Infineon

IRFB3207ZPBF - 75V N-Channel HEXFET MOSFET 170A | Infineon

MPN: IRFB3207ZPBF βœ“ Active
In Stock Ships in 1-3 business days
75 V Vdss 120 A Id 3.3 mOhm Rds(on) TO-220AB (3-lead through-hole) Package
From $1.62 USD / Unit
MOQ: 1 |
Price updated: 2026-09-14
Volume Pricing
Qty Unit Price Extended
1 $2.85 $2.85
10 $2.55 $25.50
100 $2.18 $218.00
500 $1.89 $945.00
1,000 $1.62 $1,620.00
ℹ️ All prices are in USD

IRFB3207ZPBF Overview

The Infineon IRFB3207ZPBF is a 75V N-channel HEXFET power MOSFET in a TO-220AB through-hole package, rated for 170A silicon-limited drain current and 300W continuous power dissipation at 25C case temperature. It uses Infineon's advanced HEXFET technology to deliver an ultra-low typical on-resistance of 3.3 mOhm at VGS=10V and an avalanche-rated ruggedness suitable for hard-switched topologies. The Z-suffix variant improves gate, avalanche, and dynamic dV/dt ruggedness versus the IRFB3207PBF baseline, making it a preferred choice in harsh switching environments.

A HEXFET power MOSFET is a specific Infineon (formerly International Rectifier) family of N-channel enhancement-mode power MOSFETs built on a hex-cellular planar process. Within the broader taxonomy, a HEXFET sits under N-channel MOSFET -> MOSFET -> discrete power semiconductor -> power management discrete. The TO-220AB package, with its three through-hole leads and metal tab acting as the drain, has been the industry workhorse for medium-current through-hole power designs for over three decades and is favored for hand-soldered prototypes and high-current industrial converters.

Key features of the IRFB3207ZPBF include 75V drain-source breakdown (VDS), a continuous drain current ID of 120A at TC=25C (170A silicon-limited), pulsed avalanche current rating, low gate charge, and RoHS-compliant lead-free terminal finish. It supports both standard gate-drive levels (10V) and logic-level operation in many circuits. The PBF suffix denotes lead-free Pb-free plating compliant with RoHS, while the through-hole TO-220AB tab doubles as a heatsink-mounting surface.

Typical applications include high-efficiency synchronous rectification in switch-mode power supplies (SMPS), uninterruptible power supplies (UPS), DC motor drives, battery-operated drives, solar inverters, and hard-switched high-frequency circuits. The part is well suited for AC-to-DC primary-side switching in industrial power conversion where its low RDS(on) minimizes conduction loss. In solar MPPT boost stages and three-phase inverter legs, the Z-variant's ruggedness margin protects against reverse-recovery transients and avalanche events that occur during abnormal load steps.

When designing with the IRFB3207ZPBF, calculate conduction loss as P = ID^2 x RDS(on) x (1 + 0.005 x (TJ - 25)) and ensure the heatsink keeps TJ below 175C. The TO-220AB tab is electrically live (drain), so an insulating thermal interface material (silicone pad or Kapton tape) is mandatory when mounting to a grounded chassis. Always observe safe operating area at high VDS and ID combinations.

This page synthesizes distributor pricing, drop-in cross-reference equivalents, and practical heatsink and layout design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for IRFB3207ZPBF β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with IRFB3207ZPBF (same form factor and footprint) β€” differing in Package, Technology, Avalanche Rated, Drain-Source Voltage (VDS), Operating Junction Temperature.

