EPM9560GI280-15 - 560-Macrocell MAX 9000 EPLD, 280-Pin PGA | Intel
MPN: EPM9560GI280-15 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $165 | $165.00 |
| 10 | $148.5 | $1,485.00 |
| 100 | $132 | $13,200.00 |
| 250 | $121 | $30,250.00 |
| 500 | $110 | $55,000.00 |
Drop-in alternatives for EPM9560GI280-15 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM9560GC280-15
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View Datasheet →EPM9560GC280-15N
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View Datasheet →EPM9560GC280-20
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View Datasheet →EPM9560GC280-20N
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View Datasheet →EPM9560GI280-15 Maximum Ratings & Electrical Characteristics
| Device Family | MAX 9000 |
| Architecture | CMOS EEPROM, third-generation Multiple Array MatriX (MAX) |
| Macrocells | 560 |
| Flip-Flops | 772 |
| User I/Os | 216 |
| Dedicated Inputs | 12 |
| Logic Elements / Gates | 12,000 usable gates |
| Internal Frequency (fMAX) | 145 MHz |
| Propagation Delay (tPD) | 11.4 ns |
| Clock-to-Output (tCO) | 16.6 ns |
| Supply Voltage (VCCINT/VCCIO) | 4.5 V to 5.5 V (3.3 V or 5 V I/O) |
| In-System Programmability | 5.0-V ISP via JTAG |
| Package | 280-pin PGA (ceramic, metal-sealed cofired) |
| Operating Temperature | -40 °C to 85 °C (industrial) |
| Process Technology | CMOS EEPROM |
| Moisture Sensitivity Level (MSL) | MSL-3 (168 hours) |
EPM9560GI280-15 280-pin pga (ceramic, metal-sealed cofired) Pin Configuration Guide
Complete pinout information for EPM9560GI280-15 (280-pin pga (ceramic, metal-sealed cofired) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM9560GI280-15.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM9560GI280-15 is suitable for 6 applications: Industrial Glue Logic Replacement, Telecom Backplane Bus Bridging, Legacy Avionics Display Controllers, PCI Bus Interface and Arbitration, Medical Imaging Signal Routing, Test & Measurement Equipment Front-End.
Industrial Glue Logic Replacement
The EPM9560GI280-15 fits industrial glue-logic replacement because it consolidates 560 macrocells (12,000 usable gates) into a single ceramic PGA package, eliminating the need for multiple discrete PAL/GAL devices on legacy backplanes. Its deterministic 11.4 ns pin-to-pin propagation delay and 145 MHz internal frequency handle address decoding, bus arbitration, and interrupt priority logic at full system clock without FPGA-like routing variability. Industrial -40 °C to 85 °C operation with 5-V tolerant I/O allows direct interfacing with TTL/CMOS legacy peripherals, simplifying board bring-up.
Recommended
Telecom Backplane Bus Bridging
The EPM9560GI280-15 is ideal for telecom backplane bus bridging where 216 user I/Os can absorb multiple parallel buses (PCI, H.110, local CPU bus) into a single chip with deterministic timing. Its 772 flip-flops implement deep FIFO buffers and protocol state machines, while 11.4 ns tPD ensures protocol timing margins are met on T1/E1 and ISDN-PRI backplanes. 5-V ISP allows field upgrades without removing the line card, critical for deployed telecom infrastructure.
Recommended
Legacy Avionics Display Controllers
The EPM9560GI280-15 suits legacy avionics display controllers that require ceramic PGA packages (hermetic, high-reliability), 5-V I/O tolerance for MIL-STD-1553 or ARINC 429 interfaces, and instant-on from EEPROM for fail-safe startup. Its 560 macrocells and 772 flip-flops support character generators, lookup tables, and timing generation for CRT/LCD avionics displays, while the ceramic PGA package withstands vibration and thermal cycling of -40 °C to 85 °C cockpit environments.
Recommended
PCI Bus Interface and Arbitration
The EPM9560GI280-15 is well-suited for PCI bus interface and arbitration logic at 33 MHz because its 11.4 ns tPD and 145 MHz fMAX meet PCI 2.2 timing with comfortable margin. The 560 macrocells implement full target/initiator state machines, parity generation, and bus arbiter logic, while 216 user I/Os support multiple PCI slots or PCI-X bridges on legacy server motherboards. 5-V tolerant I/O is compatible with 5-V PCI signaling used in industrial SBCs.
