broadcast, test and measurement instrumentation, industrial machine vision, high-performance computing accelerators, and high-speed serial protocol bridging. The dual ARM Cortex-A9 cores handle Linux/RTOS control, network stacks, and user interfaces, while the FPGA fabric accelerates DSP, packet processing, or codec workloads at line rate. When designing with the 10AS057K2F35E2LG, plan the PCB stack-up for the 1152-ball FCBGA with care: the 1.0 mm ball pitch demands microvia HDI, and signal-integrity-aware routing is required for the multi-gigabit transceivers. Use the Quartus Prime SoC Edition toolchain to configure the HPS-FPGA bridges, pin assignments, and DDR3/DDR4 PHY. The "E2" speed grade and "-40C to +100C" extended-industrial temperature screening make this OPN suitable for harsh-environment deployments. This page synthesizes distributor pricing snapshots, F35-package drop-in alternatives from the same Arria 10 SX family, and practical design notes that go beyond the manufacturer datasheet. For full pinout, BSDL, IBIS models, and Quartus pin assignments, refer to the official Arria 10 GX/SX device handbook.
10AS057K2F35E2SG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel (formerly Altera) 10AS057K2F35E2SG is an Arria 10 SX family System-on-Chip (SoC) FPGA integrating 570K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor subsystem in a 1152-pin FCBGA (35x35 mm) package. The device combines a high-performance 20 nm FPGA fabric with hardened ARM Cortex-A9 cores running up to 1.5 GHz with CoreSight debug, targeting embedded compute workloads that require both deterministic hardware acceleration and a Linux-capable application processor. An SoC FPGA is a single-chip device that fuses a general-purpose CPU subsystem with programmable logic on the same die, eliminating the latency, power, and board-space cost of a discrete CPU + FPGA pair. The Arria 10 SX line is Intel's mid-range 20 nm SoC FPGA family, sitting between the lower-density Cyclone/Cyclone V SoCs and the high-end Stratix 10 SoCs. The 10AS057K2F35E2SG variant is the F35-package, E2 (mid-tier) speed grade, and lead-free / RoHS build with 570K logic elements. Key features include 570K logic elements, ~22.4 Mbits of embedded M20K memory, 1568 18x19 multipliers, 24 transceivers at up to 17.4 Gbps (GX/SX), hard PCIe Gen2/Gen3 IP blocks, and the HPS dual-core ARM Cortex-A9 MPCore subsystem with peripherals such as Gigabit Ethernet, USB, NAND, SD/MMC, and DDR3/DDR4 controllers. The integrated CoreSight debug and trace fabric allows non-intrusive multi-core debug. The F35 1152-FCBGA package provides the highest I/O count in the Arria 10 family with 396 user I/O and 24 transceiver channels. This part suits 5G baseband pre-processing, radar/EW front-end DSP, ASIC prototyping, broadcast video processing, and high-performance industrial motion controllers. The mid-density 570K LE tier positions it between the 10AS048 (~480K LE) and 10AS066 (~660K LE) siblings. This page consolidates distributor pricing, lead-time data, and drop-in variant guidance not bundled in the official datasheet. The E2 speed grade typically offers 30-40% logic timing margin over E3 at the cost of Fmax, while the F35 35x35 FCBGA is the largest Arria 10 package and requires high-layer-count PCB with microvia stack-ups.
