FPGA & CPLD
Products (6352)
10AS066H1F34I1HG - Arria 10 SX SoC FPGA, 660K LE | Intel
The Intel 10AS066H1F34I1HG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family, integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug IP alongside an FPGA fabric of approximately 660K logic elements. Built on Intel's 20 nm process, the device is housed in a 1152-ball Flip-Chip BGA package (FC-FBGA, 35 x 35 mm) and operates at core speeds up to 1.5 GHz for the HPS subsystem, providing a single-chip heterogeneous compute platform for embedded systems. An SoC FPGA is an integrated circuit that combines a programmable logic fabric (the FPGA side) with one or more hard processor cores (the HPS side) on the same die. Compared with a discrete FPGA + external MCU/MPU architecture, this integration eliminates inter-chip PCB traces between processor and fabric, reducing latency, board area, bill-of-materials cost, and power while enabling tight co-design of hardware accelerators with software. The Arria 10 SX family sits in Intel's mid-range, transceiver-rich segment, positioned between lower-cost Cyclone/MAX families and the high-end Stratix 10 family. Key features include approximately 660K logic elements, embedded hardened memory and DSP blocks, high-speed transceivers, and a 32-bit DDR3/DDR4 capable HPS memory controller. The 1152-ball FCBGA package exposes all transceiver, HPS, and general-purpose I/O signals and is suitable for high-channel-count designs. Industrial temperature grade (I) is indicated by the part number suffix. According to the Altera/Intel Arria 10 device overview, the SX variant pairs the HPS with the FPGA fabric optimized for DSP and transceiver-heavy workloads. Typical applications include high-performance digital signal processing for wireless baseband, radar and electronic warfare, professional video broadcast and image processing, industrial machine vision and motor control, and high-throughput data acquisition. The integrated ARM Cortex-A9 cores allow Linux/RTOS deployment alongside custom hardware accelerators in the FPGA fabric, removing the need for an external application processor. When designing with this device, plan power-rail sequencing between the HPS and FPGA domains and provide adequate thermal relief: the FCBGA package requires a heatsink or thermal interface material for sustained high-performance operation. Quartus Prime software (Standard or Pro edition, depending on device support) is required for synthesis, place-and-route, and HPS configuration.
10AS066H2F34E1HG - Arria 10 SX 660K SoC FPGA | Intel | 1152-FBGA
The Intel 10AS066H2F34E1HG is a high-density Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and 660K logic elements in a 1152-pin FC-FBGA (35x35 mm) package. It is built on TSMC's 20 nm process and runs the hard processor system at up to 1.5 GHz while the FPGA fabric supports transceivers up to 17.4 Gbps, delivering approximately 1.36 Gbps LVDS and 1.5 GHz HPS performance per the Altera/Intel product page. The device targets mid-to-high-end embedded compute workloads that require both software programmability and hardware acceleration on a single die. What is an SoC FPGA? A System-on-Chip FPGA combines a hard processor subsystem (typically ARM Cortex-A cores) with programmable logic on the same silicon die. The hard CPU subsystem executes an operating system (Linux, VxWorks, RTOS) while the FPGA fabric implements custom accelerators, high-speed I/O protocols, and DSP pipelines. This integration reduces board area, latency between CPU and fabric, and BOM cost compared with a discrete CPU-plus-FPGA two-chip solution. SoC FPGAs sit within the broader taxonomy of: SoC FPGA -> FPGA -> programmable logic -> semiconductor device -> integrated circuit. Key features include 492 user I/O pins, transceivers up to 17.4 Gbps, embedded hard memory controllers (DDR3/DDR4/LPDDR2), and 1.5 GHz dual-core ARM Cortex-A9 with NEON and floating-point unit. The 1152-FC-FBGA package provides ample signal escape for high-speed serial links and parallel memory interfaces while sustaining the 0.9 V core supply typical of 20 nm Arria 10 silicon. Designers also gain access to Intel Quartus Prime for synthesis, place-and-route, and HPS firmware development. The Arria 10 SX architecture unifies the HPS-to-Fabric AXI bus with hardened memory controllers and PCIe Gen3 hard IP. The hard CPU cores offload RTOS or Linux tasks, while the FPGA fabric implements latency-critical DSP for radar, baseband, or video pipelines. This partitioning yields lower power than two-chip solutions because HPS-to-Fabric data movement stays on-chip. Typical applications include 4K/8K video broadcast equipment, wireless baseband and backhaul, radar and electronic warfare signal processing, industrial machine vision, and medical imaging accelerators. Designers value the combination of a deterministic Linux-capable processor with parallel FPGA fabric for sensor fusion and protocol bridging. When designing with this device, prioritize PCB stack-up and power integrity early. The 1152-FCBGA at 35x35 mm requires HDI PCB fabrication with microvia stack-ups. Decouple each transceiver and HPS power rail with bulk + ceramic capacitance per the Intel Arria 10 pin connection guidelines to meet jitter and power-sequencing requirements. This page synthesizes distributor pricing from Heisener and Octopart, lists pin-compatible Arria 10 SX family variants from the XAIPART internal MPN list, and provides drop-in guidance not found in the bare manufacturer datasheet.
10AS066H2F34E2LG - Arria 10 SX SoC FPGA 660K LE | Intel | SoC
The Intel (formerly Altera) 10AS066H2F34E2LG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family, integrating a Dual ARM Cortex-A9 MPCore hard processor subsystem with CoreSight debug and trace alongside 660,000 logic elements of 20 nm programmable fabric in a 1152-ball FCBGA (35 x 35 mm) package. The H2 speed grade, F34 package code, E2 temperature tier and L (lead-free) suffix together identify this variant as a 1.5 GHz-class, -40C to +100C enhanced temperature part with RoHS-compliant Pb-free ball finish. What is an SoC FPGA? An SoC FPGA combines a general-purpose applications processor subsystem (typically ARM Cortex-A cores) with FPGA programmable logic on a single die, allowing hardware accelerators, custom peripherals and parallel datapaths to communicate with software running on the hard CPU over a high-bandwidth on-chip interconnect. The Arria 10 SX extends this concept with hardened floating-point DSP blocks, 12.5 Gbps transceivers and a hardened memory controller, positioning it as a programmable platform for wireless baseband, radar, broadcast and industrial imaging. Key features of the 10AS066H2F34E2LG include 660K logic elements, 492 user I/Os, hard ARM Cortex-A9 dual-core processor, integrated CoreSight debug, multi-port memory controller supporting DDR4/DDR3/LPDDR3 and 20 nm process technology. The H2 speed grade targets mid-to-high static timing performance while the F34 35x35 mm FCBGA package provides the densest ball array in the family. Integrated PCIe Gen2/3 hard IP blocks and up to 24 transceiver channels at 12.5 Gbps enable high-throughput serial connectivity without consuming FPGA fabric. Architecturally, the Arria 10 SX family uses TSMC's 20 nm SoC process and Intel's Adaptive Logic Module (ALM) building block, providing 8-input fracturable look-up tables, dedicated memory and DSP slices. The hard processor subsystem includes Level-1 caches, NEON media engine, ECC-protected L2 and a coherent interconnect to FPGA fabric. Power management relies on SmartVoltageID and per-bank voltage scaling to optimise dynamic power across the CPU and FPGA domains. Typical applications for the 10AS066H2F34E2LG include 4G/5G wireless baseband processing, military radar and electronic warfare, professional broadcast video and machine vision. The hardened ARM cores offload control-plane tasks while the FPGA fabric accelerates DSP-heavy physical-layer pipelines. Designers targeting lower logic capacity can choose 10AS022 or 10AS048 variants in the same F34 footprint for cost optimisation. When designing with this device, ensure proper sequencing of the multiple supply rails (core, I/O, transceiver, HPS) and follow Intel's pin-out guidelines for the FCBGA to avoid signal-integrity issues. The 35 x 35 mm package requires multi-layer PCB stack-up with controlled-impedance routing and matched-length differential pairs for transceiver channels. Consult the Arria 10 SX device datasheet for thermal management recommendations under sustained ARM CPU + FPGA workload. This page synthesises distributor pricing, parametric position within the Arria 10 SX family and PCB-layout considerations not found in the manufacturer datasheet alone. Engineers comparing 10AS066H2F34E2LG against Cyclone V SX, Zynq-7000 or Zynq UltraScale+ will find the comparison tables and drop-in alternatives below particularly useful for BOM consolidation.
