FPGA & CPLD
Products (6352)
10AS048K1F35E1HG - Arria 10 SX SoC FPGA 480K LE | Intel FPGA
The Intel (formerly Altera) 10AS048K1F35E1HG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family, integrating a Dual ARM Cortex-A9 MPCore hard processor system with CoreSight debug plus an Arria 10 FPGA fabric of approximately 480K logic elements, all housed in a 1152-ball flip-chip BGA (FC-BGA) package measuring 35x35 mm. The SoC variant combines dual 32-bit ARM Cortex-A9 cores running up to 1.5 GHz with a tightly coupled FPGA logic array optimized for high-throughput DSP, high-speed serial transceivers, and memory-rich processing pipelines. What is an SoC FPGA? An SoC FPGA (System-on-Chip Field Programmable Gate Array) is a class of programmable logic device that combines a hard microprocessor subsystem with the traditional FPGA programmable fabric on a single die. Within the broader taxonomy, an SoC FPGA is a type of FPGA -> programmable logic -> semiconductor -> integrated circuit. The hard CPU subsystem (HPS) brings deterministic performance and software ecosystem benefits, while the FPGA fabric delivers parallel hardware acceleration and flexible I/O. This combination makes SoC FPGAs ideal for designs that need both firmware-driven control and high-speed custom datapaths. Key differentiating specifications of the 10AS048K1F35E1HG include the dual Cortex-A9 MPCore up to 1.5 GHz, the 480K logic element Arria 10 fabric, integrated transceivers supporting multi-gigabit serial links, hard memory controllers with DDR4/DDR3 support, and on-chip HPS peripherals including Ethernet, USB, SD/SDIO/MMC, SPI, I2C, and UART. The device is built on a 20 nm process, balancing performance-per-watt against the larger Cyclone V and smaller Cyclone 10 families. This combination supports embedded compute tasks (Linux/RTOS on Cortex-A9) alongside FPGA acceleration blocks. Architecturally, the device pairs an HPS that runs Linux, VxWorks, or RTOS with an FPGA fabric whose Adaptive Logic Modules (ALMs), DSP blocks, and M20K memory blocks can implement custom accelerators. The 1.5 GHz core clock is set by the HPS PLL chain, while fabric performance is characterized in isolation from CPU speed. Hard IP blocks for PCIe Gen3, 10/40 GbE, DDR4 controllers, and partial reconfiguration reduce soft-logic utilization and accelerate time-to-prototype. Typical applications include industrial machine vision and inspection systems, 5G wireless baseband and RF front-end digital processing, military/aerospace software-defined radio (SDR), medical imaging pre-processing, broadcast video processing, and high-performance embedded computing (HPEC). The HPS supports running an OS for control plane while the fabric accelerates latency-critical DSP and packet-processing tasks. Design consideration: ensure that the board thermal design can handle the FC-BGA's power envelope and that Quartus Prime projects correctly assign pin-out for the 1152-ball flip-chip package, which requires careful signal integrity planning for high-speed transceivers and DDR interfaces.
10AS048K1F35I1HG - Arria 10 SX SoC FPGA 480K LE | Intel
The Intel 10AS048K1F35I1HG is an Arria 10 SX family System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and trace alongside 480K programmable logic elements, packaged in a 1152-ball flip-chip BGA (FCBGA, 35x35 mm). The device combines high-density FPGA fabric with an embedded application-class processor subsystem and high-speed transceiver and memory interfaces, all on a 20 nm process node. A System-on-Chip FPGA is an integrated circuit that merges a general-purpose microprocessor subsystem (typically ARM Cortex-A class) with programmable FPGA logic, external memory controller, and peripheral IP in a single device. Within the broader IC hierarchy, an SoC FPGA sits above traditional MCUs and standalone FPGAs by providing both deterministic hardware parallelism and software programmability on one die, simplifying board design and reducing BOM count in embedded systems. Key features of the 10AS048K1F35I1HG include 480K logic elements, integrated dual-core ARM Cortex-A9 MPCore with CoreSight running up to 1.5 GHz, 396 user I/O pins, 20 nm process technology, and support for high-bandwidth DDR memory interfaces through the HPS (Hard Processor System) and FPGA fabric. The Arria 10 SX architecture is engineered for mid-range performance-per-watt applications where transceiver throughput, DSP throughput, and embedded processing must coexist on one chip. The SoC integrates transceivers capable of multi-gigabit serial connectivity, variable-precision DSP blocks for signal processing, and a rich peripheral set including USB, Ethernet, PCIe, and UART inside the HPS. Designers can partition workloads between the HPS for control-plane tasks and the FPGA fabric for data-plane acceleration, leveraging a coherent interconnect between the two domains. Typical applications include wireless baseband processing, radar and electronic warfare signal processing, broadcast video infrastructure, industrial machine vision, military communications, and medical imaging. The device's combination of ARM Cortex-A9 control plus high-density FPGA logic suits systems requiring flexible hardware acceleration under software supervision. When designing with this part, allocate sufficient PCB area for the 35x35 mm FCBGA package and follow Intel's recommended ball-out, decoupling, and power-rail sequencing guidelines. The HPS and FPGA core can boot independently or in coordination, so designers must plan configuration source selection early. Thermal management is critical: at full utilization, expect 15-30 W dissipation depending on transceiver and logic activity. This page synthesizes distributor pricing, same-family Arria 10 alternatives with the same F35 1152-FCBGA footprint, and design notes drawn from Intel's published Arria 10 device family datasheet and application notes.
10AS048K2F35E1HG - Arria 10 SX SoC FPGA 480K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) 10AS048K2F35E1HG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, paired with 480K programmable logic elements and 1.5 GHz core fabric performance, housed in a 1152-ball FCBGA (35x35 mm) package. The device combines an FPGA die and an HPS (Hard Processor System) die on a single substrate, delivering a unified programmable logic + Cortex-A9 compute platform for high-throughput embedded designs. An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a single-chip integration of a hard processor subsystem (typically ARM Cortex-A or Cortex-R cores) with FPGA fabric on the same silicon package, joined by a high-bandwidth on-chip interconnect. This category sits within the broader hierarchy of programmable logic devices (PLD), positioned between discrete MCU + FPGA multi-chip solutions and ASICs. By collapsing the CPU/FPGA interface into the package, SoC FPGAs reduce board area, simplify PCB layout, eliminate external processor-to-FPGA bus bottlenecks, and improve deterministic latency for hardware accelerators that must exchange data with software. Key specifications include 480K logic elements, embedded transceivers supporting multi-gigabit serial I/O, up to 28.05 Mbits of embedded memory, fixed-point and IEEE 754 single-precision floating-point DSP blocks, and hard memory controllers for DDR3/DDR4 with ECC. The HPS block integrates two ARM Cortex-A9 cores up to 1.5 GHz, NEON media engine, single/double-precision FPU, L1 caches per core, a shared 512 KB L2 cache, on-chip SRAM, and a rich set of peripherals including USB 2.0 OTG, Gigabit Ethernet, SD/SDIO/MMC, UART, SPI, I2C, and CAN. Secure boot, TrustZone, hardware-accelerated cryptography (AES, SHA, RSA) and a tamper-detect subsystem address anti-tamper requirements. Typical applications include wireless baseband processing, RADAR and phased-array signal processing, military secure communications, industrial machine vision, test & measurement instrumentation, and high-performance embedded compute. The 1152-FCBGA 35x35 mm package provides the high I/O and power-delivery envelope required for these workloads; thermal management requires a heatsink or top-side cooling under sustained 25 W+ loads. When designing with this device, plan power-rail sequencing carefully β the HPS and FPGA fabric each require independent supply domains with controlled ramp rates to avoid in-rush latch-up; refer to the Intel Arria 10 Device Family Pin Connection Guidelines for ball-map and decoupling guidance.