10AS057K2F35I1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FCBGA | Intel
The Intel 10AS057K2F35I1HG is an Arria 10 SX family System-on-Chip (SoC) FPGA delivering 570K logic elements integrated with a dual ARM Cortex-A9 MPCore hard processor subsystem in a 1152-ball Flip-Chip BGA (FCBGA, 35x35 mm) package. The device combines a high-performance FPGA fabric with CoreSight debug and 1.5 GHz maximum fabric performance, targeting embedded compute, DSP acceleration, and high-throughput signal processing workloads. An SoC FPGA integrates a general-purpose processor subsystem and programmable logic on a single die, enabling deterministic real-time control alongside software flexibility. In the Altera/Intel Arria 10 SX hierarchy, the 570K LE device sits in the mid-density range above the 10AS048 and below the 10AS066/10AS660 density grades, and the 'K2' speed grade positions it between the slower K1 and faster K3/H transceivers. Compared with discrete CPU+FPGA designs, an SoC FPGA reduces board area, BOM, and inter-chip latency by collapsing two devices into one. Key features include 570K logic elements, ARM Cortex-A9 dual-core hard processor with CoreSight debug, 396 user I/O, integrated transceivers supporting multi-gigabit serial links, embedded DSP blocks, and on-chip M20K memory blocks. The device is offered in industrial temperature grade (I1 = -40C to +100C), and the FCBGA 35x35 mm package uses 1 mm ball pitch with flip-chip attach for high signal integrity and thermal performance. The Arria 10 SX architecture uses a 20 nm process with Adaptive Logic Module (ALM) fabric, variable-precision DSP blocks, and hardened memory controllers, DDR4 PHY, and PCI Express Gen3 IP. The integrated ARM subsystem runs a separate power island, allowing the FPGA fabric to operate while the HPS is held in reset for low-power sequencing or asymmetric power-gating. Typical applications include wireless baseband processing, radar and electronic warfare signal chains, industrial machine vision, broadcast video processing, and high-performance embedded compute. The SoC integration makes it especially attractive when deterministic hardware acceleration must coexist with an operating system for control-plane tasks. Designers should plan the HPS boot flash, the HPS-to-FPGA bridge clocking, and the DDR4 pin assignment early; mis-assigned HPS EMIF pins cannot be migrated to general-purpose I/O. Power estimation must include both the FPGA fabric and the ARM subsystem, since the HPS contributes a fixed ~5-10 W floor regardless of fabric utilization. This page combines distributor pricing, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing and qualifying the 10AS057K2F35I1HG in production designs.
10AS057K2F35I2LG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel (formerly Altera) 10AS057K2F35I2LG is an Arria 10 SX SoC FPGA that integrates a Dual ARM Cortex-A9 MPCore hard processor system with CoreSight debug and trace alongside 570,000 logic elements in a 20nm TSMC process. The device is housed in a 1152-pin FC-FBGA package (35 mm x 35 mm, F35) and operates at up to 1.5 GHz on the HPS side. It targets mid-range, transceiver-rich embedded systems that need both ARM Cortex-A9 processing and high-throughput FPGA fabric in one die. A SoC FPGA (System-on-Chip FPGA) is a hybrid device that pairs a hard ARM Cortex-A processor subsystem with programmable FPGA fabric, M20K memory blocks, DSP blocks, and high-speed serial transceivers. In the broader system hierarchy, the 10AS057 sits within SoC FPGA -> FPGA & CPLD -> Programmable Logic -> Integrated Circuits. The hardened ARM subsystem offloads deterministic control-plane tasks while the FPGA fabric accelerates parallel DSP, packet processing, or video pipelines, delivering lower latency and lower BOM cost than a discrete CPU+FPGA solution. Key features of the 10AS057K2F35I2LG include 570K logic elements, 1.5 GHz HPS core clock, dual-core ARM Cortex-A9 with NEON and single/double-precision FPU, integrated CoreSight trace macrocell, multiple high-speed transceiver channels, and support for DDR3/DDR4/LPDDR3 external memory. Industrial temperature grade (-40C to +100C ambient), -I2 speed grade, and lead-free FC-FBGA packaging make it suitable for harsh-environment deployments. Connectivity includes SPI, UART/USART, EBI/EMI, USB, Gigabit Ethernet, and PCIe. Architecturally, the device combines the Arria 10 FPGA fabric with 28nm-equivalent hardened HPS, sharing on-chip interconnect, shared SDRAM controllers, and a coherent system interconnect. This enables tight CPU-to-FPGA data movement through the FPGA-to-HPS bridge (FPGA2HPS / HPS2FPGA / ACP) without external bus bottlenecks. The 20nm process provides power efficiency improvements over older 28 nm Arria V/VII parts while preserving mainstream transceiver counts. Typical applications include wireless baseband processing, military radar and electronic warfare, broadcast video encoders, industrial machine vision, medical imaging, and high-performance embedded computing. The 1.5 GHz dual-core ARM is sufficient for Linux-class OS hosting, RTOS control, and protocol stack offload, while the 570K-LE fabric accelerates DSP and packet pipelines. When designing with the 10AS057K2F35I2LG, plan power delivery for the 0.9V core rail using TI or Renesas multi-phase PMBus controllers, follow Intel's PCB layout guidelines for the 1152-BGA 1.0 mm pitch footprint, and use the Quartus Prime toolchain with the Arria 10 SoC device support for synthesis and SoC EDS for HPS firmware. The exposed-die FC-FBGA package requires thermal vias and a heatsink for typical industrial workloads. This page synthesizes distributor stock data, same-family F35 drop-in alternatives, datasheet references, and design notes for the 10AS057K2F35I2LG that complement the manufacturer datasheet.