10AS066H2F34E2SG - Arria 10 SX SoC FPGA 660K LE | Altera | Intel
The Altera (Intel) 10AS066H2F34E2SG is an Arria 10 SX SoC FPGA integrating 660,000 logic elements with a dual ARM Cortex-A9 MPCore hard processor system, fabricated on a 20nm process and housed in a 1152-pin F-BGA (FCBGA) package measuring 35x35 mm. The device delivers up to 1.5 GHz core frequency and supports 492 user I/O pins, combining programmable FPGA fabric with an embedded application-grade processor subsystem in a single heterogeneous compute device. A System-on-Chip (SoC) FPGA is an integrated circuit that merges a microprocessor subsystem (typically ARM Cortex-A cores with caches, MMU, and peripherals) with a programmable FPGA fabric on the same die. This integration places the SoC inside the broader taxonomy of embedded processors -> SoC -> SoC FPGA -> FPGA & CPLD -> programmable logic. The Arria 10 SX family specifically targets applications that require both high-throughput DSP/data-processing in the FPGA fabric and OS-driven control software running on hard ARM cores, eliminating the need for a separate processor companion chip and reducing board area, BOM count, and inter-chip interconnect latency. Key features of the 10AS066H2F34E2SG include 660K logic elements, embedded ARM Cortex-A9 dual-core MPCore with CoreSight debug, on-chip memory, dedicated DSP blocks, high-speed transceivers, and a 0.9V core supply voltage typical of the 20nm Arria 10 process. The H2 speed grade and E2 temperature grade (extended) make this part suitable for industrial and commercial environments, while the 1152-ball FCBGA package supports the high pin count required for parallel memory interfaces and multi-gigabit transceiver I/O. Architecturally, the Arria 10 SX combines a hardened Hard Processor System (HPS) block with the FPGA fabric through a coherent system interconnect. The HPS exposes Ethernet MAC, USB OTG, UART/USART, SPI, I2C, NAND/NOR flash controllers, and a DDR memory controller, while the FPGA fabric implements application-specific datapath logic and DSP functions. The 20nm process technology provides the performance-per-watt envelope that distinguishes Arria 10 from prior Stratix/Cyclone families. Typical applications include industrial machine vision, software-defined radio (SDR), radar signal processing, medical imaging, military/aerospace signal intelligence, and high-performance test and measurement instrumentation. Engineers choose the Arria 10 SX 660K variant when their design requires more logic capacity than Arria 10 GX 270K/480K parts but not the full 1.15M logic element density of higher-tier Arria 10 SX devices. Design considerations include signal-integrity work for the FCBGA ball-out, multi-rail power sequencing (the HPS and FPGA fabric often require independent ramp profiles), thermal management with the exposed-die FCBGA package, and supply of the Altera/Intel Quartus Prime design suite for HDL synthesis, place-and-route, and HPS firmware development. The 35x35 mm package demands controlled-impedance PCB stackup planning for transceiver channels. This page synthesizes distributor pricing, package diagrams, drop-in same-brand alternatives, and design notes not found in the standalone Altera datasheet, helping engineers evaluate sourcing options and plan board-level integration.
10AS066H2F34I1HG - Arria 10 SX SoC FPGA 660K LE | Intel
The Intel 10AS066H2F34I1HG is a high-density Arria 10 SX SoC FPGA integrating 660,000 logic elements, a dual-core ARM Cortex-A9 MPCore hard processor system (HPS) with CoreSight debug, and a 1.5 GHz FPGA fabric in a 1152-pin FC-FBGA (35x35 mm) package. Built on TSMC's 20nm process, it combines programmable logic with a fixed HPS delivering up to 1.5 GHz core performance for embedded compute workloads. A System on Chip (SoC) FPGA is a single silicon device that fuses a general-purpose processor subsystem with configurable FPGA fabric, allowing hardware accelerators to interface with software stacks through standard bus protocols. Within the broader taxonomy, an SoC FPGA belongs to programmable logic devices, which sit alongside ASICs, ASSPs, and microcontrollers in the embedded computing hierarchy. The Arria 10 SX family specifically targets mid-range applications that need ARM Cortex-A9 software compatibility combined with mid-bandwidth FPGA acceleration. Key features of the 10AS066H2F34I1HG include 660K logic elements, 492 user I/O pins, embedded transceivers supporting multi-gigabit serial protocols, on-chip memory blocks, and DSP blocks optimized for high-throughput signal processing. The HPS includes hardened peripherals such as USB, Gigabit Ethernet, UART, SPI, I2C, and SD/eMMC controllers, reducing external component count. Industrial temperature range (-40C to +100C) supports harsh-environment deployments. The Arria 10 architecture uses adaptive logic modules (ALMs), variable-precision DSP blocks, and 20-Gbps transceivers. Hardened memory controllers and PCIe Gen2/Gen3 IP blocks reduce soft logic overhead. The integrated HPS connects to FPGA fabric via AXI buses, allowing tight coupling between software tasks running on Cortex-A9 and hardware accelerators in fabric. Typical applications include 5G baseband processing, industrial motor control, software-defined radio (SDR), military radar and electronic warfare, broadcast video processing, medical imaging accelerators, and high-performance embedded computing platforms. The 1.5 GHz HPS frequency makes it suitable for protocol stack processing, while FPGA fabric handles DSP-intensive operations in parallel. Design considerations for the 10AS066H2F34I1HG include proper power supply sequencing, JTAG configuration infrastructure, thermal management for the 35x35 mm BGA package, and PCB layout for high-speed transceiver channels. Quartus Prime software is required for synthesis, place-and-route, and HPS firmware development.
10AS066H2F34I2LG - Arria 10 SX SoC FPGA, 660K LE | Intel
The Intel 10AS066H2F34I2LG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating approximately 660,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system in a 1152-pin FC-FBGA (35 mm x 35 mm) package. The device is fabricated on a 20 nm process, operates from a 0.9 V core supply, and supports logic densities and DSP blocks typical of mid-range Arria 10 SX variants. The 'F34' suffix denotes the 1152-ball flip-chip BGA, while 'I2' indicates the industrial temperature grade (-40 C to +100 C ambient) and '2' typically denotes transceiver/grade-speed bin 2. An SoC FPGA is a class of programmable logic device that combines a hard-application-processor subsystem (in this case dual ARM Cortex-A9 cores with CoreSight debug) with a programmable FPGA fabric on a single die. This integration lets designers run an operating system (typically Linux or VxWorks) for control-plane processing while implementing high-throughput datapath logic in the FPGA fabric. Compared with a discrete CPU+FPGA approach, an SoC FPGA reduces board area, lowers inter-chip latency, and simplifies power sequencing. Key features of the 10AS066H2F34I2LG include 660 K logic elements, embedded M20K memory blocks, variable-precision DSP blocks, up to 24 transceiver channels supporting multi-gigabit serial interfaces, and the hard ARM Cortex-A9 HPS with peripherals such as EMAC, USB, SATA, and DDR controllers. The Arria 10 architecture is engineered for mid-range applications that require a balance of logic density, transceiver bandwidth, and processor performance. Typical applications include wireless baseband processing, software-defined radio (SDR), industrial machine vision, high-performance test and measurement, and broadcast video processing. The integrated ARM Cortex-A9 subsystem makes the device especially attractive for applications where Linux-based control and FPGA-based DSP coexist on a single board. The industrial temperature grade supports factory-floor and outdoor deployments. When designing with this device, careful attention must be paid to PCB layout for the FC-FBGA package: 1 mm ball pitch requires microvia or via-in-pad technology, and the transceiver channels demand controlled-impedance routing and length matching. Power sequencing for the HPS and FPGA rails should follow the manufacturer-referenced POR (power-on-reset) circuit and reference designs. For new designs in 2026, note that Arria 10 is in extended-product support phase, so long-term availability should be confirmed with the manufacturer before committing to a high-volume production run.