Infineon
Package: TO-220AB (through-hole, 3-lead)
Technology: HEXFET (Power MOSFET)
Compare with IRFB3207ZPBF β†’
Infineon
Package: TO-220AB (through-hole)
Technology: IR MOSFET (HEXFET)
Drain-Source Voltage (VDS): 200 V
Compare with IRFB3207ZPBF β†’
Infineon
Package: TO-220AB (3-pin through-hole)
Technology: HEXFET (planar cell, fifth generation)
Avalanche Rated: Yes (ruggedized single-pulse avalanche)
Compare with IRFB3207ZPBF β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

IRFB3207PBF

βœ… Drop-In
πŸ“¦ TO-220AB
same die and TO-220AB package, no Z-suffix ruggedness upgrade; pin-to-pin compatible, ~10 percent lower avalanche margin

πŸ“‹ Reference alternative (not in catalog)

IRFB3077PBF

βœ… Drop-In
πŸ“¦ TO-220AB
same TO-220AB footprint, lower current (76A vs 120A continuous, ~37 percent lower); VDS identical at 75V

πŸ“‹ Reference alternative (not in catalog)

IRFB3206PBF

βœ… Drop-In
πŸ“¦ TO-220AB
same TO-220AB package, lower VDS rating (60V vs 75V, ~20 percent lower); pin-to-pin compatible

πŸ“‹ Reference alternative (not in catalog)

IRFB4020PBF

βœ… Drop-In
Infineon
πŸ“¦ TO-220AB
N-Channel Β· IR MOSFET (HEXFET) Β· 200 V Β· 18 A Β· 100 W Β· 100 mOhm Β· 20 V Β· 1.43 C/W

βœ“ In Stock

$1.38 / Unit

View Datasheet β†’

IRL3705NPBF

βœ… Drop-In
Infineon
πŸ“¦ TO-220AB
N-Channel Β· 55 V Β· 89 A Β· 170 W Β· 10 mOhm (typical, V_GS = 5 V) Β· 65.3 nC

βœ“ In Stock

$0.92 / Unit

View Datasheet β†’

STP75NF75

βœ… Drop-In
πŸ“¦ TO-220AB
same TO-220AB package and 75V VDS, lower ID 80A (vs 120A, ~33 percent lower), higher RDS(on) ~9 mOhm vs 3.3 mOhm; pin-to-pin compatible

πŸ“‹ Reference alternative (not in catalog)

IRFB3207ZPBF Maximum Ratings & Electrical Characteristics

Manufacturer Infineon Technologies (formerly International Rectifier)
Part Number IRFB3207ZPBF
Series HEXFET
Technology N-Channel MOSFET (HEXFET, Z-suffix ruggedized)
Drain-Source Voltage (VDS) 75 V
Continuous Drain Current (ID) at TC=25C 120 A
Silicon-Limited Drain Current 170 A
On-Resistance RDS(on) typ @ VGS=10V 3.3 mOhm
On-Resistance RDS(on) max @ VGS=10V 4.1 mOhm
Power Dissition (PD) at TC=25C 300 W
Operating Junction Temperature -55 C to +175 C
Package TO-220AB (3-lead through-hole)
Mounting Type Through Hole
Lead-Free / RoHS Yes (PBF suffix = lead-free)
MSL Level N/A (through-hole)
Avalanche Rated Yes (improved Z-variant ruggedness)

IRFB3207ZPBF Pin Configuration

TO-220 Package Pinout Diagram TO-220 3-pin vertical mount with tab, JEDEC. 1 2 3 TO-220
Pin 1 Gate β€” Gate drive input; standard 10V VGS for full enhancement
Pin 2 Drain β€” Power drain connection (also electrically tied to the metal tab)
Pin 3 Source β€” Source return; connect to circuit ground reference

IRFB3207ZPBF Safe Operating Area (DC)

DC Continuous Operation

Typical Applications

IRFB3207ZPBF is suitable for 6 applications: High-Efficiency Synchronous Rectification in SMPS, Uninterruptible Power Supply (UPS) Battery Switch, DC Motor Drive H-Bridge Switch, Solar MPPT Boost Converter Switch, Battery-Operated Forklift / E-Bike Traction Drive, Hard-Switched High-Frequency Inverter.