10AS057K2F35I2SG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel (formerly Altera) 10AS057K2F35I2SG is an Arria 10 SX family System-on-Chip (SoC) FPGA that integrates a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and 570K logic elements of programmable FPGA fabric, packaged in a 1152-ball flip-chip BGA (FC-FBGA, 35x35 mm) at the -2 speed grade and industrial temperature range. As a SoC FPGA, this device belongs to the broader category of heterogeneous computing platforms that combine a hard ARM Cortex-A9 application processor subsystem (HPS) with an FPGA fabric on a single die. SoC FPGAs sit at the intersection of Application Specific Standard Products (ASSPs), Application Specific Integrated Circuits (ASICs), and traditional standalone FPGAs, allowing hardware-accelerated peripherals, custom interfaces, and DSP pipelines to run alongside a Linux-capable processor. This integration eliminates external processor-to-FPGA bridges, reduces board area, and simplifies boot and security architecture for embedded systems. Key features of the Arria 10 SX 10AS057 device include 570K logic elements, 1.5 GHz maximum Cortex-A9 core frequency, integrated transceivers supporting multi-gigabit serial links, on-chip DSP blocks for high-throughput signal processing, hard memory controllers, and the standard Arria 10 HPS peripheral set (EMAC, USB, SPI, I2C, NAND/NOR flash controllers). The -2 speed grade balances performance and power; the I2SG suffix denotes industrial temperature (-40C to +100C), a 35x35 mm FCBGA package, and lead-free / RoHS compliance. The Arria 10 family is built on TSMC's 20 nm process, which provides a meaningful performance-per-watt improvement over 28 nm predecessors such as Arria V and Cyclone V SoCs. Typical applications for the 10AS057 include wireless baseband and radio cards, industrial machine vision and video processing, military/aerospace signal intelligence, test and measurement equipment, and high-throughput PCIe acceleration cards. The integrated ARM cores allow running a real-time Linux or RTOS control plane while the FPGA fabric implements custom data-path accelerators such as FFT engines, FEC decoders, or image processing pipelines. When designing with this part, allocate adequate PCB layers (typically 10+ layers) for the FCBGA breakout, follow Intel's pinout guidelines for HPS pin assignments and FPGA transceiver channel mapping, and validate DDR3/DDR4 memory interface timing in the Quartus Prime Timing Analyzer before tape-out. A robust thermal design is also required: at full HPS + fabric utilization, the 35x35 mm package dissipates substantial power. This page consolidates distributor pricing, drop-in Arria 10 SX family alternatives, and practical design considerations not bundled in the datasheet, providing engineers with a single decision-ready view.
10AS057K3F35E2LG - 570K LE Arria 10 SX SoC FPGA | Intel
The Intel (formerly Altera) 10AS057K3F35E2LG is a 570K logic-element Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual ARM Cortex-A9 MPCore hard processor subsystem with CoreSight debug and an Arria 10 FPGA fabric on a single die. According to the verified web data, it is housed in a 1152-pin FCBGA (F35, 35x35 mm) package, runs at up to 1.5 GHz processor clock, and uses a 20 nm process node with 0.9 V core voltage for the medical/industrial temperature grade variant. The part is a SoC FPGA whose K3 speed grade and E2 device designation indicate transceiver rate, PLL configuration, and operating-temperature window per the Arria 10 device handbook. An SoC FPGA is a heterogeneous compute device that pairs a general-purpose hard processor system (HPS) with a programmable logic fabric, allowing designers to offload latency-critical or parallel DSP tasks to the FPGA while running OS, control-plane, and I/O stacks on the ARM cores. Within the broader taxonomy, the Arria 10 SX family sits between mid-range Cyclone V/10 and high-end Stratix 10 SoCs, targeting mid-to-high bandwidth applications such as wireless radio, industrial vision, and medical imaging. Key features for the 10AS057K3F35E2LG include the dual ARM Cortex-A9 MPCore with NEON media engine, CoreSight debug and trace, an integrated Arria 10 FPGA with 570K logic elements, hardened memory controllers, PCI Express Gen2/Gen3 hard IP blocks, and multi-gigabit transceivers. The HPS provides L1/L2 caches, MMU, and a rich peripheral set including USB, Gigabit Ethernet, UART, SPI, I2C, SD/eMMC, and NAND flash controllers, simplifying system design by eliminating external processor + glue logic. The device is fabricated on TSMC's 20 nm process and uses a 0.9 V core supply with separate rails for HPS, FPGA fabric, and transceivers. Power management is handled through the Arria 10 Smart Voltage ID (SmartVID) interface and dedicated PMBus-controlled voltage regulators. The 1152-ball FCBGA F35 package provides the highest I/O count and full transceiver bandwidth, while K3 indicates the device's speed grade and E2 indicates a specific PLL/transceiver configuration per Altera/Intel ordering information. Typical applications include wireless base-station digital front-end, medical imaging accelerators, broadcast video processing, industrial motor control, and high-speed test and measurement. In each case, the FPGA fabric accelerates DSP/parallel tasks while the ARM cores handle control-plane networking and protocol stacks. When designing, ensure the 35x35 mm FCBGA thermal envelope is properly managed with a multi-layer PCB, controlled-impedance transceiver lanes, and a SmartVID-compliant power tree. This page synthesizes distributor pricing, drop-in package-identical alternatives, and selection guidance not consolidated in the manufacturer datasheet.
