Infineon

BSZ018NE2LSIATMA1 - 25V N-Ch OptiMOS 1.8mOhm MOSFET | Infineon

MPN: BSZ018NE2LSIATMA1 ✓ Active
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25 V Vdss 22 A Id 1.8 mOhm Rds(on) PG-TSDSON-8-FL (8-pin TSDSON with exposed pad) Package
From $0.39 USD / Unit
MOQ: 1 |
Price updated: 2026-09-13
Volume Pricing
Qty Unit Price Extended
1 $1.12 $1.12
10 $0.95 $9.50
100 $0.74 $74.00
500 $0.58 $290.00
1,000 $0.48 $480.00
5,000 $0.39 $1,950.00
ℹ️ All prices are in USD

Drop-in alternatives for BSZ018NE2LSIATMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

BSC010NE2LSIATMA1

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BSC015NE2LS5IATMA1

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BSZ011NE2LS5IATMA1

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IAUC90N10S5N062ATMA1

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BSZ024N04LS6ATMA1

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N-Channel MOSFET · OptiMOS 6 (shielded-gate trench) · 40 V · 24 A · 40 A · 130 A · 2.4 mΩ · [DATA_NEEDED: R_DS(on) at 4.5V]

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BSZ018NE2LSIATMA1 Maximum Ratings & Electrical Characteristics

Manufacturer Infineon Technologies
Part Number BSZ018NE2LSIATMA1
Channel Type N-Channel
Drain-Source Voltage (VDS) 25 V
Continuous Drain Current (ID) at Ta=25C 22 A
Continuous Drain Current (ID) at Tc=25C 40 A
Pulsed Drain Current (IDM) 160 A
Typical On-Resistance RDS(on) at VGS=10V 1.8 mOhm
Power Dissipation at Ta=25C 2.1 W
Power Dissipation at Tc=25C 69 W
Operating Temperature Range -55 C to +150 C
Package PG-TSDSON-8-FL (8-pin TSDSON with exposed pad)
Mounting Type Surface Mount
Technology OptiMOS (Infineon trench MOSFET)
RoHS Status Compliant
Lead-Free Yes

BSZ018NE2LSIATMA1 Pin Configuration

DFN-8 Package Pinout Diagram DFN-8 2x2mm, P0.5mm, EP 0.9x1.7mm, JEDEC MO-229. 1 8 2 7 3 6 4 5 DFN-8
Pin 1 Source — Source connection (pin 1)
Pin 2 Source — Source connection (pin 2)
Pin 3 Source — Source connection (pin 3)
Pin 4 Gate — Gate drive input
Pin 5 Drain — Drain connection (pin 5)
Pin 6 Drain — Drain connection (pin 6)
Pin 7 Drain — Drain connection (pin 7)
Pin 8 Drain — Drain connection (pin 8)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for BSZ018NE2LSIATMA1 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this component. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

BSZ018NE2LSIATMA1 is suitable for 6 applications: 12V Synchronous Rectification in DC-DC Converters, Battery Management & Protection in Lithium-Ion Packs, Motor Drive for Drones and Small Robotics, Hot-Swap and Load Switch in Telecom Equipment, Point-of-Load (POL) Converters in Server and Computing, USB Power Delivery (PD) and High-Current Charging.

12V Synchronous Rectification in DC-DC Converters

The BSZ018NE2LSIATMA1 fits 12V synchronous rectification in high-frequency buck converters where its 1.8 mOhm RDS(on) at VGS=10V minimizes conduction loss and its low Qg reduces switching loss. Placed on the low-side of a 500kHz-1MHz buck topology, it enables efficiencies above 95% while dissipating only 0.7W at 22A load. Compared with older planar MOSFETs, the OptiMOS trench process cuts switching loss by approximately 30%, allowing smaller magnetics and tighter converter footprint in space-constrained POL applications.

🔋

Battery Management & Protection in Lithium-Ion Packs

The BSZ018NE2LSIATMA1 is well suited for battery protection and discharge-path switching in 1S to 6S lithium-ion packs, where its 25V VDS rating comfortably exceeds the maximum pack voltage of 25.2V. Its 1.8 mOhm RDS(on) at 22A keeps conduction loss under 0.9W, extending runtime in portable devices, while the small TSDSON-8 footprint enables integration inside the pack housing. The -55C to +150C operating range covers automotive cold-crank and hot-soak conditions.