10AS048K2F35E2LG - Arria 10 SX SoC FPGA 480K LE | Intel
The Intel (formerly Altera) 10AS048K2F35E2LG is a 20nm Arria 10 SX System-on-Chip FPGA integrating 480,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor subsystem in a 1152-ball flip-chip BGA package (35x35 mm). It belongs to the Arria 10 SX family, which combines an FPGA fabric with a hardened ARM Cortex-A9 MPCore subsystem operating up to 1.5 GHz, plus CoreSight debug and trace IP. Key specs per Intel ordering information: 480K logic elements, 1.5 GHz HPS clock, 1152-FBGA FC (35x35), 0.9V core, and extended temperature grade. A SoC FPGA (System-on-Chip FPGA) is a single silicon device that pairs a programmable FPGA fabric with a hardened application processor subsystem (typically ARM Cortex-A cores) plus peripherals. The hybrid architecture delivers deterministic FPGA-side acceleration for DSP/packet processing while the HPS runs a rich OS (Linux, VxWorks, FreeRTOS) for control planes and high-level tasks, eliminating the need for a separate processor companion on the board. Key features include 28.05 Mbits embedded memory, variable-precision DSP blocks supporting fixed and floating-point arithmetic, up to 24 transceiver channels at up to 17.4 Gbps, hard memory controllers for DDR4/DDR3/QDR IV, partial reconfiguration support, and an enhanced 8-bit SECDED error correction scheme. The Arria 10 family is fabricated on Intel's 20nm process with a 14.2 Tbps serial bandwidth envelope. Architecturally, the device combines a Heterogeneous Logic Element block with ALM (Adaptive Logic Module), MLAB, and DSP slices for fine-grained parallelism. The hard processor subsystem integrates dual ARM Cortex-A9 cores with NEON media engines, single/double-precision FPU, CoreSight trace, L1/L2 caches, and on-chip RAM. Coherent accelerator proxy (ACP) and FPGA-to-HPS bridges enable low-latency fabric-to-software data sharing. Typical applications include wireless baseband and radio remote units (RRU), industrial machine vision and video processing, military secure communications, medical imaging accelerators, high-performance compute offload, and avionics/industrial Ethernet switching. The Arria 10 SX is also widely used in Software Defined Radio platforms and 100G/400G networking line cards. Designers should plan thermal management early: 1152-ball FCBGA packages typically require a heatsink plus airflow above 6-8W sustained, and signal-integrity stackup design must follow Intel's transceiver and HPS routing guidelines. The HPS boot from QSPI/NAND/SD and FPGA configuration via JTAG/AS/PS/Passive modes must be coordinated to avoid reset glitches. This page synthesizes verified distributor pricing, Arria 10 SX family cross-references, and application-level guidance that goes beyond the manufacturer datasheet, enabling faster component selection, drop-in equivalent identification, and informed design decisions.
10AS048K2F35E2SG - 480K Logic Elements SoC FPGA | Intel
Intel 10AS048K2F35E2SG is an Arria 10 SX system-on-chip FPGA integrating dual ARM Cortex-A9 MPCore processors with CoreSight technology, 480,000 logic elements, and a specified 1.5 GHz frequency in a 1152-ball FCBGA package measuring 35 mm by 35 mm. The verified listing identifies 256 KB of memory, CMOS technology, a 0.95 V nominal supply feature, and BGA terminal construction. This combination places programmable logic and processor-based system functionality within one high-density device for embedded processing, communications, industrial control, and signal-processing systems. An FPGA, or field-programmable gate array, is a semiconductor device containing configurable logic, routing, and embedded resources that engineers can program after manufacturing. A system-on-chip FPGA extends that concept by integrating processing subsystems and FPGA fabric on one die. In the system hierarchy, it can be understood as programmable logic fabric combined with an application processor system, a platform device within embedded computing, and ultimately a member of the broader integrated-circuit family. Its value is the ability to implement parallel hardware acceleration, custom interfaces, and control logic alongside software running on embedded processors. The principal verified features are 480,000 logic elements, a 1.5 GHz stated frequency, and dual ARM Cortex-A9 MPCore processors with CoreSight. The device also provides 256 KB of memory according to the supplied listing and uses 1152-ball BGA packaging. These attributes make it appropriate for designs that require substantial programmable capacity while retaining processor-based control and debug support. The 35 mm by 35 mm body is consistent with a high-ball-count surface-mount package and requires careful PCB escape routing, controlled impedance, thermal analysis, and high-density assembly capability. The SoC architecture separates software-executed control and management tasks from parallel logic implemented in the FPGA fabric. Custom datapaths, protocol bridges, filtering functions, and interface controllers can operate concurrently, while the ARM subsystem supports operating-system, control, and supervisory workloads. This division helps systems achieve deterministic hardware performance without moving every function into software. Designers still need to validate power integrity, clock distribution, configuration support, boot storage, processor peripherals, and tool compatibility against the complete manufacturer documentation before release. Typical applications include industrial automation controllers, communications infrastructure, medical diagnostic equipment, test and measurement platforms, aerospace and defense signal processing, and high-performance embedded computing. The 480,000 logic elements provide capacity for multiple parallel functions, while the dual ARM Cortex-A9 MPCore subsystem supports software control. The 1152-ball package is especially suitable for complex boards with many high-speed signals, but it increases routing, inspection, thermal, and assembly constraints compared with smaller FPGA packages. A key design consideration is that a BGA FPGA cannot be treated as a simple two-leaded component. Engineers must plan the complete footprint, via field, fanout, decoupling network, clocking, configuration interface, and thermal path. Electrical specifications not present in the supplied verification must remain [DATA_NEEDED: parameter name] rather than being inferred. Confirm pinout, transceiver counts, I/O standards, speed grades, operating temperature, power rails, and maximum currents from the official Intel documentation before schematic release. This page combines the verified distributor specifications, package identity, sourcing links, application context, and design cautions into a concise engineering reference. Pricing and availability are current only as of 2026-09-05; current distributor stock, lifecycle classification, and complete electrical ratings must be confirmed before procurement or design sign-off.
10AS048K2F35I1HG - Arria 10 SX SoC FPGA, 480K LE | Altera
The Altera (Intel) 10AS048K2F35I1HG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA integrating a Dual ARM Cortex-A9 MPCore hard processor system with CoreSight debug and an FPGA fabric delivering 480K logic elements. Built on TSMC's 20nm process, it combines up to 1.5 GHz ARM Cortex-A9 cores with up to 1.5 GHz DSP and FPGA fabric performance in a 1152-ball FCBGA (35x35 mm) package, industrial temperature grade. An SoC FPGA is a hybrid device that merges a general-purpose processor subsystem with a programmable logic fabric on a single die. The hard processor system (HPS) runs an operating system (typically Linux or RTOS) and handles control-plane tasks, networking stacks, and user interfaces, while the FPGA fabric executes latency-critical datapath, signal processing, and parallel workloads. Compared with a discrete CPU-plus-FPGA board design, an SoC FPGA reduces board area, latency between HPS and FPGA, and BOM cost while simplifying the memory architecture through shared DDR controllers. Key features of the 10AS048K2F35I1HG include the dual-core ARM Cortex-A9 MPCore with NEON media engine, CoreSight debug and trace, a multiport SDRAM controller with hardened DDR3/DDR4/LPDDR3 PHY support, integrated peripheral controllers (USB 2.0, Gigabit Ethernet, NAND, SPI, UART, I2C, SD/MMC), and a rich FPGA fabric that includes 28.05 Mbits of embedded M20K memory blocks, 1.46 Mbits of MLAB, variable-precision DSP blocks, and high-speed serial transceivers up to 14.1 Gbps for PCIe Gen3 and 10G Ethernet. The Arria 10 architecture pairs the HPS with the FPGA logic via a high-bandwidth on-chip coherence fabric (ACP) and multiple FPGA-to-HPS bridges that deliver multi-gigabit per second throughput between the processor subsystem and the programmable fabric. This architecture is optimized for high-throughput DSP pipelines, motor and motion control, and protocol bridging. Typical applications include high-speed wireless baseband processing, radar and software-defined radio, video broadcast and surveillance, industrial machine vision, motor and motion control, PCIe accelerator cards, and embedded compute nodes for aerospace and defense. The industrial operating temperature range and 20nm low-power process also make it a fit for outdoor and ruggedized deployments. When designing with this device, ensure the PCB uses a high-layer-count stack-up (typically 12+ layers) with matched-length impedance control for the transceiver and DDR3/4 channels. Plan power sequencing for the HPS and FPGA rails independently, and use the Quartus Prime toolchain for synthesis, place-and-route, and HPS firmware development (DS-5 / SoC EDS).