⚑

High-Efficiency Synchronous Rectification in SMPS

The IRFB3207ZPBF is purpose-built for synchronous rectifier positions in switch-mode power supplies at the secondary side of 24V and 48V bus converters. Its 3.3 mOhm typical RDS(on) at VGS=10V reduces conduction loss by approximately 60 percent compared to a Schottky diode at the same current, which directly improves overall converter efficiency at high load. The 75V VDS rating comfortably covers 48V telecom rails with full avalanche margin for transformer-induced overshoot. The Z-suffix ruggedness withstands the hard-commutation dV/dt events of CCM PFC stages. In a 1 kW half-bridge rectifier leg, two parallel IRFB3207ZPBF devices keep rectifier loss under 15W, eliminating heatsink fan requirements.

πŸ”‹

Uninterruptible Power Supply (UPS) Battery Switch

The IRFB3207ZPBF serves as the battery disconnect and hot-swap switch in line-interactive and online UPS systems operating at 48V battery bus. Its 120A continuous rating handles the full inverter surge rating, while the 75V VDS rating absorbs the inductive kick of battery cable inductance at disconnect. The 3.3 mOhm RDS(on) limits voltage drop across the switch to less than 0.4V at 120A, preserving battery runtime and reducing I^2R heating in the wiring harness. The Z-suffix ruggedness prevents avalanche failure during simultaneous battery-rectifier transfer events.

🏭

DC Motor Drive H-Bridge Switch

In brushed DC motor drives for industrial automation and electric vehicles, the IRFB3207ZPBF forms the low-side switches of a discrete H-bridge operating from a 24V to 60V bus. Its 170A silicon-limited rating handles motor stall currents with margin, while the TO-220AB package mounts directly to an aluminum chassis heatsink via an insulating thermal pad. The Z-variant's improved dV/dt ruggedness prevents shoot-through induced avalanche failures during PWM transitions at 20 kHz. With RDS(on) of 3.3 mOhm the per-FET conduction loss at 50A is only 8.25W, keeping the H-bridge efficiency above 97 percent at rated load.

🌞

Solar MPPT Boost Converter Switch

The IRFB3207ZPBF is used as the boost switch in solar maximum power point tracking (MPPT) converters for off-grid and grid-tie systems at the battery-side boost node. Its 75V VDS rating covers 48V battery banks with margin for transformer and wiring inductance spikes, and the 3.3 mOhm RDS(on) maximizes boost efficiency above 98 percent. The Z-variant ruggedness is critical during open-circuit MPPT sweep transients, where the inductor energy can momentarily exceed the FET avalanche rating. With an aluminum substrate PCB or clip-on heatsink, continuous 60A operation is achievable in a compact MPPT module housing.

πŸš—

Battery-Operated Forklift / E-Bike Traction Drive

The IRFB3207ZPBF is used in traction motor controllers for electric forklifts, e-bikes, and neighborhood electric vehicles operating at 36V to 48V nominal battery voltage. Its 120A continuous rating provides the peak torque current needed for vehicle launch, while the 3.3 mOhm RDS(on) minimizes voltage drop across the controller to extend driving range per charge cycle. The ruggedized Z-suffix withstands the back-EMF transients generated during regenerative braking, which can momentarily exceed the DC bus voltage by 30 to 40 percent. TO-220AB through-hole packaging simplifies hand-repairable designs and field service.

🏭

Hard-Switched High-Frequency Inverter

In hard-switched half-bridge and full-bridge inverters for induction heating, ultrasonic cleaners, and welding power supplies, the IRFB3207ZPBF serves as the primary switching element. The Z-suffix variant is engineered specifically for the harsh switching transients of hard-switched topologies, with improved gate charge, lower internal capacitance, and higher avalanche energy rating than the IRFB3207PBF baseline. At switching frequencies of 50 to 200 kHz, the IRFB3207ZPBF's switching loss remains manageable due to its moderate Crss/Ciss ratio. The 75V VDS rating supports 48V DC bus designs with generous headroom for transformer leakage inductance spikes.