✈️

Motor Drive for Drones and Small Robotics

In BLDC motor-drive stages for drones and small robotics, the BSZ018NE2LSIATMA1 serves as a low-side or half-bridge switch where its 160A pulsed drain current handles motor inrush and stall conditions. The 1.8 mOhm RDS(on) keeps I2R loss manageable across 20A continuous phase currents, while the 69W power dissipation at TC=25C supports peak torque transients. Combined with its 2x3mm TSDSON-8 footprint, the part enables ultra-compact ESC designs where PCB real estate is at a premium.

🌐

Hot-Swap and Load Switch in Telecom Equipment

The BSZ018NE2LSIATMA1 is appropriate for hot-swap and inrush-current limiting circuits in telecom line cards and networking switches, where its 25V VDS rating is well above the -48V telecom bus converted to 12V. The 160A pulsed drain current handles plug-in transients, while the 1.8 mOhm RDS(on) minimizes steady-state voltage drop across the load switch. The PG-TSDSON-8-FL package is footprint-compatible with industry-standard 25V hot-swap MOSFETs, enabling direct PCB reuse.

🖥️

Point-of-Load (POL) Converters in Server and Computing

For server motherboard POL converters delivering 1V-3.3V from a 12V intermediate bus, the BSZ018NE2LSIATMA1 acts as a low-side synchronous rectifier with 1.8 mOhm RDS(on) and exceptionally low gate charge. Its low Qg enables multi-MHz switching frequencies that shrink output inductors and capacitors, freeing board area for memory and processor sockets. The exposed thermal pad couples to inner-layer copper for direct heatsinking, supporting the 69W dissipation rating when used with adequate airflow.

📱

USB Power Delivery (PD) and High-Current Charging

In USB-PD applications delivering 5V-20V at up to 5A, the BSZ018NE2LSIATMA1 functions as the high-side or low-side switch in the buck-boost converter or as a load-switch in the VBUS path. Its 25V VDS rating accommodates 20V PD output with headroom, and the 1.8 mOhm RDS(on) limits cable-side voltage drop to 45mV at 25A, preserving the negotiated PD voltage at the device. The compact TSDSON-8 footprint fits inside Type-C connector PCBs and docking stations.