10AS057K3F35E2SG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA
The Intel (formerly Altera) 10AS057K3F35E2SG is a Dual ARM Cortex-A9 MPCore with CoreSight System-on-Chip (SoC) FPGA from the Arria 10 SX family, delivering 570K logic elements with embedded hard processor subsystem in a 1152-pin FC-FBGA package (35x35 mm). It integrates a 1.5 GHz capable HPS with FPGA fabric on a 20nm process node, targeting high-performance DSP and embedded processing applications. An SoC FPGA is a hybrid device that combines a general-purpose processor subsystem with programmable logic on a single die. The processor subsystem (hard CPU cores + peripherals + memory controller + interconnect) handles OS, control plane, and software-defined tasks, while the FPGA fabric accelerates parallel datapath, DSP, and I/O functions. This heterogeneous integration reduces board area, lowers latency between CPU and FPGA, and simplifies security/IP protection by keeping proprietary algorithms in hardware. The Arria 10 SX family supports up to 1.5 GHz ARM Cortex-A9 cores, floating-point operations, and a rich HPS peripheral set including Ethernet, USB, DDR memory controllers, and high-speed serial interfaces. The 570K logic element count places this device in the mid-density tier of the Arria 10 SX lineup, providing a balanced trade-off between logic capacity, DSP throughput, and power consumption for mid-to-high complexity embedded designs. This part is specified for the industrial temperature range with the F35 (35x35 mm) package outline, making it suitable for embedded vision, industrial control, and communications infrastructure. The 'K3' suffix denotes specific speed/grade combinations and the E2SG suffix encodes industrial temperature, lead-free, and RoHS-compliant packaging. When designing with this SoC FPGA, ensure the PCB BGA footprint matches the 1 mm pitch 1152-ball FC-FBGA layout and use a multi-layer stackup with continuous ground planes for signal integrity. The HPS requires dedicated DDR3/DDR4 memory routing; follow Intel's pin connection guidelines and PCB design rules. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
10AS057K3F35I2LG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel 10AS057K3F35I2LG is an Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, alongside 570K logic elements of programmable fabric, in a 1152-ball FC-FBGA package measuring 35x35 mm. This industrial-temperature (-40C to +100C) device operates with a core speed grade of -3 and is supplied in tray packaging, targeting mid-range embedded compute and DSP workloads. An SoC FPGA is a heterogeneous computing device that tightly couples a hardened CPU subsystem with programmable logic on a single die, eliminating the latency, power, and board-area overhead of a separate processor-plus-FPGA design. The hard processor system (HPS) typically includes peripherals such as DDR controllers, Ethernet MACs, USB, and SD/MMC; the FPGA fabric handles custom datapaths, DSP blocks, high-speed transceivers, and parallel I/O. Arria 10 SX extends this concept to mid- to high-density designs at lower power than prior Stratix-class parts. Key features of the 10AS057K3F35I2LG include 570K logic elements, embedded DSP blocks for fixed- and floating-point acceleration, high-speed serial transceivers supporting multi-gigabit serial links, and a wide parallel I/O count exposed through the 1152-ball BGA. The device supports configuration via industry-standard active serial or JTAG, with bitstream encryption and tamper protection features enabled by default. The industrial temperature grade permits operation in harsh environments without derating beyond standard commercial envelopes. The Arria 10 architecture combines TSMC's 20 nm process with an adaptive logic module that reduces dynamic power while maintaining timing closure on congested designs. Hard memory controllers in the HPS support DDR3/DDR4 with ECC, while the FPGA fabric provides dedicated block RAM and MLAB distributed memory for low-latency storage. Typical applications include wireless baseband processing, military radar and electronic warfare prototypes, industrial machine vision, test and measurement backplanes, and high-throughput data acquisition. Designers pair the HPS for control-plane software and the FPGA for real-time DSP or protocol offload, achieving deterministic latency impossible with discrete CPU+FPGA assemblies. When selecting this device, verify that your design's logic, DSP, memory, transceiver, and I/O utilization fits within the 570K-LE budget and the 1152-ball package pin-out. Power estimation should be performed in Intel Quartus Prime before board design because Arria 10 SX power scales non-linearly with toggle rate. This page consolidates distributor pricing, a curated set of same-family SoC FPGA variants, and practical board-design guidance not always covered in the manufacturer datasheet.