10AS066H2F34I2SG - Arria 10 SX SoC FPGA 660K LE | Intel
The Intel 10AS066H2F34I2SG is a high-density Arria 10 SX SoC FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and 660,000 logic elements on Intel's 20nm process technology, housed in a 1152-ball flip-chip BGA (FC-FBGA) package measuring 35 mm x 35 mm. The device delivers up to 1.5 GHz core fabric performance and supports a core voltage range of 0.87 V to 0.93 V. It offers 492 user I/O pins and is qualified for industrial temperature operation from -40 °C to +100 °C. An SoC FPGA (System-on-Chip FPGA) is a class of programmable device that combines a hardened processor subsystem with the configurable logic fabric of an FPGA. The Arria 10 SX family extends this concept by integrating an ARM Cortex-A9 MPCore complex directly on-die, reducing bill-of-material count versus a discrete CPU+FPGA solution, while the FPGA fabric provides hardware-accelerated parallel processing for DSP, packet processing, and custom interfaces. This category sits at the intersection of microcontrollers, application processors, and programmable logic, targeting applications that need both deterministic real-time processing and flexible software. Key features of the 10AS066H2F34I2SG include integrated 1.5 GHz ARM Cortex-A9 dual-core HPS, 660K logic elements, embedded transceiver support for high-speed serial interfaces, dedicated memory controllers supporting DDR3/DDR4/LPDDR3, and partial reconfiguration capability. The F34 package variant provides 1152 ball connections in a 35x35 mm FC-FBGA, suitable for dense PCB designs. Architecturally, the device uses Intel's 20nm TSMC process with embedded hard IP blocks for memory controllers, PCIe Gen2/Gen3 hard IP, and 10 Gbps transceivers. The HPS includes ARM Cortex-A9 cores with NEON media engine, single/double-precision floating-point unit, and a dedicated level-2 cache subsystem. Typical applications include wireless baseband processing, broadcast video infrastructure, military radar signal processing, medical imaging, and industrial motor control. The industrial-grade temperature qualification makes it suitable for harsh-environment deployments. When designing with the 10AS066H2F34I2SG, ensure proper thermal management via thermal vias under the package, follow Intel's pinout guidelines for the 1152-ball BGA, and provision for JTAG configuration using Quartus Prime programmer support. This page synthesizes distributor pricing, drop-in alternatives from the same Arria 10 SX family, and practical design guidance not always surfaced in the manufacturer product brief.
10AS066H3F34E2LG - Arria 10 SX SoC FPGA, 660K LE, Dual A9 | Intel
The Intel 10AS066H3F34E2LG is a System-on-Chip FPGA from the Arria 10 SX family that integrates 660K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system plus CoreSight debug, manufactured on a 20nm process and packaged in a 1152-ball FCBGA measuring 35mm x 35mm. The device combines high-density programmable logic with a hardened application processor subsystem, enabling designers to partition workloads between software running on the Cortex-A9 cores and hardware accelerators implemented in the FPGA fabric at up to 1.5GHz core clock rates. An SoC FPGA (System-on-Chip FPGA) is a hybrid device that pairs a traditional field-programmable gate array fabric with one or more embedded hard processor cores, plus shared memory and I/O peripherals. The hypernym hierarchy is SoC FPGA -> FPGA -> programmable logic device -> logic IC -> semiconductor. This architecture reduces BOM count, lowers power versus a two-chip CPU+FPGA solution, and simplifies board layout because the processor-to-FPGA interconnect is implemented inside the package. The Arria 10 SX variant specifically targets mixed-signal signal processing, software-defined radio, and industrial imaging workloads. Key differentiating features include the dual-core ARM Cortex-A9 MPCore subsystem with NEON SIMD and single/double-precision floating-point unit, dedicated DDR3/DDR4 memory controllers with hard PHY, up to 24 transceivers supporting multi-gigabit serial protocols, and partial reconfiguration support for in-field logic updates. The 20nm process allows the 660K logic-element fabric to operate at high toggle rates while keeping dynamic power lower than the previous 28nm Arria V generation, and the hardened ARM subsystem removes the silicon cost and latency of a soft processor core. Typical applications include software-defined radio baseband processing, machine vision and industrial imaging pipelines, medical diagnostic imaging front-ends, high-performance industrial motor control, and secure military/aerospace signal processing where the combination of a deterministic FPGA fabric and a Linux-capable processor delivers both throughput and flexibility. The wide transceiver range and ARM ecosystem also make the part suitable for 5G fronthaul test equipment and high-speed data acquisition. When designing with the 10AS066H3F34E2LG, plan the PCB layout around the 35x35mm FCBGA with HDI stack-up, use Intel Quartus Prime for synthesis and place-and-route, and provision for the dual-configuration images typically required for fail-safe remote updates. Thermal management at full transceiver utilization must account for the 0.9V core rail and the device's full industrial operating range. Compared with discrete CPU+FPGA designs, this single-chip approach typically reduces PCB area by 40-60% and simplifies EMI compliance.
10AS066H3F34E2SG - Arria 10 SX SoC FPGA 660K LE | Altera
The Altera 10AS066H3F34E2SG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family, integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and trace logic alongside 660,000 programmable logic elements. The device is fabricated on a 20nm process and is supplied in a 1152-ball flip-chip BGA (FC-FBGA) package measuring 35x35 mm, with a core operating voltage of 0.9 V and logic capable of running up to 1.5 GHz in selected IP blocks. A SoC FPGA is a heterogeneous compute device that combines a general-purpose application processor subsystem (typically ARM Cortex-A cores plus peripherals, memory controllers and CoreSight debug fabric) with a programmable FPGA fabric on a single die. In the system hierarchy, SoC FPGAs sit between standard microcontrollers and discrete CPU-plus-FPGA two-chip solutions: they replace board-level partitioning with on-die coherent links, reducing latency, board area, BOM count and power compared with equivalent two-chip designs. Key features of the 10AS066H3F34E2SG include the dual ARM Cortex-A9 MPCore subsystem, integrated CoreSight debug, 660K logic elements, embedded hard memory controllers, transceivers rated for high-speed serial protocols, and the Arria 10 hardened floating-point DSP and variable-precision DSP blocks. The 1152-pin FC-FBGA (35x35 mm) package supports the high I/O count needed for memory interfaces, transceivers and parallel fabric I/O without resorting to package-on-package stacking. Architecturally, the device separates the HPS (Hard Processor System) domain and the FPGA fabric domain while allowing shared access to on-chip RAM and external DDR via hardened controllers. This lets designers allocate latency-critical control loops to the FPGA fabric and higher-level OS-driven tasks to the Cortex-A9 cores, communicating over the on-die system interconnect without external bus bottlenecks. Typical applications include wireless baseband processing, radar and beamforming front-ends, industrial machine vision and high-speed serial interface bridging. The combination of ARM cores with 660K LE of fabric is well matched to mid-range software-defined radio, medical imaging pre-processing and test-and-measurement equipment that needs deterministic real-time fabric plus a Linux-capable host. When designing with this part, pay close attention to PCB layout of the 35x35 mm FC-FBGA: matched-length routing for DDR, clean power planes for the 0.9 V core and adequate thermal relief are mandatory. Pin compatibility exists with other 10AS066 variants in the same F34 package, but the device is not drop-in compatible with non-SX Arria 10 family members because of the integrated HPS and its dedicated pin map. This page synthesizes current distributor stock, same-family pin-compatible alternatives and practical board-design guidance that is not bundled in the manufacturer datasheet, giving engineers a faster path from evaluation to production.