What is the drain-source voltage rating of IRFB3207ZPBF?
The IRFB3207ZPBF has a drain-source voltage (VDS) rating of 75V. According to the Infineon datasheet for the IRFB3207Z family, this rating is the absolute maximum; sustained operation above 75V will trigger avalanche breakdown and likely destroy the device. For 48V telecom or solar bus applications this part provides ample margin, while 80V or higher rails should select the VBM1803 or similar 80V-class MOSFET referenced later in this page.
What is the on-resistance of IRFB3207ZPBF at 10V gate drive?
The IRFB3207ZPBF delivers a typical RDS(on) of 3.3 mOhm and a maximum of 4.1 mOhm at VGS=10V. Conduction loss at 50A continuous drain current is approximately P = ID^2 x RDS(on) = 8.25W at the typical figure. At full 120A rating this rises to 47W, which mandates a substantial heatsink or forced-air cooling to keep junction temperature below 175C.
Is IRFB3207ZPBF suitable for synchronous rectification in SMPS?
Yes, the IRFB3207ZPBF is explicitly recommended for high-efficiency synchronous rectification in switch-mode power supplies. Its 3.3 mOhm typical RDS(on) and 75V rating cover 24V and 48V bus designs. Compared to a Schottky diode at the same current, the IRFB3207ZPBF reduces rectifier losses by roughly 60 percent, which significantly improves overall converter efficiency at high load currents.
Where can I buy IRFB3207ZPBF and what is the price?
The IRFB3207ZPBF is in stock at major distributors including DigiKey, Mouser, and Octopart-listed resellers as of 2026-09-14. Pricing starts around 2.85 USD at qty 1, scaling down to approximately 1.62 USD at 1000 pieces. Lead time for production quantities is typically 8 to 12 weeks from authorized distributors. For BOM-scaled orders, XAIPART provides a quote-on-request channel with manufacturer traceability.
What is the lead time for IRFB3207ZPBF?
DigiKey typically stocks the IRFB3207ZPBF in tube quantities with same-day shipping for orders under 5000 pieces. Factory-direct lead time through Infineon authorized distributors averages 8 to 12 weeks for full-reel or tube production quantities, based on distributor listings observed as of 2026-09-14. For long-lead orders, Mouser and Arrow also list the part in their stocking programs.
IRFB3207ZPBF vs IRFB3207PBF - what is the difference?
The IRFB3207ZPBF is the ruggedized Z-suffix variant of the IRFB3207PBF baseline part. Both share the same 75V VDS, 120A ID, and TO-220AB package footprint. The Z variant offers improved gate ruggedness, higher avalanche energy rating, and better dynamic dV/dt tolerance, making it the preferred choice in hard-switched and motor-drive applications. For pin-compatible replacement, the Z suffix is a strict upgrade over the non-Z baseline.
IRFB3207ZPBF vs IRF3205 - which is better for a 12V motor drive?
The IRFB3207ZPBF (75V, 3.3 mOhm) is the better choice over the older IRF3205 (55V, 8.0 mOhm) for 24V-48V industrial motor drives because of its higher voltage headroom and lower conduction loss. For a pure 12V hobby motor application the IRF3205 still works and is cheaper, but its lower VDS rating means less margin against back-EMF transients. Choose IRFB3207ZPBF for any application above 24V nominal bus.
What is the best drop-in replacement for IRFB3207ZPBF?
The best drop-in replacement for IRFB3207ZPBF is the IRFB3207PBF (non-Z variant) from the same Infineon family in the identical TO-220AB package, differing only in slightly lower ruggedness margin. Cross-brand equivalents in TO-220AB include the STMicroelectronics STP75NF75 (75V, 80A, higher RDS(on)). For a higher-voltage upgrade in the same footprint, the Chinese-designed VBM1803 (80V) is referenced in cross-reference searches as a 2026 alternative.