10AS057K3F35I2SG - Arria 10 SX 570K LE SoC FPGA | Intel
The Intel 10AS057K3F35I2SG is a Dual ARM Cortex-A9 MPCore with CoreSight System-on-Chip FPGA from the Arria 10 SX family, integrating 570K logic elements, 1.5 GHz maximum Cortex-A9 core frequency, and a 1152-FBGA flip-chip BGA package (35x35 mm). The 'SX' designation indicates the heterogeneous architecture that combines a hard processor system (HPS) with FPGA fabric, delivering up to 396 user I/O pins for high-performance embedded designs. What is a SoC FPGA? A System-on-Chip FPGA is a hybrid device that merges a hard processor subsystem (typically ARM Cortex-A cores) with programmable logic on a single die. This architecture provides deterministic real-time performance of FPGA fabric alongside the flexibility of a software-programmable application processor, eliminating inter-chip interconnects and reducing BOM and latency. The Arria 10 SX family extends this concept to mid-range high-performance applications. Key features of the 10AS057K3F35I2SG include 570K logic elements, 1.5 GHz dual-core ARM Cortex-A9 MPCore with NEON and CoreSight debug, 396 user I/O pins, integrated transceivers supporting multi-gigabit serial interfaces, and hard IP blocks for DDR3/4 memory controllers. The device supports the industrial temperature range (-40C to +100C junction for the I2SG speed grade) and is built on Intel's 20nm process technology optimized for low-power mid-range FPGA designs. The 570K logic element fabric provides ample capacity for high-throughput DSP pipelines, video processing, and protocol bridging, while the HPS enables Linux/RTOS application execution, peripheral management (USB, Ethernet, I2C, SPI, UART), and secure boot flows. The 'K3' speed grade balances performance and power for typical commercial and industrial workloads. The 35x35 mm FCBGA package supports the high pin count and signal-integrity requirements of multi-gigabit transceiver lanes. Typical applications include industrial machine vision and video processing, software-defined radio and baseband acceleration, medical imaging systems, military/aerospace signal processing, and high-performance embedded computing platforms. The combination of HPS plus FPGA makes this part ideal for designs that require both deterministic hardware acceleration and a rich operating system environment. When designing with this device, allocate PCB layers to maintain signal integrity on the high-speed transceivers and DDR3/4 interfaces, and ensure proper thermal management because the 35x35 mm BGA can dissipate significant power under sustained fabric utilization. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and HPS firmware development.