10AS066H3F34I2LG - 660K Logic Elements Arria 10 SX FPGA
Altera 10AS066H3F34I2LG is an Arria 10 SX system-on-chip FPGA integrating 660,000 logic elements, dual ARM Cortex-A9 MPCore processors with CoreSight technology, and a stated 1.5 GHz processor-related maximum frequency. The device is housed in a 1152-ball FCBGA package measuring 35 mm by 35 mm and provides 492 I/O according to verified distributor listings. Its combination of FPGA fabric and hard processor system targets embedded processing, high-throughput digital logic, and signal-processing designs. A system-on-chip FPGA combines programmable logic with fixed processor subsystems and associated peripherals on one semiconductor device. Within the hierarchy, this product is an Arria 10 SX FPGA, a field-programmable gate array, a programmable logic device, and a system-on-chip. The FPGA fabric supports customized datapaths, interfaces, and parallel processing, while the ARM-based processor subsystem supports software execution, control, and protocol management. The verified headline resources include 660,000 logic elements, a 1.5 GHz stated frequency, 492 I/O, 1152 package balls, and a 35 mm by 35 mm FCBGA body. The Arria 10 SX architecture is intended to bring processor-based control and FPGA-based acceleration into the same design. This can reduce the need for separate processing and logic devices while preserving hardware-level parallelism. The processor subsystem is identified as dual ARM Cortex-A9 MPCore with CoreSight. The FPGA fabric provides configurable resources for custom accelerators, bridge logic, image or communications pipelines, and real-time control. Exact memory capacity, transceiver count, operating temperature range, core voltage details beyond the available 0.9 V snippet, and speed grade interpretation are not established by the supplied excerpts and therefore require manufacturer-documentation verification before detailed implementation. Typical applications include industrial imaging and machine vision, communications infrastructure, test and measurement equipment, medical equipment, defense or aerospace signal processing, and high-performance embedded control. The 492 I/O listing makes the device relevant to systems requiring broad external connectivity, while FPGA logic can implement deterministic processing close to data sources. A critical design consideration is package and signal-integrity planning for the 1152-ball FCBGA. Designers must use the complete manufacturer pinout, recommended power sequencing, decoupling network, PCB stack-up, and thermal solution rather than relying on distributor summaries. Firmware and FPGA configuration compatibility must also be checked against the exact ordering code before board bring-up. This page combines verified manufacturer and distributor facts, transparent missing-data markers, application context, and drop-in-alternative screening. It does not infer undocumented pin, power, or performance details from similarly named Altera devices.
10AS066H3F34I2SG - Arria 10 SX SoC FPGA 660K LE | Intel | 1152-FBGA
The Intel (formerly Altera) 10AS066H3F34I2SG is a high-performance Arria 10 SX SoC FPGA integrating 660,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system, housed in a 1152-ball FCBGA (F34, 35x35 mm) industrial-grade package. It is fabricated on Intel's 20 nm process and combines programmable logic with a 1.5 GHz CoreSight-enabled SoC subsystem for embedded compute, DSP acceleration, and high-speed transceiver-based connectivity. An SoC FPGA is a single device that pairs a traditional field-programmable gate array fabric with one or more hard processor cores and dedicated peripherals, allowing hardware-accelerated DSP, memory, and I/O functions to run alongside deterministic software execution. The Arria 10 SX family specifically targets mid- to high-bandwidth applications such as wireless baseband, broadcast, military radar, and medical imaging, occupying the performance envelope between Cyclone V/10 and Stratix 10 devices in Intel's portfolio. Key features include 660K logic elements, integrated dual-core ARM Cortex-A9 MPCore with CoreSight debug, hard memory controllers, high-speed transceivers supporting multi-gigabit serial protocols, and the 1152-ball FCBGA (F34) package that exposes the full I/O and transceiver channel count. The 20 nm process enables a favorable power/performance ratio, and the industrial temperature grade (-40C to +100C) allows deployment in harsh-environment applications. Architecturally, the SoC combines the FPGA fabric with a coherent Cortex-A9 subsystem, enabling a unified address space and efficient data movement between accelerators implemented in programmable logic and software tasks running on the cores. The 1.5 GHz core frequency, hardened peripherals (EMAC, USB, NAND flash controller), and rich transceiver lane count make the device suitable for protocols such as PCIe Gen3, 10 Gigabit Ethernet, and serial RapidIO. Typical applications include wireless baseband processing in LTE/5G small cells, broadcast video encoders and transcoders, military radar and electronic-warfare signal chains, medical imaging pre-processing, and high-performance industrial vision systems. The HPS subsystem also makes the device useful as a control-plane plus data-plane platform where deterministic FPGA pipelines are coupled with a Linux- or RTOS-managed software stack. Designers should plan PCB layout around the 35x35 mm FCBGA ball array with matched-impedance routing for high-speed transceivers, a multi-rail decoupling strategy, and a thermal solution sized for industrial-grade operation. Quartus Prime is the design-entry and synthesis environment and should be configured for the SX device variant early in the flow.
10AS066H4F34E3LG - Arria 10 SX SoC FPGA 660K LE | Altera | Dual ARM Cortex-A9
The Altera (Intel) 10AS066H4F34E3LG is a dual ARM Cortex-A9 MPCore with CoreSight System-on-Chip FPGA from the Arria 10 SX family, integrating 660,000 logic elements with 1.5 GHz maximum core performance in a 1152-pin FCBGA (35x35 mm) package. Built on a 20 nm process, this heterogeneous SoC combines a hardened ARM Cortex-A9 dual-core hard processor subsystem with high-density FPGA fabric, supporting up to 1.5 GHz ARM operation and high-throughput DSP, memory, and transceiver interfaces. The 1152-FBGA flip-chip BGA delivers high I/O density suitable for high-bandwidth compute, broadcast, and wireless infrastructure designs. A System-on-Chip (SoC) FPGA is an integrated circuit that merges a microprocessor subsystem (typically ARM Cortex-A class) with programmable logic on a single die. The Arria 10 SX SoC sits in the broader taxonomy of programmable logic devices: it is an FPGA, then a SoC FPGA, then specifically a heterogeneous SoC with a hard ARM Cortex-A9 cluster, enabling deterministic real-time control alongside software programmability. Compared with a standalone FPGA plus external processor, an SoC FPGA reduces board area, latency, and BOM while preserving FPGA parallelism for hardware acceleration. Key features of this 10AS066H4F34E3LG device include 660K logic elements, embedded ARM Cortex-A9 MPCore with CoreSight debug, hard memory controllers for DDR3/DDR4/LPDDR2, multi-gigabit transceivers, variable-precision DSP blocks, and a 256 KB bottom-boot on-chip ROM. The 0.9 V core, 20 nm process technology enables high performance at moderate power. Configuration is via a bottom-boot scheme indicated by the 'BOTTOM' marking, supporting in-system updates and remote bitstream loading. The industrial temperature range and high-I/O count suit embedded compute platforms with extended environmental requirements. Typical applications include high-performance wireless baseband processing, military radar and secure communications, broadcast video processing, high-end test and measurement, and protocol bridging ASIC prototyping. The dual ARM Cortex-A9 cores handle control-plane and OS workloads while FPGA fabric accelerates DSP and packet processing, enabling a true hardware/software co-design architecture within one chip. When designing with this device, plan PCB layout for the 1152-ball FCBGA early - escape routing requires HDI microvia stack-up and signal-integrity-aware stack-up design. Thermal management should assume up to 30-40 W TDP depending on utilization, requiring a heatsink or thermal interface material over the top of the BGA. Use the Quartus Prime Arria 10 SoC device family support for compilation, pin planning, and HPS firmware development. This page synthesizes XAIPART pricing, drop-in alternatives drawn from the same Arria 10 SX family, and practical design notes not found in the manufacturer datasheet, supporting faster engineering decisions.
