BSZ130N03LSGATMA1 - 30V OptiMOS N-FET, 35A, PG-TSDSON-8 | Infineon
MPN: BSZ130N03LSGATMA1 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.95 | $0.95 |
| 10 | $0.78 | $7.80 |
| 100 | $0.65 | $65.00 |
| 500 | $0.55 | $275.00 |
| 1,000 | $0.48 | $480.00 |
| 5,000 | $0.41 | $2,050.00 |
Drop-in alternatives for BSZ130N03LSGATMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →BSZ130N03LSGATMA1 Maximum Ratings & Electrical Characteristics
| Manufacturer | Infineon Technologies |
| Part Family | OptiMOS 25V / 30V |
| Polarity / Channel Type | N-Channel Enhancement Mode |
| Drain-Source Voltage (Vds) | 30 V |
| Continuous Drain Current (Ta=25 C) | 10 A |
| Continuous Drain Current (Tc=25 C) | 35 A |
| On-State Resistance Rds(on) max @ Vgs=10V | 13 mOhm |
| Gate Threshold Voltage Vgs(th) typ @ Vds=Vgs, Id=250uA | 2.2 V |
| Power Dissipation (Ta) | 2.1 W |
| Power Dissipation (Tc) | 25 W |
| Package | PG-TSDSON-8 (8-PowerTDFN, 5x6 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -55 C to +150 C (junction) |
| MSL Level | 1 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| Qualification | Industrial / Commercial (non-automotive) |
BSZ130N03LSGATMA1 Pin Configuration
| Pin 1 | Source — Source terminal (connected to bottom exposed pad via lead frame) |
| Pin 2 | Source — Source terminal |
| Pin 3 | Source — Source terminal |
| Pin 4 | Gate — Gate drive input |
| Pin 5 | Kelvin Source — Kelvin-source connection for clean gate drive return |
| Pin 6 | Source — Source terminal |
| Pin 7 | Source — Source terminal |
| Pin 8 | Source — Source terminal |
Safe Operating Area (DC, Tcase=25 C)
Typical Applications
BSZ130N03LSGATMA1 is suitable for 6 applications: 12V Point-of-Load (POL) Buck Converter, Server Voltage Regulator Module (VRM), Telecom and Datacom DC-DC Brick, Synchronous Rectification in 12V Buck Stages, Load Switch and Hot-Swap Controller, Battery Protection and Power Path Management.
12V Point-of-Load (POL) Buck Converter
The BSZ130N03LSGATMA1 fits 12 V point-of-load buck converters in server and telecom boards where a 30 V MOSFET switch delivers 5 A to 25 A at 300 kHz to 1 MHz switching frequency. Its 13 mOhm Rds(on) at 10 V Vgs keeps low-side conduction loss low, while the low Qg of the OptiMOS 30V family minimizes switching loss per cycle, yielding typical efficiencies of 92-95% at full load. Placed as the low-side synchronous FET in a multi-phase VR topology, it complements a similar 30 V control FET on the high side. The PG-TSDSON-8 footprint supports 1-2 oz copper pours with thermal vias for the 2-3 W dissipation typical at 12V/3.3V conversion. Designers should keep the gate-drive loop under 5 mm2 to avoid parasitic ringing on Vgs.
Recommended
Server Voltage Regulator Module (VRM)
The BSZ130N03LSGATMA1 is well suited to multi-phase VRM power stages for server CPU and ASIC rails, where each phase carries 20-30 A from a 12 V bus down to 0.8-1.8 V core voltages. Its 30 V Vds rating provides headroom for 12 V nominal with inductive spike transients, and the 35 A continuous Tc rating matches per-phase current in 4-6 phase designs. In the synchronous-rectifier position, the 13 mOhm Rds(on) and low Qoss reduce both conduction and reverse-recovery loss at the 300-500 kHz switching frequency typical of modern VRMs. The PG-TSDSON-8 package is pin-compatible with the broader OptiMOS family, allowing easy migration to higher-performance parts when thermal or efficiency targets tighten.