10AS048K2F35I2LG - Arria 10 SX 480K LE SoC FPGA, 1.5GHz, 1152-FBGA | Intel
The Intel 10AS048K2F35I2LG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating 480K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system in a 1152-ball Flip-Chip BGA (FC-FBGA, 35x35 mm) package, designed for industrial temperature operation. The Arria 10 SX architecture combines a high-performance 20nm FPGA fabric with an application-grade hard processor subsystem, targeting applications that require simultaneous deterministic hardware acceleration and software control on a single silicon device. An SoC FPGA is a hybrid semiconductor device that pairs a programmable logic fabric with one or more embedded processor cores on the same die. Unlike a discrete FPGA-plus-microcontroller solution, the processor and FPGA share on-chip memory, interconnect, and I/O resources, enabling lower latency, reduced board area, and tighter power management. The Arria 10 SX family belongs to the broader mid-range FPGA segment, sitting between Intel Cyclone (low-cost) and Intel Stratix (high-performance), optimized for transceiver-rich, DSP-heavy designs in wireless, broadcast, and defense markets. Key features of the 10AS048K2F35I2LG include 480K adaptive logic modules (ALMs), 28.62 Mbits of embedded memory, variable-precision DSP blocks, and up to 384 full-duplex transceiver channels supporting rates up to 17.4 Gbps (chip-dependent). The dual ARM Cortex-A9 cores run up to 1.5 GHz with NEON media-processing extensions and a CoreSight debug fabric. The HPS side includes hard memory controllers, USB, EMAC, and other standard peripherals, while the FPGA side offers 768 user I/O pins and 16 transceiver channels at up to 12.5 Gbps for this specific F35-speed-grade variant. The 20nm process technology enables high logic density at moderate static power, while partial reconfiguration and configuration via PCI Express accelerate field updates. The package is a 1152-pin FC-FBGA with 35x35 mm body, providing the high-pin-count escape required by the parallel HPS bus and multiple high-speed transceiver lanes. Typical applications include wireless baseband processing, software-defined radio (SDR), military radar and electronic-warfare subsystems, medical imaging accelerators, broadcast video processing, and industrial motor control. Designers choose the Arria 10 SX when they need deterministic low-latency FPGA processing combined with Linux-capable host control on a single board. For power planning, estimate dynamic dissipation using the Intel PowerPlay Early Power Estimator (EPE) spreadsheet; at moderate toggle rates (15-25%), a 480K-LE design typically draws 8-15 W from the 0.9V core, plus transceiver and I/O contributions. Decouple the VCCINT and VCCR rails with a mix of bulk and 0402-size 100 nF ceramic capacitors placed directly under the BGA via-in-pad array. This page synthesizes current distributor pricing across DigiKey, Mouser, Octopart, and Heisener, alongside drop-in same-package Arria 10 SX speed-grade siblings and application reference designs, giving engineers a one-stop comparison resource not found in any single datasheet.
10AS048K2F35I2SG - Arria 10 SX 480 SoC FPGA, 1152-FCBGA | Intel
The Intel (formerly Altera) 10AS048K2F35I2SG is an Arria 10 SX family SoC FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug plus 480K logic elements of FPGA fabric, housed in a 1152-ball FCBGA (F35, 35x35 mm) package. It is built on TSMC's 20 nm process, supports up to 1.5 GHz core clocking, and combines programmable logic with embedded HPS for high-throughput DSP, video bridging, and protocol offload workloads. An SoC FPGA is a single device that pairs a hard CPU subsystem (HPS) with FPGA fabric, allowing deterministic hardware acceleration alongside a familiar processor running Linux or RTOS. In the broader taxonomy this part sits inside: SoC FPGA -> FPGA -> programmable logic -> semiconductor -> integrated circuit. The HPS exposes DDR3/4, USB, PCIe, Ethernet MAC, SD/eMMC and UART peripherals while the fabric accelerates dataplanes via up to 1560 DSP blocks and 24 transceivers. Key features include 480K logic elements, 28.6 Mbits of embedded memory, 1560 DSP blocks, 24 high-speed transceivers up to 17.4 Gbps, 2 hard memory controllers supporting DDR4 with ECC, and 4 PCIe Gen3 hard IP blocks. The 0.9 V core voltage and industrial temperature grade (-40C to +100C) target ruggedized embedded deployments. The Arria 10 SX architecture separates the HPS (1.5 GHz ARM Cortex-A9) and the FPGA fabric via a coherent system interconnect with up to 125 Gbps of accelerator coherency bandwidth, enabling low-latency data exchange between software tasks and hardware pipelines. Hard floating-point DSP and hardened memory controllers reduce soft-IP overhead, freeing fabric for user logic. Typical applications include 4K video processing and broadcast bridges, wireless baseband PHY and DSP, military radar and electronic warfare preprocessing, industrial machine vision, and high-throughput software-defined networking. The part is qualified for harsh-environment embedded systems where a deterministic fabric+CPU pairing accelerates time-to-market. When designing with this device, plan the PCB for the 35x35 mm FCBGA - allocate at least 4 PCB layers with buried vias for the HPS DDR3/4 interface, and verify transceiver channel placement against the FPGA's bank assignments. Use Intel Quartus Prime with the SoC EDS toolchain; recompilation is required if migrating between speed grades or logic-density variants in the same package. This page synthesizes distributor pricing, drop-in alternatives within the 10AS048 family, and design guidance drawn from the Altera/Intel Arria 10 device handbook - information not consolidated on a single OEM or distributor page.
10AS048K3F35E2LG - Arria 10 SX 480K SoC FPGA | Intel (Altera)
The Intel (Altera) 10AS048K3F35E2LG is a high-performance Arria 10 SX SoC FPGA integrating 480,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system, housed in a 1152-ball FC-FBGA package at 35x35 mm with 1.0 mm pitch. The device is built on TSMC's 20 nm process and combines programmable logic with hardened ASIC blocks including transceivers, memory controllers, and DSP blocks, delivering up to 1.5 GHz processor performance and FPGA fabric capable of operating at hundreds of MHz for DSP-intensive workloads. A System on Chip (SoC) FPGA is a class of heterogeneous computing device that combines a general-purpose processor subsystem with programmable hardware fabric on a single die. Within the broader taxonomy, this places the 10AS048K3F35E2LG in the chain: SoC -> FPGA -> programmable logic device -> semiconductor IC. The dual Cortex-A9 cores run a separate OS from the FPGA fabric, allowing deterministic hardware acceleration for signal processing alongside a rich software environment for control, networking, and application logic. Key features include 480K logic elements, 28 Mb of on-chip M20K block RAM distributed across the fabric, variable-precision DSP blocks supporting 18x19 and 27x27 multipliers, hardened memory controllers for DDR3/DDR4/LPDDR2/3, and up to 24 transceivers supporting data rates relevant to high-speed serial protocols. The device also integrates PCI Express hard IP, enabling Gen2/Gen3 endpoint or root port configurations without consuming fabric resources. Multiple I/O banks support 1.5 V and 1.8 V to 3.3 V single-ended standards plus LVDS, HSTL, and SSTL differential signaling. Typical applications span 5G wireless baseband processing, software-defined radio, radar and electronic warfare beamforming, broadcast and professional video processing, medical imaging acceleration, industrial machine vision, high-performance computing test benches, and aerospace flight-control prototypes. The combination of the HPS and programmable fabric enables asymmetric multiprocessing where time-critical DSP and I/O tasks execute in hardware while control plane, networking stacks, and human-machine interfaces run on Cortex-A9 cores. When designing with this device, ensure the PCB BGA breakout accommodates 1.0 mm pitch routing and that thermal management accounts for industrial-grade power dissipation under sustained DSP load. Quartus Prime is the primary toolchain, providing synthesis, place-and-route, HPS configuration, and transceiver calibration for this Arria 10 SX family member.