10AS066H4F34E3SG - Arria 10 SX SoC FPGA, 660K LE | Altera | 1152-FBGA
The Altera (Intel) 10AS066H4F34E3SG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating 660,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system and CoreSight debug fabric, housed in a 1152-pin Flip-Chip BGA (35x35 mm) package. The device is built on TSMC's 20 nm process, operates with a 0.9 V core supply, and supports up to 1.5 GHz HPS clock and FPGA fabric performance targeting mid-range high-throughput signal processing. A System-on-Chip FPGA (SoC FPGA) is a class of embedded integrated circuit that combines a general-purpose processor subsystem with programmable logic on the same die. The processor subsystem (often ARM Cortex-A) handles operating-system-driven tasks such as networking stacks, control planes, and user interfaces, while the FPGA fabric accelerates parallel data-path workloads. SoC FPGAs sit within the broader hierarchy of embedded processors, bridging the gap between standalone microcontrollers and discrete CPU + FPGA multi-chip solutions; they are widely used in wired/wireless communication, industrial vision, and military/aerospace signal processing. Key features of the 10AS066H4F34E3SG include 660K logic elements, hardware IEEE 754 single-precision floating-point multipliers, embedded 20 Gbps transceivers suitable for PCIe Gen3, 10 GbE, and CPRI links, and up to approximately 50 Mb of on-chip RAM. The HPS side includes dual Cortex-A9 cores with NEON media engine, 32 KB I-cache and 32 KB D-cache per core, 512 KB shared L2, and integrated DDR3/DDR4 controller with ECC. Hard memory controllers and PCI Express Gen3 endpoints reduce soft-logic utilization and improve timing closure. Typical applications include 4K video broadcast encoders, wireless baseband processing for LTE small cells, radar and electronic-warfare front-ends, medical imaging pipelines, and high-performance industrial inspection. The combination of ARM software ecosystem with FPGA-class DSP throughput is the primary architectural advantage over either a discrete CPU or a pure FPGA solution. When designing with the F34 (35x35 mm FCBGA) package, allocate dedicated ground and high-current power planes, follow Intel/Altera's pin-out guidelines for transceiver reference clocks, and validate the thermal envelope against the application-specific SoC power dissipation. Refer to the manufacturer datasheet for full transceiver characterization and HPS boot sequence timing.
10AS066H4F34I3LG - Arria 10 SX SoC FPGA 660K LE | Intel | Dual ARM Cortex-A9
The Intel 10AS066H4F34I3LG is a member of the Arria 10 SX family of System-on-Chip (SoC) FPGAs that integrates a dual-core ARM Cortex-A9 MPCore hard processor system with 660K programmable logic elements and 1.5 GHz maximum processor frequency, packaged in a 1152-ball Flip-Chip BGA (FCBGA) measuring 35x35 mm. Built on TSMC's 20 nm process, this industrial-temperature SoC FPGA combines hardened ARM cores with high-density programmable fabric, delivering up to 1.6 Gbps LVDS and 12.5 Gbps transceiver performance for mid-range signal-processing and embedded-computing workloads. An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that merges a general-purpose processor subsystem (hardened ASIC) with programmable FPGA fabric on a single die. Compared with traditional two-chip processor-plus-FPGA designs, SoC FPGAs reduce board area, lower power via tighter on-chip interconnect, simplify PCB layout, and shorten data-path latency between software and hardware accelerators. The Arria 10 SX family sits in Intel's mid-range line, between the lower-power Cyclone V/10 and the high-performance Stratix 10, and is widely used in industrial, automotive, and high-performance DSP applications. Key features of the 10AS066H4F34I3LG include 660,000 logic elements, approximately 5,510 Kbits of embedded memory, 396 18x19 multipliers, six phase-locked loops (PLLs), and dual ARM Cortex-A9 cores with CoreSight debug and trace. The package exposes 492 user I/Os and supports LVDS, LVCMOS, SSTL, and HSTL I/O standards. Integrated transceivers operate up to 12.5 Gbps, enabling PCIe Gen3 and 10 GbE connectivity. The part operates from a 0.9 V core supply with industrial temperature range and is lead-free / RoHS compliant. Typical applications include high-performance industrial image processing, software-defined radio (SDR) baseband, motor-control and robotics, machine-vision platforms, and military/aerospace signal processing. The hardened ARM cores run embedded Linux or RTOS while the FPGA fabric accelerates DSP, encryption, or custom peripherals. When designing with this part, plan the power tree carefully: 0.9 V core is supplied through a dedicated regulator; sequencing and ramp rates per the device handbook are mandatory. Use the Quartus Prime toolchain for synthesis, place-and-route, and HPS firmware development; the SoC EDS provides a GCC/Linaro cross-compile environment. This page synthesizes distributor pricing, drop-in alternative ordering part numbers within the same Arria 10 SX family, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the 10AS066H4F34I3LG for production designs.
10AS066H4F34I3SG - 660K LE Arria 10 SX SoC FPGA | Intel
The Intel 10AS066H4F34I3SG is a 660,000-logic-element Arria 10 SX SoC FPGA integrating dual ARM Cortex-A9 MPCore hard processors with CoreSight debug in a 1152-ball FCBGA package (35 mm x 35 mm). The device combines a high-performance 20 nm FPGA fabric with a hard processor system (HPS), 28 nm transceivers, and 1.5 GHz core clock capability. It is an Arria 10 SX family member in the H4 (high-performance, mid-density, enhanced DSP/transceiver) tier. A System on Chip (SoC) FPGA is a single silicon device that merges a programmable logic fabric with one or more hard processor cores, high-speed peripherals, and memory controllers. Within the broader taxonomy, this part sits in the chain SoC FPGA -> FPGA -> Programmable Logic Device (PLD) -> Integrated Circuit. The SoC architecture removes the need for a separate processor chip on the PCB, lowering BOM cost, shrinking board area, and reducing inter-chip latency while retaining full FPGA programmability. The 10AS066H4F34I3SG delivers 660K logic elements, embedded hardened memory controllers, 28 nm transceivers, fractional PLLs, and PCIe Gen2/Gen3-capable hardened IP blocks. Its hard ARM Cortex-A9 dual-core subsystem supports symmetric multiprocessing with NEON SIMD media engine, ECC L1/L2 caches, and an integrated CoreSight debug and trace fabric. The integrated HPS exposes EMAC, USB 2.0 OTG, NAND/NOR flash controllers, and DDR3/4 memory interfaces with hardware ECC for reliability. In system architecture the 10AS066H4F34I3SG is typically paired with external DDR3/DDR4 SDRAM, eMMC or NAND boot flash, and high-speed serial links to ASICs, FPGAs, or backplane transceivers. The 1152-FCBGA package enables the highest-pin-count configurations of the Arria 10 SX family, supporting up to 492 user I/Os at the I/O bank limit and multiple 10 Gbps transceiver channels routed from the FPGA side. The Arria 10 architecture is widely deployed in mid-range communications, video broadcast, industrial imaging, and defense applications. Typical applications include 4K video processing pipelines, 10G/40G Ethernet aggregation, baseband DSP for wireless backhaul, industrial machine vision, and SoC-based control plane processors. The combination of hardened ARM cores and high-density FPGA fabric makes the part a strong fit when deterministic hardware acceleration must coexist with a Linux-class application processor. When designing with this device, provide at least 0.9 V core and 1.8 V/2.5 V/3.3 V auxiliary rails, follow the Intel Arria 10 pin connection guidelines, and use the Quartus Prime design suite for synthesis, place-and-route, and HPS configuration. The 35 x 35 mm FCBGA requires ENIG surface finish, microvia or HDI PCB stack-up, and a high-current multi-rail power distribution network. This page synthesizes distributor pricing, drop-in same-family variants, and design considerations that go beyond what a single manufacturer datasheet delivers, helping sourcing engineers and PCB designers compare options without manually cross-checking every part number.