Recommended
Telecom and Datacom DC-DC Brick
The BSZ130N03LSGATMA1 is an effective low-side switch or synchronous rectifier in isolated DC-DC brick converters for telecom and datacom systems operating from a 48 V input bus stepped down to 12 V intermediate rails. The 30 V Vds rating suits the 12 V secondary-side switching stage, where the FET carries 10-25 A continuous at 100-300 kHz. The Infineon OptiMOS 30V silicon provides excellent avalanche ruggedness for the inductive kick encountered during transformer reset. Combined with the low thermal resistance of the PG-TSDSON-8 package bonded to a 1-2 oz copper pour, the device sustains reliable operation in fan-cooled telecom chassis at 70 C ambient.
Recommended
Synchronous Rectification in 12V Buck Stages
The BSZ130N03LSGATMA1 functions as the low-side synchronous rectifier in 12 V to 5 V / 3.3 V buck converters where replacing a Schottky diode with a MOSFET reduces rectification loss by 60-80% at full load. The 13 mOhm Rds(on) at 10 V Vgs results in a forward drop of only 0.13 V at 10 A, compared to a Schottky's 0.4-0.5 V drop, cutting secondary-side conduction loss by 3-4 W at 10 A. The OptiMOS family's low Qrr further prevents reverse-recovery-induced dead-time loss, improving light-load efficiency by 2-4% at 1-5 A loads. The PG-TSDSON-8 footprint enables direct PCB migration from diode-rectified designs in compact POL modules.
Recommended
Load Switch and Hot-Swap Controller
The BSZ130N03LSGATMA1 is suitable for 12 V load-switch and hot-swap applications where the FET carries 5-15 A steady-state and must tolerate inrush transients during plug-in events. The 30 V Vds rating provides safe margin for 12 V nominal with inductive ringing, while the 35 A Tc rating supports brief inrush peaks. Driven from a hot-swap controller (such as the BTS462TATMA1 or ITS4200SMEPHUMA1) with dV/dt control, the BSZ130N03LSGATMA1 keeps steady-state voltage drop below 200 mV at 15 A. The PG-TSDSON-8 footprint enables compact switch cards for blade servers and network switches where board area is at a premium.
Recommended
Battery Protection and Power Path Management
The BSZ130N03LSGATMA1 is applicable as the low-side protection FET in 1S-3S lithium battery packs and USB-PD power-path switches, where its 30 V Vds rating comfortably exceeds 12 V system rails and its low Rds(on) minimises path loss. In a typical 3-cell battery pack delivering 10 A continuous, the 13 mOhm Rds(on) at 10 V Vgs dissipates only 1.3 W at full load, keeping the FET within the 2.1 W Ta rating on standard 1-oz copper. The Infineon OptiMOS silicon also provides robust avalanche energy for short-circuit events, allowing time for the upstream fuse or controller to respond. The PG-TSDSON-8 footprint suits compact battery-management boards where every millimeter counts.
Recommended
Recommended Products Summary
Engineering reference data for BSZ130N03LSGATMA1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | BSZ110N08NS5ATMA1 | BSZ096N10LS5ATMA1 | BSC010NE2LSIATMA1 | BSC023N08NS5SCATMA1 | BSC019N04NSGATMA1 | BSC076N06NS3GATMA1 |
|---|---|---|---|---|---|---|---|
| Package | PG-TSDSON-8 | PG-TSDSON-8 - same | PG-TSDSON-8 - same | PG-TSDSON-8 - same | PG-TSDSON-8 - same | PG-TSDSON-8 - same | PG-TSDSON-8 - same |
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Drain-Source Voltage (Vds) | 30 V | 80 V | 100 V | 25 V | 80 V | 40 V | 60 V |
| Rds(on) max @ 10 V Vgs | 13 mOhm | 11 mOhm | 9.6 mOhm | 1.05 mOhm | 2.3 mOhm | 1.9 mOhm | 7.6 mOhm |
| Continuous Drain Current (Tc=25 C) | 35 A | 40 A | 40 A | 100 A | 100 A | 100 A | 100 A |
| Gate Threshold (typ) | 2.2 V | 3.3 V | 3.5 V | 1.7 V | 2.8 V | 2.0 V | 3.0 V |
| Power Dissipation (Tc) | 25 W | 30 W | 32 W | 50 W | 45 W | 50 W | 50 W |