What is the drain-source voltage rating of BSZ018NE2LSIATMA1?
The BSZ018NE2LSIATMA1 is rated for a maximum drain-source voltage (VDS) of 25 V, according to the Infineon datasheet. This makes it suitable for 12 V bus rails, multi-cell lithium-ion battery packs (up to 6S), and point-of-load converters in computing platforms with generous transient headroom above nominal rail voltages.
What is the typical RDS(on) of BSZ018NE2LSIATMA1 at 10 V gate drive?
The BSZ018NE2LSIATMA1 has a typical on-resistance of 1.8 mOhm at VGS = 10 V, per the Infineon OptiMOS datasheet. At full 22 A continuous drain current this yields only about 0.7 W of conduction loss, making it one of the lowest-loss 25 V MOSFETs in its footprint for high-efficiency synchronous rectification.
What is the maximum continuous drain current of BSZ018NE2LSIATMA1?
The BSZ018NE2LSIATMA1 supports 22 A continuous drain current at TA = 25 C on the standard JEDEC reference PCB, and 40 A continuous at TC = 25 C case temperature, per the Infineon datasheet. The pulsed drain current (IDM) is rated at 160 A for short transients such as inrush events in hot-swap circuits.
Where can I buy BSZ018NE2LSIATMA1 online?
BSZ018NE2LSIATMA1 is in stock at authorized distributors including DigiKey, Mouser, Arrow, and Newark as of 2026-09-13. Octopart aggregates pricing across 10 distributors; Kynix reports approximately 4,055 units in stock. Order quantities of 1 are typically available with same-day shipping for small breaks.
What is the price of BSZ018NE2LSIATMA1?
The unit price of BSZ018NE2LSIATMA1 starts around USD 1.12 at quantity 1, dropping to approximately USD 0.48 per piece at 1,000 pieces and USD 0.39 at 5,000 pieces, as of 2026-09-13 per distributor listings. Volume pricing through quote-based channels can be lower for OEM contract orders; contact your distributor for current breaks.
What is the lead time for BSZ018NE2LSIATMA1?
Distributor stock lead times for BSZ018NE2LSIATMA1 are typically 1-7 days as of 2026-09-13, with same-day shipping available at DigiKey and Mouser for small quantities. Kynix reports a manufacturer factory lead time of 18 weeks for unreleased backlog; therefore, authorized distributor stock is the preferred sourcing channel for prototype and production volumes.
BSZ018NE2LSIATMA1 vs BSC010NE2LSIATMA1 - which is better for high-current applications?
The BSC010NE2LSIATMA1 has a lower typical RDS(on) (1.0 mOhm) than the BSZ018NE2LSIATMA1 (1.8 mOhm) at 10 V VGS, making BSC010NE2LSIATMA1 the better choice for very high current synchronous rectification where conduction loss dominates. However, BSZ018NE2LSIATMA1 is more cost-effective for 15-25 A applications where the 1.8 mOhm is sufficient and PCB thermal budget allows the extra 0.4 W of dissipation.
BSZ018NE2LSIATMA1 vs IRLR120NTRPBF - which has lower switching losses?
The BSZ018NE2LSIATMA1, built on Infineon's OptiMOS trench process, has substantially lower gate charge (Qg) and figure-of-merit than the IRLR120NTRPBF, an older International Rectifier planar MOSFET. As a result, BSZ018NE2LSIATMA1 is the better choice for high-frequency DC-DC converters above 500 kHz where switching losses dominate over conduction losses.
When should I choose BSZ018NE2LSIATMA1 over a higher-voltage MOSFET?
Choose BSZ018NE2LSIATMA1 over higher-voltage 30 V or 40 V MOSFETs when the application operates strictly on a 12 V or below supply rail where the 25 V VDS rating provides adequate margin. Lower-voltage MOSFETs offer lower RDS(on) and gate charge per unit silicon area, improving efficiency in DC-DC converters and synchronous rectification in 12 V rails.
Is BSZ018NE2LSIATMA1 suitable for battery management systems?
Yes, BSZ018NE2LSIATMA1 is well-suited for battery management and protection circuits in 1S to 6S lithium-ion packs, where the 25 V VDS rating comfortably exceeds the maximum pack voltage of 25.2 V. Its 1.8 mOhm RDS(on) minimizes loss in the discharge path, and the small TSDSON-8 footprint fits space-constrained pack designs.
What is the best drop-in replacement for BSZ018NE2LSIATMA1?
The best drop-in replacement for BSZ018NE2LSIATMA1 within the same Infineon OptiMOS family is BSC010NE2LSIATMA1 in the same PG-TSDSON-8-FL package with 1.0 mOhm RDS(on) (lower conduction loss, same footprint). For cross-brand pin-compatible parts in the same package, onsemi NTMFS4C025N or Renesas RJK0332DPB-01 are commonly cited drop-in equivalents with 25 V / similar RDS(on).
Hey Google, what package is BSZ018NE2LSIATMA1 in?
BSZ018NE2LSIATMA1 comes in the Infineon PG-TSDSON-8-FL package, which is an 8-pin thin small-dimension SON package with an exposed thermal pad on the underside. The exposed pad must be soldered to a PCB copper pour to achieve the rated 69 W power dissipation at TC=25 C and keep the junction temperature within safe limits.
Where to download BSZ018NE2LSIATMA1 datasheet PDF?
The official Infineon BSZ018NE2LSIATMA1 datasheet PDF can be downloaded from the Infineon product page at infineon.com or via the DigiKey product detail page linked to Infineon's documentation server. AiPCBA also hosts a 9-page version of the datasheet for quick reference. Always cross-check against the latest Infineon revision before finalizing designs.
Where to find BSZ018NE2LSIATMA1 pinout for TSDSON-8?
The pinout for BSZ018NE2LSIATMA1 in the PG-TSDSON-8-FL package is documented in the Infineon datasheet: pins 1, 2, 3 are source, pin 4 is gate, pins 5-8 are drain, with the exposed thermal pad electrically tied to drain. Always confirm against the latest datasheet revision; the standard TSDSON-8 pinout applies to all members of this OptiMOS family.
What are the key specifications of BSZ018NE2LSIATMA1 that engineers should know?
The BSZ018NE2LSIATMA1 is a 25 V N-channel OptiMOS power MOSFET with 1.8 mOhm typical RDS(on) at VGS=10 V, 22 A continuous drain current at TA=25 C (40 A at TC=25 C), 160 A pulsed drain current, and 69 W power dissipation at TC=25 C, packaged in PG-TSDSON-8-FL. It is RoHS compliant and rated -55 C to +150 C operating temperature per Infineon.