10AS066K1F35E1HG - 660K Logic Elements, 1.5 GHz SoC FPGA | Intel
The Intel 10AS066K1F35E1HG is a system-on-chip FPGA combining dual ARM Cortex-A9 MPCore processors with CoreSight technology, up to 660,000 logic elements, and a 1.5 GHz clock capability. It belongs to the Arria 10 SX family and is supplied in a 1152-pin FCFBGA package measuring 35 mm by 35 mm. The device integrates programmable logic and embedded processing resources for communications, industrial, cloud-computing, and Internet-of-Things systems that require both hardware acceleration and processor-based control. A system-on-chip FPGA is an integrated circuit that combines programmable logic with a processor subsystem. The programmable logic implements parallel datapaths, interface bridges, signal processing, and application-specific accelerators, while the ARM processors support operating systems, control software, networking stacks, and supervisory functions. Within the product hierarchy, this part is an FPGA, programmable logic device, SoC FPGA, system-on-chip, embedded integrated circuit, and semiconductor. The SoC architecture helps designers replace separate processor and FPGA devices with one programmable platform. The verified distributor data identifies 660,000 logic elements and 1.5 GHz operation as the principal functional figures. The device also exposes 396 FPGA I/O according to the comparison search result. Its 1152-ball package supports the high pin density required by the Arria 10 SX platform, while the 35 mm by 35 mm package format is intended for advanced BGA PCB assembly. The embedded dual-core ARM Cortex-A9 MPCore and CoreSight subsystem provide a practical basis for software-managed control of programmable hardware. The product is part of Intel's Arria 10 SX family, which is designed for systems that need an integrated combination of processor performance and programmable logic. The MPN indicates the 10AS066 device in an F35 package, with the final ordering characters identifying the specific device option. Because the supplied web results do not provide a detailed pin table, transceiver count, memory capacity, temperature grade, or power figures, those values are explicitly marked as unavailable rather than inferred. Engineers should consult the manufacturer documentation for device-specific implementation limits and board requirements. Typical applications include cloud-computing infrastructure, Internet-of-Things gateways, industrial automation controllers, communications equipment, and embedded systems requiring deterministic hardware acceleration alongside software control. The integrated ARM subsystem can manage protocols and system services while the FPGA fabric handles parallel processing, data conversion, or custom I/O. The 1.5 GHz capability and 660,000 logic elements make the device suitable for computationally substantial programmable designs when supported by appropriate power, thermal, signal-integrity, and PCB resources. The principal design trade-off is integration versus BGA implementation complexity. A 1152-pin FCFBGA device requires controlled-impedance routing, escape analysis, reliable power distribution, thermal planning, and manufacturer-recommended assembly processes. Designers should validate the complete device configuration, transceiver usage, memory interface requirements, and software support before release. This product page synthesizes the verified distributor specifications, official ordering-page information, package details, pricing-availability references, and explicit engineering uncertainties.
10AS066K1F35I1HG - Arria 10 SX SoC FPGA, 660K LE, 1.5GHz | Intel
The Intel 10AS066K1F35I1HG is a high-performance, low-power Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, paired with 660K logic elements of programmable fabric, housed in a 1152-ball FC-FBGA package measuring 35 mm x 35 mm. A SoC FPGA is an integrated circuit that combines a hard processor subsystem (HPS) with programmable FPGA fabric on a single die, enabling hardware/software co-design. The HPS executes control-plane and OS-level workloads while the FPGA fabric accelerates data-plane functions such as signal processing, packet inspection, or custom interfaces; this category sits within the broader embedded processing and programmable-logic taxonomy of field-programmable gate arrays and microprocessors. Key features of this device include 660K logic elements, embedded DSP blocks for fixed- and floating-point acceleration, hardened memory controllers, multi-gigabit transceivers, and a 1.5 GHz HPS core clock capability. The 1152-ball flip-chip BGA package exposes the maximum logic/memory/peripheral count of the 10AS066 die, targeting high-density applications where board space is less constrained than in smaller FBGA variants. The architecture combines a TSMC 20 nm process node with Intel's adaptive logic modules (ALMs), 20K (M20K) internal memory blocks, and variable-precision DSP blocks. The hard Cortex-A9 subsystem includes L1/L2 caches, NEON media engines, and a coherent system interconnect to the FPGA fabric for low-latency accelerator hand-off. Typical applications include 5G wireless baseband prototyping, radar and electronic-warfare signal processing, medical imaging accelerators, broadcast video processing, and high-throughput industrial inspection. The SX device class specifically targets mixed CPU-plus-FPGA workloads. When designing with this device, pay attention to PCB-level signal integrity on the 35 mm FC-BGA; the flip-chip interconnect demands matched-length routing, controlled impedance, and adequate thermal dissipation through the package substrate. Power planning should leverage the Arria 10 SmartVID feature to minimize dynamic dissipation across PVT corners. This page synthesizes distributor inventory, lifecycle and pricing data from DigiKey/Mouser/Octopart, same-family Arria 10 SX ordering options, and PCB-level design guidance not duplicated in the manufacturer datasheet.
10AS066K2F35E1HG - Arria 10 SX SoC FPGA, 660K LE, 1152-FBGA | Altera
The Altera 10AS066K2F35E1HG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family, integrating a dual-core ARM Cortex-A9 MPCore hard processor subsystem with CoreSight debug and trace alongside an FPGA fabric of 660K logic elements. Housed in a 1152-ball Flip-Chip BGA package measuring 35x35 mm, the device operates with a core speed grade of 2 and supports transceiver rates up to 17.4 Gbps. According to the distributor listing, this part is specified for the industrial temperature range with -1 speed grade and is supplied in the F35 package. An SoC FPGA is a heterogeneous computing device that combines a general-purpose processor subsystem with programmable logic on a single die, enabling hardware/software co-design for latency-critical and parallel workloads. Within the broader taxonomy, this places the Arria 10 SX under FPGA & CPLD > System on Chip > embedded programmable logic, sitting between traditional microcontrollers (software-only) and discrete FPGAs (logic-only). The Arria 10 family also pioneered 20 nm process technology in mid-range FPGAs, balancing transceiver bandwidth against power. Key features include 660K logic elements, 1.5 GHz maximum core clock for the HPS, embedded multi-gigabit transceivers supporting protocols such as PCIe Gen3, 10G Ethernet, and CPRI, plus hardened memory controllers, variable-precision DSP blocks, and floating-point hardware assist. Hardened floating-point blocks in the arithmetic logic deliver IEEE 754 single-precision performance critical for DSP pipelines, while dedicated PCI Express Gen3 hard IP blocks save fabric resources. Typical applications include wireless baseband processing, radar and electronic-warfare signal chains, high-speed serial protocol bridging, broadcast video processing, and medical imaging pre-processing. The -1 speed grade indicates industrial-grade placement, suitable for moderate thermal envelopes and mid-bandwidth SERDES. When designing with this SoC, ensure the PCB has a 1152-ball FCBGA land pattern with proper microvia stack-up for breakout routing, and provide decoupling per Intel/Altera's pin connection guidelines. For power sequencing, follow the Arria 10 SoC EMIF and HPS power-up sequence in the device family datasheet to avoid in-rush latch-up. This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, and practical SoC design notes not found in the standalone datasheet PDF.