When should I choose IRFB3207ZPBF over a logic-level MOSFET?
Choose the IRFB3207ZPBF when your gate driver provides a true 10V gate-source voltage, which is the standard for industrial and SMPS designs. Logic-level MOSFETs (VGS(th) below 2.5V) are required only when driving directly from a 3.3V or 5V microcontroller GPIO, which is uncommon in 100A-class designs. For battery or 12V-supply driven applications where 10V drive is available, the IRFB3207ZPBF gives the lowest RDS(on) per dollar.
Is IRFB3207ZPBF suitable for solar MPPT boost converters?
Yes, the IRFB3207ZPBF is well-suited for solar MPPT boost converter switches at the battery-side switching node, where its 75V rating handles 48V battery banks plus inductive spike margin. The 3.3 mOhm RDS(on) minimizes conduction loss at high boost currents, and the Z-variant ruggedness tolerates the occasional open-circuit MPPT transient. For grid-tie inverters above 60V DC bus, ensure VDS margin of at least 20 percent.
Where can I download the IRFB3207ZPBF datasheet PDF?
The official Infineon datasheet for the IRFB3207ZPBF (covering IRFB3207ZPbF, IRFS3207ZPbF, IRFSL3207ZPbF variants) is hosted at the Infineon document server linked on this page. The PDF, originally published by International Rectifier, contains the full SOA curves, thermal resistance, and switching characteristics. Mirror copies are also available on DigiKey's HTML datasheet portal for the IRFB3207ZPbF entry.
What is the pinout of IRFB3207ZPBF in TO-220AB?
The IRFB3207ZPBF in TO-220AB follows the standard N-channel MOSFET pinout when viewed from the front (tab side): Pin 1 = Gate, Pin 2 = Drain, Pin 3 = Source, with the metal tab electrically connected to the Drain. This is the JEDEC TO-220AB standard orientation. Always confirm by checking the datasheet because some manufacturers reverse pin 2 and pin 3, but Infineon HEXFET TO-220AB parts follow this convention.
Does IRFB3207ZPBF require a heatsink at 50A continuous?
At ID = 50A continuous the IRFB3207ZPBF dissipates approximately 8.25W using the typical 3.3 mOhm RDS(on). Estimated: with a TO-220AB junction-to-ambient thermal resistance of 62 C/W (no heatsink), the junction would rise 511C above ambient, which is impossible without a heatsink. In practice a TO-220 clip-on heatsink with thermal resistance below 5 C/W, or 50 square centimeters of copper pour, is required for 50A continuous operation.
What cross-brand equivalent can replace IRFB3207ZPBF?
The STMicroelectronics STP75NF75 is the most commonly cited cross-brand drop-in equivalent for the IRFB3207ZPBF in the same TO-220AB package, though its RDS(on) is higher (around 9 mOhm). Onsemi and Vishay also offer 75V N-channel TO-220AB MOSFETs that can be substituted with a thermal re-derating. Always verify RDS(on), gate charge, and SOA curves before committing to a cross-brand replacement in production designs.
What are the key specifications engineers should know about IRFB3207ZPBF?
The IRFB3207ZPBF key specifications per the Infineon datasheet are: VDS = 75V, ID = 120A continuous (170A silicon-limited), RDS(on) = 3.3 mOhm typical at VGS = 10V, PD = 300W at TC = 25C, and TO-220AB through-hole package. It is RoHS-compliant lead-free (PBF suffix), avalanche-rated, and operates from -55C to +175C junction. It is designed for high-efficiency synchronous rectification in SMPS, UPS, motor drives, and solar inverter applications.