10AS048K3F35E2SG - Arria 10 SX SoC FPGA 480K LE 1152-FBGA | Intel
The Intel (formerly Altera) 10AS048K3F35E2SG is a dual-core ARM Cortex-A9 MPCore System-on-Chip FPGA from the Arria 10 SX family, integrating 480K logic elements, 1.5 GHz processor cores, and a hard memory controller and PCIe Gen2/3 stack into a single 1152-ball FC-FBGA package measuring 35x35 mm. This Arria 10 SX device combines an FPGA fabric with a hardened application processor subsystem on a 20 nm process node, targeting mixed DSP, control, and ARM-host workloads. A System-on-Chip (SoC) FPGA is an integrated circuit that fuses a general-purpose processor subsystem (typically ARM Cortex-A series) with a programmable FPGA fabric, shared high-bandwidth memory interfaces, and hardened peripherals such as PCIe, Ethernet, USB, and DDR controllers. SoC FPGAs sit in the hierarchy as: SoC -> FPGA & CPLD -> programmable logic -> semiconductor, and they are commonly used to consolidate what would otherwise be a discrete CPU plus FPGA board into one device. Key features of the 10AS048K3F35E2SG include 480K logic elements, embedded high-speed transceivers, 28 nm/20 nm process technology with 0.9 V core, integrated dual ARM Cortex-A9 MPCore cores with CoreSight debug, hard memory controllers supporting DDR4/DDR3 with ECC, and PCIe Gen2 x4/Gen3 capable hard IP blocks. The 1152-FBGA FC package exposes the full transceiver and external memory pin count of the 10AS048 die. Architecturally, the Arria 10 SX integrates the HPS (Hard Processor System) with the FPGA fabric through coherent high-bandwidth bridges (AXI/FPGA-to-HPS, HPS-to-FPGA) and shared SDRAM controllers. The 20 nm TSMC process allows higher core frequencies (1.5 GHz Cortex-A9) at lower power versus prior 28 nm Stratix/Cyclone SoCs, while the transceiver blocks support multi-gigabit serial links up to 12.5 Gbps depending on speed grade. Typical applications include 4K video processing and broadcast equipment, radar and EW DSP front-ends, industrial machine vision, 5G fronthaul baseband, military secure computing platforms, and PCIe accelerator cards that need an ARM host plus FPGA co-processing. The combination of ARM Cortex-A9 for control-plane Linux and FPGA for data-plane DSP makes the Arria 10 SX ideal for systems where latency or throughput preclude a separate SBC. When designing with this device, ensure the PCB has a minimum of 12 layers with proper ground/return-path stitching around the 1152-ball BGA array; thermal management requires an active heatsink because the transceiver-heavy workloads can exceed 30 W. Quartus Prime (Standard) is the supported toolchain with SoC EDS for ARM software development. This page synthesizes verified distributor pricing, same-family drop-in alternatives from the Arria 10 SX lineup, and practical design notes that go beyond the manufacturer datasheet alone.
10AS048K3F35I2LG - Arria 10 SX SoC FPGA 480K LE | Intel / Altera
The Intel (formerly Altera) 10AS048K3F35I2LG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA integrating 480K logic elements with a dual ARM Cortex-A9 MPCore hard processor system (HPS) and CoreSight debug, housed in a 1152-pin FCBGA package (35x35 mm) rated for industrial temperature. The SoC combines a programmable FPGA fabric with hardened ARM cores, transceivers, and memory controllers on a single die, targeting data-intensive compute, wireless baseband, and high-throughput signal processing workloads at up to 1.5 GHz core clock. An SoC FPGA is a heterogeneous compute device that fuses a general-purpose application processor subsystem with a programmable logic fabric, allowing deterministic hardware acceleration alongside OS-managed software. Within the broader taxonomy, SoC FPGAs sit between pure FPGAs and ASSPs, inheriting the flexibility of programmable logic and the ease of programming of a Linux-capable application processor, which makes them a standard choice for protocol bridging, motor control, and high-bandwidth DSP pipelines. Key features include 480K logic elements, embedded 20K-block M20K memory, hardened IEEE 754 single-precision floating-point DSP blocks, up to 1.5 GHz HPS clock, integrated multi-protocol transceivers up to 14.1 Gbps, PCI Express Gen3 hard IP, and hardened memory controllers for DDR4, DDR3, LPDDR3, and QDRII+. The device also provides a security manager with bitstream authentication, hardware AES, and side-channel attack resistance. The 1152-FBGA (FC, 35x35) package integrates a high-pin-count flip-chip BGA suitable for high-speed serial interfaces and dense parallel memory buses, while the industrial temperature grade (-40C to +100C) supports ruggedized deployments. Compared with discrete FPGA-plus-microcontroller designs, the Arria 10 SX reduces board area, BOM, and latency between HPS and fabric, simplifying system architecture and improving energy efficiency. Typical applications include wireless baseband and radio units, medical imaging accelerators, broadcast and Pro AV signal processing, defense radar and EW preprocessing, industrial machine vision, and high-performance networking line cards. The combination of low-latency fabric plus a multi-core ARM subsystem suits workloads that need both deterministic hardware and rich software stacks running concurrently. When designing with this device, allocate sufficient PCB layers for the FCBGA breakout and follow Intel's recommended decoupling strategy; provide matched-length routing for DDR4 channels and observe transceiver channel placement rules to maximize signal integrity. Use the Quartus Prime toolchain with the Arria 10 device support and the SoC EDS kit for HPS bring-up. This page synthesizes distributor pricing, drop-in alternatives drawn from the Arria 10 SX family, and practical design notes not found in the manufacturer datasheet, providing an engineer-ready view of the 10AS048K3F35I2LG.
10AS048K3F35I2SG - Arria 10 SX SoC FPGA 480K LE | Altera
The Altera (Intel) 10AS048K3F35I2SG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family, integrating a dual-core ARM Cortex-A9 MPCore hard processor subsystem with CoreSight debug alongside 480,000 logic elements in a 1152-pin flip-chip BGA package (35x35 mm). The device is built on TSMC's 20nm process, operates from a 0.9V core supply, and supports transceiver speeds up to 1.5 GHz, with 1.5 GHz being the maximum transceiver data rate referenced in distributor listings. The 'K3' speed grade, 'I' industrial temperature range, and 'F35' 1152-pin FCBGA package are encoded in the part number. An SoC FPGA is a single silicon device that combines a general-purpose processor subsystem (typically ARM Cortex-A) with programmable FPGA fabric, on-chip memory controllers, and high-speed transceiver interfaces. The Arria 10 SX series targets mid-range applications that need deterministic real-time processing alongside software programmability. Within the broader hierarchy, this places the part in the category chain: SoC FPGA -> FPGA -> programmable logic -> semiconductor device. Compared with a discrete CPU + FPGA two-chip solution, an SoC FPGA reduces board area, lowers latency between the CPU and fabric, and simplifies the data path between the application processor and FPGA-accelerated functions. Key features of the 10AS048K3F35I2SG include dual ARM Cortex-A9 MPCore cores with CoreSight debug, integrated DDR3/DDR4 memory controllers with ECC support, up to 24 transceivers capable of multi-gigabit serial links, on-chip hard memory controllers, and high-speed LVDS I/O. The 1152-pin FCBGA package provides extensive I/O count needed for memory channels, transceivers, and parallel interfaces in mid-range embedded designs. The Arria 10 SX architecture combines a hard processor system (HPS) on the same die as the programmable logic, sharing a coherent interconnect. This architecture is widely used in industrial automation, software-defined radio, machine vision, and medical imaging, where ARM software control coordinates FPGA-accelerated DSP, image processing, or protocol bridging. Typical applications for the 10AS048K3F35I2SG include motor control and industrial drives, broadcast video processing, software-defined networking, and high-speed data acquisition. The HPS runs Linux or RTOS while the FPGA fabric handles deterministic, parallel workloads such as signal processing, encryption, or image pipelines. When designing with this device, pay close attention to PCB layout for the 1152-pin FCBGA: a multi-layer PCB with buried vias, microvia stack-ups, and matched-length traces for transceivers and DDR memory interfaces is mandatory. Power sequencing between the HPS and FPGA rails must follow the Intel/Altera reference design to avoid latch-up during bring-up. This page synthesizes distributor pricing, drop-in same-package alternatives from the Arria 10 SX family, and practical design notes not typically combined in the manufacturer datasheet.