| OptiMOS Family | 25V / 30V | 80V | 100V | 25V | 80V | 40V | 60V |
| Q1 Automotive Grade | No (industrial) | No | No | No | No | No | No |
| Approx. Unit Price @ 1k (USD) | 0.48 | 0.62 | 0.71 | 1.10 | 0.95 | 1.05 | 0.85 |
Key Differentiators
- Lowest Rds(on) in 30 V OptiMOS standard family at this price point (vs BSC010NE2LSIATMA1)
- Higher Vds headroom than 25V OptiMOS parts in same footprint (vs BSC010NE2LSIATMA1)
- Lower cost than higher-voltage alternatives in same footprint (vs BSZ110N08NS5ATMA1)
- Better suited to 30 V designs than 40 V alternatives (vs BSC019N04NSGATMA1)
Design Notes
Estimated: at Id=15 A continuous on a 1-oz copper pad of 25 mm x 25 mm with a 4x4 thermal-via array (0.3 mm drill), the junction-to-ambient thermal resistance is approximately 40-50 C/W. This yields a junction temperature rise of 25-37 C above 70 C ambient, keeping Tj under 110 C and well within the 150 C rating. For 30 A continuous operation, expand the copper area to at least 50 mm x 50 mm or use forced-air cooling. The PG-TSDSON-8 bottom-exposed pad is the primary thermal path - it MUST be soldered to the PCB copper to achieve the rated thermal performance.
Route the gate-drive loop (gate-driver output to gate pin 4 and back through Kelvin-source pin 5) in a tight area under 5 mm x 5 mm to minimise parasitic inductance. Use a 10-22 ohm gate resistor to damp ringing. Place a 10 kohm gate-source pull-down resistor directly at the FET pins to prevent unintended turn-on during power-up. The PG-TSDSON-8 footprint requires a 0.2 mm solder mask expansion and 0.1 mm paste stencil aperture reduction on the bottom drain pad to prevent solder voiding during reflow.
For multi-phase VRM layouts, place the high-side and low-side FETs in a 'source-down' loop arrangement where the AC node (switch-node) copper minimises loop inductance to under 1 nH. Use a 4-layer PCB with the second layer as a continuous ground plane; place the switch-node copper on the top and third layers to create a wide, low-impedance return path. Decoupling capacitors (1 uF + 0.1 uF ceramic) must sit within 2 mm of the FET drain and source pins to suppress voltage spikes during switching transitions. Avoid routing signal traces under the FET exposed pad to prevent leakage coupling.
Do not exceed Vds=30 V; even brief overshoots during switching transients can avalanche the part. Verify Vgs never exceeds +/-20 V (the absolute maximum rating), even during ESD events - add a 10 kohm gate-source resistor if the gate is left floating. Do not rely on the 35 A Tc rating for continuous operation in a small package; this rating assumes an infinite heatsink at 25 C. For switching applications above 500 kHz, derate Rds(on) by 1.5x to account for skin-effect and proximity losses in the source bond wires. Do not parallel BSZ130N03LSGATMA1 parts without gate-source resistors on each device to suppress parasitic oscillations.
At switching frequencies above 500 kHz, the PG-TSDSON-8 source-bond-wire inductance (~1 nH) and drain-pad capacitance (~200 pF) form a resonant tank that can ring at 100-200 MHz. Add a small RC snubber (4.7 ohm + 1 nF) across the drain-source of the low-side FET to damp this ringing. Use a gate-drive IC with 1-2 A peak sink/source current and place it within 5 mm of the FET to maintain a tight gate-drive loop. For EMI compliance (CISPR 22 Class B), the input-bus decoupling capacitance must be increased by 30-50% relative to a Schottky-rectified design due to the higher di/dt of the OptiMOS switch.
Compliance Information
RoHS compliant and lead-free per Infineon product declaration. Not AEC-Q100 qualified - this is an industrial/commercial grade MOSFET. For automotive applications, an AEC-Q100 qualified Q1 variant would be required (separate part number).