Engineering reference data for IRFB3207ZPBF β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the IRFB3207ZPBF when you need a 75V-rated N-channel HEXFET MOSFET in the industry-standard TO-220AB through-hole package with the best balance of low RDS(on) (3.3 mOhm typical) and high continuous current (120A) for industrial SMPS, UPS, and motor drive designs. It is the preferred Infineon part for hard-switched applications where the Z-suffix ruggedness is required. Select the IRFB3207PBF instead only if cost is critical and you do not need the ruggedness upgrade. For higher-voltage rails above 100V, migrate to the IRFB4020PBF (200V TO-220AB) or a CoolMOS-class part. For cross-brand substitution, the STMicroelectronics STP75NF75 is pin-compatible but has approximately 2.7x higher RDS(on), requiring thermal re-derating.

Comparison with Alternatives

Parameter This Product IRFB3207PBF IRFB3077PBF IRFB3206PBF STP75NF75
Package TO-220AB TO-220AB - same TO-220AB - same TO-220AB - same TO-220AB - same
Brand Infineon Technologies Infineon Technologies Infineon Technologies Infineon Technologies STMicroelectronics
VDS (Drain-Source Voltage) 75 V 75 V 75 V 60 V 75 V
Continuous Drain Current (TC=25C) 120 A 120 A 76 A 120 A 80 A
Power Dissipation (TC=25C) 300 W 300 W 200 W 300 W 300 W
Ruggedness (Z-suffix) Yes (improved avalanche + dV/dt) No (baseline) No No Standard
RoHS / Lead-Free Yes (PBF suffix) Yes Yes Yes Yes
Unit Price @ 1pc (USD, as of 2026-09-14) $2.85 $2.50 $3.20 $2.40 $2.10

Key Differentiators

  • Z-suffix ruggedness upgrade over IRFB3207PBF baseline (vs IRFB3207PBF)
  • Lower RDS(on) than cross-brand STP75NF75 (vs STP75NF75)
  • Higher voltage rating than IRFB3206PBF (vs IRFB3206PBF)
  • Higher continuous current than IRFB3077PBF (vs IRFB3077PBF)

Design Notes

Estimated: at ID=120A continuous and RDS(on)=3.3 mOhm typical, conduction loss is P = 120^2 x 0.0033 = 47.5W. The TO-220AB junction-to-case thermal resistance is approximately 0.5 C/W, so junction temperature rise above case at full load is about 24C. With a clip-on heatsink having thermal resistance of 2 C/W and case-to-ambient thermal pad resistance of 0.5 C/W, total junction-to-ambient is 3 C/W. At 25C ambient, junction reaches 25 + 47.5 x 3 = 168C, dangerously close to the 175C maximum. Either reduce continuous current to 100A or upgrade to a fan-cooled heatsink with thermal resistance below 1 C/W. Always verify with the manufacturer's thermal curves in the datasheet SOA section.

The metal tab of the TO-220AB package is electrically tied to the Drain pin (pin 2). When mounting to a grounded chassis heatsink, always use an insulating thermal interface material such as a silicone rubber pad (Wakefield 173-7 or similar) plus a plastic shoulder washer on the mounting screw. Without insulation, the Drain will be shorted to chassis ground, destroying the MOSFET and potentially the gate driver. Alternatively, mount to a floating heatsink with a fan-cooled or liquid-cooled design where insulation is provided by the heatsink design itself.

Minimize the source-inductance loop between the IRFB3207ZPBF source pin and the gate driver's ground return. Use a star-ground topology or a 4-layer PCB with a dedicated ground plane directly under the source lead. Source inductance of more than 5 nH causes gate voltage overshoot during turn-off, which can exceed VGS(max)=20V and trigger gate oxide rupture. Place the gate-driver output within 10mm of the gate pin and use a 10-ohm gate resistor to damp the LC resonance.

Never operate the IRFB3207ZPBF above its VDS=75V rating, even transiently. Avalanche breakdown above 75V can occur in microseconds and permanently damage the part. For 48V battery bus designs add at least 10V of margin (so peak VDS must stay below 65V), which requires a clamp snubber or TVS across the drain-source junction. Also note the silicon-limited current of 170A is NOT a continuous rating - the bond wires cannot sustain this current without failure; respect the 120A TC=25C continuous rating for production designs.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant and lead-free (PBF suffix) per Infineon product page. Not AEC-Q100 qualified; for automotive designs use the AU-prefixed variants. Halogen-free status not explicitly stated in the verified web data.

Data verified on: 2026-09-14 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Infineon Technologies International Rectifier IRFB3207ZPBF IRFB3207PBF IRFB3077PBF IRFB3206PBF IRFB4020PBF STP75NF75 HEXFET N-channel MOSFET power MOSFET discrete semiconductor TO-220AB through-hole package JEDEC TO-220 RDS(on) VDS PSRR-equivalent for MOSFET: SOA (Safe Operating Area) avalanche rating synchronous rectification SMPS UPS RoHS AEC-Q100 dV/dt ruggedness
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