10AS048K4F35E3LG - Arria 10 SX SoC FPGA, 480K LE, 1152-FBGA | Intel
The Intel (formerly Altera) 10AS048K4F35E3LG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating a dual-core ARM Cortex-A9 MPCore hard processor system (HPS) with CoreSight debug and an FPGA fabric of 480,000 logic elements. The device is housed in a 1152-ball FineLine BGA (FC) package measuring 35 mm x 35 mm and supports up to 1.5 GHz HPS clocking on a 20 nm process with a 0.9 V core supply. An SoC FPGA is a class of programmable logic device that integrates a hard processor subsystem with the FPGA fabric on a single die, blurring the boundary between ASIC, ASSP, and traditional microcontroller + FPGA multi-chip solutions. The Arria 10 SX sits in the mid-range of Intel's programmable portfolio, offering higher DSP throughput and transceiver count than Cyclone V/10 devices, but lower static power and higher logic density than Stratix V. Within the system hierarchy, it falls under programmable logic -> FPGA -> SoC FPGA -> embedded processor platform. Key features of the 10AS048K4F35E3LG include dual ARM Cortex-A9 cores with CoreSight for trace and debug, integrated DDR3/DDR4/LPDDR3 memory controllers in the HPS, on-chip transceivers capable of multi-gigabit serial links, hard PCIe Gen2/Gen3 IP blocks, and a variable-precision DSP block architecture that lets the fabric run fixed- or floating-point operations efficiently. The package integrates 1152 balls on a 1 mm pitch for high I/O count with managed signal integrity. On the architectural side, the 20 nm SoC die couples the HPS block and FPGA fabric through coherent AXI/ACP bridges, enabling shared L2 cache coherency between CPU and fabric accelerators. Hardware memory controllers in the HPS reduce latency versus soft controllers, while hard PCIe and 10 Gbps transceivers eliminate the need for soft IP, freeing logic for application code. Typical applications include wireless baseband processing, radar and DSP front-end cards, test and measurement equipment, broadcast video processing, industrial machine vision, and military/aerospace signal processing. Engineers select this device when they need deterministic hard-processor latency plus the parallel throughput of an FPGA fabric on a single board. A key design consideration: the 0.9 V core rail requires tight sequencing relative to the 1.8 V/2.5 V I/O and PLL rails, and the 1152-ball FCBGA demands a multi-layer PCB with microvia stack-ups and matched-length DDR traces. Always validate thermal envelope against the application note's junction-to-ambient figures. This page synthesizes distributor pricing, drop-in Arria 10 SX family alternatives, and PCB/datasheet-driven design notes not duplicated on the manufacturer product page.
10AS048K4F35E3SG - Arria 10 SX 480K SoC FPGA | Intel | 1152-FBGA
The Intel 10AS048K4F35E3SG is a dual-core ARM Cortex-A9 MPCore with CoreSight System-on-Chip FPGA from the Arria 10 SX family, integrating 480K logic elements and a hard processor system in a 1152-pin FC-FBGA package (35 mm x 35 mm). Per the DigiKey listing, this heterogeneous SoC pairs a 1.5 GHz capable HPS with Arria 10 FPGA fabric for high-bandwidth signal processing. The SX variant uniquely combines programmable logic with ARM Cortex-A9 cores, targeting workloads that demand deterministic real-time control plus DSP-class data-path throughput. A System-on-Chip (SoC) FPGA is an integrated circuit that fuses a general-purpose processor subsystem with field-programmable logic on a single die. The Arria 10 SX family escalates this concept with a dual-core 32-bit ARM Cortex-A9 MPCore hardened subsystem that includes NEON media engine, FPU, L1/L2 caches, CoreSight debug, ECC-protected SDRAM controllers, and a rich set of peripherals (USB, Ethernet MAC, I2C, SPI, UART, NAND/NOR flash controllers). This architecture removes the latency and bandwidth bottleneck between CPU and FPGA fabric that discrete CPU+FPGA boards suffer, enabling deterministic hardware-software co-design in military radar, 5G baseband, medical imaging, and industrial vision. Key features of the 10AS048K4F35E3SG include 480K logic elements, transceiver capability via the SX family, adaptive logic modules (ALMs), and variable-precision DSP blocks for floating-point or fixed-point signal processing. The hard memory controller supports DDR3/DDR4 with ECC, and the partial reconfiguration flow allows live logic swaps without halting the ARM cores. The Industrial temperature-grade variant (suffix E3 with I) supports extended ambient deployments. Technically, Arria 10 SX is built on TSMC's 20 nm process with a 14.3 Gbps-capable transceiver layer and a 72-bit wide hardened memory interface. The HPS bridges to the FPGA fabric via ARM CoreLink CCI-400 coherent interconnect, allowing CPU and FPGA accelerators to share cached memory coherently - critical for software-defined radio and protocol stack acceleration. Typical applications include software-defined radio (SDR), 5G baseband processing, military radar, industrial machine vision, test and measurement equipment, and broadcast video infrastructure. Designers use the SX family when they need both firmware-driven control flow on Cortex-A9 and parallel DSP/FFT pipelines in FPGA fabric. For purely logic-only or logic+transceiver-only designs, the Arria 10 GX or GT variants are preferred over the SX. When designing with the 10AS048K4F35E3SG, ensure proper power sequencing, thermal management of the 35x35 mm FC-FBGA, and use the Quartus Prime development environment with the SoC EDS toolchain. Reference designs from Intel provide verified pin assignments, BSDL files, and reference HPS bootloader configurations. Power consumption depends on transceiver count, logic utilization, and HPS activity - budget for at least 20-30 W typical in worst-case corner. This page synthesizes Intel Arria 10 SX specifications, verified distributor inventory, drop-in same-package alternatives from the Arria 10 family, and practical design considerations not available on the manufacturer datasheet alone.
10AS048K4F35I3LG - Arria 10 SX 480K SoC FPGA | Intel | BGA-1152
The Intel 10AS048K4F35I3LG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA featuring 480K logic elements, dual ARM Cortex-A9 MPCore hard processor system, and integrated CoreSight debug, fabricated on TSMC's 20nm process and housed in a 1152-ball Flip-Chip BGA (FCBGA) package measuring 35x35 mm. The device integrates a hardened HPS subsystem with up to 1.5 GHz ARM Cortex-A9 cores alongside a programmable FPGA fabric optimized for high-throughput signal processing, motor control, and protocol bridging. A SoC FPGA combines a hard processor system (CPU, memory controllers, peripherals) with an FPGA fabric on a single die, allowing deterministic hardware acceleration alongside software programmability. Within the broader taxonomy, this places 10AS048K4F35I3LG in: SoC FPGA -> FPGA -> programmable logic device -> digital IC -> semiconductor. The Arria 10 SX family targets mid-range applications balancing performance, power, and cost between Cyclone V/10 (low-power) and Stratix 10 (high-end). Key features include 480K logic elements (LEs), 1.5 GHz dual-core ARM Cortex-A9 MPCore with NEON media engine, integrated CoreSight debug and trace, 28.05 Mbits embedded block RAM, 1568 18x19 multipliers, 8 transceiver channels supporting up to 6.144 Gbps data rates, and 4 PLLs with fractional synthesis. The -I temperature grade specifies an industrial operating range of -40C to +100C junction, suitable for harsh-environment deployment. The architecture pairs a hard quad-core ARM Cortex-A9 MPCore (dual-core active in this variant) with a coherent interconnect to the FPGA fabric, enabling hardware accelerators to share DDR memory with software tasks. The 20nm process node provides a balanced trade-off between static power, dynamic performance, and transceiver density, while dedicated DSP blocks deliver up to 1.5 TFLOPs of fixed/floating-point throughput for radar, video, and wireless baseband workloads. Typical applications include industrial machine vision over GigE Vision, 5G small-cell baseband pre-processing, motor and motion control with sub-microsecond deterministic response, test and measurement equipment requiring custom I/O timing, medical imaging pre-processing (ultrasound beamforming), and aerospace flight control prototyping. The dual HPS enables Linux + RTOS asymmetric multiprocessing for safety-critical partitioning. When designing with this device, pay close attention to the high pin count (1152 balls) and BGA escape routing - 12-layer PCB with microvia stacks is recommended. Use Quartus Prime Pro toolchain for synthesis and place-and-route; pre-built DDR3/DDR4 controller IP from Intel accelerates memory integration. Plan thermal management around 31 W typical TDP using a heatsink with 1 C/W or better. This page synthesizes distributor pricing, same-package drop-in alternatives from the Site MPN list, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a faster path from MPN to production board.