10AS057K4F35E3LG - Arria 10 SX 570K LE SoC FPGA | Intel
The Intel 10AS057K4F35E3LG is a dual ARM Cortex-A9 MPCore with CoreSight System-on-Chip FPGA from the Arria 10 SX family, integrating 570K logic elements with up to 1.5 GHz hard processor system performance in a 1152-pin FC-FBGA package measuring 35x35 mm. An SoC FPGA combines a processor subsystem (typically dual ARM Cortex-A cores with caches, peripherals, and memory controller) with an FPGA fabric in a single die. This heterogeneous architecture lets firmware handle control-plane tasks while the FPGA accelerates data-plane DSP, packet processing, or signal conditioning, giving system designers both software flexibility and parallel hardware throughput in one chip. Arria 10 SX sits in Intel's mid-to-high-range portfolio, balancing cost, power, and transceiver capability for mid-volume designs. Key features include 570K logic elements, hard DDR4 memory controller support, up to 24 transceivers, and integrated variable-precision DSP blocks. The dual ARM Cortex-A9 MPCore subsystem runs up to 1.5 GHz with NEON media engine and 32 KB I-cache / 32 KB D-cache per core, plus 512 KB shared L2. The 20 nm process keeps core voltage at 0.9 V with typical active power well under 30 W depending on logic utilization and transceiver count. The Arria 10 SX architecture couples the hard processor system (HPS) to the FPGA fabric through hardened AXI bridges delivering multi-gigabit inter-domain bandwidth, eliminating soft-processor latency and freeing fabric resources for application logic. Hard PCIe Gen2/Gen3 and 100G Ethernet MAC blocks further reduce soft-IP overhead. Backplane and signal-integrity features include adaptive equalization on transceivers and dynamic partial reconfiguration. Typical applications include industrial motor control, 5G baseband preprocessing, software-defined radio, broadcast video processing, and high-throughput test-and-measurement backplanes. The HPS accelerates RTOS-based control loops while the FPGA fabric handles parallel data acquisition. When designing with this device, plan thermal dissipation early: a 35x35 mm FC-FBGA has substantial thermal headroom, but a full 24-transceiver mid-utilization design can still draw 20-25 W. Follow Intel's PCB layout guide for power-plane stitching and decoupling. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that extend beyond the manufacturer datasheet, helping engineers evaluate the 10AS057K4F35E3LG for new designs and second-source planning.
10AS057K4F35E3SG - Arria 10 SX SoC FPGA, 570K LE, 1.5GHz | Altera
The Altera (Intel) 10AS057K4F35E3SG is a member of the Arria 10 SX family of System-on-Chip (SoC) Field-Programmable Gate Arrays, integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and trace into an Arria 10 FPGA fabric. Per the Arria 10 family datasheet, the device provides 570K logic elements, a 1.5 GHz maximum Cortex-A9 core frequency, and 1152-FBGA (FCBGA) package with 35x35 mm body. SoC FPGAs fuse a general-purpose processor subsystem with programmable logic for applications that need deterministic hardware acceleration alongside high-level OS support. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), dedicated DSP blocks, on-chip memory, and high-speed transceiver slices connected by a programmable routing fabric. A System-on-Chip FPGA adds a hard processor subsystem (HPS) - in Arria 10 SX, a dual-core ARM Cortex-A9 with caches, NEON media engine, and CoreSight debug - so designers can partition control-plane code onto a real CPU while accelerating data-plane work in fabric. The Arria 10 family is built on TSMC's 20 nm process and targets mid-range DSP, transceiver bandwidth, and ARM-based embedded workloads. Key features of the 10AS057K4F35E3SG variant include the 570K logic-element count (mid-density Arria 10 SX), up to 1.5 GHz Cortex-A9 dual-core HPS, integrated CoreSight debug, and the -3 speed grade indicating a faster fabric timing bin. The 1152-ball FCBGA package exposes the high I/O count and dedicated transceiver/clock pin assignments required by mid-range Arria 10 designs; finer details such as exact transceiver count and DSP block count require the Arria 10 family datasheet and device-specific addendum. The 10AS057K4F35E3SG blends a deterministic, Linux-capable Cortex-A9 HPS with hardened memory controllers and high-throughput serial transceivers, enabling single-chip designs that previously required an external processor plus a separate FPGA. Designers use it for protocol bridging, motor/control loops, and data-pipeline preprocessing where a deterministic real-time fabric must interoperate with a managed OS. Typical applications include wireless baseband preprocessing, industrial motor control with Linux supervisory layer, medical imaging front-ends, broadcast video processing, and military/aerospace signal intelligence prototypes. The dual-core ARM HPS allows a real-time OS (RTOS) and Linux to share the chip for partitioned workloads. When designing with this device, use Quartus Prime SoC Edition (Standard or Pro) for both FPGA bitstream and HPS first-stage bootloader (FSBL) generation, and use the Arria 10 SoC development kit (available separately) as a reference for power-rail sequencing, DDR3/4 pin assignment, and transceiver reference clock routing. Pinout, transceiver channel mapping, and HPS peripheral pin multiplexing are documented in the Arria 10 family datasheet and device errata. This page consolidates distributor pricing, parametric drop-in alternatives, and design considerations not surfaced in the manufacturer ordering part-number page, giving engineers a single reference for sourcing and substitution decisions.