Recommended
Medical Imaging Signal Routing
The EPM9560GI280-15 fits medical imaging signal routing (ultrasound, X-ray) where deterministic timing of 11.4 ns tPD synchronizes analog front-end multiplexer control with ADC sampling clocks. Its 560 macrocells implement beamforming logic for ultrasound transducers, while 5-V tolerant I/O interfaces to legacy medical-instrumentation front ends. Ceramic PGA packaging provides the long-term reliability and solder-joint integrity required for FDA/IEC 60601 medical-device compliance.
Recommended
Test & Measurement Equipment Front-End
The EPM9560GI280-15 supports test-and-measurement equipment front ends that require dense logic, fast deterministic timing, and 5-V I/O for legacy instrument buses (GPIB/IEEE-488, VXI). Its 560 macrocells implement trigger sequencing, time-base generation, and front-panel switching matrices, while 772 flip-flops support deep counters for frequency counters and time-interval analyzers. Ceramic PGA reliability and -40 to 85 °C operation suit benchtop and field-portable instrument use.
Recommended
Recommended Products Summary
Engineering reference data for EPM9560GI280-15 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM9560GC280-15 | EPM9560GC280-15N | EPM9560GC280-20 | EPM9560GC280-20N | EPM9560ARC240-10 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 280-pin PGA (ceramic) | 280-pin PGA (ceramic) - same | 280-pin PGA (ceramic) - same | 280-pin PGA (ceramic) - same | 280-pin PGA (ceramic) - same | 240-pin PGA (ceramic) - smaller |
| Macrocells | 560 | 560 | 560 | 560 | 560 | 560 |
| Speed Grade (tPD / fMAX) | -15 (11.4 ns / 145 MHz) | -15 (11.4 ns / 145 MHz) | -15 (11.4 ns / 145 MHz) | -20 (16.6 ns / 118 MHz) | -20 (16.6 ns / 118 MHz) | -10 (10 ns / 151 MHz) |
| Operating Temperature | -40 °C to 85 °C (Industrial) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial Pb-free) | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C (Commercial Pb-free) | -40 °C to 85 °C (Industrial) |
| User I/Os | 216 | 216 | 216 | 216 | 216 | [DATA_NEEDED] |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| In-System Programmability | 5.0-V ISP | 5.0-V ISP | 5.0-V ISP | 5.0-V ISP | 5.0-V ISP | 5.0-V ISP |
Key Differentiators
- Largest density MAX 9000 device with full 216 I/O (vs EPM9480RC240-15)
- Industrial temperature range vs commercial-grade variants (vs EPM9560GC280-15)
- Mid-tier speed grade balances performance and power (vs EPM9560GC280-20)
- Largest 280-pin ceramic PGA I/O exposure (vs EPM9560ABC356-10)
Design Notes
The 280-pin ceramic PGA package has high thermal mass but limited PCB-side heat dissipation. Estimated: at internal frequency 145 MHz with all 560 macrocells active (typical toggle rate 25%), power dissipation is approximately 1.8 W (per MAX 9000 datasheet Icc spec). Mount the device in a PGA socket with thermal vias under the socket to a copper pour, or use a heatsink for industrial-temperature operation above 70 °C ambient. Add 100 lfm airflow for closed-enclosure deployments.
The 280-pin PGA requires a through-hole socket; do not solder directly to the PCB because field-replacement of NRND parts is expected. Use a machined-pin PGA socket (e.g. 3M/Textool) for reliable insertion cycles; specify a socket with low-inductance (<5 nH) lead frame to preserve signal integrity on clocks >100 MHz. Decouple each VCC/VCCIO pin pair with 0.1 µF X7R ceramic placed within 5 mm of the pin via; add bulk 47 µF tantalum or polymer capacitor near the socket.
Do not assume new design-ins are supported; the MAX 9000 family is NRND and Quartus II legacy support is limited. For new designs, evaluate MAX II EPM570, MAX V 5M240ZT, or MAX 10 10M08 series which are active, lower power, and supported by current Quartus Prime toolchains. When upgrading an existing design, verify that the new toolchain supports the legacy MAX 9000 BSDL/POF files for JTAG ISP and boundary-scan testing.
Use JTAG pins (TCK, TMS, TDI, TDO, TRST) as dedicated I/O - do not share with user logic - so boundary-scan ISP works without board re-routing. Place a 4.7 kΩ pull-up on TCK and a 1 kΩ pull-up on TMS/TRST per IEEE 1149.1. Route JTAG signals to a 10-pin header in a star topology to avoid stub reflections; add series 33 Ω damping resistors on long JTAG traces (>50 mm).
Compliance Information
CERAMIC PGA packages were historically exempt from RoHS lead-free conversion due to high-temp solder constraints; the 'N' suffix denotes Pb-free commercial variants where available (e.g. EPM9560GC280-15N). Reach and halogen status were not specified in distributor data; set to 'unknown'.