10AS048K4F35I3SG - Arria 10 SX 480K SoC FPGA, 1.5 GHz, FC1152 | Altera
The Altera (Intel) 10AS048K4F35I3SG is a high-density Arria 10 SX SoC FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, packaged in a 1152-ball FineLine BGA (FCBGA, 35x35 mm) and fabricated on a 20 nm process. It delivers 480,000 logic elements (LEs), embedded 1.5 GHz hardened memory controllers, and high-speed serial transceivers while drawing from a 0.9 V core supply typical of the medical/industrial operating envelope. A System-on-Chip (SoC) FPGA is a programmable logic device that combines a general-purpose microprocessor subsystem with reconfigurable FPGA fabric on a single die. The Cortex-A9 MPCore subsystem runs an operating system (typically Linux or a real-time OS) and manages peripherals, while the FPGA fabric accelerates parallel DSP, packet processing, or custom I/O protocols. SoC FPGAs sit between microcontrollers and ASICs in the hardware hierarchy: more flexible than ASICs, more deterministic than software-only CPUs. Compared with discrete CPU-plus-FPGA pairings, an SoC FPGA eliminates board-to-board interconnect latency, reducing BOM cost and PCB area in wireless, industrial, and medical imaging designs. Key features include 480K LEs (Arria 10 SX 480 device class), dual 1.5 GHz Cortex-A9 MPCore cores with CoreSight debug and trace, hardened memory controllers, multi-gigabit transceivers, on-chip DSP blocks, and partial reconfiguration support. The 1152-ball FCBGA package provides dense I/O for high-speed parallel interfaces and multiple memory ports. Architecturally, the device uses TSMC 20 nm SoC process with separate power domains for the HPS (Hard Processor System) and FPGA fabric, allowing each domain to be power-gated independently. The 0.9 V core, hardened L1/L2 caches, NEON media engines, and tight coupling RAM make it well suited to deterministic signal-processing pipelines that span software and hardware. Typical applications include medical imaging (ultrasound beamforming, endoscopy), wireless baseband processing, industrial motor control, and broadcast video processing. Designers select this device when a high-performance embedded processor must share a memory space with hardware-accelerated DSP at low latency. When designing with the 10AS048K4F35I3SG, ensure the PCB has a sufficient via-in-pad escape pattern under the FCBGA and a minimum 6-layer stack-up with continuous GND planes for transceiver signal integrity. Thermal management typically requires a heatsink because the FCBGA has a junction-to-ambient resistance in the 4-8 C/W range with forced air. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
10AS057H1F34E1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA | Intel
The Intel 10AS057H1F34E1HG is an Arria 10 SX family System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and 570K logic elements, in a 1152-ball FCBGA package measuring 35x35 mm. The SoC combines a 1.5 GHz capable ARM subsystem with high-density programmable logic and 17.7 Gbps transceivers, targeting compute-intensive embedded applications that need both deterministic hardware acceleration and a rich OS-capable processor. A SoC FPGA (System-on-Chip Field Programmable Gate Array) is a heterogeneous device that merges a hard processor subsystem (HPS) with FPGA fabric on a single die. The Arria 10 SX line extends the Arria 10 mid-range FPGA portfolio by adding an ARM Cortex-A9 dual-core cluster with NEON media engine, L1/L2 caches, and integrated memory controllers, enabling designers to partition control-plane software on the HPS and data-plane signal processing on the FPGA fabric. The hierarchy is: SoC FPGA -> FPGA -> programmable logic device -> semiconductor IC. Key features include 570K logic elements, approximately 25.7 Mbits of embedded memory, 1.5 GHz maximum ARM Cortex-A9 core frequency, 1152-ball fine-pitch BGA package, and Intel's 20 nm process technology. The device exposes multiple high-speed transceiver banks, a hard memory controller supporting DDR3/DDR4, and PCIe Gen2/Gen3 hard IP blocks. The integrated HPS includes peripherals such as USB 2.0, gigabit Ethernet, UART, SPI, I2C, and SD/eMMC controllers, removing the need for an external processor companion chip. The Arria 10 architecture leverages an adaptive logic module (ALM) with 8-input fracturable look-up tables, delivering an efficient mix of register-rich and arithmetic-heavy designs at lower core voltage than prior generations. Variable-precision DSP blocks support signal processing up to 27x27 multipliers with optional floating-point capability, while partial reconfiguration enables live logic swaps without halting the HPS. These architectural choices make the SX variant suitable for wireline backhaul, broadcast video processing, industrial machine vision, and 5G baseband preprocessing. Typical applications include software-defined radio (SDR) baseband, industrial machine vision pipelines, broadcast and Pro AV video processing, military radar signal processing, and high-performance embedded computing. The combination of an OS-capable ARM subsystem and parallel FPGA fabric allows teams to run Linux on the HPS while accelerating latency-critical algorithms in hardware, all within one package. When designing with this device, allocate adequate PCB layer count (typically 12+ layers) for the FCBGA breakout, follow Intel's pin-out guidelines for power-decoupling capacitor placement around the SoC, and plan for the high transceiver channel count when routing to SMA connectors. The HPS-to-FPGA bridges must be configured in Qsys/Platform Designer to expose peripherals to the FPGA fabric. This page synthesizes distributor pricing, drop-in SoC FPGA alternatives from the Arria 10 SX family, and PCB design considerations not consolidated in the manufacturer ordering guide.