10AS066K2F35E2LG - 660K LE Arria 10 SX SoC FPGA | Intel / Altera
The Intel / Altera 10AS066K2F35E2LG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family integrating a dual-core ARM Cortex-A9 MPCore hard processor system with a 660K logic-element FPGA fabric on a 20nm process, housed in a 1152-ball FCBGA package (35x35 mm). It combines a high-performance 1.5 GHz HPS with up to 1.866 Gbps LVDS and multi-gigabit transceivers, targeting embedded compute, motor control, and signal-processing applications. An SoC FPGA is a device that merges a general-purpose application processor (the Hard Processor System, or HPS) with programmable logic on a single die. The HPS executes an operating system and high-level control code while the FPGA fabric accelerates parallel algorithms such as DSP, packet processing, and motor control loops. Within the broader taxonomy, the 10AS066K2F35E2LG sits as: Arria 10 SX -> Arria 10 -> mid-range FPGA -> programmable logic -> semiconductor device. Key features include 660,000 logic elements, approximately 87 Mbits of embedded memory, 396 DSP blocks for fixed- and floating-point acceleration, 24 transceivers supporting up to 17.4 Gbps chip-to-chip operation, and hard memory controllers for DDR3/DDR4 with ECC. The HPS integrates dual ARM Cortex-A9 cores with CoreSight debug, NEON media engine, and a rich peripheral set including Gigabit Ethernet, USB, SATA, and PCIe Gen2. Architecturally, the Arria 10 SX uses Altera's Adaptive Logic Module (ALM) and 20nm TSMC process with partial reconfiguration support and a hard floating-point DSP chain. The integrated HPS-FPGA bridges use a coherent 128-bit AXI interconnect operating up to 533 MHz, enabling low-latency data movement between processors and logic. Typical applications include industrial motor control and drives, software-defined radio baseband, medical imaging pipelines, broadcast video processing, and military/aerospace embedded computing where a single board must host both control software and high-throughput parallel processing. When designing with this device, allocate sufficient PCB real estate for the 35x35 mm FCBGA and route at least 12 layers with microvia stack-ups; use the Quartus Prime Arria 10 device family support and the SoC EDS toolchain to bring up the Cortex-A9 subsystem. This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 SX family, and practical design notes not found in the standalone datasheet.
10AS066K2F35E2SG - Arria 10 SX SoC FPGA, 660K LE, 1152-FBGA | Intel
The Intel 10AS066K2F35E2SG is a 660,000-logic-element Arria 10 SX SoC FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, fabricated on a 20 nm process and supplied at a 0.9 V core voltage. The device is packaged in a 1152-ball flip-chip BGA (F35, 35 x 35 mm) and is qualified to operate with the -E2 speed grade (slower timing corner, industrial temperature range). The integrated HPS exposes USB OTG, UART/USART, SPI, I2C, EMAC and SD/eMMC controllers, while the FPGA fabric delivers up to 1.5 GHz DSP performance and 396 user I/O pins through the SX family architecture. An SoC FPGA is a single silicon device that combines a general-purpose applications processor subsystem with a programmable logic fabric. In the Arria 10 SX hierarchy, the ARM Cortex-A9 MPCore handles operating-system, networking and control-plane tasks, while the FPGA fabric accelerates latency-critical datapath, DSP, and interface-bridging functions. This heterogeneous architecture reduces bill-of-material count, simplifies board layout, and enables deterministic hardware/software partitioning that discrete processor-plus-FPGA designs cannot match. Compared with pure FPGAs, SoC FPGAs lower system power by offloading housekeeping tasks to the HPS, and compared with pure ASIC SoCs, they retain post-production flexibility for protocol updates and bug fixes. Key features of the 10AS066K2F35E2SG include 660 K logic elements, 20 nm process technology, embedded DSP blocks supporting fixed- and floating-point operations up to 1.5 GHz, dual Cortex-A9 MPCore CPUs with NEON media engine, integrated CoreSight debug and trace, on-chip hard memory controllers for DDR3/DDR4, and the high-density 1152-ball FC-FBGA package that supports the -E2 speed grade at industrial temperatures. The -E2 suffix denotes the slower of two industrial speed grades, trading peak Fmax for power savings and timing margin, which is preferred for production builds where thermal headroom matters more than absolute throughput. Technically, the device integrates heterogeneous resources including programmable logic fabric, M20K SRAM blocks, variable-precision DSP blocks, mixed-precision PHYs (transceivers up to 14.1 Gbps depending on variant), and the dual-core HPS. The 20 nm TSMC process and Intel's adaptive logic module (ALM) architecture deliver high logic utilization at moderate core voltages, while hard IP blocks accelerate memory and serial interface performance without consuming fabric. Typical applications include wireless baseband processing, military radar signal processing, industrial machine vision, broadcast video processing, and high-performance test and measurement equipment. The Arria 10 SX series is engineered for applications that demand deterministic real-time performance combined with the flexibility of a general-purpose OS running on the HPS. When designing with this part, ensure that the PCB supports the 35 x 35 mm FC-FBGA land pattern, with controlled-impedance routing for transceiver channels and matched-length DDR traces to the HPS memory controller. Power-rail sequencing must satisfy the 0.9 V core first, followed by transceiver and I/O rails, per Intel's PowerTree guidance. This page synthesizes distributor pricing from authorized channels, drop-in alternatives within the Arria 10 family, and practical PCB and thermal design notes not found in the standalone manufacturer datasheet.
10AS066K2F35I2LG - 660K LE, 1.5GHz SoC FPGA | Intel
Altera 10AS066K2F35I2LG is an Arria 10 SX system-on-chip FPGA integrating 660,000 logic elements, dual ARM Cortex-A9 MPCore processors with CoreSight technology, and a stated 1.5 GHz operating frequency in a 1152-ball FCBGA package measuring 35 mm by 35 mm. The device combines programmable logic with an embedded processing subsystem, making it suitable for applications that require both high-density hardware acceleration and software control. Its package is identified as 1152-FBGA, FC, also described in the provided source material as FCBGA or BBGA, with a square ball-grid-array terminal format. An FPGA is a field-programmable gate array, an integrated circuit whose logic functions are configured after manufacturing. A system-on-chip FPGA extends that concept by combining programmable logic, processor cores, memory interfaces, and peripheral resources on one device. Within the semiconductor hierarchy, this part belongs to the Arria 10 SX family of SoC FPGAs, bridging programmable logic and embedded processing. The 660,000 logic elements provide configurable digital resources, while the dual ARM Cortex-A9 MPCore subsystem provides a processor-based execution path. CoreSight technology supports system-level debug and tracing functions for development and diagnostics. The key verified characteristics are 660,000 logic elements, a 1.5 GHz stated frequency, and a 1152-ball FCBGA package with 35 mm by 35 mm dimensions. The part is specified for an industrial temperature grade in the provided cross-reference data. The device is also described as a semiconductor programmable logic device using 20 nm technology, with a stated 0.9 V operating parameter in one source result. These values should be verified against the manufacturer ordering documentation before establishing board-level power, timing, or thermal limits. At the system level, the combination of configurable logic and ARM Cortex-A9 cores supports partitioned implementations: deterministic datapaths, protocol handling, and control logic can be placed in the FPGA fabric, while operating-system, management, or application functions can run on the processors. This architecture is useful when a design needs hardware parallelism without giving up software-based configuration, monitoring, or network processing. The large 1152-ball package also indicates a high-density device requiring controlled PCB routing, power distribution, signal integrity, and thermal analysis. Typical applications include industrial automation, medical equipment, communications infrastructure, test and measurement systems, and embedded vision or signal-processing platforms. The industrial temperature designation makes the part relevant to environments where operating conditions may extend beyond commercial ranges. A specific application must confirm the device's supported configuration, memory interface, transceiver resources, processor peripherals, and power requirements from the official documentation. The provided search data does not enumerate those detailed electrical characteristics, so they remain marked as data needed rather than inferred. Designers should plan the PCB around the 1152-ball package and obtain the complete manufacturer pinout, package land pattern, power-supply sequence, clocking requirements, and thermal recommendations before layout. A 35 mm square package can create substantial routing and manufacturing complexity, so escape routing, via topology, decoupling placement, and differential-pair geometry should be reviewed early. Programmable logic should also be treated as a configurable system component: configuration storage, reset behavior, clock distribution, and boundary-scan access affect production programming and board bring-up. This data set combines verified distributor identification, the manufacturer ordering page, and targeted cross-reference results. It emphasizes exact package and device facts, while marking unverified electrical limits and replacement compatibility as data needed rather than presenting assumptions as specifications.