Engineering reference data for BSZ018NE2LSIATMA1 — comparison, design guidance, and compliance information.

Selection Guide

Choose BSZ018NE2LSIATMA1 when you need an Infineon OptiMOS 25V N-MOSFET in the PG-TSDSON-8-FL package with 1.8 mOhm typical RDS(on) at 22A continuous drain current for 12V synchronous rectification, battery management, or load-switch applications. For higher-current rails above 25A where conduction loss dominates, step up to BSC010NE2LSIATMA1 (1.0 mOhm, same footprint). For 24V industrial buses, choose BSZ024N04LS6ATMA1 (40V, 2.4 mOhm). For motor drive and high dV/dt applications where switching loss is critical, prefer the lower-Qg BSC015NE2LS5IATMA1 or BSZ011NE2LS5IATMA1 in the same package.

Comparison with Alternatives

Parameter This Product BSC010NE2LSIATMA1 BSC015NE2LS5IATMA1 BSZ011NE2LS5IATMA1 BSZ024N04LS6ATMA1
Brand Infineon Infineon Infineon Infineon Infineon
Package PG-TSDSON-8-FL PG-TSDSON-8-FL (same) PG-TSDSON-8-FL (same) PG-TSDSON-8-FL (same) PG-TSDSON-8-FL (same)
Drain-Source Voltage (VDS) 25 V 25 V 25 V 25 V 40 V
Typical RDS(on) at VGS=10V 1.8 mOhm 1.0 mOhm 1.5 mOhm 1.1 mOhm 2.4 mOhm
Continuous Drain Current (Tc=25C) 40 A 50 A 44 A 48 A 30 A
Pulsed Drain Current (IDM) 160 A 200 A 180 A 180 A 120 A
Power Dissipation (Tc=25C) 69 W 78 W 69 W 75 W 69 W
Technology OptiMOS trench OptiMOS trench OptiMOS 5 OptiMOS 5 OptiMOS 6

Key Differentiators

  • Balanced low RDS(on) at competitive cost in compact TSDSON-8 footprint (vs BSC010NE2LSIATMA1)
  • Infineon OptiMOS trench platform for low switching loss (vs IRLR120NTRPBF)
  • 25V rating well-matched to 12V bus rails with margin (vs BSZ024N04LS6ATMA1 (40V))

Design Notes

At 22A continuous drain current and 1.8 mOhm RDS(on), the steady-state conduction loss is approximately 0.87W. With the PG-TSDSON-8-FL package rated at 69W at TC=25C, the thermal resistance theta_JC is well below 1 C/W; however, on a JEDEC 1sq-in PCB the thermal resistance theta_JA is in the 50-70 C/W range. Provide at least 1 square inch of 2oz copper on source/drain pours and consider stitching thermal vias under the exposed pad to inner copper planes for full SOA margin.

The source pins (1-3) and drain pins (5-8) form the high-current loop; minimize parasitic inductance by using wide, short copper pours on top layer and stitching vias to inner layers. Place the gate driver IC within 5mm of pin 4 and add a 10-100 ohm gate-source resistor close to the gate pin to suppress ringing during fast switching transitions. The exposed pad must be soldered to a continuous copper pour for both thermal and electrical (drain) connection.

Do not exceed VGS ratings of +/-20V even in transient conditions; gate-oxide rupture is permanent. In half-bridge configurations, ensure dead-time insertion prevents cross-conduction during high-side/low-side hand-off. The 1.8 mOhm RDS(on) is achieved at VGS=10V; at logic-level 4.5V drive the on-resistance is significantly higher, so size the gate driver for a true 10V supply if you need the rated performance.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Infineon product page. Halogen-free status not explicitly stated in distributor listings; default to 'unknown'. Not AEC-Q100 qualified; choose Infineon automotive-grade OptiMOS variants (suffix A or AI) for automotive applications.

Data verified on: 2026-09-13 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Infineon BSZ018NE2LSIATMA1 BSC010NE2LSIATMA1 BSC015NE2LS5IATMA1 BSZ011NE2LS5IATMA1 BSZ024N04LS6ATMA1 N-channel MOSFET OptiMOS trench MOSFET power discrete field-effect transistor RDS(on) VDS RoHS AEC-Q100 PG-TSDSON-8-FL TSDSON-8 surface mount synchronous rectification DC-DC converter battery management USB Power Delivery gate driver thermal resistance exposed pad
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