10AS057K4F35I3LG - Arria 10 SX SoC FPGA, 570K LE | Intel | Altera
The Intel (formerly Altera) 10AS057K4F35I3LG is a System-on-Chip (SoC) Field-Programmable Gate Array from the Arria 10 SX family, integrating 570,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system plus CoreSight debug fabric in a single 1152-ball Flip-Chip BGA package. Per the manufacturer datasheet, this -3 speed-grade industrial-temperature device is fabricated on a 20 nm TSMC process and targets mixed DSP, transceiver, and embedded-processing workloads. The part is offered in the 35x35 mm FCBGA (1152-FBGA, FC) package with 396 user I/O and a 0.9 V core supply. A SoC FPGA is a class of heterogeneous computing device that combines general-purpose application processor cores with programmable FPGA fabric on a single die, allowing deterministic hardware acceleration alongside a Linux/RTOS-capable host CPU. Within the broader taxonomy, this device sits at the intersection of programmable logic (FPGA) and microprocessors (MPU/MCU/SoC). The Arria 10 SX family specifically integrates up to 1.5 GHz dual-core ARM Cortex-A9 CPUs with hardened peripherals, on-chip memory controllers, and high-speed serial transceivers, making it a mainstream mid-range SoC FPGA used in wireless baseband, industrial imaging, and defense signal processing. Key differentiating features of 10AS057K4F35I3LG include 570 K logic elements, 1.5 GHz dual-core ARM Cortex-A9 MPCore with CoreSight, embedded hard memory controllers and PCIe Gen2/Gen3 IP blocks, up to 24 transceivers at 17.4 Gbps, and integrated DSP blocks for high-throughput floating-point and fixed-point math. The industrial (-I) temperature grade supports -40 °C to +100 °C junction, and the -3 speed grade positions this device at the high-performance end of the Arria 10 SX lineup. Architecturally, the Arria 10 SX combines a quad-core ARM Cortex-A9 cluster (two cores enabled here per the SX 570 device variant) with a variable-precision DSP architecture, hardened floating-point units, and an adaptive logic module (ALM) fabric. The 20 nm process enables higher integration and lower power than the prior 28 nm Arria V generation while increasing transceiver line rate to 17.4 Gbps. Typical applications include 4G/5G wireless baseband, software-defined radio (SDR), industrial machine vision, broadcast video processing, military radar and electronic warfare, and high-performance embedded compute. For cost-sensitive applications with lower logic requirements, the 10AS048 or 10AS032 variants in the same family offer pin-compatible scaling. When designing with this part, ensure the PCB implements all required decoupling per the Arria 10 pin connection guidelines and that the HPS boot configuration (BOOT_SEL straps and clock source) is reviewed against the Arria 10 SX System-on-Chip FPGA User Guide. Industrial-temperature variants should be qualified against the full -40 °C to +100 °C range rather than relying on commercial-grade thermal margins. This page consolidates distributor pricing, drop-in same-family alternatives, application guidance, and design notes not typically summarized in a single manufacturer datasheet chapter, helping procurement and engineering teams make faster sourcing and architecture decisions.