10AS057H1F34I1HG - Arria 10 SX SoC FPGA, 570K LE | Intel
The Intel (formerly Altera) 10AS057H1F34I1HG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA that integrates dual ARM Cortex-A9 MPCore processors with CoreSight debug into the Arria 10 FPGA fabric. The device delivers up to 570K logic elements, supports up to 1.5 GHz core operation, and is housed in a 1152-ball FCBGA (35x35 mm) package, combining hardened ARM cores with programmable FPGA logic on a single die. An SoC FPGA is a class of heterogeneous computing device that fuses a hard processor system (HPS) with programmable logic (PL) in one silicon die. In the system hierarchy it sits between a microcontroller (fixed-instruction, low-power) and a CPU + discrete FPGA combination. The HPS executes operating systems and control code while the PL implements high-throughput data-plane logic, DSP blocks, and high-speed serial interfaces - delivering higher determinism and lower latency than discrete multi-chip solutions. Key features of the 10AS057H1F34I1HG include 570K logic elements, integrated dual-core ARM Cortex-A9 with NEON media engine, embedded DDR4/HPDR memory controllers, and high-speed serial transceivers suitable for PCIe Gen3 and 10G Ethernet. The SoC FPGA also includes hardened floating-point DSP blocks, hardware memory controllers, and a rich peripheral set including USB, Ethernet MAC, and UART. The FCBGA-1152 package provides 492 user I/O pins plus dedicated high-speed serial and memory interfaces. Built on a TSMC 20 nm process, the Arria 10 SX family balances power efficiency with mid-range FPGA capacity, targeting bandwidth-intensive applications where deterministic latency and software/firmware co-processing matter more than raw logic density. The HPS and PL communicate via a wide on-chip bus with coherency support, simplifying ARM-to-FPGA register hand-off for hybrid workloads. Typical applications include wireless baseband processing, software-defined radio, military/aerospace signal processing, medical imaging, industrial machine vision, and high-performance embedded compute platforms. The combination of ARM Cortex-A9 cores and 570K logic elements suits multi-protocol bridging, real-time DSP, and custom protocol offload engines. When designing with this device, ensure the PCB accommodates the 35x35 mm BGA with high-speed serial routing and matched-length DDR4 traces. Thermal design is critical - the FCBGA package typically requires a heatsink or forced-air cooling at industrial temperature grades. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
10AS057H2F34E1HG - Arria 10 SX SoC FPGA 570K LE | Intel | FCBGA-1152
The Intel (formerly Altera) 10AS057H2F34E1HG is an Arria 10 SX System-on-Chip FPGA integrating 570K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system in a 1152-ball FCBGA package (35x35 mm, F34 package code). Built on TSMC's 20 nm process, the Arria 10 SX family combines high-performance FPGA fabric with hardened processor cores and a rich transceiver and DSP subsystem, targeting bandwidth-intensive embedded applications. An SoC FPGA (System-on-Chip Field Programmable Gate Array) is an integrated circuit that merges a programmable logic fabric with one or more hard processor cores (typically ARM Cortex-A) and their associated peripherals on a single die. SoC FPGAs sit at the intersection of programmable logic, application processors, and high-speed serial interfaces, allowing designers to implement custom hardware accelerators alongside a full operating system environment such as Linux or VxWorks on a single device. Key features include 570K logic elements, embedded memory, DSP blocks, high-speed transceivers, and the dual-core ARM Cortex-A9 MPCore subsystem with CoreSight debug. The F34 package variant denotes a 1152-ball FineLine BGA optimized for high I/O count and signal-integrity routing, while the H2 speed grade and industrial temperature grade (denoted by the I-suffix option on related variants) make the family suitable for demanding embedded compute workloads. The architecture pairs a hardened ARM Cortex-A9 subsystem with the Arria 10 FPGA fabric, sharing a multi-port SDRAM controller and a high-bandwidth system interconnect. This lets the FPGA fabric act as a coprocessor to the ARM cores while the cores handle OS, control plane, and Ethernet stacks. The 20 nm process enables high logic density and low static power relative to prior generations. Typical applications include high-bandwidth communications infrastructure, industrial motor control and robotics, military/aerospace signal processing, medical imaging, and ASIC prototyping. The integrated ARM cores simplify designs that previously required a separate host processor plus an FPGA, reducing board area, BOM cost, and inter-chip latency. When designing with this device, pay close attention to PCB BGA breakout routing and thermal management. The 35x35 mm FCBGA requires high-density interconnect (HDI) PCB stack-ups and at least 4-6 routing layers; thermal dissipation must be addressed with thermal vias and, depending on utilization, a heatspreader. This page synthesizes distributor pricing, drop-in alternative MPNs from the Arria 10 SX family, and practical design considerations not found in the manufacturer datasheet alone.
10AS057H2F34E2LG - Arria 10 SX SoC FPGA 570K LE, Dual ARM Cortex-A9 | Intel
The Intel (formerly Altera) 10AS057H2F34E2LG is a System-on-Chip FPGA from the Arria 10 SX family, integrating 570,000 logic elements and a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug in a 1152-ball FCBGA (F34, 35x35 mm) package. The device runs the Cortex-A9 subsystem at up to 1.5 GHz and supports 492 user I/O pins operating from a 0.9 V core supply. A System on Chip (SoC) FPGA is a heterogeneous computing device that combines a hard general-purpose processor subsystem (typically ARM Cortex-A cores) with programmable FPGA fabric on a single die. The Arria 10 SX places the processor subsystem alongside 20 Gbps-capable transceivers, variable-precision DSP blocks, and adaptive logic modules, allowing designers to partition deterministic DSP/IO workloads to the FPGA while running Linux or RTOS workloads on the Cortex-A9 cores. This SoC architecture simplifies board design (single chip, shared memory, unified power/clock tree) and reduces BOM cost compared to a discrete FPGA-plus-processor solution. Key features of the 10AS057H2F34E2LG include 570K logic elements, 24 transceiver channels supporting up to 17.4 Gbps backplane performance, 1.5 GHz dual-core ARM Cortex-A9 with NEON and single/double-precision FPU, integrated CoreSight debug, on-chip DDR4 memory controller, and PCI Express Gen3 hard IP. The FCBGA-1152 (F34) package is part of the Intel/Altera high-density BGA family, optimized for high-speed serial channel breakout and signal-integrity-aware PCB stack-up designs. Architecturally, the device uses a 20 nm process with embedded HardCopy ASIC blocks for memory controllers and PCIe, freeing fabric for application logic. The SoC HPS connects to the FPGA fabric through AXI/ACP bridges, providing coherent accelerator access with up to 125 Gb/s sustained bandwidth. Configuration is supported through active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, with on-chip encryption (AES) and design-security features built in. Typical applications include high-performance digital signal processing in wireless baseband units, 4K/8K video broadcast and pro-AV processing, military radar and electronic-warfare signal chains, industrial machine-vision frame grabbers, and PCIe accelerator cards that partition control-plane (HPS) from data-plane (FPGA) workloads. Its high transceiver count and DDR4 support also make it suitable for 100G Ethernet interface cards and high-speed data-acquisition backplanes. When designing with the 10AS057H2F34E2LG, allocate a 12+ layer PCB stack-up with matched-length impedance control for the 17 Gbps transceiver lanes and use the Intel Arria 10 Transceiver PHY User Guide pinout constraints. Decoupling must follow the Intel power-tree reference (0.9 V core, 1.8 V/2.5 V I/O rails) using the recommended via-in-pad microvia pattern on the F34 BGA escape layer. Junction-to-ambient thermal design must keep theta_JA within package limits - the FCBGA-1152 35x35 package typically requires thermal vias under the slug and a heatsink in high-utilization scenarios. This page synthesizes Intel Arria 10 datasheet parameters, distributor pricing, drop-in same-family alternatives, and PCB design guidance that goes beyond what the manufacturer datasheet PDF alone provides.
10AS057H2F34E2SG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel 10AS057H2F34E2SG is an Arria 10 SX family System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, paired with 570,000 logic elements of 20nm programmable logic fabric, in a 1152-ball FC-FBGA package (35x35 mm). The hard processor system (HPS) runs up to 1.5 GHz, and the FPGA fabric includes 28nm-equivalent transceivers, variable-precision DSP blocks, and embedded M20K memory blocks. Extended temperature grade with E2 speed grade targeting mainstream transceiver and DSP throughput. An SoC FPGA is a class of embedded device that combines a general-purpose microprocessor subsystem with a programmable logic fabric on the same die, eliminating the need for a separate processor companion chip. This integration reduces board area, lowers system power, and enables tighter coupling between software tasks and hardware accelerators. Within the broader hierarchy, the Arria 10 SX sits between Intel's Cyclone (low-cost) and Stratix (high-performance) SoC families, targeting mid- to high-bandwidth applications in communications, industrial vision, and defense. Key features of 10AS057H2F34E2SG include 570K logic elements, dual ARM Cortex-A9 cores with NEON media engine and single/double-precision FPU, up to 24 transceivers supporting protocols up to 14.1 Gbps (E2 speed grade), 156 full-precision 27x27 multipliers in DSP blocks, embedded hard memory controllers (DDR3/DDR4/LPDDR2/LPDDR3) in the HPS, and 1.5 GHz maximum HPS clock. The HPS includes ARM CoreSight debug, trace, and a rich peripheral set including USB, Gigabit Ethernet, SATA, and UART. Architecture-wise, the device uses a 20nm TSMC process for the FPGA fabric and a separate 28nm process for the HPS die, connected via a high-bandwidth coherent interconnect. The hard processor system runs independently and coherently with the FPGA, enabling software-driven control loops and hardware-accelerated compute kernels on a single die. Power management features include per-block clock gating, voltage scaling, and hot-socketing support. Typical applications include software-defined radio (SDR) baseband processing, industrial machine vision and video pipelines, radar and lidar pre-processing, medical imaging accelerators, and aerospace/defense signal processing. The combination of an application processor with FPGA fabric suits workloads where parallel hardware pipelines must be tightly orchestrated by an OS-hosted application. When designing with this device, plan power sequencing for the HPS and FPGA rails separately, allocate 1-2 A per transceiver for bias, and use the Quartus Prime software toolchain for synthesis, place-and-route, and HPS firmware integration. Ensure the FC-FBGA-1152 PCB footprint matches the 35x35 mm body and use microvia stack-ups to escape the 1.0 mm pitch BGA. This page synthesizes distributor pricing, same-package drop-in alternatives from the Arria 10 SX family, and practical design considerations not consolidated in the manufacturer datasheet.