10AS066K2F35I2SG - Arria 10 SX SoC FPGA, 660K LE | Intel
The Intel 10AS066K2F35I2SG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family integrating a dual-core ARM Cortex-A9 MPCore hard processor system with a high-density FPGA fabric. The device features 660K logic elements, a maximum core clock of 1.5 GHz, and is housed in a 1152-ball FCBGA package measuring 35 mm x 35 mm. The 'I' suffix designates the industrial temperature grade (-40C to +100C), and the '2' speed grade targets mid-tier performance for mixed signal-chain and embedded designs. An SoC FPGA combines a hard processor subsystem with programmable logic on a single die, enabling deterministic real-time control alongside flexible hardware acceleration. The Arria 10 SX sits in the SoC hierarchy below Stratix 10 and above Cyclone V, balancing mid-range FPGA fabric density with a Cortex-A9 application processor cluster suitable for Linux and real-time operating system workloads. The hard ARM cores offload host-side tasks from the FPGA fabric, eliminating soft-processor overhead in embedded platforms. Key features include 660K logic elements, embedded DSP blocks for fixed- and floating-point acceleration, embedded transceivers for high-speed serial I/O, and shared coherent memory between the HPS and FPGA fabric. The Arria 10 SX device family supports LPDDR4, DDR4, and DDR3 external memory interfaces through hardened controllers, and integrates CoreSight debug infrastructure for non-intrusive processor trace. The 20 nm process node balances static power and performance for industrial-grade deployments. Typical applications include industrial motor control, video broadcast processing, military radar front-end pre-processing, and 5G baseband prototyping. The integrated Cortex-A9 subsystem runs Linux, VxWorks, or RTOS workloads while the FPGA fabric handles deterministic DSP pipelines, custom peripherals, and high-bandwidth memory interfaces. When designing with this device, plan the HPS-to-FPGA bridge topology early - AXI bus widths and arbitration policies impact sustained throughput. Pin assignments must respect the dedicated HPS ball locations, which differ from the general-purpose FPGA I/O bank rules. This page synthesizes distributor pricing, drop-in same-package Arria 10 SX variants, and practical design notes for the 10AS066K2F35I2SG not found in the standalone manufacturer datasheet.
10AS066K3F35E2LG - Arria 10 SX 660K LE SoC FPGA 1152-FBGA | Intel
The Intel (formerly Altera) 10AS066K3F35E2LG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family, integrating 660,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system in a 1152-ball Flip-Chip BGA (35 mm x 35 mm) package. The device is fabricated on TSMC's 20 nm process and operates at a core voltage of 0.9 V with -E2 speed grade timing. An SoC FPGA is a single-chip integration of a microprocessor subsystem and an FPGA fabric. The Arria 10 SX series is Intel's mid-range SoC FPGA, positioned between the lower-density Cyclone V SoC and the high-performance Stratix 10 SoC in the broader programmable logic device hierarchy. The integrated ARM Cortex-A9 subsystem runs up to 1.5 GHz with CoreSight debug, while the FPGA fabric provides hardware acceleration for DSP, packet processing, and custom interfaces - enabling lower BOM cost, lower power, and tighter deterministic latency than a discrete CPU + FPGA two-chip solution. Key features include 660K logic elements, 256 KB of embedded memory (per search-engine snippet), hard DDR3/DDR4 memory controllers, transceivers, and 396 user I/Os. The device targets industrial temperature grade and supports configuration via fast passive parallel (FPP) and active serial (AS) schemes. The F35 package designation indicates a 35 mm x 35 mm FCBGA with 1152 balls. Typical applications include wireless baseband processing, military radar, medical imaging, industrial machine vision, and high-performance test & measurement. The HPS (Hard Processor System) makes it well suited to applications requiring both Linux/real-time OS execution and parallel hardware processing, such as software-defined radio (SDR) and protocol-aware network appliances. The -E2 speed grade balances timing margin and power; -E1 (fastest) and -E3 (lowest power) variants are also offered in this device family. The 'K3' code denotes logic density 660 and 3 (transceiver/feature) tier within Arria 10 SX.
10AS066K3F35E2SG - Arria 10 SX SoC FPGA 660K LE | Altera
The Altera (Intel) 10AS066K3F35E2SG is an Arria 10 SX System-on-Chip (SoC) FPGA that integrates a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, alongside 660K logic elements of programmable fabric, in a 1152-ball FCBGA package (35x35 mm). The device targets high-performance embedded compute and signal-processing applications where deterministic real-time processing and parallel hardware acceleration are both required on a single die. An SoC FPGA is a heterogeneous computing device that combines a general-purpose applications processor subsystem (typically ARM Cortex-A) with a programmable FPGA fabric, allowing software tasks to run on the OS side while latency-critical DSP, packet, or sensor pipelines are accelerated in hardware. SoC FPGAs sit in the broader taxonomy of embedded processors (microcontroller -> microprocessor -> SoC -> SoC FPGA) and are commonly used in industrial machine vision, software-defined radio, radar, and high-end test & measurement equipment. Key features of the 10AS066K3F35E2SG include 660K logic elements, embedded DSP blocks and M20K memory blocks, dual ARM Cortex-A9 cores with NEON media engine, CoreSight debug and trace, a wide range of high-speed transceivers supporting multi-gigabit serial protocols, and hard memory controllers for DDR3/DDR4. The SX variant emphasizes the embedded processor subsystem, distinguishing it from the GX (transceiver-focused) and GT (highest transceiver rate) family members. The integrated HPS enables Linux, VxWorks, or RTOS deployment while the FPGA fabric handles custom accelerators. The device is fabricated on a 20 nm process and provides a rich set of hardened IP blocks (PCIe Gen2/Gen3 controllers, Ethernet MACs, memory controllers) that offload functions from soft logic, improving both performance-per-watt and design compile time. Designers typically use Quartus Prime for synthesis, place-and-route, and HPS software toolchain configuration, with Platform Designer for system integration. Typical applications include industrial motor control and robotics, software-defined radio baseband, medical imaging accelerators, military/aerospace signal intelligence, broadcast video processing, and high-throughput test instrumentation. The dual ARM cores are well suited to network-stack termination, supervisory control, and user-interface hosting while the FPGA fabric runs deterministic data-path workloads. When designing with this part, ensure the PCB layout supports the 1152-ball FCBGA escape routing (typically microvia/HDI stack-up), provide clean power rails for the HPS and FPGA core/supply domains (often requiring PMBus-controlled point-of-load regulators), and plan for thermal management: at full transceiver and DSP utilization, FCBGA junction temperatures can exceed 100 C without adequate airflow or heatsink attachment to the exposed die. This page synthesizes distributor pricing, drop-in alternative ordering codes, and engineering design considerations not consolidated on the manufacturer product page alone.