10AS057K4F35I3SG - Arria 10 SX SoC FPGA 570K LE | Altera | Industrial
The Altera (Intel) 10AS057K4F35I3SG is a Dual ARM Cortex-A9 MPCore with CoreSight System-on-Chip FPGA from the Arria 10 SX family, integrating 570K logic elements with a hardened application processor subsystem in a 1152-pin FCBGA package (35x35 mm). It is specified for an industrial operating temperature grade and supports up to 1.5 GHz processor clocking, combining programmable logic with a fixed ARM Cortex-A9 hard processor system (HPS) for heterogeneous compute. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks, programmable interconnect, and I/O elements that engineers can re-program after manufacturing. SoC FPGAs extend this by integrating one or more hard processor cores, on-chip memory controllers, and peripherals alongside the fabric, reducing bill-of-materials, board area, and inter-chip latency versus a discrete CPU + FPGA design. The Arria 10 SX family targets mid-to-high-end applications that need ARM Cortex-A9 application processing together with high-throughput DSP, multi-gigabit transceivers, and external memory interfaces in a single device. Key features include 570K logic elements, dual-core ARM Cortex-A9 MPCore with NEON media engine and single/double precision floating-point unit, CoreSight debug and trace, integrated hardened memory controllers, and high-speed serial transceivers. The 1152-ball FCBGA (35x35 mm) package supports the device's 396 user I/O pins and exposes multiple high-bandwidth memory and serial interfaces needed by communications, broadcast, and industrial imaging designs. Architecturally, the device pairs a TSMC 20 nm process FPGA fabric with a hardened HPS subsystem, eliminating soft CPU latency overhead. The 20 nm node also lowers dynamic power relative to the prior 28 nm Arria V generation, enabling higher logic density at the same thermal envelope. Embedded hard IP blocks (PCIe Gen2/Gen3, multi-gigabit transceivers up to 14.1 Gbps, and DDR4 memory controllers) accelerate protocol implementation while preserving FPGA logic for differentiated design IP. Typical applications include wireless baseband processing, radar and electronic warfare signal processing, military secure communications, medical imaging acceleration, industrial machine vision, and broadcast video processing. The integrated HPS is well suited to control-plane tasks (OS, network stack, system management) while the FPGA fabric handles data-plane DSP and packet processing. When designing with this part, pay attention to the 1152-ball FCBGA routing complexity: a high layer-count PCB (typically 12+ layers) with microvia stack-ups and matched-length transceiver routing is required. Power sequencing for HPS and FPGA rails must follow the Intel Arria 10 Power Management User Guide to avoid inrush damage, and thermal design must assume the industrial -40C to +100C operating range. This page synthesizes distributor inventory, drop-in Arria 10 SX device variants, and practical design considerations not found in the manufacturer datasheet, helping engineers select the correct speed/temperature/package variant for their application.
10AS066H1F34E1HG - Arria 10 SX SoC FPGA, 660K LE | Intel
The Intel (Altera) 10AS066H1F34E1HG is a high-density Arria 10 SX System-on-Chip FPGA integrating 660,000 logic elements with a hardened dual-core ARM Cortex-A9 MPCore subsystem and CoreSight debug fabric, packaged in a 1152-ball flip-chip BGA (FCBGA, 35 x 35 mm). It operates at up to 1.5 GHz core frequency and delivers 492 user I/O pins, targeting mixed processor-plus-accelerator workloads in communications, broadcast, military radar, and industrial imaging. A SoC FPGA is a class of embedded device that fuses a general-purpose applications processor with programmable logic on a single die, allowing deterministic hardware acceleration to offload latency-critical DSP and packet-processing tasks from the CPU. The Arria 10 SX family sits in the mid-range of Intel's SoC portfolio, between the lower-power Cyclone V SoC and the high-end Stratix 10 SX, offering a balance of transceiver throughput, DSP density, and ARM subsystem performance. Key features of this 10AS066 variant include 660K logic elements, embedded hard memory controllers, high-speed transceivers, variable-precision DSP blocks, and the 32-bit ARM Cortex-A9 dual-core hard processor system (HPS) with 32 KB I-cache, 32 KB D-cache per core, NEON media engine, and a CoreSight debug/trace infrastructure. The part supports DDR4/DDR3 external memory with hardware ECC. Architecturally, Arria 10 SX uses a 20 nm process with heterogeneous fabric tiles combining adaptive logic modules (ALMs), M20K embedded SRAM blocks, and DSP blocks that can be configured for fixed- or floating-point arithmetic. The HPS connects to the FPGA fabric through high-bandwidth bridges that allow tight coupling between software running on the cores and custom logic accelerators. Typical applications include software-defined radio baseband, radar and electronic warfare front-ends, video broadcast encoding/decoding, 4K/8K video processing, industrial machine-vision pipelines, and aerospace telemetry. Designers choose this part when they need a mid-density programmable platform with deterministic low-latency control and an integrated OS-capable processor. A key design consideration is PCB complexity: the 1152-ball FCBGA demands a multilayer (typically 12+ layer) PCB with microvia stack-ups, controlled-impedance routing for transceivers, and careful power-plane segmentation for the HPS and FPGA core rails. Thermal management is also critical - the package exposes a large integrated heat spreader surface for cooling. This page synthesizes distributor pricing, verified drop-in same-package alternatives from the Arria 10 SX family, and practical design notes that are not consolidated in the manufacturer datasheet PDF.