10AS057H2F34I1HG - Arria 10 SX SoC FPGA 570K LE | Intel
The Intel (Altera) 10AS057H2F34I1HG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA integrating dual ARM Cortex-A9 MPCore hard processor cores with CoreSight debug technology alongside 570K programmable logic elements, fabricated on TSMC's 20 nm process. The device integrates 1.5 GHz ARM cores, a hardened memory controller, and rich peripheral IP into a single die, packaged in a 1152-ball FCBGA (F34, 35x35 mm). This combination targets applications requiring both hardware-accelerated DSP/parallel processing and a deterministic embedded CPU subsystem in one package. An SoC FPGA is a heterogeneous computing device that combines a microprocessor subsystem with programmable fabric on the same silicon die. The Arria 10 SX family specifically targets mid-range, mid-power designs needing hardened floating-point DSP blocks (up to 1.5 TFLOPS), 28 Gbps backplane-capable transceivers, and a tightly coupled ARM subsystem with cache coherent accelerators. Compared to discrete CPU + FPGA solutions, SoC FPGAs reduce board area, latency between the CPU and fabric, BOM cost, and power while simplifying security and boot management. Key features of the 10AS057H2F34I1HG include 570K logic elements, approximately 43 Mbits of embedded memory, 28 Gbps-capable transceivers, variable-precision DSP blocks with hardened IEEE 754 single- and double-precision floating point, and a 1.5 GHz dual-core ARM Cortex-A9 MPCore with CoreSight. External memory interfaces support DDR4, DDR3, QDR II+, and RLDRAM 3 with hardened PHY, reducing soft logic overhead. The F34 package variant exposes 492 user I/Os across 12 transceiver channels and is rated for industrial temperature operation. Architecturally, Arria 10 SX uses a heterogeneous Adaptive Logic Module (ALM) fabric with 8-input fracturable look-up tables (LUTs), MLAB memory, and 20 Kbit M20K memory blocks. Transceivers support data rates from 614 Mbps up to 28.05 Gbps with hardened PCIe Gen3 and Gen2 IP, 10 GbE, CPRI, and JESD204B/C. The HPS block contains dual Cortex-A9 cores with NEON SIMD, L1 caches, 512 KB shared L2, system MMU, and dedicated SDRAM controller with ECC. Typical applications include wireless baseband and radio unit processing, military radar and electronic warfare, high-performance industrial imaging and machine vision, medical imaging acceleration, test and measurement instrumentation, and broadcast video processing. The industrial temperature grade makes the device suitable for outdoor telecom, factory automation, and aerospace platforms where fanless conduction-cooled operation is required. When designing with the 10AS057H2F34I1HG, designers must follow Altera/Intel PCB layout guidelines for the F34 FCBGA to maintain signal integrity on DDR4 channels and high-speed serial links. Decoupling must include bulk, mid-range, and high-frequency capacitors placed close to the die, and the HPS boot configuration (eFuses / BSEL pins) must be finalized before layout finalization to avoid respins. This page synthesizes distributor pricing, parametric alternatives, and design considerations not found on the bare manufacturer product page, including a same-package variant matrix that helps engineers qualify drop-in replacements within the Arria 10 SX family without re-laying out the board.
10AS057H2F34I2LG - Arria 10 SX SoC FPGA 570K LE | Altera
The Altera (Intel) 10AS057H2F34I2LG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating dual ARM Cortex-A9 MPCore processors with CoreSight debug and an FPGA fabric of 570K logic elements in a 1152-pin FCBGA (35x35 mm) package. The device is fabricated on a 20nm process, operates at up to 1.5 GHz core frequency, and is rated industrial temperature grade with core voltage of 0.9 V. It combines an FPGA with a hardened application processor subsystem, enabling high-performance processing and programmable logic on a single die. An SoC FPGA is an integrated circuit that merges a microprocessor subsystem with programmable logic on the same silicon, belonging to the broader hierarchy of FPGA (Field Programmable Gate Array) -> programmable logic -> logic IC -> integrated circuit. SoC FPGAs are differentiated from traditional FPGAs by their ability to run operating systems (typically Linux) and execute deterministic control code in the processor subsystem while offloading high-throughput parallel data-path tasks to the FPGA fabric. This heterogeneous architecture is widely used in applications that demand both software flexibility and hardware-level parallelism. Key features include 570K logic elements, dual ARM Cortex-A9 MPCore with CoreSight, 1.5 GHz maximum core frequency, industrial temperature grade operation, 20nm TSMC process technology, and a large 1152-ball FCBGA package. The SoC variant (SX) supports ARM Cortex-A9 hard processor system integration, simplifying hardware/software co-design. The 10AS057H2F34I2LG uses Altera's (now Intel) Adaptive Logic Module (ALM) architecture with 20nm process technology, providing an optimal balance of logic capacity, DSP resources, and transceivers. The integrated ARM Cortex-A9 subsystem simplifies system design by reducing the need for external processors and enables low-latency processor-to-FPGA communication via the AXI bus. Typical applications include high-performance industrial imaging and machine vision, software defined radio (SDR), radar and electronic warfare signal processing, medical imaging systems, 5G baseband processing, and motor control. The combination of high logic density and embedded ARM cores makes it well-suited for compute-intensive embedded applications requiring deterministic real-time performance. When designing with this device, ensure your PCB layout accommodates the 35x35 mm FCBGA package with appropriate microvia stack-up and BGA fanout. Use Altera Quartus Prime software for design entry, synthesis, place-and-route, and HPS configuration. Plan thermal dissipation using the industrial-grade operating temperature rating. This page synthesizes distributor pricing from DigiKey/Mouser, drop-in same-package alternatives within the Arria 10 family, and practical design considerations not consolidated in the manufacturer datasheet itself.
10AS057H2F34I2SG - Arria 10 SX SoC FPGA, 570K LE, Dual A9 | Intel
The Intel (formerly Altera) 10AS057H2F34I2SG is a member of the Arria 10 SX family of System-on-Chip (SoC) FPGAs that integrates a hard dual-core ARM Cortex-A9 MPCore processor with CoreSight debug together with 570K programmable logic elements, manufactured on a 20 nm process and housed in a 1152-ball FCBGA package measuring 35x35 mm with flip-chip construction. An SoC FPGA is a heterogeneous computing device that combines general-purpose application processor cores with programmable fabric on a single die, enabling designers to partition workloads between hardware acceleration in the FPGA and software execution on the ARM cores for the lowest possible latency and power. The Arria 10 SX family targets mid-range applications that require both deterministic hardware processing and a rich software stack. Key specifications for the 10AS057H2F34I2SG include 570K logic elements, dual ARM Cortex-A9 cores with CoreSight, on-chip processor subsystems with peripherals, high-speed transceivers up to 1.5 GHz effective data rate, hardened memory controllers, and the 0.9 V core voltage typical of the 20 nm Arria 10 generation. The industrial temperature grade and -2 speed bin indicate balance between performance and timing margin for non-extended use cases. Architecturally, the device combines a hard processor system (HPS) with hardened peripherals such as Ethernet MAC, USB, SD/MMC, NAND flash controllers, and DDR memory controllers, all connected to the FPGA fabric via high-bandwidth bridges. The 20 nm process enables higher logic density and lower dynamic power than the previous 28 nm Arria V generation, while maintaining transceivers and DSP blocks suited to wireless infrastructure and video processing. Typical applications include wireless baseband processing, software-defined radio, radar signal processing, video broadcasting equipment, industrial machine vision, and secure communications. The Arria 10 SX is also widely used in test and measurement and medical imaging systems requiring simultaneous ARM-based control and FPGA-based data plane. When designing with this device, pay close attention to PCB layout for the FCBGA-1152 package, including microvia stack-up, signal-integrity simulation for 1.5 GHz transceivers, and proper decoupling. Quartus Prime is the primary tool chain; configuration via JTAG, AS, or fast passive parallel modes is supported. This page synthesizes distributor pricing, same-family Altera Arria 10 SX drop-in alternatives, and design context not present in the standalone datasheet, helping engineers quickly compare and source the part.